CN101972998A - Lower polishing disk of polishing machine - Google Patents
Lower polishing disk of polishing machine Download PDFInfo
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- CN101972998A CN101972998A CN 201010270760 CN201010270760A CN101972998A CN 101972998 A CN101972998 A CN 101972998A CN 201010270760 CN201010270760 CN 201010270760 CN 201010270760 A CN201010270760 A CN 201010270760A CN 101972998 A CN101972998 A CN 101972998A
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- disk
- lower wall
- polishing
- water inlet
- cooling
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Abstract
The invention relates to the structure of a silicon wafer lapping machine or a polishing machine, in particular to the structure of a lower polishing disk of a silicon wafer lapping machine or a polishing machine. The lower polishing disk of a polishing machine comprises a lower disk working disk (7), and is mainly characterized by also comprising a lower disk base disk (9) on the lower part of the lower disk working disk (7), wherein a cooling cavity (3) is formed between the lower disk base disk (9) and the lower disk working disk (7); the lower disk base disk (9) is provided with a water inlet (8) and a water outlet (5); and the water inlet (8) and the water outlet (5) are respectively communicated with the cooling cavity (3). The invention has the advantages that the special structure of a water cooling disk can prevent cooling water taking a shortcut; because cooling water can flow out from the water outlet (5) only after the cooling cavity (3) is filled, a polishing disk can be fully cooled by cooling water; and because heat generated by operating is carried out in time, the polishing disk can be forcibly cooled. Compared with a traditional passive cooling method, the invention is more reliable. The lower polishing disk is combined with a precise temperature measuring system and a cooling water flow regulating system to realize the precise control of polishing temperature.
Description
Technical field:
The present invention relates to the structure of silicon chip grinding machine or polishing machine, relate in particular to the structure of polishing disk under silicon chip grinding machine or the polishing machine.
Background technology:
The following polishing disk that is used for the silicon wafer polishing machine, owing to can produce a large amount of heat in polishing process, variation of temperature will inevitably cause polishing disk generation deformation, and then influences crudy, the temperature of therefore necessary strict control polishing disk.The size of IC chip silicon chip trend ever-larger diameters is also more and more tighter to the quality requirement of silicon chip in recent years, for the polissoir that is used for carrying out silicon chip twin polishing processing, must strictly control the deformation of dumping.
The employing monolithic construction of dumping of the Twp-sided polishing machine of Sheng Chaning is not carried out special temperature controlled device before this, and the heat that is produced in the polishing processing is mainly taken away by polishing fluid, belongs to the passive type cooling, and the variation of temperature of dumping is uncontrollable.Traditional equipment also is applied in non-IC industry mostly, temperature control requirement to lower wall is not high, and the IC industry to the requirement of silicon chip than higher, it is essential that polishing disk is up and down carried out precision temperature control, therefore must adopt new lower wall structure, so that cool off, reach the accurately purpose of control of temperature to dumping.
Summary of the invention:
The objective of the invention is to avoid the deficiencies in the prior art, a kind of following polishing disk of polishing machine is provided.At the inner logical cooling medium of forcing of dumping, polishing disk is down forced cooling, the precision control of the temperature that realizes dumping reaches the dump purpose of distortion of control.
For achieving the above object, the technical scheme that the present invention takes is: a kind of following polishing disk of polishing machine, include lower wall scratch diskette (7), also include in the below of lower wall scratch diskette (7) and be provided with lower wall basal disc (9), be provided with cooling chamber (3) between lower wall basal disc (9) and the lower wall scratch diskette (7), be provided with water inlet (8) and delivery port (5) on lower wall basal disc (9), described water inlet (8) and delivery port (5) are communicated with cooling chamber (3) respectively.
Described cooling chamber (3) is to be provided with several recessed sector regions on lower wall basal disc (9); Each recessed sector region is divided into two recessed cooling zones (4) that are communicated with each other by water inlet pipe (6), and described water inlet pipe (6) is communicated with water inlet (8); On the interior circle of lower wall basal disc (9), be provided with delivery port (5).Adopt unique circulation canal, water inlet (8) locate to be equipped with water pipe (6) with cooling water by the external side of the inboard positioning disk of disk body, promptly discharge from delivery port (5) by cooling zone (4), the loop that has guaranteed the cooling water process is long and do not take a shortcut,
Described water inlet pipe (6) is communicated with water inlet (8) by water supply connector (10).
End at described water inlet pipe (6) is provided with pipe clamp (2).
Outer ring and inner ring place between described lower wall basal disc (9) and the lower wall scratch diskette (7) are equipped with sealing device.Sealing device is a sealing ring.
Be provided with the branch muscle on described lower wall basal disc (9), be provided with connection screw (1) on minute muscle, lower wall basal disc (9) is connected by screw with lower wall scratch diskette (7).
The height of described delivery port (5) is higher than the height of cooling chamber (3).The height of delivery port (5) is higher than the faying face of compound disk body, and cooling water could flow out from delivery port (5) after must being full of cavity fully, guarantees to dump and can be cooled off fully.
Beneficial effect of the present invention: special aqueous cold plate structure has avoided cooling water to take a shortcut, only after being full of cavity, cooling water could flow out from delivery port, guaranteed that cooling water can fully cool off dumping, in time take away the heat that produces because of processing, played the effect of forcing cooling to dumping, more traditional passive type cooling is more reliable.In conjunction with accurate temp measuring system and cooling water flow regulating system, the precision control of the temperature that realized dumping.
Description of drawings:
Fig. 1 is a structural representation of the present invention;
Fig. 2 is the cutaway view of the AA of Fig. 1.
Among the figure: 1, connect screw; 2, pipe clamp; 3, cooling chamber; 4, cooling zone; 5, delivery port; 6, water inlet pipe; 7, lower wall scratch diskette; 8; Water inlet; 9, lower wall basal disc; 10, water supply connector.
The specific embodiment:
Below principle of the present invention and feature are described, institute gives an actual example and only is used to explain the present invention, is not to be used to limit scope of the present invention.
Embodiment 1: as Fig. 1, shown in Figure 2, a kind of following polishing disk of polishing machine, include lower wall scratch diskette 7, also include and below lower wall scratch diskette 7, be provided with lower wall basal disc 9, be provided with cooling chamber 3 between lower wall basal disc 9 and the lower wall scratch diskette 7, be provided with water inlet 8 and delivery port 5 on lower wall basal disc 9, described water inlet 8 and delivery port 5 are communicated with cooling chamber 3 respectively.Described cooling chamber 3 is to be provided with several recessed sector regions on lower wall basal disc 9; Each recessed sector region is divided into two recessed cooling zones 4 that are communicated with each other by water inlet pipe 6, and described water inlet pipe 6 is communicated with water inlet 8; On the interior circle of lower wall basal disc 9, be provided with delivery port 5.Described water inlet pipe 6 is communicated with water inlet 8 by water supply connector 10.End at described water inlet pipe 6 is provided with pipe clamp 2.Outer ring and inner ring place between described lower wall basal disc 9 and the lower wall scratch diskette 7 are equipped with sealing device.Be provided with the branch muscle on described lower wall basal disc 9, be provided with on minute muscle and connect screw 1, lower wall basal disc 9 and lower wall scratch diskette 7 are connected by screw.The height of described delivery port 5 is higher than the height of cooling chamber 3.The height of delivery port 5 is higher than the faying face of compound disk body, and cooling water could flow out from delivery port 5 after must being full of cavity fully, guarantees to dump and can be cooled off fully.
Polishing disk all adopts the composite double layer structure under the present invention, is hollow structure, and the upper strata is a scratch diskette, and lower floor is an aqueous cold plate, and the centre can lead to cooling water.Lower wall is provided with 12 independently sector region chambeies, interior cloth water-cooled passage, adopt unique circulation canal, be equipped with in the water inlet water pipe with cooling water by the external side of the inboard positioning disk of disk body, do not take a shortcut than length in the loop that has guaranteed the cooling water process, and the height of water return outlet is higher than the faying face of compound disk body, cooling water could flow out from water return outlet after must being full of cavity fully, guarantee to dump and to be cooled off fully, sealing ring is equipped with in outside faying face dress and screw junction in the disk body, is used to prevent reveal.
The above only is preferred embodiment of the present invention, and is in order to restriction the present invention, within the spirit and principles in the present invention not all, any modification of being done, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. the following polishing disk of a polishing machine, include lower wall scratch diskette (7), it is characterized in that, also include in the below of lower wall scratch diskette (7) and be provided with lower wall basal disc (9), be provided with cooling chamber (3) between lower wall basal disc (9) and the lower wall scratch diskette (7), be provided with water inlet (8) and delivery port (5) on lower wall basal disc (9), described water inlet (8) and delivery port (5) are communicated with cooling chamber (3) respectively.
2. the following polishing disk of polishing machine as claimed in claim 1 is characterized in that, described cooling chamber (3) is to be provided with several recessed sector regions on lower wall basal disc (9); Each recessed sector region is divided into two recessed cooling zones (4) that are communicated with each other by water inlet pipe (6), and described water inlet pipe (6) is communicated with water inlet (8); On the interior circle of lower wall basal disc (9), be provided with delivery port (5).
3. the following polishing disk of polishing machine as claimed in claim 1 is characterized in that, described water inlet pipe (6) is communicated with water inlet (8) by water supply connector (10).
4. the following polishing disk of polishing machine as claimed in claim 1 is characterized in that, is provided with pipe clamp (2) at the end of described water inlet pipe (6).
5. the following polishing disk of polishing machine as claimed in claim 1 is characterized in that, outer ring and inner ring place between described lower wall basal disc (9) and the lower wall scratch diskette (7) are equipped with sealing device.
6. the following polishing disk of polishing machine as claimed in claim 1 is characterized in that, is provided with the branch muscle on described lower wall basal disc (9), is provided with to connect screw (1) on minute muscle, and lower wall basal disc (9) is connected by screw with lower wall scratch diskette (7).
7. the following polishing disk of polishing machine as claimed in claim 1 is characterized in that, the height of described delivery port (5) is higher than the height of cooling chamber (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010270760 CN101972998A (en) | 2010-08-30 | 2010-08-30 | Lower polishing disk of polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010270760 CN101972998A (en) | 2010-08-30 | 2010-08-30 | Lower polishing disk of polishing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101972998A true CN101972998A (en) | 2011-02-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010270760 Pending CN101972998A (en) | 2010-08-30 | 2010-08-30 | Lower polishing disk of polishing machine |
Country Status (1)
| Country | Link |
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| CN (1) | CN101972998A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104772718A (en) * | 2015-03-27 | 2015-07-15 | 苏州赫瑞特电子专用设备科技有限公司 | Lower polishing disk of polishing machine |
| CN106064350A (en) * | 2016-07-28 | 2016-11-02 | 苏州赫瑞特电子专用设备科技有限公司 | Polishing disk structure under the water-cooled of a kind of buffing machine |
| CN106078521A (en) * | 2016-07-19 | 2016-11-09 | 苏州赫瑞特电子专用设备科技有限公司 | Polishing disk structure under the water-cooled of a kind of buffing machine |
| CN113001422A (en) * | 2021-03-08 | 2021-06-22 | 天津职业技术师范大学(中国职业培训指导教师进修中心) | Pellet-stacked metal glass powder binding agent sintered internal-cooling grinding wheel and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6062459A (en) * | 1983-09-14 | 1985-04-10 | Hitachi Ltd | Ceramic lapping surface plate |
| JPH0752034A (en) * | 1993-08-19 | 1995-02-28 | Nippon Steel Corp | Wafer polishing device |
| JP2002373875A (en) * | 2001-06-13 | 2002-12-26 | Hitachi Ltd | Method of manufacturing semiconductor device, and chemical mechanical polishing apparatus |
| CN101407040A (en) * | 2008-11-11 | 2009-04-15 | 广东工业大学 | Face lapping mill with abrasive disk cooling mechanism |
| CN101549484A (en) * | 2009-05-07 | 2009-10-07 | 清华大学 | A polishing disk with internal circulated cooling |
| CN201824259U (en) * | 2010-08-30 | 2011-05-11 | 兰州瑞德实业集团有限公司 | Lower polishing disk of polishing machine |
-
2010
- 2010-08-30 CN CN 201010270760 patent/CN101972998A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6062459A (en) * | 1983-09-14 | 1985-04-10 | Hitachi Ltd | Ceramic lapping surface plate |
| JPH0752034A (en) * | 1993-08-19 | 1995-02-28 | Nippon Steel Corp | Wafer polishing device |
| JP2002373875A (en) * | 2001-06-13 | 2002-12-26 | Hitachi Ltd | Method of manufacturing semiconductor device, and chemical mechanical polishing apparatus |
| CN101407040A (en) * | 2008-11-11 | 2009-04-15 | 广东工业大学 | Face lapping mill with abrasive disk cooling mechanism |
| CN101549484A (en) * | 2009-05-07 | 2009-10-07 | 清华大学 | A polishing disk with internal circulated cooling |
| CN201824259U (en) * | 2010-08-30 | 2011-05-11 | 兰州瑞德实业集团有限公司 | Lower polishing disk of polishing machine |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104772718A (en) * | 2015-03-27 | 2015-07-15 | 苏州赫瑞特电子专用设备科技有限公司 | Lower polishing disk of polishing machine |
| CN106078521A (en) * | 2016-07-19 | 2016-11-09 | 苏州赫瑞特电子专用设备科技有限公司 | Polishing disk structure under the water-cooled of a kind of buffing machine |
| CN106064350A (en) * | 2016-07-28 | 2016-11-02 | 苏州赫瑞特电子专用设备科技有限公司 | Polishing disk structure under the water-cooled of a kind of buffing machine |
| CN113001422A (en) * | 2021-03-08 | 2021-06-22 | 天津职业技术师范大学(中国职业培训指导教师进修中心) | Pellet-stacked metal glass powder binding agent sintered internal-cooling grinding wheel and preparation method thereof |
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Application publication date: 20110216 |