CN101964317B - Substrate conveying method and device - Google Patents
Substrate conveying method and device Download PDFInfo
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- CN101964317B CN101964317B CN200910160082.5A CN200910160082A CN101964317B CN 101964317 B CN101964317 B CN 101964317B CN 200910160082 A CN200910160082 A CN 200910160082A CN 101964317 B CN101964317 B CN 101964317B
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Abstract
The invention relates to a substrate conveying method and a substrate conveying device. The substrate conveying method comprises the following steps of: providing a substrate on the surface of a first plate body in a first position; shifting the first plate body from the first position to a second position which is positioned in the upper space of a second plate body; and lifting the substrate from the surface of the first plate body and placing the substrate from the upper space on the surface of the second plate body. The substrate conveying device comprises the first plate body and the second plate body, wherein the first plate body and the second plate body are respectively provided with surfaces for carrying the substrate; and the first plate body can move between the first position and the second position. The substrate conveying method or device of the invention can obviously reduce conveying time and improve the capacity of a heating process. In addition, the invention obviously reduces the conveying time and effectively reduces the temperature reduction in the conveying process, thereby more easily controlling heat quantity and the reduction of an opening and the key size.
Description
Technical field
The present invention relates to a kind of substrate conveying method and device thereof, particularly relate to a kind of between heating plate (hot plate), transmit wafer method and device thereof.
Background technology
Heating plate is the instrument being widely used in heat solid or liquid.For the hot manufacturing process comprising two benches or more stage different temperatures, often use the heating plate of identical respective amount, to reach process multi-disc substrate continuously.For example, photoresistance again hot-fluid (reflow) manufacturing process generally includes two heating stepses at different temperatures, and uses two heating plates to carry out heating steps respectively.
Fig. 1 is the temperature curve of the photoresistance reheating stream manufacturing process of the hot manufacturing process of known a kind of two step.Patterning photoresist layer 110 to be formed in substrate 100 and to have opening 120, carries out reheating stream manufacturing process, to reduce the size of opening 120 to patterning photoresist layer 110.Reheating stream manufacturing process comprises the first heating steps and the second heating steps, first heating steps is that the first heating plate between time point t1 and t2 and at a first temperature t 1 carries out the first baking, second heating steps is that the second heating plate between time point t3 and t4 and under the second temperature T2 (> T1) carries out the second baking, and wherein manufacturing process comprises the delivery time substrate is sent to the second heating plate from the first heating plate between two heating stepses.After carrying out the second heating steps, result opening 120a has less size.
Generally speaking, substrate is moved between heating plate by robotic arm.But, carry out owing to utilizing robotic arm moving and need (the t2-t3 time period in Fig. 1 considerable time, about 8-15 second), effective temperature (significant temperature) can be made in the process of delivery time to decline, the micro of thermal dose (thermal dosage) and result opening and critical size (criticaldimension, CD) is caused to be difficult to control.In addition, substrate transmits and production capacity can be made too slowly to reduce.
As can be seen here, above-mentioned existing substrate conveying method and device thereof are at method, product structure and use, and obviously still have inconvenience and defect, and are urgently further improved.In order to solve above-mentioned Problems existing, relevant manufactures there's no one who doesn't or isn't seeks solution painstakingly, but have no applicable design for a long time to be completed by development always, and conventional method and product do not have appropriate method and structure to solve the problem, this is obviously the anxious problem for solving of relevant dealer.Therefore how to found a kind of new substrate conveying method and device thereof, one of current important research and development problem of real genus, also becomes the target that current industry pole need be improved.
Summary of the invention
The object of the invention is to, overcome the defect that existing substrate conveying method exists, and provide a kind of new substrate conveying method, technical problem to be solved is the delivery time making it effectively between the different plate body of shortening, is very suitable for practicality.
Another object of the present invention is to, overcome the defect that existing substrate conveying device exists, and a kind of substrate conveying device of new structure is provided, technical problem to be solved makes it that delivery time between different plate body is significantly reduced, thus be more suitable for practicality.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to the substrate conveying method that the present invention proposes.Substrate is provided on the surface at the first plate body of primary importance.First plate body is moved to the second place being positioned at the second plate body upper space from primary importance.Substrate is risen from the surface of the first plate body.First plate body is removed from the second place.Then, substrate is put into the surface of the second plate body from upper space.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
In one embodiment, the first above-mentioned plate body and the second plate body be heating plate with heated substrate, the surface of heating plate has different heating-up temperatures.
In one embodiment, step substrate risen from the surface of the first plate body is with by substrate, the step be placed on the surface of the second plate body is that use one group can from the thimble of the surface elongation of the second plate body and withdrawal.In step substrate risen from the surface of the first plate body and the step removed from the second place by the first plate body, thimble is by one group of gap in the first plate body.
In one embodiment, substrate conveying method of the present invention more comprises the following steps.Substrate is risen from the surface of the second plate body.3rd plate body is moved to the space between substrate and the second plate body.Substrate is placed on the surface of the 3rd plate body.3rd plate body is moved to the 3rd position from the upper space of the second plate body.
First plate body and the second plate body can be heating plate with heated substrate, the surface of heating plate has different heating-up temperatures, and the 3rd plate body is that coldplate is to cool substrate.
In one embodiment, when use the 3rd plate body, the step that substrate is risen from the surface of the first plate body, step substrate is placed on the surface of the second plate body, by substrate from step, step substrate is placed on the surface of the 3rd plate body that the second plate body surface is risen use one group can from the thimble of the surface elongation of the second plate body and withdrawal.In step substrate risen from the surface of the first plate body and the step removed from the second place by the first plate body, thimble is by one group of gap in the first plate body; And in the step the 3rd plate body being moved to the space between substrate and the second plate body and step substrate being placed on the surface of the 3rd plate body, thimble is by one group of gap in the 3rd plate body.
In one embodiment, above-mentioned transmitted substrate is wafer.
The object of the invention to solve the technical problems also realizes by the following technical solutions.According to the substrate conveying device that the present invention proposes, it comprises the first plate body and the second plate body, and the first plate body and the second plate body have surface respectively with bearing basement.First plate body can move in primary importance and between the second place of the second plate body upper space.Primary importance by base load on the first plate body, and in the second place substrate unloaded from the first plate body and be put on the surface of the second plate body.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.In one embodiment, the first plate body and the second plate body be heating plate with heated substrate, and the surface of heating plate has different heating-up temperatures.
In one embodiment, the second plate body is configured with substrate lifting tool (substratelifting/lowering means).Substrate is risen from the surface of the first plate body in the second place by substrate lifting tool, substrate to be unloaded from the first plate body, and substrate is declined substrate to be placed on the surface of the second plate body.In this embodiment, lifting tool can comprise one second group of extending and regain thimble, has one group of gap in the first plate body, and gap can extend to the moving direction of the first plate body and align with thimble on the moving direction of the first plate body; And when the first plate body is in the second place, second group of thimble can extend through gap.First plate body is configurable one first group of thimble also, and when the first plate body is in primary importance, first group of thimble can extend through the gap in the first plate body, and thimble is recoverable.
In one embodiment, above-mentioned device more comprise have surface with the 3rd plate body of bearing basement, and the 3rd plate body can move between the second place and the 3rd position, wherein by substrate from second plate body unloading after, the second place by base load on the surface of the 3rd plate body.
First plate body and the second plate body can be heating plate with heated substrate, the surface of heating plate has different heating-up temperatures, and the 3rd plate body is that coldplate is to cool substrate.
In one embodiment, when device also comprises the 3rd plate body, the second plate body is configured with substrate lifting tool.Substrate is risen from the surface of the first plate body substrate to be unloaded from the first plate body by substrate lifting tool; Substrate is declined substrate to be placed on the surface of the second plate body; Substrate is risen from the surface of the second plate body substrate to be unloaded from the second plate body; And after substrate being risen from the surface of the second plate body and the 3rd plate body is moved to the second place, substrate is declined substrate to be placed on the surface of the 3rd plate body.
In one embodiment, when device comprises the 3rd plate body and the second plate body is configured with substrate lifting tool, lifting tool comprises one second group of extending and regain thimble, have one first group of gap in first plate body, first group of gap can extend to the moving direction of the first plate body and align with second group of thimble on the moving direction of the first plate body; Have one second group of gap in 3rd plate body, second group of gap can extend to the moving direction of the 3rd plate body and align with second group of thimble on the moving direction of the 3rd plate body; And when the first plate body or the 3rd plate body are in the second place, second group of thimble can extend through second group of gap in first group of gap of the first plate body or the 3rd plate body.First plate body is configurable one first group of thimble also, and when the first plate body is in primary importance, first group of thimble can extend through first group of gap in the first plate body, and first group of thimble is recoverable.3rd plate body is configurable 1 the 3rd group of thimble also, and when the 3rd plate body is in the 3rd position, the 3rd group of thimble can extend through second group of gap in the 3rd plate body, and thimble is recoverable.
In one embodiment, when device comprises the 3rd plate body, the first plate body, the second plate body and the 3rd plate body can sequential in a single direction.In another embodiment, the first plate body and the second plate body can arrange in a first direction, and the second plate body and the 3rd plate body can arrange in a second direction, and wherein first direction is different from second direction.
In one embodiment, above-mentioned transmitted substrate is wafer.
By technique scheme, substrate conveying method of the present invention and device thereof at least have following advantages and beneficial effect:
Add plate body to transmit substrate far faster than use robotic arm owing to directly using, therefore use transfer approach of the present invention or device significantly can reduce the delivery time.Thus, by the method being applied to the hot manufacturing process using two or more quantity heating plates, the production capacity of hot manufacturing process can be made to be improved.
In addition, when transfer approach of the present invention is applied to the hot manufacturing process between two or more quantity heating plates that substrate need be sent to and be set in different temperatures, effectively can reduce the decline of temperature in transport process based on significantly reducing the delivery time, thus more easily controlling thermal dose.Therefore, when hot manufacturing process be two step photoresistance reheating stream manufacturing process to reduce patterns of openings time, more easily control reduction and the critical size (CD) of opening.
In sum, the present invention has significant progress technically, has obvious good effect, is really a new and innovative, progressive, practical new design.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to technological means of the present invention can be better understood, and can be implemented according to the content of specification, and can become apparent to allow above and other object of the present invention, feature and advantage, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, be described in detail as follows.
Accompanying drawing explanation
Fig. 1 is the temperature curve of the photoresistance reheating stream manufacturing process of the hot manufacturing process of existing known a kind of two step.
Fig. 2 A is the schematic top plan view of the hot manufacturing process equipment of use two heating plates according to first embodiment of the invention.
Fig. 2 B is the generalized section of Fig. 2 A along A-A ' hatching.
Fig. 3 A to Fig. 3 I illustrates the schematic diagram according to the hot manufacturing process of use two heating plates of first embodiment of the invention.
Fig. 4 is the schematic top plan view of the hot manufacturing process equipment of use two heating plates according to second embodiment of the invention.
Fig. 5 A to Fig. 5 E illustrates the hot schematic diagram of fabrication technology according to use two heating plates of third embodiment of the invention.
10,10 ': wafer 100: substrate
110: patterning photoresist layer 120: opening
120a: result opening 200,400: equipment
210,410,510: the first heating plate 220,420,520: the second heating plates
230,430: coldplate 240,440,450: track
212,222,232,412,422,432,512,522: thimble
214,234,414,434: gap T1: the first temperature
T2: the second temperature t1, t2, t3, t4: time point
Embodiment
For further setting forth the present invention for the technological means reaching predetermined goal of the invention and take and effect, below in conjunction with accompanying drawing and preferred embodiment, the substrate conveying method propose foundation the present invention and the embodiment of device, method, step, structure, feature and effect thereof, be described in detail as follows.
Following embodiment is used to further illustrate the present invention, but and is not used to limit scope of the present invention.For example, although the substrate carrying out transmitting in embodiment is the follow-up wafer heated on hot plate in advance, but consider transfer mechanism, also optionally can use any other kind substrate needing to carry out any other kind process on any other kind plate body.Moreover, although substrate lifting tool comprises one group of thimble in embodiments, also can optionally comprise other mechanism in other embodiments.
In addition, the orientation of two heating plates, the second heating plate are not necessarily identical or mutually vertical with the orientation of coldplate.The height of immovable heating plate also can close to movable heating plate and movable coldplate the height in its home position.And movable heating plate and coldplate not only can move horizontally, different mechanisms also can be utilized a little vertically mobile to cross the second heating plate.
In addition, although the hot manufacturing process in any embodiment uses two heating plates to carry out twice heating steps respectively, substrate conveying method of the present invention easily can be applied to any hot manufacturing process using three or more quantity heating plate, to carry out heating steps three times or more, wherein one or more heating plates can move.
Fig. 2 A is the schematic top plan view of the hot manufacturing process equipment of use two heating plates according to first embodiment of the invention, and Fig. 2 B is the generalized section of Fig. 2 A along A-A ' hatching.
Please refer to shown in Fig. 2 A, Fig. 2 B, equipment 200 comprises the first heating plate 210, second heating plate 220, coldplate 230 and two tracks 240, wherein the first heating plate 210, second heating plate 220 and coldplate 230 sequential in a single direction.First heating plate 210 is configured with three thimbles 212 that can extend (dotted outline) and regain (solid line portion), second heating plate 220 is configured with three thimbles 222 that can extend (dotted outline) and regain (solid line portion), and coldplate 230 is configured with three thimbles 232 that can extend (dotted outline) and regain (solid line portion).There are in first heating plate 210 two gaps 214, and three thimbles 212 can extend through gap 214.There are in coldplate 230 two gaps 234, and three thimbles 232 can extend through gap 234.
First heating plate 210 can move to above the second heating plate 220 along track 240, and then movement is gone back again.Each gap 214 in first heating plate 210 can extend to the moving direction of the first heating plate 210, and the gap 214 that the thimble 222 of the second heating plate 220 can align in the first heating plate 210 in the direction of movement.Thus, when the first heating plate 210 is above the second heating plate 220, thimble 222 can extend through gap 214 to contact substrate (not illustrating); And when thimble 222 extends and the first heating plate 210 is moved into above the second heating plate 220, gap 214 makes thimble 222 be passed through.
Coldplate 230 can move to above the second heating plate 220 along track 240 on the direction being same as the first heating plate 210 moving direction, and then movement is gone back again.Each gap 234 in coldplate 230 can extend to the moving direction of coldplate 230, and the gap 234 that the thimble 222 of the second heating plate 220 can align in coldplate 230 in the direction of movement.Therefore, when coldplate 230 is above the second heating plate 220, thimble 222 can extend through gap 234 to contact substrate (not illustrating); And when thimble 222 extends and coldplate 230 is moved into above the second heating plate 220, gap 234 makes thimble 222 be passed through.
Fig. 3 A to Fig. 3 I illustrates the hot manufacturing process according to use two heating plates of the first embodiment, and wherein hot manufacturing process uses equipment 200 as shown in Figure 2 A.
Please refer to shown in Fig. 3 A, when initial condition, movable first heating plate 210 all remains on its home position with movable coldplate 230, and whole thimbles 212,222,232 is all regain.
Please refer to shown in Fig. 2 A, Fig. 2 B and Fig. 3 B, the thimble 212 of the first heating plate 210 extends through the gap 214 in the first heating plate 210.Utilizing the bogey as robotic arm to be placed on thimble 212 by wafer 10, wafer 10 is such as have the patterning photoresist layer carrying out reheating stream in advance.Have the opening (as shown in Figure 1) carrying out dimension reduction in advance in patterning photoresist layer, its split shed is such as contact window.
Please refer to shown in Fig. 3 C, regain the thimble 212 of the first heating plate 210 to be placed on the first heating plate 210 by wafer 10, and wafer 10 is carried out to first heating steps of lasting first period at a first temperature.
Please refer to shown in Fig. 2 A, Fig. 2 B and Fig. 3 D, after the first heating steps completes, first heating plate 210 is moved into the top of the second heating plate 220 together with the wafer 10 on it, and the thimble 222 of the second heating plate 220 can extend through the gap 214 in the first heating plate 210, to be risen from the surface of the first heating plate 210 by wafer 10.
Please refer to shown in Fig. 2 A, Fig. 2 B and Fig. 3 E, the first heating plate 210 is retracted its home position, and wherein the thimble 222 of the second heating plate 220 can by the gap 214 in the first heating plate 210.Then, regain thimble 222 so that wafer 10 is placed on the second heating plate 220, and wafer 10 is carried out to second heating steps of the lasting second phase at the second temperature.In addition, after the first heating plate 210 is retracted its home position, another wafer 10 ' also can be transferred into the first heating plate 210, and while wafer 10 carries out the second heating steps, can carry out the first heating steps to wafer 10 '.Thus, the effect of process multi-disc substrate continuously can be reached.
As shown in Fig. 3 D and 3E, wafer 10 is sent to time needed for the second heating plate 220 about only 0.5-1 second, far fewer than the time (about 8-15 second) used needed for robotic arm.
Please refer to shown in Fig. 2 A, Fig. 2 B and Fig. 3 F, after the second heating steps completes, the thimble 222 of the second heating plate 220 can extend to be risen from the second heating plate 220 by wafer 10.Coldplate 230 can move between the second heating plate 220 and wafer 10, and wherein the thimble 222 of the second heating plate 220 can by the gap 234 in coldplate 230.The temperature of coldplate 230 can be set among a small circle usually.
Please refer to shown in Fig. 3 G, regain thimble 222 to be placed on coldplate 230 by wafer 10, then coldplate 230 is retracted its home position.Afterwards, the cooling step between the lasting third phase is carried out to wafer 10.
When wafer 10 being such as when having the patterning photoresist layer carrying out reheating stream in advance, the first temperature is about 125-135 DEG C usually, and first period is about 45-120 second, second temperature is about 145-160 DEG C, the second phase is about 45-120 second, and the temperature of coldplate 230 is about 20-23 DEG C, about 45-120 second between the third phase.
Please refer to shown in Fig. 2 A, Fig. 2 B and Fig. 3 H, after cooling step completes, the thimble 232 of coldplate 230 can extend through the gap 234 in coldplate 230, to be risen from coldplate 230 by wafer 10.
Please refer to shown in Fig. 3 I, the wafer 10 risen from coldplate 230 such as can be sent to other places (not illustrating) by robotic arm, and regains thimble 232 and get back to initial condition as shown in Figure 3A to make equipment.
Although the first heating plate in the above-described first embodiment, the second heating plate and coldplate are sequential in a single direction, the orientation of the first heating plate and the second heating plate is optionally different from the orientation of the second heating plate and coldplate.Fig. 4 is the schematic top plan view of this kind of hot manufacturing process equipment 400 of use two heating plates according to second embodiment of the invention, and wherein the orientation of the first heating plate 410 and the second heating plate 420 is perpendicular to the orientation of the second heating plate 420 with coldplate 430.
Please refer to shown in Fig. 4, the first heating plate 410 is configured with three thimbles 412, second heating plate 420 and is configured with three thimbles 422, and coldplate 430 is configured with three thimbles 432, and wherein thimble 412,422,432 can extend as the aforementioned and regain.There are in first heating plate 410 two gaps 414, and three thimbles 412 can extend through gap.There are in coldplate 430 three gaps 434, and three thimbles 432 can extend through gap 434.
First heating plate 410 can move to above the second heating plate 420 along track 440, and then movement is gone back again.Each gap 414 in first heating plate 410 can extend to the moving direction of the first heating plate 410, and the gap 414 that the thimble 422 of the second heating plate 420 can align in the first heating plate 410 in the direction of movement.Therefore, when the first heating plate 410 is above the second heating plate 420, thimble 422 can extend through gap 414 to contact substrate (not illustrating); And when thimble 422 extends and the first heating plate 410 is moved into above the second heating plate 420, gap 414 makes thimble 422 be passed through.
Coldplate 430 can move to above the second heating plate 420 along track 450 on the direction perpendicular to the first heating plate 410 moving direction, and then movement is gone back again.Each gap 434 in coldplate 430 can extend to the moving direction of coldplate 430, and the gap 434 that the thimble 422 of the second heating plate 420 can align in coldplate 430 in the direction of movement.Therefore, when coldplate 430 is above the second heating plate 420, thimble 422 can extend through gap 434 to contact substrate (not illustrating); And when thimble 422 extends and coldplate 430 is moved into above the second heating plate 420, gap 434 makes thimble 422 be passed through.
In addition, although substrate is first heated on movable heating plate, substrate is optionally first heated on immovable heating plate.Fig. 5 A to Fig. 5 E illustrates the hot manufacturing process according to use two heating plates of third embodiment of the invention, and wherein used equipment comprises movable first heating plate 510 and the second heating plate 520.First heating plate 510 and the second heating plate 520 are configured with thimble 512,522 respectively, and thimble 512,522 is mechanically similar to the thimble 212,222 described in the first embodiment.Movable coldplate can also to be configured in after next-door neighbour first heating plate 510 and higher than the first heating plate 510, to accept from the first heating plate 510 and to cool substrate.Or immovable coldplate can be configured in after next-door neighbour first heating plate 510 and thus can to transmit substrate to coldplate to cool substrate lower than the first heating plate 510, first heating plate.
Please refer to shown in Fig. 5 A, when initial condition, movable first heating plate 510 remains on its home position, and whole thimbles 512,522 is all regain.
Please refer to shown in Fig. 5 B, the thimble 522 of the second heating plate 520 can extend, and utilizes the bogey as robotic arm to be placed on thimble 522 by wafer 10.
Please refer to shown in Fig. 5 C, regain the thimble 522 of the second heating plate 520 to be placed on the second heating plate 520 by wafer 10, and carry out the first heating steps on the second heating plate 520.
Please refer to shown in Fig. 5 D, after the first heating steps, thimble 522 can extend to be risen from the second heating plate 520 by wafer 10.Moved to by first heating plate 510 between second heating plate 520 and wafer 10, wherein thimble 522 by the gap (not illustrating) in the first heating plate 510, can pass through the gap 234 in coldplate 230 just as the thimble 222 described in the first embodiment.
Please refer to shown in Fig. 5 D and Fig. 5 E, regain thimble 522 to be placed on by wafer 10 on first heating plate 510, then the first heating plate 510 moves back to its home position together with the wafer 10 on it, to carry out the second heating steps.
Owing to directly using heating plate to transmit substrate far faster than use robotic arm, therefore use transfer approach of the present invention significantly can reduce the delivery time, the production capacity of hot manufacturing process is improved.For example, in the hot manufacturing process only including two each heating stepses of 60 seconds, and hot manufacturing process uses two heating plates with continuation mode process more wafers (10,10 ') as shown in FIGURE 3 E, every sheet substrate average handling time of robotic arm is used to be about 68-75 second, use every sheet substrate average handling time of movable heating plate to be about 60.5-61 second, and use the delivery time of movable heating plate and robotic arm to be about 0.5-1 and 8-15 second respectively.Therefore, movable heating plate is used can to contribute to making the production capacity increase about 11-24% ((1/60.5-1/75)/(1/75) ≈ 24%, (1/61-1/68)/(1/68) ≈ 11%) of hot manufacturing process.
Moreover, when transfer approach of the present invention is applied to the hot manufacturing process between two or more quantity heating plates that substrate need be sent to and be set in different temperatures, effectively can reduce the decline of temperature in transport process based on significantly reducing the delivery time, thus more easily controlling thermal dose.Therefore, when hot manufacturing process be two step photoresistance reheating stream manufacturing process to reduce patterns of openings time, more easily control reduction and the critical size (CD) of opening.
The above, it is only preferred embodiment of the present invention, not any pro forma restriction is done to the present invention, although the present invention discloses as above with preferred embodiment, but and be not used to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be do not depart from technical solution of the present invention content, according to any simple modification that technical spirit of the present invention is done above embodiment, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (9)
1. a substrate conveying method, is characterized in that it comprises the following steps:
The surface of one first plate body of a primary importance provides a substrate;
This first plate body is moved to a second place of the upper space being positioned at one second plate body from this primary importance, and this first plate body only moves in this primary importance and between this second place of a upper space of this second plate body;
This substrate is risen from the surface of this first plate body;
This first plate body is removed from this second place;
By this substrate on the surface that this upper space is put into this second plate body;
This substrate is risen from the surface of this second plate body;
One the 3rd plate body is moved to the space between this substrate and this second plate body;
This substrate is placed on the surface of the 3rd plate body; And
3rd plate body is moved to one the 3rd position from this upper space of this second plate body;
Wherein, the step this substrate risen from the surface of this first plate body, the step this substrate be placed on the surface of this second plate body, the step this substrate risen from this second plate body surface, the step this substrate be placed on the surface of the 3rd plate body use one group of thimble, this group thimble from the surface elongation of this second plate body and withdrawal, and
In the step that this substrate is risen from the surface of this first plate body with the step that this first plate body is removed from this second place, this group thimble is by first group of gap in this first plate body, this first group of gap extends to the moving direction of this first plate body and aligns with this group thimble on the moving direction of this first plate body, and in the step the 3rd plate body being moved to this space between this substrate and this second plate body and the step this substrate being placed on the surface of the 3rd plate body, this group thimble is by second group of gap in the 3rd plate body, this second group of gap extends to the moving direction of the 3rd plate body and aligns with this group thimble on the moving direction of the 3rd plate body.
2. substrate conveying method according to claim 1, is characterized in that, wherein
This first plate body and this second plate body are heating plate, to heat this substrate,
The surface of described heating plate has different heating-up temperatures, and
3rd plate body is coldplate, to cool this substrate.
3. substrate conveying method according to claim 1, is characterized in that, wherein this substrate is wafer.
4. a substrate conveying device, is characterized in that, it comprises:
One first plate body, has surface to carry a substrate;
One second plate body, has surface to carry this substrate; And
One the 3rd plate body, has surface to carry this substrate;
Wherein, this first plate body only moves in a primary importance and between a second place of a upper space of this second plate body, 3rd plate body moves between this second place and one the 3rd position, this primary importance by this base load on this first plate body, and in this second place this substrate unloaded from this first plate body and be put on the surface of this second plate body; By this substrate from this second plate body unloading after, this second place by this base load on the surface of the 3rd plate body;
It also comprises one second group of thimble, and this second group of thimble can extend and regain,
Have one first group of gap in this first plate body, this first group of gap extends to the moving direction of this first plate body and aligns with this second group of thimble on the moving direction of this first plate body,
Have one second group of gap in 3rd plate body, this second group of gap extends to the moving direction of the 3rd plate body and aligns with this second group of thimble on the moving direction of the 3rd plate body, and
When this first plate body or the 3rd plate body are in this second place, this second group of thimble extends through this first group of gap of this first plate body or this second group of gap of the 3rd plate body.
5. substrate conveying device according to claim 4, is characterized in that, wherein
This first plate body and this second plate body are heating plate, to heat this substrate,
The surface of described heating plate has different heating-up temperatures, and
3rd plate body is coldplate, to cool this substrate.
6. substrate conveying device according to claim 4, is characterized in that, wherein
This first plate body is configured with one first group of thimble, and when this first plate body is in this primary importance, this first group of thimble extends through this first group of gap in this first plate body, and this first group of thimble can be regained, and
3rd plate body is configured with one the 3rd group of thimble, and when the 3rd plate body is in the 3rd position, the 3rd group of thimble extends through this second group of gap in the 3rd plate body, and the 3rd group of thimble can be regained.
7. substrate conveying device according to claim 4, is characterized in that, wherein this first plate body, this second plate body and the 3rd plate body sequential on a single direction.
8. substrate conveying device according to claim 4, it is characterized in that, wherein this first plate body and this second plate body arrange on a first direction, and this second plate body and the 3rd plate body arrange in a second direction, and wherein this first direction is different from this second direction.
9. substrate conveying device according to claim 4, is characterized in that, wherein this substrate is wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910160082.5A CN101964317B (en) | 2009-07-22 | 2009-07-22 | Substrate conveying method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910160082.5A CN101964317B (en) | 2009-07-22 | 2009-07-22 | Substrate conveying method and device |
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