CN101959375A - Full-automatic exposing machine for inner circuit processing - Google Patents
Full-automatic exposing machine for inner circuit processing Download PDFInfo
- Publication number
- CN101959375A CN101959375A CN2009101579307A CN200910157930A CN101959375A CN 101959375 A CN101959375 A CN 101959375A CN 2009101579307 A CN2009101579307 A CN 2009101579307A CN 200910157930 A CN200910157930 A CN 200910157930A CN 101959375 A CN101959375 A CN 101959375A
- Authority
- CN
- China
- Prior art keywords
- table top
- circuit board
- internal layer
- lifting platform
- exposure machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention provides a full-automatic exposing machine for inner circuit processing, which comprises a jacking platform, an input device, an exposing platform and an output device which are arranged on a machine, wherein the jacking platform is used for jacking a circuit board; the input device inputs the circuit board and moves the circuit board to the jacking platform; the exposing platform is arranged above the jacking platform, a tilting table top is pivoted on a fixed frame and a negative film is adhered to the tilting table top; and the output device moves the circuit board out of the jacking platform and outputs the circuit board. In the invention, the exposing platform is designed to be tilted for enlarging working space, and the shortcoming of the narrow working space of the conventional fixed exposing platform is overcome.
Description
Technical field
The present invention relates to exposure machine, relate in particular to a kind of exposure stage and enlarge spacing is set, with the fully automatic exposure machine of the internal layer circuit processing procedure that increases working space for lifting formula.
Background technology
Printed circuit board (PCB) (Printed Circuit Board, PCB) be to be aided with the formed structural member of lead with insulating material, be tending towards under the multi-functional complicated preceding topic at electronic product, the contact distance of integrated circuit elements is dwindled thereupon, the speed that signal transmits then improves relatively, the thing followed is the raising of wiring quantity, the length locality of distribution shortens between point, these just need utilize high-density line configuration and micropore technology to finish, but, utilize distribution and cross-over connection to reach highdensity and be connected, basically to single sided board (Single Sided Board) or double sided board (Double Sided Board) and the difficulty that Yan Youqi finishes.Therefore circuit board moves towards multiple stratification, is a kind of corollary.So multilayer board (Multilayer Printed Circ
UiT Board) use will be more general, with the design in response to the continuous increase of signal line and more bus plane and ground plane.
Secondly, multilayer board typically uses the thin copper foil substrate, forms the inner plating production process on its surface, and its flow process is roughly as follows:
Chemistry pre-treatment (Pretreatment) → press mold (D/F Lamination) → exposure (Exposure) → development/etching/striping (Developing/Etching/Stripping) → automatic visual inspection (A01) → pressed sheet registration holes (Punch Hole) → pressing plate.
Wherein, above-mentioned exposure manufacture process, be after the photoresistance film forms, ultraviolet exposure is surely carried out in the egative film combination that circuit board is made according to firsthand information, sorts by the zone of egative film, the ultraviolet ray district of exposing to the sun can produce chemical reaction, thereby form reaction zone and non-reaction zone, be insoluble for minus film reaction zone, for the eurymeric film then reaction zone be solubility.
Again, the light source of exposure can divide parallel and non-parallel light source, cooperates different photoresistances and different selectivity is arranged.Again, exposure machine can be divided into: manual exposure machine, automatic exposure machine and semi-automatic exposure machine haply as with institutional classification.Common manual exposure machine is to expose simultaneously with two-sided, is equiped with two cover exposure frame on the board, just carries out a batch exposure after imposing a condition, and the alignment system majority carries out with artificial, reference pins or indirect labor's alignment system.Automatic exposure machine reads egative film and circuit board reference position then with solid-state video camera, overlaps the operation of position automatically, enters the allowed band post-exposure through system comparison residual quantity, in the operation once simultaneously to expose.In addition, semi-automatic exposure machine is then between manual and automatic exposure machine.And the problem that institute of the present invention desire is discussed is the fully automatic exposure machine at the internal layer circuit processing procedure of multilayer circuit.
As shown in Figure 1, the existing fully automatic exposure machine that is applied to circuit board internal layer exposure manufacture process, be that an exposure stage 10 of pasting for egative film 60 is fixedly installed on a lifting platform 20 tops, by an input unit 30 input circuit plates 50 and transfer load to this lifting platform 20,20 of this lifting platforms are with circuit board 50 upwards jackings, make circuit board 50 abut in egative film 60 and carry out exposure program, after exposure program is finished, this lifting platform 20 position originally that descends back, circuit board 50 after will being exposed by an output device 40 again, these lifting platform 20 transfers are come out and are exported certainly.
Because in order to allow circuit board 50 can be posted by egative film 60 fast, this exposure stage 10 is the smaller the better with the spacing d that is provided with of lifting platform 20, spacing d is much more general to adopt minimized design so this is provided with, as long as just allow this input unit 30 can be at these lifting platform 200 circuits plates 50 with output device 40.But, because of this is provided with spacing d also for operating personnel are pasted on the working space of exposure stage 10 with egative film 60, and the existing project organization of this exposure stage 10 is fixed, narrow working space, carrying out egative film 60 for operating personnel and change stickup or cleaning, very is inconvenience.
Summary of the invention
Main purpose of the present invention is to overcome the above-mentioned shortcoming that existing product exists, and provide a kind of fully automatic exposure machine of internal layer circuit processing procedure, it is designed to exposure stage can lift formula, to increase working space, overcomes existing fixed exposure stage and causes the narrow defective of working space.
The objective of the invention is to realize by following technical scheme.
The fully automatic exposure machine of internal layer circuit processing procedure of the present invention is characterized in that, it is provided with at a board: a lifting platform, in order to jacking that circuit board is made progress; One input unit, the input circuit plate also transfers load to this lifting platform; One exposure stage is arranged on the top of this lifting platform, is hubbed on a fixed frame and lift table top with one, and this lifts table top and pastes for egative film; One output device comes out circuit board and export from this lifting platform transfer.
The fully automatic exposure machine of aforesaid internal layer circuit processing procedure, wherein exposure stage is provided with detent mechanism lifting between table top and the fixed frame.
The fully automatic exposure machine of aforesaid internal layer circuit processing procedure, wherein fixed frame is provided with and will lifts the corner cylinder of table top compacting.
The fully automatic exposure machine of aforesaid internal layer circuit processing procedure wherein lifts table top and is gone up the top by the jacking cylinder.
The fully automatic exposure machine of aforesaid internal layer circuit processing procedure wherein lifts table top and gives folding by push-and-pull cylinder and pivot link.
The beneficial effect of the fully automatic exposure machine of internal layer circuit processing procedure of the present invention, architectural feature of the present invention are to be provided with at a board: a lifting platform, in order to jacking that circuit board is made progress; One input unit, the input circuit plate also transfers load to this lifting platform; One exposure stage is arranged on the top of this lifting platform, is hubbed on a fixed frame and lift table top with one, and this lifts table top and pastes for egative film; One output device comes out circuit board and export from this lifting platform transfer.
In addition, this exposure stage is to be provided with detent mechanism lifting between table top and the fixed frame.Again, this fixed frame is provided with and will lifts the corner cylinder of table top compacting.In addition, this lifts table top and is gone up the top by the jacking cylinder.Moreover this lifts table top and gives folding by push-and-pull cylinder and pivot link.
It is designed to exposure stage can lift formula, to increase working space, overcomes existing fixed exposure stage and causes the narrow defective of working space.
Description of drawings:
Fig. 1 is existing fully automatic exposure machine structural representation.
Fig. 2 is an overall structure schematic diagram of the present invention, shows that lifting table top covers state.
Fig. 3 is an overall structure schematic diagram of the present invention, shows that lifting table top raises state.
Fig. 4 is an exposure stage structure vertical view of the present invention.
Fig. 5 is an exposure stage structure side view of the present invention.
Major label description in figure: 10 exposure stage, 20 lifting platforms, 30 input units, 40 output devices, 50 circuit boards, 60 egative films, 80 exposure stage, 81 are lifted table top, 82 fixed frames, 83 corner cylinders, 84 detent mechanisms, 85 push-and-pull cylinders, 86 pivot links, 87 jacking cylinders.
Embodiment
As Fig. 2, shown in Figure 3, the present invention is provided with at a board: a lifting platform 20, in order to jackings that circuit board 50 is made progress; One input unit 30, input circuit plate 50 also transfers load to this lifting platform 20; One exposure stage 80 is arranged on the top of this lifting platform 20, is hubbed on a fixed frame 82 and lift table top 81 with one, and this lifts table top 81 and pastes for egative films 60, and is provided with the corner cylinder 83 that will lift table top 81 compactings at fixed frame 82; So when this lifted table top 81 and raises, the spacing that is provided with that itself and lifting platform are 20 was expanded as D by d; One output device 40 comes out circuit board 50 and export from these lifting platform 20 transfer.
As Fig. 4, shown in Figure 5, this exposure stage 80 is to be provided with detent mechanism 84 lifting between table top 81 and the fixed frame 82, is lifting table top 81 by raising when replying the state that covers, and the position that is positioned to fix is in order to avoid the precision of influence exposure; Again, this lifts table top 81 and gives folding by push-and-pull cylinder 85 and pivot link 86; In addition, this lifts table top 81 and is gone up the top by jacking cylinder 87, the action of raising again.
Based on above-mentioned formation, the present invention is with exposure stage, be designed to lift formula by the improvement of existing fixed formula, thereby allow and spacing is set expands as D by d, the handled easily personnel carry out egative film 60 and change stickup or cleaning, have exposure stage is designed to lift formula, to increase the effect of working space.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, every foundation technical spirit of the present invention all still belongs in the scope of technical solution of the present invention any simple modification, equivalent variations and modification that above embodiment did.
Claims (5)
1. the fully automatic exposure machine of an internal layer circuit processing procedure is characterized in that, it is provided with at a board:
One lifting platform is in order to jacking that circuit board is made progress;
One input unit, the input circuit plate also transfers load to this lifting platform;
One exposure stage is arranged on the top of this lifting platform, is hubbed on a fixed frame and lift table top with one, and this lifts table top and pastes for egative film;
One output device comes out circuit board and export from this lifting platform transfer.
2. the fully automatic exposure machine of internal layer circuit processing procedure according to claim 1 is characterized in that, described exposure stage is provided with detent mechanism lifting between table top and the fixed frame.
3. the fully automatic exposure machine of internal layer circuit processing procedure according to claim 2 is characterized in that, described fixed frame is provided with and will lifts the corner cylinder of table top compacting.
4. the fully automatic exposure machine of internal layer circuit processing procedure according to claim 1 is characterized in that, the described table top that lifts is gone up the top by the jacking cylinder.
5. according to the fully automatic exposure machine of claim 1,2,3 or 4 described internal layer circuit processing procedures, it is characterized in that the described table top that lifts gives folding by push-and-pull cylinder and pivot link.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101579307A CN101959375A (en) | 2009-07-17 | 2009-07-17 | Full-automatic exposing machine for inner circuit processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101579307A CN101959375A (en) | 2009-07-17 | 2009-07-17 | Full-automatic exposing machine for inner circuit processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101959375A true CN101959375A (en) | 2011-01-26 |
Family
ID=43486364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101579307A Pending CN101959375A (en) | 2009-07-17 | 2009-07-17 | Full-automatic exposing machine for inner circuit processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101959375A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103019041A (en) * | 2012-11-26 | 2013-04-03 | 京东方科技集团股份有限公司 | Exposure machine |
-
2009
- 2009-07-17 CN CN2009101579307A patent/CN101959375A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103019041A (en) * | 2012-11-26 | 2013-04-03 | 京东方科技集团股份有限公司 | Exposure machine |
| CN103019041B (en) * | 2012-11-26 | 2014-10-22 | 京东方科技集团股份有限公司 | Exposure machine |
| US9436100B2 (en) | 2012-11-26 | 2016-09-06 | Boe Technology Group Co., Ltd. | Exposure machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101594745B (en) | Improved structure of registration of upper and lower films and electronic circuit board | |
| CN108231852B (en) | Preparation method of display panel | |
| US9198298B2 (en) | Method for manufacturing transparent printed circuit and method for manufacturing transparent touch panel | |
| CN104360768B (en) | Touch-control display module and electronical display product | |
| US11545607B2 (en) | Upper substrate for miniature LED component, miniature LED component, and miniature LED display device | |
| CN102647856A (en) | Method for producing COF (Chip on Film) flexible printed circuit board | |
| CN102480845A (en) | Manufacturing method of flexible printed circuit (FPC) | |
| CN110324982A (en) | A kind of PCB printing ink printing art method | |
| CN106201041A (en) | A kind of touch screen preparation method | |
| CN102595795A (en) | Method for making double-sided flexible printed circuit board by using pure copper plate as base material | |
| JP6821060B2 (en) | Electrode substrate for transparent light emitting element display and its manufacturing method | |
| CN101959375A (en) | Full-automatic exposing machine for inner circuit processing | |
| CN100399114C (en) | Method for combining display panel and back light module | |
| CN104051278B (en) | The molding milling method of DBC ceramic substrate | |
| KR20140135667A (en) | Vertical conductive unit and manufacturing method thereof | |
| CN102497740B (en) | Laminator for laminating coverage film of flexible circuit board and method for laminating coverage film by using laminator | |
| CN105307388A (en) | Operation method of FPC (flexible circuit board) line PIN alignment | |
| CN207560447U (en) | A kind of sheet sticking structure of the dotted stiffening plate of flexible circuit board | |
| CN201489272U (en) | Full-automatic exposure machine | |
| CN107957544A (en) | A kind of LCD circuit board installation frames | |
| CN103324375A (en) | Capacitive touch screen and manufacture method thereof | |
| CN107896419A (en) | A kind of PCB structure and its manufacture craft | |
| CN208922018U (en) | A kind of novel liquid crystal display module | |
| CN202535648U (en) | Film structure for circuit board | |
| CN207053913U (en) | A kind of circuit board fast wiring device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20110126 |
|
| C20 | Patent right or utility model deemed to be abandoned or is abandoned |