CN101943863A - Photosensitive resin composition for black resist, and light shielding film of color filter - Google Patents
Photosensitive resin composition for black resist, and light shielding film of color filter Download PDFInfo
- Publication number
- CN101943863A CN101943863A CN2010101286898A CN201010128689A CN101943863A CN 101943863 A CN101943863 A CN 101943863A CN 2010101286898 A CN2010101286898 A CN 2010101286898A CN 201010128689 A CN201010128689 A CN 201010128689A CN 101943863 A CN101943863 A CN 101943863A
- Authority
- CN
- China
- Prior art keywords
- carbon number
- black resist
- photosensitive polymer
- polymer combination
- composition
- Prior art date
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- Granted
Links
- 239000011342 resin composition Substances 0.000 title abstract description 5
- 150000001875 compounds Chemical class 0.000 claims abstract description 38
- -1 methylacryloyl group Chemical group 0.000 claims abstract description 31
- 229920005989 resin Polymers 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 25
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000000178 monomer Substances 0.000 claims abstract description 15
- 230000001588 bifunctional effect Effects 0.000 claims abstract description 11
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims abstract description 8
- 239000000376 reactant Substances 0.000 claims abstract description 5
- 150000001735 carboxylic acids Chemical class 0.000 claims abstract description 3
- 239000000203 mixture Substances 0.000 claims description 67
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 46
- 229910052799 carbon Inorganic materials 0.000 claims description 46
- 229920000642 polymer Polymers 0.000 claims description 41
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 15
- 239000004593 Epoxy Substances 0.000 claims description 14
- 125000000217 alkyl group Chemical group 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 239000012860 organic pigment Substances 0.000 claims description 10
- 125000003118 aryl group Chemical group 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 238000011161 development Methods 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 9
- 239000006185 dispersion Substances 0.000 claims description 8
- 125000005843 halogen group Chemical group 0.000 claims description 8
- 125000005641 methacryl group Chemical group 0.000 claims description 8
- 239000006229 carbon black Substances 0.000 claims description 6
- 125000003545 alkoxy group Chemical group 0.000 claims description 5
- 125000000304 alkynyl group Chemical group 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
- 238000012216 screening Methods 0.000 claims description 5
- 125000002769 thiazolinyl group Chemical group 0.000 claims description 5
- 125000005702 oxyalkylene group Chemical group 0.000 claims description 4
- 150000008064 anhydrides Chemical class 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 32
- 239000011521 glass Substances 0.000 abstract description 18
- 239000011159 matrix material Substances 0.000 abstract description 18
- 150000008065 acid anhydrides Chemical class 0.000 abstract description 7
- 238000007789 sealing Methods 0.000 abstract description 5
- 238000002156 mixing Methods 0.000 abstract description 4
- 239000003973 paint Substances 0.000 abstract 2
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 20
- 230000006978 adaptation Effects 0.000 description 15
- 238000012360 testing method Methods 0.000 description 13
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 12
- 239000004973 liquid crystal related substance Substances 0.000 description 12
- 239000002253 acid Substances 0.000 description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 150000003254 radicals Chemical class 0.000 description 10
- 239000000049 pigment Substances 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 235000000126 Styrax benzoin Nutrition 0.000 description 8
- 230000018109 developmental process Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 239000002585 base Substances 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 239000004094 surface-active agent Substances 0.000 description 7
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 6
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 6
- 229930185605 Bisphenol Natural products 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 235000015511 Liquidambar orientalis Nutrition 0.000 description 6
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 6
- 241000736148 Styrax Species 0.000 description 6
- 239000004870 Styrax Chemical class 0.000 description 6
- 239000003513 alkali Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 5
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 4
- 239000006087 Silane Coupling Agent Substances 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- 239000012965 benzophenone Substances 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 229940035423 ethyl ether Drugs 0.000 description 4
- 150000002220 fluorenes Chemical class 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 4
- 150000002576 ketones Chemical class 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 229950004288 tosilate Drugs 0.000 description 4
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 description 3
- FIDRAVVQGKNYQK-UHFFFAOYSA-N 1,2,3,4-tetrahydrotriazine Chemical compound C1NNNC=C1 FIDRAVVQGKNYQK-UHFFFAOYSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 239000001294 propane Substances 0.000 description 3
- 239000003380 propellant Substances 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 150000003918 triazines Chemical class 0.000 description 3
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 2
- GZBSIABKXVPBFY-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GZBSIABKXVPBFY-UHFFFAOYSA-N 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 2
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- WPSWDCBWMRJJED-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol;oxirane Chemical compound C1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 WPSWDCBWMRJJED-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 206010034960 Photophobia Diseases 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 206010070834 Sensitisation Diseases 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- SSOONFBDIYMPEU-UHFFFAOYSA-N [3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propyl] prop-2-enoate Chemical compound OCC(CO)(CO)COCC(CO)(CO)COC(=O)C=C SSOONFBDIYMPEU-UHFFFAOYSA-N 0.000 description 2
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 2
- 150000008062 acetophenones Chemical class 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 229940106691 bisphenol a Drugs 0.000 description 2
- 239000008199 coating composition Substances 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 150000001896 cresols Chemical class 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- UBHZUDXTHNMNLD-UHFFFAOYSA-N dimethylsilane Chemical compound C[SiH2]C UBHZUDXTHNMNLD-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 239000002612 dispersion medium Substances 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- WBJINCZRORDGAQ-UHFFFAOYSA-N ethyl formate Chemical compound CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical group C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 238000005984 hydrogenation reaction Methods 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- 208000013469 light sensitivity Diseases 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229960005235 piperonyl butoxide Drugs 0.000 description 2
- 238000013001 point bending Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000008313 sensitization Effects 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 150000003457 sulfones Chemical class 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N tetrahydrofuran Substances C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- 125000001544 thienyl group Chemical group 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 239000012953 triphenylsulfonium Substances 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- QAEDNLDMOUKNMI-UHFFFAOYSA-O (4-hydroxyphenyl)-dimethylsulfanium Chemical compound C[S+](C)C1=CC=C(O)C=C1 QAEDNLDMOUKNMI-UHFFFAOYSA-O 0.000 description 1
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical compound [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- WGYZMNBUZFHYRX-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-ol Chemical compound COCC(C)OCC(C)O WGYZMNBUZFHYRX-UHFFFAOYSA-N 0.000 description 1
- VDHBXQMYKGNZRP-UHFFFAOYSA-N 1-(2-methylpropoxy)butane Chemical compound CCCCOCC(C)C VDHBXQMYKGNZRP-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- WDFYPITVMAKZRL-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol;2-methyloxirane Chemical compound CC1CO1.OCC(C)(C)CO WDFYPITVMAKZRL-UHFFFAOYSA-N 0.000 description 1
- XZNZSQWHZSUEJJ-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol;oxirane Chemical compound C1CO1.OCC(C)(C)CO XZNZSQWHZSUEJJ-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- HLLZBGMBLQZQJD-UHFFFAOYSA-N 2,6-dibromo-4-(9h-fluoren-1-yl)phenol Chemical class C1=C(Br)C(O)=C(Br)C=C1C1=CC=CC2=C1CC1=CC=CC=C21 HLLZBGMBLQZQJD-UHFFFAOYSA-N 0.000 description 1
- TXYQFJWVHVYIHB-UHFFFAOYSA-N 2,6-dichloro-4-(3,5-dichloro-4-hydroxyphenoxy)phenol Chemical compound C1=C(Cl)C(O)=C(Cl)C=C1OC1=CC(Cl)=C(O)C(Cl)=C1 TXYQFJWVHVYIHB-UHFFFAOYSA-N 0.000 description 1
- BFQFFNWLTHFJOZ-UHFFFAOYSA-N 2-(1,3-benzodioxol-5-yl)-4,6-bis(trichloromethyl)-1,3,5-triazine Chemical compound ClC(Cl)(Cl)C1=NC(C(Cl)(Cl)Cl)=NC(C=2C=C3OCOC3=CC=2)=N1 BFQFFNWLTHFJOZ-UHFFFAOYSA-N 0.000 description 1
- JEUPWQVILXWUFD-UHFFFAOYSA-N 2-(1h-imidazol-2-yl)ethanol Chemical compound OCCC1=NC=CN1 JEUPWQVILXWUFD-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- JVCBVNUOEFLXGK-UHFFFAOYSA-N 2-(2-methoxyphenyl)-1h-imidazole Chemical class COC1=CC=CC=C1C1=NC=CN1 JVCBVNUOEFLXGK-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- KJSGODDTWRXQRH-UHFFFAOYSA-N 2-(dimethylamino)ethyl benzoate Chemical compound CN(C)CCOC(=O)C1=CC=CC=C1 KJSGODDTWRXQRH-UHFFFAOYSA-N 0.000 description 1
- QTUVQQKHBMGYEH-UHFFFAOYSA-N 2-(trichloromethyl)-1,3,5-triazine Chemical class ClC(Cl)(Cl)C1=NC=NC=N1 QTUVQQKHBMGYEH-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- CQOZJDNCADWEKH-UHFFFAOYSA-N 2-[3,3-bis(2-hydroxyphenyl)propyl]phenol Chemical compound OC1=CC=CC=C1CCC(C=1C(=CC=CC=1)O)C1=CC=CC=C1O CQOZJDNCADWEKH-UHFFFAOYSA-N 0.000 description 1
- RZRILSWMGXWSJY-UHFFFAOYSA-N 2-[bis(2-hydroxyethyl)amino]ethanol;sulfuric acid Chemical compound OS(O)(=O)=O.OCCN(CCO)CCO RZRILSWMGXWSJY-UHFFFAOYSA-N 0.000 description 1
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- 238000001259 photo etching Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- CIBMHJPPKCXONB-UHFFFAOYSA-N propane-2,2-diol Chemical compound CC(C)(O)O CIBMHJPPKCXONB-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 150000005201 tetramethylbenzenes Chemical class 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 125000005490 tosylate group Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Optical Filters (AREA)
- Optical Elements Other Than Lenses (AREA)
- Liquid Crystal (AREA)
Abstract
The invention provides a photosensitive resin composition for black resist, which can form a black matrix having high sealing performance and good quality with glass substrate in front of and at the rear of PCT. The photosensitive resin composition for black resist is characterized in that the photosensitive resin composition for black resist contains: (a) bifunctional monomers having totally two ones of any one or two radicals selected from acryloyl group and methylacryloyl group; (b) resin containing unsaturated groups, which is obtained by further acting reactant of compound and (methyl) acrylic acid having more than two epoxy groups with polybasic carboxylic acid or acid anhydride; (c) photopolymerization initiator; and (d) light shielding dispersing liquid containing more than one light shielding compounds selected from black organic paint, color mixing organic paint and light shielding material.
Description
Technical field
The present invention relates to black resist (black resist) with photosensitive polymer combination and color filter (color filter) photomask, particularly, the black resist that relates to the photosensitive, aqueous alkaline solution developable that is suitable on transparency carrier forming fine photomask is with photosensitive polymer combination and the color filter photomask that uses its formation.
Background technology
In all spectras such as LCD TV, monitoring lcd device, color liquid crystal mobile phone, used color LCD screen (liquid crystal panel).Color LCD screen becomes Jie is fitted by substrate and subtend substrate (TFT substrate) that encapsulant will be formed with color filter, is filled with the structure of liquid crystal between two substrates.Wherein, as manufacturing method of color filter, usually use such method: the surface at transparency carriers such as glass, plastic sheets forms the black matrix (black matrix) that suppresses to bring into play the effect that improves contrast by the colour mixture of of all kinds of red, green, blue, then forms the different tones of the red, green, blue of all self-colored effects of performance performance successively according to chromaticity diagram cases such as strip or mosaic shapes.
Endurancing (fail-test) as liquid crystal display, generally carry out PCT (PressureCooker Test, the pressure cooker test), this test method(s) is that liquid crystal display is placed a few hours under the such rigor condition of the air pressure of 120 ℃ temperature, 100% humidity, 2atm, confirms that the liquid crystal of enclosing between the filter substrate of liquid crystal display and the TFT substrate has or not leakage.As mentioned above, black matrix be present in red, green, blue of all kinds between, except the effect that improves contrast, also have function as the housing photomask of color filter, the part of housing photomask is situated between by encapsulant and subtend baseplate-laminating.Even black matrix also required also not take place simultaneously the high dhering strength peeled off with glass substrate under the such rigor condition of PCT.Especially, in recent years in order to improve the visibility of liquid crystal display, the demand height of high shadingization,
In order to realize high shadingization, the thickness of black matrix is thickeied in consideration, if but make thickness blocked up, when forming the pixel of red, green, blue in the manufacturing process afterwards, thickness thickening with the red, green, blue of black matrix intersection produces so-called " horn " step discrepancy in elevation.This " horn " step discrepancy in elevation becomes the reason of liquid crystal aligning disorder, and the visibility that causes shielding reduces, so seeking to realize high shadingization (being the high shadingization of film) under the thickness of not thickening black matrix.
In order to ensure the high shading of film, usually must make the content of the black pigment in the resin combination many, its result, owing to help the resin glue of curable, the cooperation ratio that acrylate becomes to grade to diminish relatively, filming becomes is difficult to abundant curing, film and the adaptation of glass substrate reduces, produce the problem of peeling off easily etc.
Like this owing in recent years the requirement of the adaptation of black matrix and substrate is further improved, all the time to the demand of the high black matrix of the adaptation of glass substrate also in increase.Therefore, for example in patent documentation 1, proposed to be selected from least a in amine silane compound, kitimine silane compound and the isocyanates silane compound by in light-blocking resin composition, adding, thereby the black matrix that does not produce after the PCT test is peeled off the photosensitive polymer combination that adaptation is good.But, see embodiment as can be known, the concentration of carbon black mostly is 40 quality % most with respect to the solid shape branch in the photosensitive polymer combination, for the adaptation under high pigment levels, the leeway of research is arranged.In addition, for the adaptation of glass substrate beyond assessment item, for example photolithographic characteristics, storage stability etc. can not be understood fully.In addition, for not record of the adaptation before the PCT.
[prior art document]
[patent documentation]
[patent documentation 1] spy opens the 2006-330209 communique
Summary of the invention
The problem that invention will solve
The object of the present invention is to provide black resist photosensitive polymer combination, it can be formed in before and after the PCT and the good black matrix (or photomask) of adaptation height, quality of glass substrate, but also is to provide the color filter that is formed by this photosensitive polymer combination photomask.
Be used to solve the means of problem
In order to solve above-mentioned prior art problems point; the inventor furthers investigate; found that by containing with pigment, resin glue and Photoepolymerizationinitiater initiater to add up to and have 2 bifunctional monomers that are selected from the group in acryloyl group and the methacryl; when having high adaptation; can realize the high shadingization of film, thereby finish the present invention.
That is, the present invention is characterized in that containing for black resist photosensitive polymer combination
(a) total has 2 bifunctional monomers that are selected from any one or two kinds of groups in acryloyl group and the methacryl,
(b) contain the resin of unsaturated group, it further obtains with polybasic carboxylic acid or its anhydride reaction by making compound and (methyl) acrylic acid reactant with 2 above epoxy radicals,
(c) Photoepolymerizationinitiater initiater and
(d) light-proofness dispersion liquid, it contains the shading composition more than a kind that is selected from black organic pigment, colour mixture organic pigment and the light screening material.
When any was above below black resist of the present invention satisfied with photosensitive polymer combination, provide preferred black resist photosensitive polymer combination.
1) described (a) adds up to that to have 2 bifunctional monomers that are selected from any one or two kinds of groups in acryloyl group and the methacryl are compounds by following general formula (1) or general formula (2) expression.
(in the formula, R
1And R
2Expression hydrogen atom or methyl can be same to each other or different to each other, and AO and BO represent that carbon number is 2～4 mutually different oxyalkylene.In addition, m and n are the integer more than 0, are the scope of m+n=4～30.)
(in the formula, R
1And R
2Expression hydrogen atom or methyl can be same to each other or different to each other R
3～R
10Representing that independently of one another hydrogen atom, halogen atom, carbon number are that 1～5 alkyl, carbon number are that 1～5 thiazolinyl, carbon number are that 1～5 alkynyl, carbon number are that 5～9 naphthenic base, carbon number are that 6～10 aryl or carbon number are 1～5 alkoxy, X represents-CO-,-SO
2-,-C (CF
3)
2-,-Si (CH
3)
2-,-CH
2-,-C (CH
3)
2-,-O-, 9,9-fluorenyl or singly-bound.AO and BO represent that carbon number is 2～4 mutually different oxyalkylene.In addition, m and n are the integer more than 0, are the scope of m+n=4～30.)
The compound with 2 above epoxy radicals that uses when 2) obtaining (b) composition is for being selected from least a kind of compound by the compound of following general formula (3) and general formula (4) expression.
(in the formula (3), R
11And R
12For hydrogen atom, carbon number are 1～5 alkyl or halogen atom, can be same to each other or different to each other, X represents-CO-,-SO
2-,-C (CF
3)
2-,-Si (CH
3)
2-,-CH
2-,-C (CH
3)
2-,-O-, 9,9-fluorenyl or singly-bound, n are 0～10 integer.)
(in the formula (4), n represents 1～5 integer, R
13～R
16Represent that independently of one another hydrogen atom, carbon number are that 1～5 alkyl, carbon number are that 5～9 naphthenic base or carbon number are 6～10 aryl, R
17～R
27Represent that independently of one another hydrogen atom, halogen atom, carbon number are that 1～5 alkyl, carbon number are that 1～5 thiazolinyl, carbon number are that 1～5 alkynyl, carbon number are that 5～9 naphthenic base, carbon number are that 6～10 aryl or carbon number are 1～5 alkoxy.)
3) (d) the shading composition in the composition is a carbon black.
4) (d) content of the shading composition in the composition is divided into 40～60 quality % with respect to black resist with the solid shape in the photosensitive polymer combination.
5) (c) Photoepolymerizationinitiater initiater be selected from the acyl group oximes Photoepolymerizationinitiater initiater more than a kind or 2 kinds.
In addition, black resist photosensitive polymer combination of the present invention, can be suitable for forming the color filter photomask, in addition, the present invention is the color filter photomask, its by on transparency carrier the coating above-mentioned black resist photosensitive polymer combination, after the drying, obtain by each operation of following necessity: (i) utilize the exposure of ultraviolet exposure apparatus according, (ii) utilize the development of aqueous alkali and (iii) heat burn till.
Below black resist of the present invention is explained with photosensitive polymer combination (below be also referred to as photosensitive polymer combination or composition).It is neccessary composition that composition of the present invention contains (a)～(d) composition.Promptly; (a) total has 2 bifunctional monomers that are selected from any one or two kinds of groups in acryloyl group and the methacryl; (b) contain the resin of unsaturated group; it further obtains with polybasic carboxylic acid or its anhydride reaction by making compound and (methyl) acrylic acid reactant with 2 above epoxy radicals; (c) Photoepolymerizationinitiater initiater; (d) light-proofness dispersion liquid, it contains the shading composition more than a kind that is selected from black organic pigment, colour mixture organic pigment and the light screening material.
Have 2 bifunctional monomers that are selected from any one or two kinds of groups in acryloyl group and the methacryl for total as (a) composition; be preferably compound by above-mentioned general formula (1) or general formula (2) expression; as its instantiation; can enumerate diglycol two (methyl) acrylate; triethylene glycol two (methyl) acrylate; tetraethylene glycol two (methyl) acrylate; nine glycol two (methyl) acrylate; dipropylene glycol two (methyl) acrylate; tripropylene glycol two (methyl) acrylate; four propylene glycol two (methyl) acrylate; 1; 4-butylene glycol two (methyl) acrylate; 1; 5-pentanediol two (methyl) acrylate; 1; 6-hexanediol two (methyl) acrylate; 1,9-nonanediol two (methyl) acrylate; neopentyl glycol two (methyl) acrylate; two (methyl) acrylate of neopentyl glycol ethylene oxide adduct; two (methyl) acrylate of neopentyl glycol propylene oxide adduct; two (methyl) acrylate of bisphenol-A ethylene oxide adduct; two (methyl) acrylate of the propylene oxide adduct of bisphenol-A; two (methyl) acrylate of hydrogenation bisphenol-A ethylene oxide adduct; two (methyl) acrylate of hydrogenation bisphenol-A propylene oxide adduct etc.
In addition; the flatness of the improvement of pattern intensity, patterned surfaces excellent aspect; as required, except the bifunctional monomer of above-mentioned (a) composition, also can add to have and add up to the polyfunctional monomer be selected from any one or two kinds of groups in acryloyl group and the methacryl more than 3.Can enumerate for example trimethylolpropane triacrylate, trimethylol-propane trimethacrylate, pentaerythritol triacrylate, pentaerythritol acrylate trimethyl, tetramethylol methane tetraacrylate, pentaerythrite tetramethyl acrylate, dipentaerythritol tetraacrylate, dipentaerythritol tetramethyl acrylate, dipentaerythritol acrylate, dipentaerythritol hexamethyl acrylate etc.But,, wish below the 20 quality % for bifunctional monomer for the cooperation ratio of these polyfunctional monomers.When surpassing 20 quality %, compare with the situation that bifunctional monomer is independent, the substrate adaptation reduces.
The resin that contains unsaturated group as (b) composition reacts with the compound with 2 above epoxy radicals for making " (methyl) acrylic acid " (it is the connotation of " acrylic acid and/or methacrylic acid "), makes " polybasic carboxylic acid or its acid anhydrides " and " compound with hydroxyl " reaction that obtains obtain " epoxy (methyl) acrylate acid addition product ".Reaction by hydroxyl and polybasic carboxylic acid generates polyester, can be about 2～500 low-molecular-weight resin for its average degree of polymerization.
As " the compound " in (b) composition with 2 above epoxy radicals, but illustration (adjacent,, right-) cresols phenolic resin varnish type epoxy resin, phenol novolak type epoxy resin, bisphenol A type epoxy resin, bisphenol f type epoxy resin, triphenol methane type epoxy resin etc., specifically, can the serve as reasons compound of following general formula (3) or (4) expression, the compound of the following general formula (5) of can serving as reasons in more detail expression.
(in the formula (3), R
11And R
12For hydrogen atom, carbon number are 1～5 alkyl or halogen atom, can be same to each other or different to each other, X represents-CO-,-SO
2-,-C (CF
3)
2-,-Si (CH
3)
2-,-CH
2-,-C (CH
3)
2-,-O-, 9,9-fluorenyl or singly-bound, n are 0～10 integer.)
(in the formula (4), n represents 1～5 integer, R
13～R
16Represent that independently of one another hydrogen atom, carbon number are that 1～5 alkyl, carbon number are that 5～9 naphthenic base or carbon number are 6～10 aryl, R
17～R
27Represent that independently of one another hydrogen atom, halogen atom, carbon number are that 1～5 alkyl, carbon number are that 1～5 thiazolinyl, carbon number are that 1～5 alkynyl, carbon number are that 5～9 naphthenic base, carbon number are that 6～10 aryl or carbon number are 1～5 alkoxy.)
For (b) composition, preferably derived from epoxy compound by above-mentioned general formula (3) or (4) expression.Wherein, the epoxy compound of general formula (3) is derived from bisphenols.Therefore, by the explanation bisphenols, can understand general formula (3) epoxy compound so that with (methyl) acrylic acid reactant, further understand (b) composition, so preferred instantiation is described by bisphenols.
As the bisphenols that produces preferred (b) composition, the bisphenols that can be listed below.Can enumerate: two (4-hydroxy phenyl) ketone, two (4-hydroxyls-3, the 5-3,5-dimethylphenyl) ketone, two (4-hydroxyls-3, the 5-dichlorophenyl) ketone, two (4-hydroxy phenyl) sulfone, two (4-hydroxyls-3, the 5-3,5-dimethylphenyl) sulfone, two (4-hydroxyls-3, the 5-dichlorophenyl) sulfone, two (4-hydroxy phenyl) HFC-236fa, two (4-hydroxyls-3, the 5-3,5-dimethylphenyl) HFC-236fa, two (4-hydroxyls-3, the 5-dichlorophenyl) HFC-236fa, two (4-hydroxy phenyl) dimethylsilane, two (4-hydroxyls-3, the 5-3,5-dimethylphenyl) dimethylsilane, two (4-hydroxyls-3, the 5-dichlorophenyl) dimethylsilane, two (4-hydroxy phenyl) methane, two (4-hydroxyls-3, the 5-dichlorophenyl) methane, two (4-hydroxyls-3, the 5-dibromo phenyl) methane, 2, two (4-hydroxy phenyl) propane of 2-, 2, two (the 4-hydroxyls-3 of 2-, the 5-3,5-dimethylphenyl) propane, 2, two (the 4-hydroxyls-3 of 2-, the 5-dichlorophenyl) propane, 2, two (the 4-hydroxy-3-methyl phenyl) propane of 2-, 2, two (4-hydroxyl-3-chlorphenyl) propane of 2-, two (4-hydroxy phenyl) ether, two (4-hydroxyls-3, the 5-3,5-dimethylphenyl) ether, two (4-hydroxyl-3,5-dichlorophenyl) ether etc.Also having the X in the general formula (3) is 9,9 of 9-fluorenyl, two (4-hydroxy phenyl) fluorenes, 9 of 9-, two (the 4-hydroxy-3-methyl phenyl) fluorenes, 9 of 9-, two (4-hydroxyl-3-chlorphenyl) fluorenes, 9 of 9-, two (4-hydroxyl-3-bromophenyl) fluorenes, 9 of 9-, two (4-hydroxyl-3-fluorophenyl) fluorenes, 9 of 9-, two (the 4-hydroxy 3-methoxybenzene base) fluorenes, 9 of 9-, two (4-hydroxyl-3, the 5-3,5-dimethylphenyl) fluorenes, 9 of 9-, two (the 4-hydroxyls-3 of 9-, the 5-dichlorophenyl) fluorenes, 9, two (4-hydroxyl-3,5-dibromo phenyl) fluorenes of 9-etc.Also can enumerate 4,4 in addition '-xenol, 3,3 '-compound of xenol etc.
As the epoxy compound of general formula (4), as stating, can enumerate (adjacent,, right-) cresols phenolic resin varnish type epoxy resin, phenol novolak type epoxy resin etc.
In addition, " polybasic carboxylic acid or its acid anhydrides " that uses when obtaining (b) composition, can enumerate for example maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, the interior methylene tetrahydrophthalic acid of methyl, HET acid, methyl tetrahydrophthalic acid, trimellitic acid, pyromellitic acid etc., their acid anhydrides also can be enumerated aromatic series polybasic carboxylic acids such as benzophenone tetracarboxylic acid, bibenzene tetracarboxylic, diphenyl ether tetraformic and acid dianhydride thereof etc.In addition, for the usage ratio of acid anhydrides and acid dianhydride, can select to be fit to form the ratio of fine pattern by exposure and alkali development operation.
In addition, the reaction of " compound " and " (methyl) acrylic acid " and " epoxy (methyl) acrylate " (the compound) and the reaction of " polyprotonic acid or its acid anhydrides " that obtain by this reaction with hydroxyl with 2 above epoxy radicals, for example can adopt and spy such as in cellosolve kind solvents such as ethyl cellosolve acetate, butyl cellosolve acetate, under heating, to react and open the known method of putting down in writing in the flat 8-278629 communique etc., but be not particularly limited.In addition,, can only use its a kind, also can use the potpourri more than 2 kinds for the resin that contains unsaturated group of (b) composition that obtains.(b) composition that obtains is owing to have ethylenic unsaturated double-bond and carboxyl concurrently, therefore has effect as cementing agent, in addition, except black resist is given the excellent photo-curable with photosensitive polymer combination, give good development and patterning characteristic (alkali-soluble, alkali-developable), bring the rerum natura of photomask to improve.
For above-mentioned (a) composition and (b) blending ratio of composition, (a)/(b) can be 10/90～50/50 in weight ratio, preferably, can be 20/80～40/60.(a) the cooperation ratio of composition is less than at 10/90 o'clock, and the solidfied material behind the photocuring becomes fragile, and in addition, because the acid number of filming is low, therefore the dissolubility for alkaline developer reduces, and may produce pattern edge and have sawtooth and become rough problem in unexposed.On the contrary, more than 50/50 o'clock, photoreactivity functional group shared ratio in resin is few, the formation of cross-linked structure is insufficient, in addition, the acid number in the resinous principle is spent height, uprises for the dissolubility of the alkaline developer in the exposure portion, the pattern that therefore might produce formation is thinner than target live width, is easy to generate the problem of pattern shortcoming.
As the Photoepolymerizationinitiater initiater of (c) composition, use at least a kind Photoepolymerizationinitiater initiater, but but so long as can cause the compound of compound polymerization, be not particularly limited with ethylenic unsaturated link and addition polymerization.Can enumerate for example acetophenone compounds, compound in triazine class, styrax compounds, benzophenone compound, thioxanthones compounds, glyoxaline compound, acyl group oxime compound etc.
Wherein, as acetophenone compounds, can enumerate oligomer of for example diethoxy acetophenone, 2-hydroxy-2-methyl-1-phenyl-propane-1-ketone, benzyl dimethyl ketal, 2-hydroxy-2-methyl-1-(4-(2-hydroxyl-oxethyl) phenyl) propane-1-ketone, 1-hydroxycyclohexylphenylketone, 2-methyl-2-morpholino-1-(4-methyl mercapto phenyl (methylthiophenyl)) propane-1-ketone, 2-benzyl-2-dimethylamino-1-(4-morpholino phenyl) butane-1-ketone, 2-hydroxy-2-methyl-1-(4-(1-methyl ethylene) phenyl) propane-1-ketone etc.
As compound in triazine class, for example can enumerate 2,4,6-three (trichloromethyl)-1,3,5-triazines, 2-methyl-4, two (the trichloromethyl)-1,3,5-triazines of 6-, 2-phenyl-4, two (the trichloromethyl)-1,3,5-triazines of 6-, 2-(4-chlorphenyl)-4, two (the trichloromethyl)-1,3,5-triazines of 6-, 2-(4-methoxyphenyl)-4, two (the trichloromethyl)-1,3,5-triazines of 6-, 2-(4-methoxyl naphthyl)-4, two (the trichloromethyl)-1,3,5-triazines of 6-, 2-(4-methoxyl-styrene)-4, two (trichloromethyl)-1 of 6-, 3, the 5-triazine, 2-(3,4,5-trimethoxy styryl)-4, two (the trichloromethyl)-1,3,5-triazines of 6-, 2-(4-methylthio phenyl vinyl (methylthiostyryl))-4, two (trichloromethyl)-1 of 6-, 3, the 5-triazine, 2-(piperonyl) (ピ プ ロ ニ Le)-4, two (trichloromethyl)-1 of 6-, 3,5-triazine etc.
As the styrax compounds, can enumerate for example styrax, styrax methyl ether, styrax ethylether, benzoin isobutyl propyl group ether, benzoin isobutyl butyl ether etc.In addition; as benzophenone compound; for example can enumerate benzophenone, o-benzoyl yl benzoic acid methyl esters, 4-phenyl benzophenone, 4-benzoyl-4 '-dimethyl diphenyl sulfide, 3; 3 '; 4; 4 '-four (tert-butyl hydroperoxide carbonyl) benzophenone, 2,4,6-tri-methyl benzophenone etc.
As the thioxanthones compounds, can enumerate for example 2-isopropyl thioxanthone, 4-isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-two clopenthixal ketones, 1-chloro-4-propoxyl group thioxanthones etc.In addition, as glyoxaline compound, can enumerate for example 2-(neighbour-chlorphenyl)-4,5-phenylimidazole dimer, 2-(neighbour-chlorphenyl)-4,5-two (-methoxyphenyl) imidazoles dimer, 2-(ortho-fluorophenyl base)-4,5-diphenyl-imidazole dimer, 2-(neighbour-methoxyphenyl)-4,5-diphenyl-imidazole dimer, 2,4,5-triarylimidazoles dimer etc.
As the acyl group oxime compound; can enumerate for example 1-[9-ethyl-6-(2-methyl benzoyl)-9.H.-carbazole-3-yl]-bicycloheptyl-1-ketoxime-O-acetic acid esters; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H.-carbazole-3-yl]-adamantyl methane-1-ketoxime-O-benzoic ether; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H.-carbazole-3-yl]-adamantyl methane-1-ketoxime-O-acetic acid esters; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H.-carbazole-3-yl]-tetrahydrofuran methylmethane-1-ketoxime-O-benzoic ether; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H.-carbazole-3-yl]-tetrahydrofuran methylmethane-1-ketoxime-O-acetic acid esters; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H.-carbazole-3-yl]-thiophenyl (thiophenyl) methane-1-ketoxime-O-benzoic ether; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H.-carbazole-3-yl]-thiophenyl (thiophenyl) methane-1-ketoxime-O-acetic acid esters; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H.-carbazole-3-yl]-morpholinyl (モ ロ Off オ ニ Le) methane-1-ketoxime-O-benzoic ether; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H.-carbazole-3-yl]-morpholinyl methane-1-ketoxime-O-acetic acid esters; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H.-carbazole-3-yl]-ethane-1-ketoxime-O-norbornane formic ether; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H.-carbazole-3-yl]-ethane-1-ketoxime-O-tristane formic ether; 1-[9-ethyl-6-(2-methyl benzoyl)-9.H.-carbazole-3-yl]-ethane-1-ketoxime-O-adamantanecarboxylic acid ester; 1; the 2-octadiene; 1-[4-(thiophenyl)-; 2-(O-benzoyl oximes)] (the system goods name イ of チ バ ス ペ シ ヤ Le テ イ ケ ミ カ Le ズ society Le ガ キ ユ ア OXE01); エ タ Application; 1-[9-ethyl-6-(2-methyl benzoyl)-9H-carbazole-3-yl]-, 1-(O-acetyl group oxime) (the system goods name イ of チ バ ス ペ シ ヤ Le テ イ ケ ミ カ Le ズ society Le ガ キ ユ ア OXE02) etc.
As the Photoepolymerizationinitiater initiater of (c) composition, also can use living radical propellant and acid-producing agent.As the living radical propellant; for example can enumerate 2; 4; 6-trimethylbenzoyl diphenyl phosphine oxide, 2,2 '-two (neighbour-chlorphenyl)-4,4 '; 5; 5 '-tetraphenyl-1,2 '-bisglyoxaline, 10-butyl-2-chloro-acridine ketone, 2-EAQ, benzil, 9,10-phenanthrenequione, camphorquinone, phenyl glyoxalic acid methylester, two cyclopentadiene titanium compounds etc.As acid-producing agent, can enumerate for example salts such as 4-hydroxy phenyl dimethyl sulfonium tosilate, 4-hydroxy phenyl dimethyl sulfonium hexafluoro antimonate, 4-acetoxyl group phenyl dimethyl sulfonium tosilate, 4-acetoxyl group phenyl methyl benzyl sulfonium hexafluoro antimonate, triphenylsulfonium tosilate, triphenylsulfonium hexafluoro antimonate, diphenyl iodine tosilate, diphenyl iodine hexafluoro antimonate, nitrobenzyl tosylate class, styrax tosylate class etc.In addition, as the living radical propellant, in above-claimed cpd, produce the compound of living radical and acid in addition simultaneously, for example, compound in triazine class is also as acid-producing agent.
(c) in the Photoepolymerizationinitiater initiater of composition, especially preferably use acyl group oximes Photoepolymerizationinitiater initiater.(c) Photoepolymerizationinitiater initiater of composition can use separately or use mixing more than 2 kinds.In addition, also can add and himself not play Photoepolymerizationinitiater initiater, sensitizer, but, can make the compound of the ability increase of Photoepolymerizationinitiater initiater, sensitizer by being used in combination with above-claimed cpd.As such compound, can enumerate resultful aminated compounds when for example being used in combination with benzophenone.Herein, as aminated compounds, can enumerate for example triethanolamine, methyldiethanolamine, triisopropanolamine, 4-dimethylaminobenzoic acid methyl esters, 4-dimethylaminobenzoic acid ethyl ester, 4-dimethylaminobenzoic acid isopentyl ester, benzoic acid 2-dimethylamino ethyl ester, 4-dimethylaminobenzoic acid 2-Octyl Nitrite, N, N-dimethyl-p-toluidine, 4,4 '-two (dimethylamino) benzophenone, 4,4 '-two (diethylamino) benzophenone, 4,4 '-two (ethylmethylamino) benzophenone etc.
(c) use amount of the Photoepolymerizationinitiater initiater of composition is a benchmark with total 100 weight portions as (a) of resinous principle and each composition (b), is suitably 10～50 weight portions.In the situation of cooperation ratio less than 10 weight portions of (c) composition, photopolymerisable speed is slack-off, light sensitivity reduces, on the other hand, surpass in the situation of 50 weight portions, light sensitivity is strong excessively, and pattern line-width becomes thick state with respect to pattern mask, can not verily reproduce live width to mask, perhaps may produce pattern edge band saw tooth and the rough problem that becomes.
Shading compositions such as black organic pigment, colour mixture organic pigment or light screening material as (d) composition can be the material of thermotolerance, photostability and solvent resistance excellence.As the black organic pigment, can enumerate that Li such as perylene are black, cyanines are black etc. herein.As the colour mixture organic pigment, the pigment more than 2 kinds that can enumerate in red with being selected from, blue, green, purple, yellow, cyanine, the magenta etc. mixes and the pigment of accurate blackization.As light screening material, can enumerate that carbon black, chromium oxide, iron oxide, titanium are black, nigrosine, cyanines be black, also can suitably select to use more than 2 kinds, especially, light-proofness, surface smoothing, dispersion stabilization, and the compatibility of resin good aspect, preferred especially carbon black.In addition, these shading compositions are disperseed in dispersion medium and obtain light-proofness dispersion liquid as (d) composition.As dispersion medium, can enumerate for example propylene glycol monomethyl ether, acetate 3-methoxyl butyl ester etc. herein.
For the blending ratio of shading composition in the light-proofness dispersion liquid of (d) composition, can be with respect to whole branches of shapes admittedly of the present composition with the scope use of 20～60 quality %, preferred 40～60 quality %.When being less than 20 quality %, it is not enough that light-proofness becomes.When surpassing 60 quality %, reduce owing to become the content of the photoresist of cementing agent originally, film forms the impaired so not preferred problem of ability when being created in the infringement developing property.Composition of the present invention, special for the high scope of pigment concentration, specifically, with the total shape component admittedly in the photosensitive polymer combination is benchmark, contain the pigment (shading composition) of the amount that surpasses 40 weight %, and then contain the composition of the above pigment of 45 weight %, given play to high effect.
Black resist preferably also uses solvent with in the photosensitive polymer combination among the present invention except above-mentioned (a)～(d) composition.As solvent, can enumerate for example methyl alcohol, ethanol, n-propanol, isopropyl alcohol, ethylene glycol, alcohols such as propylene glycol, α-or terpenes such as β-terpilenol, acetone, methyl ethyl ketone, cyclohexanone, ketones such as N-N-methyl-2-2-pyrrolidone N-, toluene, dimethylbenzene, tetramethylbenzenes etc. are aromatic hydrocarbon based, cellosolve, methyl cellosolve, ethyl cellosolve, carbitol, methyl carbitol, ethyl carbitol, butyl carbitol, propylene glycol monomethyl ether, propylene glycol list ethylether, DPGME, dihydroxypropane single-ethyl ether, the triethylene glycol monomethyl ether, glycol ethers such as triethylene glycol list ethylether, ethyl acetate, butyl acetate, the cellosolve acetic acid esters, ethyl cellosolve acetate, butyl cellosolve acetate, the carbitol acetic acid esters, the ethyl carbitol acetic acid esters, acetate of butyl carbitol, propylene glycol monomethyl ether, acetate esters such as propylene glycol list ethylether acetic acid esters etc., dissolve by using them, mix, can form the composition of uniform solution shape.
In addition, black resist of the present invention can contain silane coupling agent as the adaptation modifying agent with in the resin combination.As silane coupling agent, 3-glycidoxypropyltrimewasxysilane, 3-glycidoxypropyl triethoxysilane, 3-glycidoxypropyl methyl dimethoxysilane, 3-glycidoxypropyl methyldiethoxysilane, vinyltrimethoxy silane, vinyltriethoxysilane etc., preferred because raw material obtains easily.Because above-mentioned silane coupling agent improves bonding effect just to have on a small quantity, there is no need add as addition more, the total shape branch admittedly for composition can be preferably 0.2～10 quality %, more preferably 0.5～5 quality %.
In addition, for the flatness of coating, colouring covering film with prevent the purpose of Benard cell (benardcell), also can add surfactant.The addition of surfactant can be preferably 0.01～1 quality % for 0.001～5 quality % of resin combination usually.When addition is very few, does not have the flatness of coating, colouring covering film and prevent the effect of Benard cell, in the time of too much, have the situation that the rerum natura of filming becomes bad on the contrary.Concrete example as surfactant, can enumerate Texapon Special, anionic surfactants such as polyethylene oxide alkyl ethers sulfuric acid triethanolamine, stearyl amine acetate, cationic surfactants such as lauryl trimethyl ammonium chloride, lauryl dimethyl amine oxide, amphoteric surfactantes such as lauryl ethyloic hydroxyethyl imidazole betaine, the polyoxyethylene lauryl ether, the polyoxyethylene stearyl ether, non-ionic surfactants such as anhydrosorbitol monostearate, with dimethyl silicone polymer etc. is the silicon-type surfactant of main framing, and fluorine is a surfactant etc.Among the present invention, be not limited to them, can use the surfactant more than a kind or 2 kinds.
Black resist of the present invention contains above-mentioned (a)～(d) composition or they and solvent as major component with photosensitive polymer combination.Remove in the solid shape branch (Gu becoming the monomer that solid shape is divided after comprising curing in the shape branch) that desolvates, wish that total comprises above (a)～(d) composition of 80 quality %, preferred 90 quality %.The amount of solvent changes according to target viscosities, can the scope with 70～90 quality % contain in photosensitive polymer combination.
Black resist photosensitive polymer combination among the present invention as the resin combination excellence that is used to form the color filter photomask, can obtain the color filter photomask by for example following photoetching (photolithography) method.Can enumerate following method: at first, photosensitive polymer combination is formed solution, be coated on the transparency carrier, after next makes solvent seasoning (prebake conditions), will put photomask on the overlay film that obtain like this, irradiation ultraviolet radiation and make exposure portion solidify, re-use aqueous alkali unexposed stripping developed, thereby form pattern, in addition, dry as the back, carry out back baking (heat is burnt till).
Transparency carrier as the photosensitive resin coating composition solution, except glass substrate, but illustration hyaline membrane (for example polycarbonate, polyethylene terephthalate, polyethersulfone etc.) is gone up the transparency electrode evaporation of ITO, gold etc. or the substrate of patterning etc.As the method for the solution of photosensitive resin coating composition on transparency carrier, except known solution dipping method, spraying process, can adopt any methods such as method of using roll coater, ラ Application De コ one タ, one machine and spin coater.By these methods, be applied to desirable thickness after, desolvate (prebake conditions) by removing, form overlay film.Prebake conditions is undertaken by adopting heating such as baking oven, hot plate.The heating-up temperature of prebake conditions and heat time heating time are suitably selected according to the solvent that uses, and for example carry out under 60～110 ℃ temperature 1～5 minute.
The exposure of carrying out after the prebake conditions is undertaken by ultraviolet exposure apparatus according, only makes resist sensitization corresponding to the part of pattern by being situated between by photomask exposure.Suitably select exposure device and exposure irradiation condition thereof, use light sources such as ultrahigh pressure mercury lamp, high-pressure sodium lamp, metal halide lamp, far ultraviolet lamp to expose, make the black resist photosensitive polymer combination photocuring in filming.
Alkali after the exposure develops and carries out with the purpose of the resist of removing unexposed portion, and developing by this forms desirable pattern.As being suitable for the developer solution that this alkali develops, can enumerate the aqueous solution of the carbonate of alkaline metal, alkaline-earth metal for example, aqueous solution of alkali-metal oxyhydroxide etc., especially, can use the weak alkaline aqueous solution of carbonate such as the sodium carbonate that contains 0.05～3 quality %, sal tartari, lithium carbonate, under 23～28 ℃ temperature, develop, use commercially available developing machine, supersonic wave cleaning machine etc. can critically form fine image.
After the development, preferably, under the condition of 180～250 ℃ temperature and 20～60 minutes, heat-treat (back baking).The baking of this back is carried out with purpose such as the photomask that improves patterning and the adaptation of substrate.It and prebake conditions are similarly undertaken by adopting heating such as baking oven, hot plate.The photomask of patterning of the present invention is through forming according to above photolithographic each operation.
Photosensitive polymer combination of the present invention, as mentioned above, be suitable for forming fine pattern,, also can obtain the photomask of same light-proofness, adaptation, electrical insulating property, thermotolerance, chemical-resistant excellence even form pattern by serigraphy in the past by operations such as exposure, alkali developments.In addition, black resist of the present invention can be suitable as coating material with photosensitive polymer combination, be particularly suitable as the color filter that uses in liquid crystal indicator or the imaging apparatus with China ink, can be used as black matrix that color filter, crystal projection use etc. by its photomask that forms.
The effect of invention
According to the present invention, can be formed on before and after the PCT and the good black matrix (or photomask) of adaptation height, quality of glass substrate.Even comprise the situation of shading composition especially with high concentration, also can keep high adaptation, can realize the high shadingization of so-called film.
Embodiment
Below based on embodiment and comparative example, specify embodiments of the present invention, but the present invention is not limited to them.Herein, raw material and the contracted notation that uses in the manufacturing of the black matrix of embodiment and comparative example is as described below.
(monomer)
(a)-1: alkoxylate neopentylglycol diacrylate (the system trade name CD9043 of サ one ト マ one ジ ヤ パ Application society)
(a)-2: alkoxylate hexanediyl ester (the system trade name CD564 of サ one ト マ one ジ ヤ パ Application society)
(a)-3: polyethyleneglycol diacrylate (day system trade name Block レ of oil (strain) society Application マ one ADE-600)
(a)-4: polyethyleneglycol diacrylate (day system trade name Block レ of oil (strain) society Application マ one ADE-400)
(a)-5: ethoxylation (10) bisphenol a diacrylate (the system trade name SR602 of サ one ト マ one ジ ヤ パ Application society)
(a)-6: tetramethylol methane tetraacrylate (サ one ト マ one ジ ヤ パ Application (strain) system, trade name SR295)
(a)-7: the potpourri of dipentaerythritol acrylate and dipentaerythritol five acrylate (Japanese chemical drug (strain) system, trade name DPHA)
(resin that contains unsaturated group)
(b)-1: the propylene glycol monomethyl ether solution (the solid shape branch concentration of resin=56.5 quality %, Nippon Steel's chemistry (strain) system, trade name V259ME) of acid anhydrides condensed polymer with epoxy acrylate of fluorene skeleton
(b)-propylene glycol monomethyl ether solution (the solid shape of resin is divided concentration=35.5 quality %), (N-phenylmaleimide: acrylic acid: styrene=19: 22: 59mol%) of the N-phenylmaleimide/acrylic acid/styrol copolymer of 2:Mw (weight-average molecular weight) 9000, acid number 80
(Photoepolymerizationinitiater initiater)
(c)-1: エ タ Application, 1-[9-ethyl-6-(2-methyl benzoyl)-9H-carbazole-3-yl]-1-(0-acetyl group oxime) (チ バ ジ ヤ パ Application society system, goods name イ Le ガ キ ユ ア OXE02)
(c)-2:2-benzyl-2-dimethylamino-1-(4-morpholino phenyl)-1-butanone (チ バ ジ ヤ パ Application society system, goods name イ Le ガ キ ユ ア 369)
(c)-and 3:2-(piperonyl (ピ プ ロ ニ Le))-4, two (the trichloromethyl)-1,3,5-triazines (Japanese シ one ベ Le ヘ グ Na one society's system, goods name triazine PP) of 6-
(light-proofness dispersion liquid)
(d): the propylene glycol monomethyl ether dispersion liquid (Gu shape divides 29.75%) of carbon black concentration 25.0 quality %, macromolecule dispersing agent concentration 4.75 quality %
(silane coupling agent)
(e): 3-methyl allyl acyloxypropyl trimethoxysilane (trade name: KBM-503: SHIN-ETSU HANTOTAI's chemistry (strain) system)
(solvent)
(f)-1: propylene glycol monomethyl ether
(f)-2: cyclohexanone
(surfactant)
(g): メ ガ Off ア Star Network F475 (big Japanese ink chemical industry (strain) system)
Embodiment
[embodiment 1～6, comparative example 1～5]
Ratio with record in the table 1 is mixed above-mentioned gradation composition, the black resist photosensitive polymer combination of preparation embodiment 1～6 and comparative example 1～5.() interior numeral of (b) composition contains solid shape component (g), (d) the solid shape component (g) of () of composition interior numeral shading composition in the resin of unsaturated group in the table 1.
Carrying out homogeneous with the combination of each composition of record in the table 1 mixes, use the rotary coating machine embodiment 1～6 that coating obtains on the glass substrate (コ one ニ Application グ 1737) of 125mm * 125mm and each black resist photosensitive polymer combination of comparative example 1～5, making the thickness after the back baking was 1.0 μ m, 90 ℃ of following prebake conditions 1 minute.Afterwards, adjusting exposing clearance is 80 μ m, places the minus photomask of μ m/2 μ m, 4 μ m/4 μ m, 5 μ m/5 μ m, 6 μ m/6 μ m, 8 μ m/8 μ m, 10 μ m/10 μ m, 20 μ m/20 μ m of line/at interval=2 on dry coating, with I line illumination 30mW/cm
2Ultra high pressure mercury light irradiation 100mj/cm
2Ultraviolet ray, carry out the photocuring reaction of sensitization part.Secondly, this coated board of exposing in 23 ℃, 0.05% potassium hydroxide aqueous solution, is used 1kgf/cm
2Spray develop to press, the development time that begins to manifest from pattern (go out the picture time, breaktime=BT) beginning+10 seconds ,+20 seconds development after, carry out 5kgf/cm
2The injection washing of pressure, remove the unexposed portion of filming, on glass substrate, form pattern of pixels, afterwards, use air drier 230 ℃ carry out heat back baking in 30 minutes after, estimate live width, pattern rectilinearity and the resolution wide with respect to the mask of 20 μ m lines.Show the result in table 2 and table 3.In addition, evaluation method is as described below.
＜pattern wire spoke 〉
Use and survey the pattern line-width that long microscope ((strain) ニ コ Application system trade name XD-20) is measured mask width 20 μ m.
＜pattern rectilinearity 〉
20 μ m mask patterns after microscopic examination is developed, will not find for substrate peel off with pattern edge sawtooth partly be evaluated as zero, will send out existing to be evaluated as *.
＜resolution 〉
In 2 μ m, 4 μ m, 5 μ m, 6 μ m, 8 μ m, 10 μ m and the 20 μ m mask patterns, with minimum pattern size residual on the substrate as resolution.Resolution be the situation of 2 μ m, 4 μ m, 5 μ m, 6 μ m or 8 μ m be evaluated as the above situation of zero, 10 μ m and be evaluated as *.
In addition, in order to estimate dhering strength (sealing intensity), homogeneous mixes each composition of above-mentioned table 1, use the rotary coating machine to go up the black resist photosensitive polymer combination that coating obtains at the glass substrate (コ one ニ Application グ 1737) of 125mm * 125mm, making the thickness after the back baking was 1.0 μ m, 90 ℃ of following prebake conditions 1 minute.Afterwards, do not use the minus photomask and with 100mJ/cm
2Carry out blanket exposure, use air drier under 230 ℃, to carry out heat back baking in 30 minutes.
Then, for by the above-mentioned back baking substrate that obtains, adopt evaluation method, according to following evaluation sealing intensity based on the three-point bending driving fit test method of JIS K6856-1994.Above-mentioned back baking substrate and the glass substrate of uncoated resin combination (コ one ニ Application グ 1737) are cut into 20mm * 63mm oblong-shaped respectively, thereby prepare test film.For be situated between by a certain amount of sealant with after the glass substrate that is coated with lamina membranacea and uncoated resin combination that toasted be 8mm with the overlap width, both sides' substrate (test film) is fitted.Sealant during coincidence be shaped as circle and the about 5mm of diameter.Afterwards, the test film that overlaps 90 ℃ of following prebake conditions 20 minutes then, is implemented 2 hours back baking respectively under 150 ℃, make the three point bending test sheet.In addition, also made use and the above-mentioned same 20mm * 63mm glass sheet of method with uncoated resin combination between the sample that is used for comparison test of fitting.
In by the above-mentioned test film that obtains, for making the coincidence position become the center, the glass substrate of using with 2 supporter supports coated panels and subtend substrate (substrate that does not have coating) or uncoated comparison test (2 stilt length are 3cm), the speed of dividing with 1mm/ with ORIENTEC (system) trade name UCT-100 by directly over the coincidence part under increase load, when observing release surface, read the load of this moment and divided by the spreading area of sealant, with the load of per unit area as dhering strength.In addition, under the condition of 121 ℃, 100%RH, 2atm and 4 hours, implement PCT (pressure cooker) test after, implements same dhering strength test, try to achieve the dhering strength of PCT front and back.Dhering strength between the glass of uncoated resist (resin combination) before and after the PCT is counted respectively at 100 o'clock, the dhering strength of each composition is represented as relative value.With before and after the PCT more than 60 as zero, the conduct less than 60 *.Show the result in table 2 and table 3.
Above result shows, by filming that the photosensitive polymer combination of embodiment 1～6 obtains, live width, pattern rectilinearity, resolution, sealing intensity are all good.In contrast, by filming that the photosensitive polymer combination of comparative example 1～5 obtains, no live width, pattern rectilinearity, resolution, the figure film that the sealing intensity all items is good.
The color filter that use is formed with the black matrix that the photosensitive polymer combination that uses the foregoing description 1～6 obtains is made the situation of liquid crystal display, even if under rigor condition, does not also almost have peeling off of black matrix, can prevent the leakage of liquid crystal.In addition, also can not damage developing properties such as development driving fit, pattern rectilinearity, resolution.Therefore, even under the situation of the black matrix of the high shading rate that resinous principle tails off relatively, film from peeling off of glass substrate and also reduce, can guarantee high productivity (yield) and reliability making that the pigment concentration will comprise in the filming of mineral black improves.
Claims (8)
1. black resist photosensitive polymer combination is characterized in that containing
(a) have 2 bifunctional monomers that are selected from any one or two kinds of groups in acryloyl group and the methacryl of total,
(b) contain the resin of unsaturated group, it further obtains with polybasic carboxylic acid or its anhydride reaction by making compound and (methyl) acrylic acid reactant with 2 above epoxy radicals,
(c) Photoepolymerizationinitiater initiater and
(d) light-proofness dispersion liquid, it contains the shading composition more than a kind that is selected from black organic pigment, colour mixture organic pigment and the light screening material.
2. the described black resist photosensitive polymer combination of claim 1, wherein said (a) have and add up to 2 bifunctional monomers that are selected from any one or two kinds of groups in acryloyl group and the methacryl by following general formula (1) or general formula (2) expression:
In the formula, R
1And R
2Expression hydrogen atom or methyl can be same to each other or different to each other, and AO and BO represent that carbon number is 2～4 mutually different oxyalkylene, and in addition, m and n are the integer more than 0, are the scope of m+n=4～30,
In the formula, R
1And R
2Expression hydrogen atom or methyl can be same to each other or different to each other R
3～R
10Representing that independently of one another hydrogen atom, halogen atom, carbon number are that 1～5 alkyl, carbon number are that 1～5 thiazolinyl, carbon number are that 1～5 alkynyl, carbon number are that 5～9 naphthenic base, carbon number are that 6～10 aryl or carbon number are 1～5 alkoxy, X represents-CO-,-SO
2-,-C (CF
3)
2-,-Si (CH
3)
2-,-CH
2-,-C (CH
3)
2-,-O-, 9,9-fluorenyl or singly-bound, AO and BO represent that carbon number is 2～4 mutually different oxyalkylene, in addition, m and n are the integer more than 0, are the scope of m+n=4～30.
3. the described black resist photosensitive polymer combination of claim 1, the compound with 2 above epoxy radicals that uses when wherein obtaining (b) composition is for be selected from by a kind of compound in the compound of following general formula (3) and general formula (4) expression at least:
In the formula (3), R
11And R
12For hydrogen atom, carbon number are 1～5 alkyl or halogen atom, can be same to each other or different to each other, X represents-CO-,-SO
2-,-C (CF
3)
2-,-Si (CH
3)
2-,-CH
2-,-C (CH
3)
2-,-O-, 9,9-fluorenyl or singly-bound, n are 0～10 integer,
In the formula (4), n represents 1～5 integer, R
13～R
16Represent that independently of one another hydrogen atom, carbon number are that 1～5 alkyl, carbon number are that 5～9 naphthenic base or carbon number are 6～10 aryl, R
17～R
27Represent that independently of one another hydrogen atom, halogen atom, carbon number are that 1～5 alkyl, carbon number are that 1～5 thiazolinyl, carbon number are that 1～5 alkynyl, carbon number are that 5～9 naphthenic base, carbon number are that 6～10 aryl or carbon number are 1～5 alkoxy.
4. the described black resist photosensitive polymer combination of claim 1, wherein the shading composition in (d) composition is a carbon black.
5. the described black resist photosensitive polymer combination of claim 1, wherein the content of shading composition is divided into 40～60 quality % with respect to black resist with the solid shape in the photosensitive polymer combination in (d) composition.
6. the described black resist photosensitive polymer combination of claim 1, wherein (c) Photoepolymerizationinitiater initiater be selected from the acyl group oximes Photoepolymerizationinitiater initiater more than a kind or 2 kinds.
7. each described black resist photosensitive polymer combination of claim 1～6, it is used to form the color filter photomask.
8. the color filter photomask is characterized in that,
The described black resist photosensitive polymer combination of coating claim 7 on transparency carrier, after the drying, obtain by each operation of following necessity: (i) utilize the exposure of ultraviolet exposure apparatus according, (ii) utilize the development of alkaline aqueous solution and (iii) heat burn till.
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| JP2009049446A JP5416434B2 (en) | 2009-03-03 | 2009-03-03 | Photosensitive resin composition for black resist and color filter light-shielding film |
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| JP5875345B2 (en) * | 2011-11-28 | 2016-03-02 | ニッコー・マテリアルズ株式会社 | Photosensitive resin composition for solder resist, and photoresist film for solder resist using the same |
| CN104603168B (en) | 2012-09-14 | 2016-07-06 | 富士胶片株式会社 | Solidification compound and image forming method |
| JP6423215B2 (en) * | 2014-09-18 | 2018-11-14 | 株式会社Adeka | Photocurable composition |
| US10324376B2 (en) | 2015-09-30 | 2019-06-18 | Toray Industries, Inc. | Negative type colored photosensitive resin composition, cured film, element, and display device |
| CN111435220B (en) * | 2019-01-15 | 2024-02-27 | 新应材股份有限公司 | Photosensitive resin composition, optical film, and method for producing same |
| US11520197B2 (en) | 2020-05-15 | 2022-12-06 | Omnivision Technologies, Inc. | Active-pixel device assemblies with rough coating for stray-light reduction, and methods for manufacture |
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| CN101045807A (en) * | 2006-03-30 | 2007-10-03 | 新日铁化学株式会社 | Light shading resin composition for color filter and color filter |
| JP2008156613A (en) * | 2006-11-30 | 2008-07-10 | Nippon Steel Chem Co Ltd | Alkali-soluble resin, method for production thereof, and photosensitive resin composition using the same, cured product and color filter |
| CN101266311A (en) * | 2007-03-15 | 2008-09-17 | 新日铁化学株式会社 | Lightproof composition and color filter |
| JP2008268854A (en) * | 2007-03-28 | 2008-11-06 | Nippon Steel Chem Co Ltd | Photosensitive resin composition for black matrix, cured product using the same and color filter |
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| JP2007271987A (en) * | 2006-03-31 | 2007-10-18 | Nippon Steel Chem Co Ltd | Photosensitive resin composition for black resist |
| JP4890314B2 (en) * | 2007-03-29 | 2012-03-07 | 新日鐵化学株式会社 | Photosensitive resin composition for black resist |
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| CN101045807A (en) * | 2006-03-30 | 2007-10-03 | 新日铁化学株式会社 | Light shading resin composition for color filter and color filter |
| JP2008156613A (en) * | 2006-11-30 | 2008-07-10 | Nippon Steel Chem Co Ltd | Alkali-soluble resin, method for production thereof, and photosensitive resin composition using the same, cured product and color filter |
| CN101266311A (en) * | 2007-03-15 | 2008-09-17 | 新日铁化学株式会社 | Lightproof composition and color filter |
| JP2008268854A (en) * | 2007-03-28 | 2008-11-06 | Nippon Steel Chem Co Ltd | Photosensitive resin composition for black matrix, cured product using the same and color filter |
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| TWI463254B (en) | 2014-12-01 |
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