CN101942287A - Low-temperature electricity conducting glue and preparation method thereof - Google Patents
Low-temperature electricity conducting glue and preparation method thereof Download PDFInfo
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- CN101942287A CN101942287A CN 201010293031 CN201010293031A CN101942287A CN 101942287 A CN101942287 A CN 101942287A CN 201010293031 CN201010293031 CN 201010293031 CN 201010293031 A CN201010293031 A CN 201010293031A CN 101942287 A CN101942287 A CN 101942287A
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Abstract
The invention relates to a low-temperature electricity conducting glue and a preparation method thereof. The electricity conducting oil ink is prepared by the following raw materials in mass percent: 50-55% of metal fiber, 5-10% of metal powder, 15-20 parts of carrier A, 15-20% of carrier B, 0.2-1% of coupling agent and 0-1% of anti-aging agent. The preparation method of the electricity conducting oil ink comprises the following steps: fully mixing the carrier A, the carrier B, the metal powder and the coupling agent in mass percent; grinding the above raw materials and dispersing for 3-5 times by utilizing a three-roller grinding machine to form an even mixing phase, wherein, one kilogram of raw material is dispersed one time for 3-15 minutes; adding the anti-aging agent, continuously grinding for 2-3 times, and dispersing evenly to obtain the electricity conducting glue. The electricity conducting glue has better electricity conducting performance, and better hardness as well as splicing and cutting strength; and the combining capacity of the electricity conducting materials is more firm.
Description
Technical field
The present invention relates to a kind of low-temperature conductive glue and preparation method thereof.
Background technology
The conductivity type tackiness agent is called for short conductive resin, is the sizing agent that has certain conductivity after a kind of curing or the drying; Be a kind ofly can glued joint various materials effectively, have the tackiness agent of conductivity again.It is that conducting particles is main moiety with matrix resin and conductive filler material usually, and the bonding effect by matrix resin combines conducting particles, forms conductive path, realizes being connected by the conduction of sticking material.At present conductive resin has been widely used in the encapsulation of electronic component such as photodiode (LED), liquid crystal display (LCD), pcb component (PCBA), thin film switch, smart card, lattice block, ceramic condenser and assembly and bonding, and the trend that progressively replaces traditional soldering welding is arranged.
This conductive resin has multiple advantages such as self-vulcanizing, the excellent wide region of conduction temperature, bonding strength height, easy operation.Use: the microwave device lead-in wire connects, the printed-wiring board (PWB) circuit connects, the wire cloth shielding strip is bonding and metal and metal sticking.
Summary of the invention
The object of the present invention is to provide a kind of good low-temperature conductive glue, can be used for being widely used in the encapsulation of electronic components such as photodiode (LED), liquid crystal display (LCD), pcb component (PCBA), thin film switch, smart card, lattice block, ceramic condenser and assembly and bonding.
Another object of the present invention is to provide a kind of preparation method of conductive resin.
The objective of the invention is to be achieved through the following technical solutions, a kind of low-temperature conductive glue is characterized in that, this conductive resin is formed by the feedstock production of following mass percentage content:
Steel fiber 50-55%;
Metal-powder 5-10%;
Carrier A 15-20%;
Carrier B 15-20%;
Coupling agent 0.2-1%;
Anti-aging agent 0-1%.
Described steel fiber is copper fiber, silver-colored fiber or nickel fiber, and radius is 0.1-25 μ m, and length is 1-1000 μ m.
Described metal-powder is copper powder, silver powder or nickel powder, and metal-powder is a spherical powder, and radius is 0.1-10 μ m.
Described carrier A is formed by the feedstock production of following mass percentage content:
Thermosetting resin 80-85%;
Solidifying agent 15-20%.
Described carrier B is formed by the feedstock production of following mass percentage content:
Solvent type resin 30-35%;
High boiling solvent 65-70%.
Described thermosetting resin is a Resins, epoxy; Described solvent type resin is selected vibrin or polyurethane for use.
Described solidifying agent is selected modified amine curing agent for use, modified fatty amine, modified aromatic amine or modified multicomponent amine; Described high boiling solvent is 1, a kind of in 4-butyrolactone, diethylene adipate or the 2-Butoxyethyl acetate.
Described coupling agent is silane resin acceptor kh-550, KH-551, KH-590 or KH-602.
Described anti-aging agent is antioxidant 264, anti-aging agent 4020 or antioxidant D NP.
The present invention gives the preparation method of this low-temperature conductive glue, and this method comprises the steps:
1) carrier A: the weighing mass percent be the solidifying agent of the thermosetting resin of 80-85% and 15-20% in there-necked flask high-speed stirring to evenly; Standby;
2) carrier B: the weighing mass percent is the solvent type resin of 30-35% and the high boiling solvent of 65-70%, in 70-100 ℃ of water-bath high-speed stirring 2-5 hour, makes resin be dissolved in the solvent fully; Standby;
3) preparation of silver slurry:
With 15-20% carrier A, 15-20% carrier B, 50-55% steel fiber, 5-10% metal-powder, the 0.2-1% coupling agent thorough mixing that makes, use three-roll grinder to disperse 3-5 time then, make it to form uniform mixed phase according to each kilogram every time 3-15 minute, grinding; Add the 0-1% anti-aging agent then, continue to grind 2-3 time, being uniformly dispersed promptly gets conductive resin.
The present invention has replaced metal-powder to do main conductive filler material with the metal primitive fiber.Conductive filler material obtains the form of the fine-fibered of metal primitive fiber like this, has many points to contact with each other; Can keep than the bigger conductive paths of conventional electrocondution slurry, conductivity is better.Simultaneously, be interweaved together after making conductive filler material be distributed to resin, increased the ability that mutually combines of material, material is more firm.Better hardness and adhesive shear strength are arranged.
Embodiment
Below by specific embodiment the present invention is described in further detail.Need to prove that following embodiment only is used to illustrate the present invention, but be not limited to practical range of the present invention.
Unless otherwise indicated, the following raw material add-on that adopts of the present invention is mass percent.
Embodiment 1
Prepare carrier A earlier:
The weighing mass percent is Resins, epoxy 85% and modified fatty amine 15% high-speed stirring in there-necked flask, and resin is dissolved in the solvent fully, and is standby;
The preparation carrier B:
The weighing mass percent is polyurethane 32% and dihexyl adipate 68%, high-speed stirring in water-bath, and bath temperature is 70 ℃, churning time is 5 hours, and resin is dissolved in the solvent fully, and is standby;
According to following ratio weighing material:
Silver fiber 52%;
Silver powder 8%;
Carrier A 19%;
Carrier B 20%;
KH-602 0.5％；
Antioxidant D NP 0.5%;
With above-mentioned load weighted carrier A, carrier B, argent fiber, silver powder powder, coupling agent KH-602 raw material thorough mixing, use three-roll grinder (SDV 1300, Switzerland's cloth are reined in) to grind then and disperse (one kilogram every all over 3 minutes) 5 times, make it to form uniform mixed phase; Add antioxidant D NP then and continue to grind 2 times, be uniformly dispersed, promptly get this low-temperature conductive glue.
Embodiment 2
Prepare carrier A earlier:
The weighing mass percent is Resins, epoxy 80% and modified aromatic amine 20% high-speed stirring in there-necked flask, and resin is dissolved in the solvent fully, and is standby;
The preparation carrier B:
The weighing mass percent is vibrin 30% and 1,4 butyrolactone 70%, high-speed stirring in water-bath, and bath temperature is 85 ℃, churning time is 4 hours, and resin is dissolved in the solvent fully, and is standby;
According to following ratio weighing material:
Copper fiber 53%;
Copper powder 11%;
Carrier A 15%;
Carrier B 20%;
KH-550 0.8％；
Anti-aging agent 4,020 0.2%;
With above-mentioned load weighted carrier A, carrier B, metallic copper fiber, metallic copper powder, coupling agent KH-550 raw material thorough mixing, use three-roll grinder (SDV 1300, Switzerland's cloth are reined in) to grind then and disperse (one kilogram every all over 4 minutes) 4 times, make it to form uniform mixed phase; Continue to add 4020 anti-aging agent then and grind 3 times, be uniformly dispersed, promptly get low-temperature conductive glue.
Embodiment 3
Prepare carrier A earlier:
The weighing mass percent is Resins, epoxy 82% and modified multicomponent amine 18% high-speed stirring in there-necked flask, and resin is dissolved in the solvent fully, and is standby;
The preparation carrier B:
The weighing mass percent is vibrin 35% and 2-Butoxyethyl acetate 65%, high-speed stirring in water-bath, and bath temperature is 90 ℃, churning time is 4 hours, and resin is dissolved in the solvent fully, and is standby;
According to following ratio weighing material:
Nickel fiber 53%;
Nickel powder 10%;
Carrier A 20%;
Carrier B 15%;
KH-590 1％；
Antioxidant 264 1%;
With above-mentioned load weighted carrier A, carrier B, metallic nickel fiber, metallic nickel powder, coupling agent KH-590 raw material thorough mixing, use three-roll grinder (SDV 1300, Switzerland's cloth are reined in) to grind then and disperse (one kilogram every all over 10 minutes) 5 times, make it to form uniform mixed phase; Add antioxidant 264 then and continue to grind 2 times, be uniformly dispersed, promptly get conductive resin.
Embodiment 4
Prepare carrier A earlier:
The weighing mass percent is Resins, epoxy 83% and modified fatty amine 17% high-speed stirring in there-necked flask, and resin is dissolved in the solvent fully, and is standby;
The preparation carrier B:
The weighing mass percent is polyurethane 33% and 1,4 butyrolactone 67%, high-speed stirring in water-bath, and bath temperature is 100 ℃, churning time is 2 hours, and resin is dissolved in the solvent fully, and is standby;
According to following ratio weighing material:
Silver fiber 50%;
Silver powder 10%;
Carrier A 20%;
Carrier B 19%;
KH-602 1％；
With above-mentioned load weighted carrier A, carrier B, argent fiber, argent powder, coupling agent KH-602 raw material thorough mixing, use three-roll grinder (SDV 1300, Switzerland's cloth are reined in) to grind then and disperse (one kilogram every all over 15 minutes) 6 times, make it to form uniform mixed phase; Be uniformly dispersed, promptly get conductive resin.
Embodiment 5
Prepare carrier A earlier:
The weighing mass percent is Resins, epoxy 85% and modified fatty amine 15% high-speed stirring in there-necked flask, and resin is dissolved in the solvent fully, and is standby;
The preparation carrier B:
The weighing mass percent is polyurethane 32% and dihexyl adipate 68%, high-speed stirring in water-bath, and bath temperature is 80 ℃, churning time is 3 hours, and resin is dissolved in the solvent fully, and is standby;
According to following ratio weighing material:
Copper fiber 55%;
Copper powder 5%;
Carrier A 19%;
Carrier B 20%;
KH-551 0.2％；
Antioxidant D NP 0.8%;
With above-mentioned load weighted carrier A, carrier B, metallic copper fiber, metallic copper powder, coupling agent KH-551 raw material thorough mixing, use three-roll grinder (SDV 1300, Switzerland's cloth are reined in) to grind then and disperse (one kilogram every all over 5 minutes) 5 times, make it to form uniform mixed phase; Add antioxidant D NP then and continue to grind 2 times, be uniformly dispersed, promptly get conductive resin.
Claims (10)
1. a low-temperature conductive glue is characterized in that, this conductive resin is formed by the feedstock production of following mass percentage content:
Steel fiber 50-55%;
Metal-powder 5-10%;
Carrier A 15-20%;
Carrier B 15-20%;
Coupling agent 0.2-1%;
Anti-aging agent 0-1%.
2. a kind of low-temperature conductive glue according to claim 1 is characterized in that, described steel fiber is copper fiber, silver-colored fiber or nickel fiber, and radius is 0.1-25 μ m, and length is 1-1000 μ m.
3. a kind of low-temperature conductive glue according to claim 1 is characterized in that described metal-powder is copper powder, silver powder or nickel powder, and metal-powder is a spherical powder, and radius is 0.1-10 μ m.
4. a kind of low-temperature conductive glue according to claim 1 is characterized in that described carrier A is formed by the feedstock production of following mass percentage content:
Thermosetting resin 80-85%;
Solidifying agent 15-20%.
5. a kind of low-temperature conductive glue according to claim 1 is characterized in that described carrier B is formed by the feedstock production of following mass percentage content:
Solvent type resin 30-35%;
High boiling solvent 65-70%.
6. according to claim 4 or 5 described a kind of low-temperature conductive glue, it is characterized in that described thermosetting resin is a Resins, epoxy; Described solvent type resin is selected vibrin or polyurethane for use.
7. according to claim 4 or 5 described a kind of low-temperature conductive glue, it is characterized in that described solidifying agent is selected modified amine curing agent for use, modified fatty amine, modified aromatic amine or modified multicomponent amine; Described high boiling solvent is 1, a kind of in 4-butyrolactone, diethylene adipate or the 2-Butoxyethyl acetate.
8. a kind of low-temperature conductive glue according to claim 1 is characterized in that described coupling agent is silane resin acceptor kh-550, KH-551, KH-590 or KH-602.
9. a kind of low-temperature conductive glue according to claim 1 is characterized in that, described anti-aging agent is antioxidant 264, anti-aging agent 4020 or antioxidant D NP.
10. the preparation method of a kind of low-temperature conductive glue according to claim 1 is characterized in that, this method comprises the steps:
1) carrier A: the weighing mass percent be the solidifying agent of the thermosetting resin of 80-85% and 15-20% in there-necked flask high-speed stirring to evenly; Standby;
2) carrier B: the weighing mass percent is the solvent type resin of 30-35% and the high boiling solvent of 65-70%, in 70-100 ℃ of water-bath high-speed stirring 2-5 hour, makes resin be dissolved in the solvent fully; Standby;
3) preparation of silver slurry:
With 15-20% carrier A, 15-20% carrier B, 50-55% steel fiber, 5-10% metal-powder, the 0.2-1% coupling agent thorough mixing that makes, use three-roll grinder to disperse 3-5 time then, make it to form uniform mixed phase according to each kilogram every time 3-15 minute, grinding; Add the 0-1% anti-aging agent then, continue to grind 2-3 time, being uniformly dispersed promptly gets conductive resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010293031 CN101942287A (en) | 2010-09-27 | 2010-09-27 | Low-temperature electricity conducting glue and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010293031 CN101942287A (en) | 2010-09-27 | 2010-09-27 | Low-temperature electricity conducting glue and preparation method thereof |
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| CN101942287A true CN101942287A (en) | 2011-01-12 |
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| CN 201010293031 Pending CN101942287A (en) | 2010-09-27 | 2010-09-27 | Low-temperature electricity conducting glue and preparation method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102181250A (en) * | 2011-03-28 | 2011-09-14 | 彩虹集团公司 | Carbon black conductive adhesive and preparation method thereof |
| CN102190980A (en) * | 2011-03-28 | 2011-09-21 | 彩虹集团公司 | Low-temperature conductive adhesive and preparation method thereof |
| CN102399523A (en) * | 2011-08-25 | 2012-04-04 | 浙江科创新材料科技有限公司 | Nano-grade-silver-filled room-temperature-cured conductive adhesive |
| CN103890115A (en) * | 2011-08-10 | 2014-06-25 | 德莎欧洲公司 | Electrically conductive heat-activated adhesive compound |
| US9399723B2 (en) | 2011-08-10 | 2016-07-26 | Tesa Se | Electrically conductive adhesive compound and adhesive tape |
| CN111303750A (en) * | 2020-04-16 | 2020-06-19 | 湖南汇田高分子科技有限公司 | Water-based protective coating for mercury skin on back of rhinestone, preparation method and application |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1197098A (en) * | 1997-04-24 | 1998-10-28 | 中国科学院低温技术实验中心 | Low temp. adhesive and firming agent used for low temp. adhesive |
| CN101629057A (en) * | 2009-08-22 | 2010-01-20 | 漳立冰 | Nano conductive adhesive and preparation method thereof |
| CN101792627A (en) * | 2010-03-10 | 2010-08-04 | 彩虹集团公司 | Shielding electrically conductive printing ink and preparation method thereof |
-
2010
- 2010-09-27 CN CN 201010293031 patent/CN101942287A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1197098A (en) * | 1997-04-24 | 1998-10-28 | 中国科学院低温技术实验中心 | Low temp. adhesive and firming agent used for low temp. adhesive |
| CN101629057A (en) * | 2009-08-22 | 2010-01-20 | 漳立冰 | Nano conductive adhesive and preparation method thereof |
| CN101792627A (en) * | 2010-03-10 | 2010-08-04 | 彩虹集团公司 | Shielding electrically conductive printing ink and preparation method thereof |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102181250A (en) * | 2011-03-28 | 2011-09-14 | 彩虹集团公司 | Carbon black conductive adhesive and preparation method thereof |
| CN102190980A (en) * | 2011-03-28 | 2011-09-21 | 彩虹集团公司 | Low-temperature conductive adhesive and preparation method thereof |
| CN103890115A (en) * | 2011-08-10 | 2014-06-25 | 德莎欧洲公司 | Electrically conductive heat-activated adhesive compound |
| US9399723B2 (en) | 2011-08-10 | 2016-07-26 | Tesa Se | Electrically conductive adhesive compound and adhesive tape |
| US9593264B2 (en) | 2011-08-10 | 2017-03-14 | Tesa Se | Electrically conductive heat-activated adhesive compound |
| CN103890115B (en) * | 2011-08-10 | 2017-10-24 | 德莎欧洲公司 | Conductive heat activated adhesive compounds |
| CN102399523A (en) * | 2011-08-25 | 2012-04-04 | 浙江科创新材料科技有限公司 | Nano-grade-silver-filled room-temperature-cured conductive adhesive |
| CN102399523B (en) * | 2011-08-25 | 2014-02-05 | 浙江科创新材料科技有限公司 | Nano-grade-silver-filled room-temperature-cured conductive adhesive |
| CN111303750A (en) * | 2020-04-16 | 2020-06-19 | 湖南汇田高分子科技有限公司 | Water-based protective coating for mercury skin on back of rhinestone, preparation method and application |
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Application publication date: 20110112 |