CN101935007A - Acoustic sensor packaging structure for micro electro mechanical system - Google Patents
Acoustic sensor packaging structure for micro electro mechanical system Download PDFInfo
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- CN101935007A CN101935007A CN2009101515292A CN200910151529A CN101935007A CN 101935007 A CN101935007 A CN 101935007A CN 2009101515292 A CN2009101515292 A CN 2009101515292A CN 200910151529 A CN200910151529 A CN 200910151529A CN 101935007 A CN101935007 A CN 101935007A
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Abstract
The invention relates to an acoustic sensor packaging structure for a micro electro mechanical system. The packaging structure comprises a carrier, a drive chip, an acoustic sensor, a cover body and a sound hole, wherein the carrier is formed by stacking multiple layers of printed circuit boards, and the carrier is provided with an accommodation space for embedding the drive chip; the drive chip is electrically connected with a ground return circuits on the printed circuit boards; the cover body covers the carrier to form a chamber; the acoustic sensor is arranged in the chamber and is electrically connected with the drive chip; and the sound hole is communicated with the outside world and the chamber, so that the acoustic sensor can receive a sound from the outside world, and the electromagnetic interference is eliminated through the drive chip electrically connected with the ground return circuits. By embedding or inlaying the drive chip into the printed circuit bards and electrically connecting the drive chip with the ground return circuits of the circuit boards, the invention can achieve the efficacies of electromagnetic interference protection and overall dimension reduction.
Description
Technical field
The present invention relates to a kind of microelectromechanicacoustical acoustical sensor encapsulating structure, particularly relate to and a kind ofly embed or imbed in the middle of the multilayer board, and electrically connect microelectromechanicacoustical acoustical sensor encapsulating structure with the effect that reaches electromagnetic interference shielding with the earth-return circuit of circuit board by driving chip.
Background technology
Common microphone is generally electret formula microphone at present, and the demand on function is a target to reduce volume all, and because the progress of science and technology, existing micro-electro-mechanical microphone is developed out on the industry.Micro-electro-mechanical microphone has more the usability of industry on function and volume, yet because micro-electro-mechanical microphone must be connected with the external sound source, be subjected to the influence of external factor easily, modal is exactly that electronic building brick is subjected to electromagnetic signal interference, cause the micro-electro-mechanical microphone signal to noise ratio not good, cause the surcharge of electronic product to reduce; Therefore, micro-electro-mechanical microphone still has the necessity that breaks through the problems referred to above point on encapsulating structure.
Existing known micro-electro-mechanical microphone structure sees also shown in Figure 1, its structure for being disclosed in the United States Patent (USP) No. 6781231 " Microelectromechanical System Package with Environmental and Interference Shield ", wherein in the middle of this micro-electro-mechanical microphone 10, include a microsensor 11, one drives a chip 12 and a passive component 13, and these surface sticking assemblies all stick together on a substrate 14, stick together assembly on substrate 14 and more include a crown cap 15 on the substrate 14 with covering, and the circuit on crown cap 15 and the substrate 14 electrically conducts, the common chamber that forms a protection electromagnetic interference (EMI, Electromagnetic Interference).
Has the function of electromagnetic interference shielding in order to ensure existing known micro-electro-mechanical microphone, selection and the necessary exactissima diligentia of use for conducting resinl between crown cap 15 and the substrate 14, must avoid because of the error in the conducting resinl gluing process, electrically conduct the usefulness of the electromagnetic interference shielding that detracted and make crown cap 15 and substrate 14 not form; In addition, be the height of consideration surface sticking assembly itself, so crown cap 15 also must design higher, thus, the size of whole micro-electro-mechanical microphone packaging structure promptly is restricted, and for for the designer trends of microminiaturization development, necessity of improvement is again arranged in fact.
This shows that above-mentioned existing electroacoustics sensor package structure obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of novel microelectromechanicacoustical acoustical sensor encapsulating structure, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing electroacoustics sensor package structure exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of novel microelectromechanicacoustical acoustical sensor encapsulating structure, can improve general existing electroacoustics sensor package structure, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
Main purpose of the present invention is, overcome the defective that existing electroacoustics sensor package structure exists, and provide a kind of novel microelectromechanicacoustical acoustical sensor encapsulating structure, technical problem to be solved is to make it provide a kind of chip that will drive to embed or imbed in the middle of the printed circuit board (PCB), and after electrically connecting with the earth-return circuit of circuit board, the effect that reaches electromagnetic interference shielding and can dwindle overall dimensions is very suitable for practicality.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of microelectromechanicacoustical acoustical sensor encapsulating structure that the present invention proposes, it comprises: a carrier formed by the multilayer board storehouse, and this carrier has an accommodation space; One drives chip, is arranged in this accommodation space, and is electrically connected at the earth-return circuit of those printed circuit board (PCB)s; One lid, lid is located on this carrier to form a chamber; One acoustic sensor is arranged in this chamber, and drives the chip electric connection with this; And a sound hole, be communicated in extraneous and this chamber, receive outside sound for this acoustic sensor.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid microelectromechanicacoustical acoustical sensor encapsulating structure, wherein said accommodation space are a groove that is formed on this carrier.
Aforesaid microelectromechanicacoustical acoustical sensor encapsulating structure, wherein said sound hole are arranged on this carrier or this lid.
Aforesaid microelectromechanicacoustical acoustical sensor encapsulating structure is provided with a groove in addition and embeds for this acoustic sensor on the wherein said carrier.
Aforesaid microelectromechanicacoustical acoustical sensor encapsulating structure, wherein said lid are coincided by plate among a upper plate and and form, and this upper plate with should in be provided with colloid between plate for combining, and should in be provided with another colloid for combining between plate and this carrier.
Aforesaid microelectromechanicacoustical acoustical sensor encapsulating structure, wherein said upper plate reach and should be all printed circuit board (PCB) by middle plate.
Aforesaid microelectromechanicacoustical acoustical sensor encapsulating structure, wherein said upper plate and this colloid that is somebody's turn to do between the middle plate are conducting resinl, and this colloid that is somebody's turn to do between middle plate and this carrier is insulating cement or conducting resinl.
Aforesaid microelectromechanicacoustical acoustical sensor encapsulating structure is provided with a shell fragment to electrically connect between wherein said upper plate and this carrier.
Aforesaid microelectromechanicacoustical acoustical sensor encapsulating structure, wherein said lid is made in integrated mode.
Aforesaid microelectromechanicacoustical acoustical sensor encapsulating structure, the outer surface of wherein said carrier and this lid all correspondence is provided with a plurality of connection welding, and those connection welding of this carrier are electrically connected at those connection welding of this lid, use being electrically connected on the external electrical product.
Aforesaid microelectromechanicacoustical acoustical sensor encapsulating structure, wherein said lid is also made by multilayer board, and all be equipped with the plural gold-plated hole of corresponding conducting on each layer printed circuit board of this lid and this carrier, and those gold-plated holes all are electrically connected at those corresponding connection welding.
Aforesaid microelectromechanicacoustical acoustical sensor encapsulating structure more is provided with a metal patch or a thin magnetic film to hide this driving chip on the wherein said carrier.
Aforesaid microelectromechanicacoustical acoustical sensor encapsulating structure, wherein said accommodation space are a room that is formed in this carrier.
Aforesaid microelectromechanicacoustical acoustical sensor encapsulating structure is provided with a plurality of conducting pieces in the printed circuit board (PCB) of the wherein said carrier the superiors, this in this room drive chip by those conducting pieces to electrically connect with this earth-return circuit.
Aforesaid microelectromechanicacoustical acoustical sensor encapsulating structure, wherein said conducting piece are the gold-plated hole that is formed in this printed circuit board (PCB).
The present invention compared with prior art has tangible advantage and beneficial effect.As known from the above, for achieving the above object, the invention provides a kind of microelectromechanicacoustical acoustical sensor encapsulating structure, comprise a carrier, one drives chip, one acoustic sensor, one lid and a sound hole, carrier is to be formed by the multilayer board storehouse, and be formed with at least one accommodation space on the carrier for the driving chip is set, and driving chip is the earth-return circuit that is electrically connected on those printed circuit board (PCB)s, lid then covers and is located on the carrier to form a chamber, and acoustic sensor is arranged in the chamber to electrically connect with the driving chip, sound hole then is arranged on and can be communicated with suitable place extraneous and chamber, receive the sound come from the outside for acoustic sensor, and by the driving chip that electrically connects with earth-return circuit to eliminate electromagnetic interference.
Moreover, for reaching aforementioned purpose, be provided with a room in the carrier of above-mentioned microelectromechanicacoustical acoustical sensor encapsulating structure, be to be embedded in the room and drive chip, and still electrically connect with the earth-return circuit of those printed circuit board (PCB)s.
By technique scheme, microelectromechanicacoustical acoustical sensor encapsulating structure of the present invention has following advantage and beneficial effect at least: the driving chip of microelectromechanicacoustical acoustical sensor encapsulating structure of the present invention embeds or is embedded in the middle of the printed circuit board (PCB) of multilayer because be, because directly be by with circuit board on earth-return circuit electrically connect the effect of reaching electromagnetic interference shielding, therefore needn't consider the state that glues together between lid and the carrier as known as existing, in addition, drive chip and acoustic sensor if all embed or be embedded in the middle of the carrier, lid thickness can not influence under the function of acoustic sensor back of the body chamber, design with thin size, therefore, microelectromechanicacoustical acoustical sensor encapsulating structure of the present invention can be more neatly in response to different clients' demand to do to change design.
In sum, the invention provides a kind of microelectromechanicacoustical acoustical sensor encapsulating structure, it comprises a carrier, one drives chip, one acoustic sensor, one lid and a sound hole, carrier is to be formed by the multilayer board storehouse, and having an accommodation space on the carrier embeds for driving chip, and this driving chip is electrically connected at the earth-return circuit on those printed circuit board (PCB)s, cover cap is located on the carrier to form a chamber, and acoustic sensor is arranged in the chamber and with drive chip and electrically connect, and sound hole is communicated in the external world and chamber, and make acoustic sensor must receive the sound that comes from the outside, and by the driving chip that electrically connects with earth-return circuit to eliminate electromagnetic interference.
The present invention has obvious improvement technically, and has tangible good effect, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the schematic diagram of existing known micro-electro-mechanical microphone.
Fig. 2 is the schematic diagram of first embodiment of the invention microelectromechanicacoustical acoustical sensor encapsulating structure.
Fig. 3 is the schematic diagram of second embodiment of the invention microelectromechanicacoustical acoustical sensor encapsulating structure.
Fig. 4 is the schematic diagram of third embodiment of the invention microelectromechanicacoustical acoustical sensor encapsulating structure.
Fig. 5 is the schematic diagram of fourth embodiment of the invention microelectromechanicacoustical acoustical sensor encapsulating structure.
Fig. 6 is the schematic diagram of fifth embodiment of the invention microelectromechanicacoustical acoustical sensor encapsulating structure.
Fig. 7 is the schematic diagram of sixth embodiment of the invention microelectromechanicacoustical acoustical sensor encapsulating structure.
Fig. 8 is the schematic diagram of seventh embodiment of the invention microelectromechanicacoustical acoustical sensor encapsulating structure.
10: micro-electro-mechanical microphone 11: microsensor
12: drive chip 13: passive component
14: substrate 15: crown cap
20: microelectromechanicacoustical acoustical sensor encapsulating structure 21: carrier
211: printed circuit board (PCB) 212: groove
213: connection welding 22: drive chip
23: acoustic sensor 24: lid
241: upper plate 242: middle plate
243: colloid 244: colloid
25: chamber 26: sound hole
27: passive component
30: microelectromechanicacoustical acoustical sensor encapsulating structure 31: groove
32: shell fragment
40: microelectromechanicacoustical acoustical sensor encapsulating structure 41: lid
42: metal patch
50: microelectromechanicacoustical acoustical sensor encapsulating structure 51: sound hole
60: microelectromechanicacoustical acoustical sensor encapsulating structure 61: carrier
611: printed circuit board (PCB) 612: conducting piece
613: connection welding 62: room
63: sound hole
70: the microelectromechanicacoustical acoustical sensor encapsulating structure
72: shell fragment 73: connection welding
74: gold-plated hole
The specific embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its specific embodiment of microelectromechanicacoustical acoustical sensor encapsulating structure, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Relevant aforementioned and other technology contents, characteristics and effect of the present invention can clearly present in the following detailed description that cooperates with reference to graphic preferred embodiment.For convenience of description, in following embodiment, components identical is represented with identical numbering.
Please refer to shown in Figure 2ly, be the schematic diagram of the microelectromechanicacoustical acoustical sensor encapsulating structure of first embodiment of the invention.Microelectromechanicacoustical acoustical sensor encapsulating structure 20 shown in the figure includes a carrier 21, and drives chip 22, an acoustic sensor 23, a lid 24 and a sound hole 26.Carrier 21 is to be formed by plural layer printed circuit board (PCB) 211 storehouses, and being formed with an accommodation space on the carrier 21 embeds for driving chip 22, in addition, acoustic sensor 23 is to be arranged on the carrier 21 and with driving chip 22 to electrically connect, 24 lids of lid are located on the carrier 21 to form a chamber 25, drive chip 22 and all be located in the chamber 25, and acoustic sensor 23 promptly sees through sound hole 26 to receive outside sound with acoustic sensor 23.
In the middle of present embodiment, accommodation space is embodied as a groove 212 that is formed on the carrier 21, and above-mentioned printed circuit board (PCB) 211 generally disposes electric power loop and control loop according to circuit design, and the earth-return circuit area occupied is bigger in the electric power loop, for the protection effect of electromagnetic interference just better, therefore after utilizing multilayer board 211 to increase the earth-return circuit area, the driving chip 22 that is embedded in the groove 212 is electrically connected with earth-return circuit, the electromagnetic interference that can make driving chip 22 be subjected to is directed to earth-return circuit, and can effectively reach the effect of electromagnetic interference shielding.
In addition, carrier 21 is formed by two layer printed circuit boards, 211 storehouses, and the bottom of the printed circuit board (PCB) 211 of lower floor is provided with several connection welding 213 that can electrically connect with the external electrical product that for example is mobile phone; Moreover, upper printed circuit board 211 foundation when processing procedure drives chip 22 sizes with the mould punching press, laser or milling cutter processing procedure form a perforation, when combining with following layer printed circuit board 211 so again, can form groove 212 is embedded for driving chip 22, and the weld pad that herein drives on the chip 22 can be by tin cream, elargol or conducting resinl with printed circuit board (PCB) 211 on weld pad bind, to reach the anti-oxidation function of weld pad, and drive thus between chip 22 and the printed circuit board (PCB) 211 and needn't also not beat the unnecessary processing procedure that needs benefit glue and toast again behind the gold thread as existing known by beating the gold thread mode to electrically connect with regard to not having; In addition, levels printed circuit board (PCB) 211 when processing procedure, also go out the perforation of same position and size in advance, during when 211 combinations of two layer printed circuit boards and with acoustic sensor 23 assembly, two perforation promptly connect with as sound hole 26.
Moreover, in the middle of present embodiment, being provided with a passive component 27 on the carrier 21 in addition, it also sees through circuit on the printed circuit board (PCB) 211 electrically connecting with driving chip 22, and passive component 27 is embodied as a capacitor at this.
In addition, lid 24 is made up of plate 242 among a upper plate 241 and in the middle of present embodiment, upper plate 241 can be made by non-conductive material or metal material with middle plate 242, and cohere with colloid 243 between upper plate 241 and the middle plate 242, also cohere between middle plate 242 and the carrier 21 with colloid 244, at this two colloid 243,244 can be conducting resinl or insulating cement, when being all the design of the state of electrically conducting between upper plate 241 and middle plate 242 and the carrier 21, it is best that the electromagnetic interference shielding of microelectromechanicacoustical acoustical sensing encapsulating structure 20 can reach.
For the difference of other embodiment of the present invention and first embodiment is described in detail in detail,, give explanation this spy so partly will indicate identical label at the same structure shown in following each embodiment.
Please refer to shown in Figure 3ly, be the schematic diagram of the microelectromechanicacoustical acoustical sensor encapsulating structure of second embodiment of the invention.The difference of the microelectromechanicacoustical acoustical sensor encapsulating structure 30 shown in the present embodiment and first embodiment is, carrier 21 more has additional a groove 31 and is embedded for acoustic sensor 23 in the present embodiment, in process stage, upper printed circuit board 211 promptly must be according to driving chip 22 and acoustic sensor 23 sizes with mould punching press two perforation respectively, when combining with following layer printed circuit board 211 so again, can form groove 212 and groove 31 for driving chip 22 and acoustic sensor 23 embeddings, thus, be equal to the back of the body cavity space that has increased acoustic sensor 23, thereby obtained better acoustic efficiency, on the other hand, the height of lid 24 also no longer is subject to the height that drives chip 22 and acoustic sensor 23, even if when also being embedded in passive component 27 in the carrier 21, the size design of microelectromechanicacoustical acoustical sensor encapsulating structure 30 can have more multifarious variation.
Moreover, in the present embodiment, lid 24 can select to be embodied as insulating cement with the colloid 244 of carrier 21 junctions, and colloid 243 selects to be embodied as conducting resinl, and upper plate 241 and middle plate 242 are made by metal material, thus, upper plate 241 and middle plate 242 are for electrically conducting, then do not electrically conduct between lid 24 and the carrier 21, yet, one shell fragment 32 can be set in the present embodiment in addition between upper plate 241 and carrier 21, transport properties by shell fragment 32, can make carrier 21 and upper plate 241 electrically conduct, also make carrier 21 form simultaneously and electrically conduct, thereby guaranteed the electromagnetic interference shielding effect of microelectromechanicacoustical acoustical sensor encapsulating structure 30 integral body with lid 24.
Please refer to shown in Figure 4ly, be the schematic diagram of the microelectromechanicacoustical acoustical sensor encapsulating structure of third embodiment of the invention.In the present embodiment, the difference of microelectromechanicacoustical acoustical sensor encapsulating structure 40 and previous embodiment is that lid 41 makes crown cap or nonmetal lid in one-body molded mode, and have additional a metal patch 42 on the carrier 21 and drive chip 22 to cover, thus, even if lid 24 is made with non-metallic material, yet drive electromagnetic interference that chip 22 produced also must by the earth-return circuit filtering on metal patch 42 and the printed circuit board (PCB) 211 it, thereby still have the effect of electromagnetic interference shielding.In the present embodiment, metal patch 42 also is able to the thin magnetic film replacement.
What this must replenish be,, be insulating cement but combine employed colloid 244 with carrier 21 if lid 41 is made into integration with metal material, then also can be by the shell fragment shown in Fig. 3 32 to electrically conduct, to add the protection of strong electromagnetic.
Please refer to shown in Figure 5ly, be the schematic diagram of the microelectromechanicacoustical acoustical sensor encapsulating structure of fourth embodiment of the invention.In the present embodiment, microelectromechanicacoustical acoustical sensor encapsulating structure 50 is with the difference of first embodiment shown in Figure 2, the sound hole 51 of present embodiment is opened on the lid 24, and the radio reception of acoustic sensor 23 partly promptly must be towards the direction of lid 24, present embodiment mainly changes the adjustment that only is the radio reception direction, however the still unlikely influence to some extent of the effect of electromagnetic interference shielding.
In addition, for example can setting up on the carrier 21, the central groove 31 of Fig. 4 embeds for acoustic sensor 23, also can be different according to what electrically conduct between lid 24 and the carrier 21, and set up shell fragment 32 in the middle of Fig. 3 for example to electrically connect, thus, all can guarantee to reach effects such as electromagnetic interference shielding and reduction thickness.
Please refer to shown in Figure 6ly, be the schematic diagram of the microelectromechanicacoustical acoustical sensor encapsulating structure of fifth embodiment of the invention.In the present embodiment, microelectromechanicacoustical acoustical sensor encapsulating structure 60 is with the difference of first embodiment shown in Figure 2, the accommodation space of the carrier 61 of present embodiment is embodied as a room 62, and driving chip 22 is arranged in the room 62, and be electrically connected at that to be embedded in the middle of the printed circuit board (PCB) 611 for example be the conducting piece 612 in gold-plated hole, thus, driving chip 22 not only can electrically connect with the acoustic sensor 23 and the passive component 27 on carrier 61 surfaces, also must electrically connect, and can reach the effect of electromagnetic interference shielding with the earth-return circuit in the middle of the printed circuit board (PCB) 611.
The formation of the room 62 of carrier 21 herein, can be to form by three layer printed circuit boards, 611 storehouses, wherein, promptly be provided with a perforation on the printed circuit board (PCB) 611 in intermediate layer according to the size that drives chip 22, thus, when three layer printed circuit boards 611 coincide together, can form this room 62, can promptly be attached in the perforation at intermediate layer printed circuit board (PCB) 611 with after printed circuit board 611 combines and drive chip 22, cover by top layer printed circuit board 611 more at last.Moreover the bottom of undermost printed circuit board (PCB) 611 is provided with several connection welding 613 that can electrically connect with the external electrical product that for example is mobile phone in addition.
In addition, in the present embodiment, sound hole 63 as Fig. 2 operated by rotary motion on carrier 21 (being carrier 61 in this example), also can be as Fig. 5, to be opened on the lid 24, and with the radio reception of acoustic sensor 23 partly towards the direction of lid 24, only the technical characterictic of this adjustment is with can to reach function all identical with previous embodiment, so promptly do not give unnecessary details in addition at this.
Moreover, as shown in Figure 7, be the schematic diagram of the microelectromechanicacoustical acoustical sensor encapsulating structure of sixth embodiment of the invention.In the present embodiment, microelectromechanicacoustical acoustical sensor encapsulating structure 70 is with the difference of the 5th embodiment shown in Figure 6, the carrier 61 of present embodiment is provided with a groove 71 and embeds for acoustic sensor 23, and be provided with a shell fragment 72 between lid 24 and the carrier 61 to use as electrically connecting, thus, as second embodiment shown in Fig. 3, can select colloid 244 between lid 24 and the carrier 21 neatly, the error in the time of needn't worrying to select conducting resinl for use on processing procedure as conductive material.In addition, because acoustic sensor 23 also is arranged in the carrier 61 in the mode that embeds, so the height of lid 24 can not be subject to the height that drives chip 22 and acoustic sensor 23, and the size design of microelectromechanicacoustical acoustical sensor encapsulating structure 70 can be more flexible.
At last, as shown in Figure 8, be the schematic diagram of the microelectromechanicacoustical acoustical sensor encapsulating structure of seventh embodiment of the invention.In the present embodiment, microelectromechanicacoustical acoustical sensor encapsulating structure 70 is with the difference of the 6th embodiment shown in Figure 7, the upper plate 241 of the lid 24 of present embodiment is provided with a plurality of connection welding 73 corresponding to carrier 61, being communicated with between the connection welding 73 of upper plate 241 and the connection welding 613 of carrier 61, in the time of can seeing through processing procedure at each layer printed circuit board 611,242, gold-plated hole 74 conducting each other that wears on 241, thus, microelectromechanicacoustical acoustical sensor encapsulating structure 70 end faces and bottom surface all have the connection welding 73 that can electrically connect with the external electrical product, 613, therefore can keep for the radio reception direction of microelectromechanicacoustical acoustical sensor encapsulating structure 70 to select with end face or bottom surface according to design of electronic products to combine with the circuit board of electronic product.
In addition, what must replenish is, but above-mentioned by on each layer printed circuit board, wearing gold-plated hole 74 so that two sides all conducting and the technology that electrically connects with electronic product also can be applicable in the middle of aforementioned each embodiment.
Comprehensively above-mentioned, the driving chip of microelectromechanicacoustical acoustical sensor encapsulating structure of the present invention embeds or is embedded in the middle of the printed circuit board (PCB) of multilayer because be, by with circuit board on earth-return circuit form to electrically connect, can consider the state that glues together between lid and the carrier, promptly reach the effect of electromagnetic interference shielding; Moreover, also can hide on the printed circuit board (PCB) of top layer and drive chip by a thin magnetic film or a metal patch, and make the function of electromagnetic interference shielding more promote, certainly, if lid also is embodied as metal material and forms an electromagnetic protection cover with carrier, promote the effect of electromagnetic interference shielding especially widely.
In addition, if will drive chip and acoustic sensor embeds in the lump or is embedded in the middle of the carrier, be embedded in the printed circuit board (PCB) the inside in then noise-producing source is equal to, so not only can prevent the interference of noise to acoustic sensor, also because the driving chip all is that the direct of solder joint butt welding point is connected with acoustic sensor, feedback circuit is the shortest distance, with existing known techniques with the long disappearance of the feedback circuit of playing gold thread side's line and being caused difference to some extent, moreover, to drive chip simultaneously, acoustic sensor, passive component embeds all in the lump or imbeds, also can make the minimizing of lid at when design thickness, therefore can design the volume in acoustic sensor back of the body chamber more neatly, and change in response to the different designs demand.
The above only is an illustrative, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be included in the accompanying claim its equivalent modifications of carrying out or change.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (15)
1. microelectromechanicacoustical acoustical sensor encapsulating structure is characterized in that it comprises:
One carrier is formed by the multilayer board storehouse, and this carrier has an accommodation space;
One drives chip, is arranged in this accommodation space, and is electrically connected at the earth-return circuit of those printed circuit board (PCB)s;
One lid, lid is located on this carrier to form a chamber;
One acoustic sensor is arranged in this chamber, and drives the chip electric connection with this; And
One sound hole is communicated in extraneous and this chamber, receives outside sound for this acoustic sensor.
2. microelectromechanicacoustical acoustical sensor encapsulating structure according to claim 1 is characterized in that wherein said accommodation space is a groove that is formed on this carrier.
3. microelectromechanicacoustical acoustical sensor encapsulating structure according to claim 1 is characterized in that wherein said sound hole is arranged on this carrier or this lid.
4. microelectromechanicacoustical acoustical sensor encapsulating structure according to claim 1 is characterized in that being provided with in addition on the wherein said carrier groove and embeds for this acoustic sensor.
5. microelectromechanicacoustical acoustical sensor encapsulating structure according to claim 1, it is characterized in that wherein said lid is coincided by plate among a upper plate and forms, and this upper plate with should in be provided with colloid between plate for combining, and should in be provided with another colloid for combining between plate and this carrier.
6. microelectromechanicacoustical acoustical sensor encapsulating structure according to claim 5 is characterized in that wherein said upper plate and should be all printed circuit board (PCB) by middle plate.
7. microelectromechanicacoustical acoustical sensor encapsulating structure according to claim 5 it is characterized in that this colloid between wherein said upper plate and this middle plate is a conducting resinl, and this colloid that is somebody's turn to do between middle plate and this carrier is insulating cement or conducting resinl.
8. microelectromechanicacoustical acoustical sensor encapsulating structure according to claim 7 is characterized in that being provided with a shell fragment to electrically connect between wherein said upper plate and this carrier.
9. microelectromechanicacoustical acoustical sensor encapsulating structure according to claim 1 is characterized in that wherein said lid makes in integrated mode.
10. microelectromechanicacoustical acoustical sensor encapsulating structure according to claim 1, the outer surface that it is characterized in that wherein said carrier and this lid all correspondence is provided with a plurality of connection welding, and those connection welding of this carrier are electrically connected at those connection welding of this lid, use being electrically connected on the external electrical product.
11. microelectromechanicacoustical acoustical sensor encapsulating structure according to claim 10, it is characterized in that wherein said lid also made by multilayer board, and all be equipped with the plural gold-plated hole of corresponding conducting on each layer printed circuit board of this lid and this carrier, and those gold-plated holes all are electrically connected at those corresponding connection welding.
12. microelectromechanicacoustical acoustical sensor encapsulating structure according to claim 1 is characterized in that more being provided with on the wherein said carrier metal patch or a thin magnetic film to hide this driving chip.
13. microelectromechanicacoustical acoustical sensor encapsulating structure according to claim 1 is characterized in that wherein said accommodation space is a room that is formed in this carrier.
14. microelectromechanicacoustical acoustical sensor encapsulating structure according to claim 13, it is characterized in that being provided with a plurality of conducting pieces in the printed circuit board (PCB) of the wherein said carrier the superiors, this in this room drive chip by those conducting pieces to electrically connect with this earth-return circuit.
15. microelectromechanicacoustical acoustical sensor encapsulating structure according to claim 14 is characterized in that wherein said conducting piece is the gold-plated hole that is formed in this printed circuit board (PCB).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101515292A CN101935007A (en) | 2009-06-30 | 2009-06-30 | Acoustic sensor packaging structure for micro electro mechanical system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101515292A CN101935007A (en) | 2009-06-30 | 2009-06-30 | Acoustic sensor packaging structure for micro electro mechanical system |
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| Publication Number | Publication Date |
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| CN101935007A true CN101935007A (en) | 2011-01-05 |
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| CN2009101515292A Pending CN101935007A (en) | 2009-06-30 | 2009-06-30 | Acoustic sensor packaging structure for micro electro mechanical system |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103313175A (en) * | 2012-03-16 | 2013-09-18 | 美律电子(深圳)有限公司 | Micro-electro-mechanical microphone encapsulating module |
| CN104956684A (en) * | 2012-10-16 | 2015-09-30 | 应美盛股份有限公司 | Packaged microphone system with integrated passive device die |
| CN106231454A (en) * | 2016-08-08 | 2016-12-14 | 钰太芯微电子科技（上海）有限公司 | A kind of directional microphone |
| CN109275080A (en) * | 2018-08-06 | 2019-01-25 | 歌尔股份有限公司 | A kind of sensor |
| CN109362013A (en) * | 2018-12-07 | 2019-02-19 | 歌尔股份有限公司 | Combination sensor |
| CN110690207A (en) * | 2019-02-19 | 2020-01-14 | 美律电子(深圳)有限公司 | Electronic packaging structure |
| CN111128978A (en) * | 2019-12-31 | 2020-05-08 | 山东盛品电子技术有限公司 | System-level packaging structure and method |
| CN111422826A (en) * | 2020-06-11 | 2020-07-17 | 潍坊歌尔微电子有限公司 | Method for manufacturing sensor |
| US10745269B2 (en) | 2014-11-10 | 2020-08-18 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | MEMS package |
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- 2009-06-30 CN CN2009101515292A patent/CN101935007A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103313175A (en) * | 2012-03-16 | 2013-09-18 | 美律电子(深圳)有限公司 | Micro-electro-mechanical microphone encapsulating module |
| CN104956684A (en) * | 2012-10-16 | 2015-09-30 | 应美盛股份有限公司 | Packaged microphone system with integrated passive device die |
| US10745269B2 (en) | 2014-11-10 | 2020-08-18 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | MEMS package |
| EP3218301B1 (en) * | 2014-11-10 | 2020-12-23 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Package for mems |
| CN106231454A (en) * | 2016-08-08 | 2016-12-14 | 钰太芯微电子科技（上海）有限公司 | A kind of directional microphone |
| CN106231454B (en) * | 2016-08-08 | 2024-03-26 | 钰太芯微电子科技（上海）有限公司 | Directional microphone |
| CN109275080A (en) * | 2018-08-06 | 2019-01-25 | 歌尔股份有限公司 | A kind of sensor |
| CN109275080B (en) * | 2018-08-06 | 2020-07-24 | 歌尔股份有限公司 | Sensor |
| CN109362013B (en) * | 2018-12-07 | 2023-11-14 | 潍坊歌尔微电子有限公司 | Combined sensor |
| CN109362013A (en) * | 2018-12-07 | 2019-02-19 | 歌尔股份有限公司 | Combination sensor |
| CN110690207A (en) * | 2019-02-19 | 2020-01-14 | 美律电子(深圳)有限公司 | Electronic packaging structure |
| CN111128978A (en) * | 2019-12-31 | 2020-05-08 | 山东盛品电子技术有限公司 | System-level packaging structure and method |
| CN111422826A (en) * | 2020-06-11 | 2020-07-17 | 潍坊歌尔微电子有限公司 | Method for manufacturing sensor |
| CN111422826B (en) * | 2020-06-11 | 2020-10-20 | 潍坊歌尔微电子有限公司 | Method for manufacturing sensor |
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