CN101929819A - Flat-plate heat pipe - Google Patents
Flat-plate heat pipe Download PDFInfo
- Publication number
- CN101929819A CN101929819A CN2009103037543A CN200910303754A CN101929819A CN 101929819 A CN101929819 A CN 101929819A CN 2009103037543 A CN2009103037543 A CN 2009103037543A CN 200910303754 A CN200910303754 A CN 200910303754A CN 101929819 A CN101929819 A CN 101929819A
- Authority
- CN
- China
- Prior art keywords
- lower cover
- flat plate
- plate heat
- heat
- heat tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009835 boiling Methods 0.000 abstract description 16
- 239000007791 liquid phase Substances 0.000 abstract 1
- 239000012071 phase Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000009834 vaporization Methods 0.000 description 4
- 230000008016 vaporization Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
- F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a flat-plate heat pipe. The pipe comprises a lower cover plate, an upper cover plate matched with the lower cover plate, and a capillary structure adhered to the inner surface of the lower cover plate, wherein the lower cover plate comprises a heat absorbing part contacted with a heat source; and a plurality of pits are reserved on the inner side wall of the heat absorbing part. The structure that the pits are reserved on the inner side wall of the heat absorbing part of the flat-plate heat pipe promotes a working medium to generate nuclear boiling; a large amount of heat energy is changed from a liquid phase to an air phase and then is transferred to a heat releasing part; and then the interface temperature between the flat-plate heat pipe and the heat source is effectively reduced.
Description
Technical field
The present invention relates to a kind of heat pipe, particularly a kind of flat plate heat tube.
Background technology
For solving the high density heat dissipation problem of high-speed electronic calculator, industry generally adopts the technology of utilizing the phase change principle to dispel the heat or conduct heat at present, such as the heat pipe of commonly using at present (Heat Pipe), loop hot-pipe (Loop Heat Pipe) and flat plate heat tube products such as (Vapor Chamber).With regard to heat pipe, little because of its volume, utilize the phase-change heat transfer effect can carry a large amount of heat energy to make uniformity of temperature profile fast, and heat pipe also have simple structure, in light weight, need not advantages such as characteristic such as applied external force, life-span length, low thermal resistance, long distance transmission, therefore the radiating requirements that meets present computer and some high-end electronic devices is widely used for solving heat dissipation problem.
Flat plate heat tube belongs to a kind of of heat pipe, its operation principle is identical with the traditional type heat pipe, because of having the heat transfer area bigger than traditional type heat pipe, and meet " light, thin, short, little " the requirement of high practical value, had on the electronic product of large-scale radiating surface and be applied in large quantities as central processing unit etc.Though, the existing multiple way of realization of traditional flat plate heat tube was suggested, but for producing in a large number, most flat plate heat tubes still as shown in Figure 1, the flat plate heat tube of general tradition, mainly formed the airtight cavity that is lower than big pressure, a capillary structure 102 is set in it and is packaged with an amount of working media in it by upper and lower cover 100,101 plates.After the endothermic section of lower cover 100 absorbs enough heats, working media changes because of wallop produces the liquid vapour phase, simultaneously heat is converted to the gas medium by liquid medium and is passed to upper cover plate 101 as heat unit via solid thermal, working media makes working media be transformed into liquid state by steam state again because of exothermic effects, get back to evaporation ends via capillary structure at last, so periodic duty is to dispel the heat.
Yet, in actual applications, the heat between flat plate heat tube and the electronic component is transmitted interface heat skewness, for example, interface 103 temperature that can occur between flat plate heat tube and the electronics thermal source are too high, thereby cause electronic component Yin Wendu too high and the life-span shortens or damage.
Summary of the invention
In view of this, be necessary to provide a kind of flat plate heat tube that can effectively reduce the interface temperature that contacts with thermal source.
A kind of flat plate heat tube comprises a lower cover, a upper cover plate that cooperates with lower cover and is attached at a capillary structure of lower cover inner surface that described lower cover comprises an endothermic section that contacts with thermal source, is formed with some pits on the madial wall of described endothermic section.
Compared with prior art, the above-mentioned structural design that pit is set at flat plate heat tube endothermic section medial surface, be beneficial to working media and produce the nuclear boiling effect, with a large amount of heat energy via liquid to the vapour phase variation and be passed to heat unit, and then effectively reduce interface temperature between flat plate heat tube and thermal source.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
Description of drawings
Fig. 1 is the schematic cross-section of traditional flat plate heat tube.
Fig. 2 is the schematic cross-section of one embodiment of the invention middle plateform formula heat pipe lower cover and capillary structure.
Fig. 3 is the enlarged drawing of circle part among Fig. 2.
Fig. 4 is that Fig. 2 middle plateform formula heat pipe is used for removing schematic perspective view behind the capillary structure with the thermal source contact portion.
The specific embodiment
To shown in Figure 4, be evaporator section in the flat plate heat tube in one embodiment of the invention as Fig. 2, just the lower cover 10 of this flat plate heat tube be laid on lower cover 10 medial surfaces on the combining of capillary structure 20.Conventional heat pipe is consistent, therefore, not shown in the diagram among other parts of this flat plate heat tube and Fig. 1.
The middle part of above-mentioned flat plate heat tube lower cover 10 protrudes out an endothermic section 12 downwards, and these 12 bottom surfaces, endothermic section contact with thermal source, and its shape can be chosen as shapes such as rectangle, circle according to the shape of thermal source.
Especially as shown in Figure 3 and Figure 4, be formed with some pits 120 on these endothermic section 12 medial surfaces, described pit 120 is distributed on these endothermic section 12 medial surfaces evenly, thick and fast.Each pit 120 opening is towards capillary structure 20, and the bore of pit 120 dwindles to the bottom surface of lower cover 10 direction gradually along the inner surface of lower cover 10, thereby form the awl hole of coniform or tetrahedral in lower cover 10, each pit 120 does not extend to the bottom surface of lower cover 10.This pit 120 is because self form effect, working media of being placed in it is fully contacted and intensifications of being heated fast with inclined wall on pit 120 perisporiums, and then make pit 120 interior working medias in the process of flat plate heat tube transmission heat, take the lead in forming bubble.Simultaneously, because working media fluid self-characteristic, be difficult in the space that complete filling constantly dwindles in pit 120, therefore, working media also is convenient to form bubble in pit 120.The opening shape of above-mentioned pit 120 is not limited to any one concrete shape, can be triangular in shape, shape such as rectangle, circle, prismatic, the shape of pit 120 openings is square in the present embodiment, therefore, the space is tetrahedral in each pit 120, and each pit 120 has the four triangle perisporiums that tilt.
The above-mentioned structural design that pit 120 is set thick and fast at flat plate heat tube 10 endothermic sections 12 medial surfaces, be beneficial to working media and produce the nuclear boiling effect, a large amount of heat energy are changed and are passed to heat unit to vapour phase via liquid, and then effectively reduce interface temperature between flat plate heat tube and thermal source.And compare classic flat-plate formula heat pipe, the endothermic section inwall of classic flat-plate formula heat pipe is smooth smooth, and contacts fully with working media, can't form bubble on endothermic section inwall and interface that working media contacts, and then can't produce the nuclear boiling effect.
Because the definition of boiling is in liquid surface and inner process of carrying out " violent vaporization " simultaneously.Every kind of liquid only is elevated to boiling point when temperature, and just can produce boiling phenomenon when continuing heat absorption, and working media becomes steam state by liquid phase-change.With the boiling water is example, minute bubbles during boiling on liquid internal and the glass wall are being played the part of the effect of vaporization nucleus, the vapour pressure of these minute bubbles increases along with the rising of temperature, during heating minute bubbles can grow up gradually and slowly rise and and other minute bubbles be combined into air pocket, when the vapour pressure of air pocket is increased to when identical with ambient pressure, air pocket can unexpected rising reaches the water surface at last and breaks and emit water vapour, and this violent vaporescence is called boiling.Because playing the part of this process of the role of vaporization nucleus here, minute bubbles also can be called nuclear boiling (nucleate Boiling).Merit attention simultaneously when the contact-making surface of glass and water excessive when smooth or liquid itself is when too pure and free from foreign meter, minute bubbles will be difficult to nucleation, so that 100 ℃ temperature is not sufficient to make the water boiling, even still do not seethe with excitement on a little more than 100 ℃, water at this moment can be in superheat state (super-heating).Because being resistance value, the employed working media of flat plate heat tube reaches the ultra-pure water of eight power ohm of 10, so a plurality of nuclear boiling points (line) need be set, be beneficial to the acceleration of vaporescence, and then reach the function of transferring heat energy in advance, make flat plate heat tube can not be in superheat state, and reach the interface temperature that reduces between flat plate heat tube and electronics thermal source.
For this reason, a plurality of pits 120 are set in the present embodiment, and that the contact area of working media in pit 120 and pit perisporium is compared isopyknic working media is much bigger with the contact area of plane tube wall in classic flat-plate formula heat pipe, therefore the working media in the pit 120 can be heated fast to heat up and take the lead in forming vaporization nucleus, thereby generation nuclear boiling, and then generation steam bubble, increase along with heat, steam bubble is increasing and move up, via original capillary structure gas is dissipated to cavity space, heat is passed to upper cover plate, and gas is phase-changed into liquid by gas again because of exothermic effects, return endothermic section 12 at last to carry out next circulation, thus circulation endlessly, and with the heat of endothermic section 12 under efficient nuclear boiling effect, in time conduct the upper cover plate of flat plate heat tube 10 apace, thereby effectively reduce the interface temperature that endothermic section 12 contacts with thermal source, effectively increase electronic component stability and service life thereof.
Claims (9)
1. flat plate heat tube, comprise a lower cover, a upper cover plate that cooperates with lower cover and be attached at a capillary structure of lower cover inner surface, described lower cover comprises an endothermic section that contacts with thermal source, it is characterized in that: be formed with some pits on the madial wall of described endothermic section.
2. flat plate heat tube as claimed in claim 1 is characterized in that: the bore of described pit is by dwindling gradually in the export-oriented lower cover.
3. flat plate heat tube as claimed in claim 2 is characterized in that: described pit is coniform depression in lower cover.
4. flat plate heat tube as claimed in claim 2 is characterized in that: described pit is the tetrahedral depression in lower cover.
5. flat plate heat tube as claimed in claim 4 is characterized in that: described pit opening is square.
6. flat plate heat tube as claimed in claim 5 is characterized in that: described pit has the four triangle perisporiums that tilt.
7. as each described flat plate heat tube of claim 1 to 3, it is characterized in that: the rounded or prismatic of described pit opening.
8. as each described flat plate heat tube of claim 1 to 4, it is characterized in that: described pit is distributed on the inwall of endothermic section evenly, thick and fast.
9. as each described flat plate heat tube of claim 1 to 4, it is characterized in that: described endothermic section is protruded out downwards by the lower cover middle part.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103037543A CN101929819A (en) | 2009-06-26 | 2009-06-26 | Flat-plate heat pipe |
| US12/641,339 US20100326631A1 (en) | 2009-06-26 | 2009-12-18 | Plate-type heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103037543A CN101929819A (en) | 2009-06-26 | 2009-06-26 | Flat-plate heat pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101929819A true CN101929819A (en) | 2010-12-29 |
Family
ID=43369132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009103037543A Pending CN101929819A (en) | 2009-06-26 | 2009-06-26 | Flat-plate heat pipe |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20100326631A1 (en) |
| CN (1) | CN101929819A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105674779A (en) * | 2014-11-20 | 2016-06-15 | 双鸿电子科技工业(昆山)有限公司 | Temperature uniformizing board |
| CN110476033A (en) * | 2017-04-28 | 2019-11-19 | 株式会社村田制作所 | Soaking plate |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120267077A1 (en) * | 2011-04-21 | 2012-10-25 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses and power electronics modules comprising the same |
| US9618275B1 (en) * | 2012-05-03 | 2017-04-11 | Advanced Cooling Technologies, Inc. | Hybrid heat pipe |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1158982A (en) * | 1995-05-30 | 1997-09-10 | 藤仓电线株式会社 | Radiating pipe and manufacturing method thereof |
| US20040200442A1 (en) * | 2002-12-12 | 2004-10-14 | Perkins Engines Company | Cooling arrangement and method with selected surfaces configured to inhibit changes in boiling state |
| CN1786647A (en) * | 2004-12-06 | 2006-06-14 | 乐金电子（昆山）电脑有限公司 | Heat pipe |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4474231A (en) * | 1981-08-05 | 1984-10-02 | General Electric Company | Means for increasing the critical heat flux of an immersed surface |
| US6371199B1 (en) * | 1988-02-24 | 2002-04-16 | The Trustees Of The University Of Pennsylvania | Nucleate boiling surfaces for cooling and gas generation |
| US6082443A (en) * | 1997-02-13 | 2000-07-04 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
| US6199625B1 (en) * | 1999-06-11 | 2001-03-13 | Psc Computer Products, Inc. | Stackable heat sink for electronic components |
| US6883597B2 (en) * | 2001-04-17 | 2005-04-26 | Wolverine Tube, Inc. | Heat transfer tube with grooved inner surface |
| US6840311B2 (en) * | 2003-02-25 | 2005-01-11 | Delphi Technologies, Inc. | Compact thermosiphon for dissipating heat generated by electronic components |
| US7017654B2 (en) * | 2003-03-17 | 2006-03-28 | Cooligy, Inc. | Apparatus and method of forming channels in a heat-exchanging device |
| US20050139995A1 (en) * | 2003-06-10 | 2005-06-30 | David Sarraf | CTE-matched heat pipe |
| US7123479B2 (en) * | 2003-12-08 | 2006-10-17 | Intel Corporation | Enhanced flow channel for component cooling in computer systems |
| US6957692B1 (en) * | 2004-08-31 | 2005-10-25 | Inventec Corporation | Heat-dissipating device |
| TWI275766B (en) * | 2005-03-18 | 2007-03-11 | Foxconn Tech Co Ltd | Heat pipe |
| JP4621531B2 (en) * | 2005-04-06 | 2011-01-26 | 株式会社豊田自動織機 | Heat dissipation device |
| US20090025910A1 (en) * | 2007-07-27 | 2009-01-29 | Paul Hoffman | Vapor chamber structure with improved wick and method for manufacturing the same |
-
2009
- 2009-06-26 CN CN2009103037543A patent/CN101929819A/en active Pending
- 2009-12-18 US US12/641,339 patent/US20100326631A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1158982A (en) * | 1995-05-30 | 1997-09-10 | 藤仓电线株式会社 | Radiating pipe and manufacturing method thereof |
| US20040200442A1 (en) * | 2002-12-12 | 2004-10-14 | Perkins Engines Company | Cooling arrangement and method with selected surfaces configured to inhibit changes in boiling state |
| CN1786647A (en) * | 2004-12-06 | 2006-06-14 | 乐金电子（昆山）电脑有限公司 | Heat pipe |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105674779A (en) * | 2014-11-20 | 2016-06-15 | 双鸿电子科技工业(昆山)有限公司 | Temperature uniformizing board |
| CN105674779B (en) * | 2014-11-20 | 2017-12-12 | 双鸿电子科技工业(昆山)有限公司 | Temperature-uniforming plate |
| CN110476033A (en) * | 2017-04-28 | 2019-11-19 | 株式会社村田制作所 | Soaking plate |
| CN110476033B (en) * | 2017-04-28 | 2022-05-10 | 株式会社村田制作所 | Vapor chamber |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100326631A1 (en) | 2010-12-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20101229 |