CN101915404A - Super-heat radiating LED module - Google Patents

Super-heat radiating LED module Download PDF

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Publication number
CN101915404A
CN101915404A CN2010102409433A CN201010240943A CN101915404A CN 101915404 A CN101915404 A CN 101915404A CN 2010102409433 A CN2010102409433 A CN 2010102409433A CN 201010240943 A CN201010240943 A CN 201010240943A CN 101915404 A CN101915404 A CN 101915404A
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CN
China
Prior art keywords
super
led chip
heat radiating
fixed head
described fixed
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Granted
Application number
CN2010102409433A
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Chinese (zh)
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CN101915404B (en
Inventor
商松
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HENAN LEISHUO OPTOELECTRONICS TECHNOLOGY Co.,Ltd.
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Shenzhen Zhongqing Micro Technology Development Co Ltd
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Priority to CN201010240943.3A priority Critical patent/CN101915404B/en
Publication of CN101915404A publication Critical patent/CN101915404A/en
Application granted granted Critical
Publication of CN101915404B publication Critical patent/CN101915404B/en
Expired - Fee Related legal-status Critical Current
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Abstract

The invention discloses a super-heat radiating LED module comprising at least one LED chip, a fixed plate, a packaging body and a heat radiator, wherein each LED chip corresponds to the packaging body and is packaged through the packaging body; the packaging body is embedded into the fixed plate and internally packages each LED chip; the fixed plate is made of ceramic materials, and the first side surface of the fixed plate is provided with a plurality of fixing positions used for fixing each LED chip; each fixing position is arranged as a groove, and each LED chip is placed in the groove; the heat radiator is fixedly arranged the second side surface of the fixed plate and corresponds to each LED chip and the fixed plate; and a waterproof adhesive layer is perfused on the surface of the super-heat radiating LED module and made of nanometer colloidal materials. The invention has stable structure and very good heat radiating and waterproof effect.

Description

A kind of super-heat radiating LED module
Technical field
The present invention relates to lighting device, particularly relate to a kind of super-heat radiating LED module.
Background technology
Stage now, pursue in the whole world healthy, environmental protection pressure, under the great situation of energy crisis, semiconductor lighting by universally acknowledged be a kind of important channel of health energy-saving environment protective, expand its range of application just at faster speed.
In the prior art, led module can be applied in various display screens and LED lamp decoration, LED has advantages such as long service life, energy-conserving and environment-protective, but follow the increase of LED current strength and luminous quantity, the caloric value of led chip also rises thereupon, the heat radiation of led chip will become a big problem, and its quality to the LED product, service life and reliability have great influence.
Therefore, there is defective in prior art, needs to improve.
Summary of the invention
Technical problem to be solved by this invention is, provides a kind of structure firm, and radiating effect is very good, and, the also extraordinary super-heat radiating LED module of waterproof effect.
Technical scheme of the present invention is as follows: a kind of super-heat radiating LED module, comprise at least one led chip, fixed head, packaging body and radiator, and wherein, each led chip is corresponding with described packaging body, and, by described packaging body encapsulation; Described packaging body embeds described fixed head, and, each led chip is encapsulated in its inside; Described fixed head adopts ceramic material to make, and described fixed head first side is provided with the plurality of fixed position, is used for fixing each led chip; Described fixed bit is set to a groove, and each led chip is placed in the described groove; And described radiator is fixedly installed on second side of described fixed head; And corresponding each led chip and described fixed head also are provided with a Waterproof glue line on the surface of described super-heat radiating LED module, and described Waterproof glue line adopts the nano-colloid material to make.
Described super-heat radiating LED module, wherein, described ceramic material is aluminium oxide or aluminium nitride.
Described super-heat radiating LED module, wherein, described radiator comprises heat sink or fin, and is wholely set with described fixed head.
Described super-heat radiating LED module, wherein, described fixed head two ends also are provided with a linkage unit respectively, and described linkage unit is provided with power interface, signaling interface.
Described super-heat radiating LED module, wherein, each linkage unit is set to the waterproof linkage unit.
Described super-heat radiating LED module, wherein, corresponding each led chip, described fixed bit is provided with a metal coating, and described metal coating is used for welding and fixes each led chip.
Described super-heat radiating LED module, wherein, described fixed head also is provided with some troughs, is used to place the connection line between each led chip.
Described super-heat radiating LED module, wherein, each trough is provided with at least one fixed cell, is used for each connection line of positioning and fixing.
Described super-heat radiating LED module, wherein, described fixed head also fixedly installs at least one control module, and described control module is used for driving each led chip of control.
Described super-heat radiating LED module, wherein, described fixed head also is provided with at least two control modules, and each control module is only by a signal line cascade.
Described super-heat radiating LED module, wherein, described fixed head also is provided with at least two control modules, and each control module is by the cascade setting respectively of two signal lines.
Adopt such scheme, the present invention embeds described fixed head by the packaging body with each led chip, and, described fixed head adopts ceramic material to make, the fixed head of ceramic material has good heat conductivity and electrical insulating property, therefore, the heat that can the described led chip of extraordinary derivation sends, and, by will heat being derived in the extraneous air with the radiator that fixed head fixes, make radiating effect very good, and, also some fixed bits that are used for fixing each led chip are set in described fixed head first side, as, fixed bit is set to groove, and each led chip is fixing firm; And the Waterproof glue line that a nano-colloid material is made also is set on its surface, waterproof effect is also very good, is fit to various application scenarios.
Description of drawings
Fig. 1 is a kind of enforcement schematic diagram of the present invention.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.
As shown in Figure 1, present embodiment provides a kind of super-heat radiating LED module, and described super-heat radiating LED module comprises one or more led chips 102, fixed head 104, packaging body 101 and radiator 105.
Wherein, each led chip 102 is corresponding with described packaging body 101, packaging body 101 is used for encapsulation and fixes each led chip 102, wherein, a packaging body 101 can correspondingly encapsulate a led chip 101, perhaps, a packaging body 101 also can correspondingly encapsulate two or more led chips 102, and each led chip 102 can be direct insertion encapsulation, perhaps, be the surface-mount type encapsulation, perhaps, as required, be other packing forms, and each led chip 102 can be in red LED, blue led and the green LED one or more.
And described packaging body 101 also embeds described fixed head 104, and promptly described packaging body 101 can interfix with described fixed head 104, thereby each led chip and described fixed head 104 are interfixed; Wherein, described fixed head 104 adopts ceramic material to make, ceramic material is oxide mostly, nitride, boride and carbide etc., the general hardness of ceramic material is higher, does not absorb water corrosion-and high-temp-resistant fully, and, ceramic material has good heat-conductive characteristic and electrical insulation capability, therefore, each packaging body 101 is embedded described fixed head 104, not only can each led chip of held stationary, and, can also have good heat-conducting effect to described package interior led chip 102, make package interior led chip 102 heat on every side derive the outside fast, avoid heat accumulation, and each led chip is burnt out, or, the service life of reducing led chip.On this routine basis, described radiator can be wholely set with described fixed head, and at this moment, described radiator can be heat sink or fin.
For example, described ceramic material is aluminium oxide or aluminium nitride.Aluminium oxide or aluminium nitride other ceramic materials relatively have better heat conductivity and electrical insulation capability, therefore, be more suitable for as described fixed head, thereby each led chip is played better heat-conducting effect and insulation effect.On this routine basis, described radiator can be wholely set with described fixed head, and at this moment, described radiator can be heat sink or fin.
And, also plurality of fixed position 103 being set in first side of described fixed head 101, each fixed bit 103 is used for fixing each led chip 102, wherein, and can each fixed bit 103 corresponding led chip 102, be used for fixing its corresponding led chip 102; For example, described fixed bit 103 is set to a groove, and each led chip 102 is placed in the described groove, so, each led chip is fully contacted with described fixed head, and described fixed head can better conduct heat energy.
Perhaps, corresponding each led chip can also be provided with a metal coating at described fixed bit 103, by metal coating is set, each led chip can be weldingly fixed on the described fixed head 101, firmly is connected with described fixed head 101.
And, described radiator 105 is fixedly installed on second side of described fixed head 101, and, contact with second side of described fixed head 101, thereby the heat of described fixed head 101 can be delivered on the described radiator 105, export to extraneous air by described radiator 105 again.Described second side and described first side are two relative sides of described fixed head 101.Wherein, described radiator 105 can be heat sink or fin, and described radiator 105 can adopt heat-conducting to make, as, can adopt metallic element or nonmetalloid to make, as copper, iron, aluminium, graphite etc.
And, corresponding each led chip and described fixed head, also one Waterproof glue line is set on the surface of described super-heat radiating LED module, as, pour into a Waterproof glue line, perhaps, plate a marine glue rete, promptly, can be except that the light-emitting area of each led chip, the surface of described super diffusing LED thermal modules is provided with a Waterproof glue line, and described Waterproof glue line can play waterproof effect to described super-heat radiating LED module, makes described super-heat radiating LED module can be applied to the open air, perhaps, be applied to the water the inside, as, as the open air screen, underwater lamp etc., wherein, described membrane waterproofing can adopt modes such as plated film or injection moulding to be provided with, and described Waterproof glue line can adopt the nano-colloid material to make, adopt the nano-colloid material, can carry out strengthening and toughening to watertight composition, and, the compactness of ceramic material fixed head can also be improved, fineness, cold and hot fatigability, fracture toughness, creep-resistant property and high-wear resistance etc.
Perhaps, can also one linkage unit also be set respectively at described fixed head 101 two ends, wherein, described linkage unit is provided with power interface, signaling interface, by described linkage unit is set, can make the described super-heat radiating LED module can be respectively and another super-heat radiating LED module of adjacent both ends, realize being electrically connected being connected with signal.For example, each linkage unit is set to the waterproof linkage unit.
Perhaps, another example is, described fixed head 101 also is provided with some troughs, each trough can be according to the setting of arranging of the cabling of each connection line between each led chip, each connection line is placed in its corresponding trough, each connection line is arranged neatly, be not easy to influence each other, disturb; And each trough is provided with one or more fixed cells, as, some clamps are set, each clamp can each connection line of positioning and fixing, is about to each connection line according to its settings of arranging, and tightens to be fixed in its corresponding trough.
Perhaps, another example is, described fixed head 101 also fixedly installs one or more control modules, and wherein, each control module can directly be connected with each led chip, be used for driving each led chip of control, perhaps, each control module can also be through over-drive unit and each led chip, by the control driver element, and drive each led chip of control, make each led chip realize display graphics, literal, letter and video cartoon etc.
For example, described fixed head also is provided with two or more control module, and, each control module is only by a signal line cascade, be that each control chip receives the control signal of only importing from a bars circuit, be used for driving each led chip of control, and only the cascade control signal sent to next control module by a signal line.
So, four traditional holding wires can be integrated, use a DATA holding wire to transmit all signals, simplified the required circuit of transfer of data, can transmit high-quality Visual Display Data when simplifying the cascade transmission line greatly; And, adopt the mode of video data package, RGB display data signal and CLK clock signal and ENABLE signal be integrated carry out package, and in package, be composed of data packet head and packet tail and error checking and deceive sign indicating number, when allowing to data be transmitted, judged and carried out error correction with rub-out signal with serial mode; So greatly reduce the design difficulty of final products, help designing the innovative product that transmission performance is stable, display effect is good, simple in structure, form is exquisite, reduce design and production cost, enhance productivity.
And for example, described fixed head also is provided with two or more control modules, and each control module can be by the cascade setting respectively of two signal lines.Promptly each control module can be received a main signal circuit and a control signal respectively from the signal line input, and, be used to select the control signal of described main signal line input, send to described control module, perhaps, when described main signal line fault, select described control signal, and send to described control module from the signal line input.Wherein, each holding wire is used to transmit identical control signal, can be synchronizing signal or asynchronous signal.
When main signal line and all just often, then preferentially select described main signal line for use from holding wire, when when judging described main signal line fault, then switch to select for use described from holding wire.So, can make from the holding wire control signals transmitted is the backup of main signal line control signals transmitted, when the main signal line fault, can adopt respectively from the holding wire transmission of control signals, the control signal transmission is stable, reliable, make after main signal line breaks down, described super-heat radiating LED module still can operate as normal, the reliability height.
Should be understood that, for those of ordinary skills, can be improved according to the above description or conversion, and all these improvement and conversion all should belong to the protection domain of claims of the present invention.

Claims (10)

1. a super-heat radiating LED module comprises at least one led chip, fixed head, packaging body and radiator, it is characterized in that, each led chip is corresponding with described packaging body, and, by described packaging body encapsulation;
Described packaging body embeds described fixed head, and, each led chip is encapsulated in its inside;
Described fixed head adopts ceramic material to make, and described fixed head first side is provided with the plurality of fixed position, is used for fixing each led chip;
Described fixed bit is set to a groove, and each led chip is placed in the described groove;
And described radiator is fixedly installed on second side of described fixed head;
And corresponding each led chip and described fixed head also are provided with a Waterproof glue line on the surface of described super-heat radiating LED module, and described Waterproof glue line adopts the nano-colloid material to make.
2. super-heat radiating LED module according to claim 1 is characterized in that, described ceramic material is aluminium oxide or aluminium nitride.
3. super-heat radiating LED module according to claim 1 and 2 is characterized in that described radiator comprises heat sink or fin, and is wholely set with described fixed head.
4. super-heat radiating LED module according to claim 1 is characterized in that, described fixed head two ends also are provided with a linkage unit respectively, and described linkage unit is provided with power interface, signaling interface.
5. super-heat radiating LED module according to claim 4 is characterized in that each linkage unit is set to the waterproof linkage unit.
6. super-heat radiating LED module according to claim 1 is characterized in that, corresponding each led chip, and described fixed bit is provided with a metal coating, and described metal coating is used for welding and fixes each led chip.
7. super-heat radiating LED module according to claim 1 is characterized in that described fixed head also is provided with some troughs, is used to place the connection line between each led chip.
8. super-heat radiating LED module according to claim 7 is characterized in that each trough is provided with at least one fixed cell, is used for each connection line of positioning and fixing.
9. super-heat radiating LED module according to claim 1 is characterized in that described fixed head also fixedly installs at least one control module, and described control module is used for driving each led chip of control.
10. super-heat radiating LED module according to claim 9 is characterized in that described fixed head also is provided with at least two control modules, and each control module is only by a signal line cascade, and perhaps, each control module is by the cascade setting respectively of two signal lines.
CN201010240943.3A 2010-07-30 2010-07-30 Super-heat radiating LED module Expired - Fee Related CN101915404B (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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CN101915404A true CN101915404A (en) 2010-12-15
CN101915404B CN101915404B (en) 2014-07-16

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102184685A (en) * 2011-04-22 2011-09-14 深圳市中庆微科技开发有限公司 Urltra-light and ultrathin LED display screen
CN102840484A (en) * 2012-06-01 2012-12-26 友达光电股份有限公司 light emitting structure
CN103644549A (en) * 2013-11-29 2014-03-19 中国科学院半导体研究所 LED (Light-emitting diode) heat dissipation structure

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070018181A1 (en) * 2002-07-16 2007-01-25 Steen Ronald L White led headlight
CN200979881Y (en) * 2006-11-23 2007-11-21 宁波安迪光电科技有限公司 A light source device of a strong power LED and lamps with such light source
CN201059521Y (en) * 2007-07-06 2008-05-14 黄继革 LED lighting lamp structure
CN101271943A (en) * 2007-03-22 2008-09-24 张辉鸿 LED module structure and manufacturing method thereof
CN101403488A (en) * 2008-10-14 2009-04-08 姜建国 Heat radiating structure for LED lamp

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070018181A1 (en) * 2002-07-16 2007-01-25 Steen Ronald L White led headlight
CN200979881Y (en) * 2006-11-23 2007-11-21 宁波安迪光电科技有限公司 A light source device of a strong power LED and lamps with such light source
CN101271943A (en) * 2007-03-22 2008-09-24 张辉鸿 LED module structure and manufacturing method thereof
CN201059521Y (en) * 2007-07-06 2008-05-14 黄继革 LED lighting lamp structure
CN101403488A (en) * 2008-10-14 2009-04-08 姜建国 Heat radiating structure for LED lamp

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102184685A (en) * 2011-04-22 2011-09-14 深圳市中庆微科技开发有限公司 Urltra-light and ultrathin LED display screen
CN102184685B (en) * 2011-04-22 2015-11-11 深圳市中庆微科技开发有限公司 A kind of ultralight ultra-thin LED display
CN102840484A (en) * 2012-06-01 2012-12-26 友达光电股份有限公司 light emitting structure
CN103644549A (en) * 2013-11-29 2014-03-19 中国科学院半导体研究所 LED (Light-emitting diode) heat dissipation structure

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Owner name: HENAN LEISHUO OPTOELECTRONICS TECHNOLOGY CO., LTD.

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Address before: Futian District Che Kung Temple Tairan industrial zone of Shenzhen city in Guangdong province 518040 211 706

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