CN101905529B - Pressure device - Google Patents
Pressure device Download PDFInfo
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- CN101905529B CN101905529B CN201010242006.1A CN201010242006A CN101905529B CN 101905529 B CN101905529 B CN 101905529B CN 201010242006 A CN201010242006 A CN 201010242006A CN 101905529 B CN101905529 B CN 101905529B
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Abstract
The invention provides a pressing device. A pressing device for performing heating pressing to the machined object between thermal plates, includes: thermal plate inner pipelines in which the heat-transfer medium formed in the thermal plates passes through; a plurality of thermoregulation parts, connecting the entrance and export of the thermal plate inner pipeline, to move the heat-transfer medium formed in the thermal plates; a switching mechanism, selectively connecting any one of the plurality of thermoregulation parts to the thermal plate inner pipeline; and a selecting mechanism, selecting a thermoregulation part that is object to connect with the thermal plate inner pipeline, and controlling the switching mechanism. Each of the plurality of thermoregulation parts has: a thermal plate outer pipeline connected to the entrance and export of the thermal plate inner pipeline; a heater, configured in the thermal plate outer pipeline, and heating the heat-transfer medium moving in the thermal plate outer pipeline to a prescribed setting temperature; and a pump, configured in the thermal plate outer pipeline, and conveying heat-transfer medium. The heaters of the plurality of thermoregulation parts are setup with setting temperatures different from each other.
Description
Technical field
The present invention relates to and a kind of hot pressing is carried out to manufacture the pressure setting of resin formed article to machined object.
Background technology
In order to manufacture the resin formed article of the tabular such as electronic circuit substrate, IC plastic clip, the pressure setting as being documented in Japanese Patent Application Laid-Open JP3-197044A can be used.Pressure setting has the heat dish after at least two temperature adjustment, by carrying out hot pressing to the machined object being laminated with resin sheet, Copper Foil etc. between this heat dish, manufactures resin formed article.
As the method for temperature of adjustment heat dish, be included in heat dish and form pipeline, and heat transfer medium after temperature is adjusted is comprising the method etc. of circulating path Inner eycle of this pipeline.The heating of heat transfer medium is that the heater be arranged in circulating path carries out by making heat transfer medium lead to.During heating, adjusted the temperature of heat dish by the output adjusting heater.The cooling of heat dish is by making to lead to cooler to carry out in a part for the heat transfer medium of circulating path Inner eycle.
In existing this pressure setting, when adjusting the temperature of heat dish, except heat dish self, the temperature of the whole heat transfer medium flowed in circulating path, heater and pump that heat transfer medium is circulated all changes.That is, when heat hot dish, except the energy for heat hot dish self, the energy for heating heat transfer medium, heater and pump is also needed.
Like this, in existing pressure setting, a part for the heat energy that heater produces is used to heat heat transfer medium, heater and pump, therefore when will carry out heat hot dish with higher firing rate, needs to export relative to the sufficiently high heater of the thermal capacity of heat dish.
Summary of the invention
The invention solves the problems referred to above.Also namely the object of this invention is to provide a kind of pressure setting, it can carry out heat hot dish by exporting lower heater with higher rate of rise in temperature.
To achieve these goals, pressure setting of the present invention comprises: pipeline in heat dish, and it is formed in heat dish, passes through heat transfer medium; Multiple temperature adjustment portion, it connects the entrance and exit of pipeline in heat dish, and the above-mentioned heat transfer medium in heat dish in pipeline is moved; Switching mechanism, any one temperature adjustment portion in multiple temperature adjustment portion is connected to pipeline in heat dish by selectively; And selection mechanism, the temperature adjustment portion that its selection will be connected with pipeline in heat dish, and switching mechanism is controlled, each temperature adjustment portion in multiple temperature adjustment portion all has: the outer pipeline of the heat dish that can be connected respectively with the entrance and exit of pipeline in heat dish; To be configured in the outer pipeline of heat dish and the heat transfer medium of movement in the outer pipeline of heat dish to be heated to the heater of the design temperature of regulation; Heat is coiled in outer pipeline, the pump of conveying heat transfer medium with being configured in, and the heater in multiple temperature adjustment portion is set to design temperature different from each other.
Multiple temperature adjustment portion preferably includes: design temperature is set to the first temperature adjustment portion of the first temperature; The second temperature adjustment portion of second temperature higher than the first temperature is set to design temperature, selection mechanism preferably by the first temperature adjustment portion with heat coil in pipeline be connected and after the stipulated time, switch above-mentioned switching mechanism to select the second temperature adjustment portion as the temperature adjustment portion that will connect.
In addition, multiple temperature adjustment portion preferably includes: design temperature is set to the first temperature adjustment portion of the first temperature, and design temperature is set to the second temperature adjustment portion of second temperature higher than the first temperature; The 3rd temperature adjustment portion of three temperature higher than the second temperature is set to design temperature, preferred: the first temperature is higher than atmosphere temperature and lower than the softening beginning temperature of machined object temperature, second temperature is higher than the softening beginning temperature of machined object and starts the low temperature of temperature than the sclerosis of machined object, and the 3rd temperature is start the high temperature of temperature than the sclerosis of machined object.
In addition, each temperature adjustment quality award from the ministry choosing in multiple temperature adjustment portion has makes heater in the outer pipeline of heat dish and the upstream side of pump and the bypass pipe of downstream bypass, the choosing of multiple temperature adjustment quality award from the ministry is configured to: when not selected by selection mechanism, makes the heat transfer medium circulation in the path that formed by the outer pipeline of heat dish and bypass pipe.
Further preferably: the midway of bypass pipe is provided with open and close valve, selection mechanism is not being controlled open and close valve by the mode flowed in the bypass pipe in temperature adjustment portion selected according to heat transfer medium.
In addition, the temperature adjustment quality award from the ministry choosing that in multiple temperature adjustment portion, design temperature is minimum is configured to: have the cooler for cooling the heat transfer medium flowing through the outer pipeline of this heat dish.
In addition, selection mechanism is preferably configured to further: when heat of cooling dish, selects the temperature adjustment portion that in multiple temperature adjustment portion, design temperature is minimum, and is connected to pipeline in heat dish.
Further preferably: selection mechanism, when heat of cooling dish, makes to be disconnected by the heater in the temperature adjustment portion selected.
As mentioned above, pressure setting of the present invention has multiple for heating heat transfer medium and the temperature adjustment portion making it circulate.And according to the temperature according to detected heat dish, the temperature adjustment portion that in the heat dish that the way selection that the variations in temperature in temperature adjustment portion diminishes and heat are coiled, pipeline is connected, can suppress the heat energy consumed for heating temperature adjustment portion self thus lower.Therefore, the heat energy major part exported from heater is used to hot heating of coiling, even if for exporting lower heater, also can carry out heat hot dish with higher rate of rise in temperature.
Accompanying drawing explanation
Fig. 1 is the circuit diagram of the pressure setting of embodiments of the present invention.
Fig. 2 represents to use the pressure setting of embodiments of the present invention to carry out the flow chart adding the step of hot pressing of machined object.
Fig. 3 is the circuit diagram of the state represented when heat dish to be heated to lower temperature in the pressure setting of embodiments of the present invention.
Fig. 4 is the circuit diagram of the state represented when heat dish to be heated to moderate temperature in the pressure setting of embodiments of the present invention.
Fig. 5 is the circuit diagram of the state represented when heat dish to be heated to higher temperature in the pressure setting of embodiments of the present invention.
Fig. 6 is the circuit diagram of state when representing heat of cooling dish in the pressure setting of embodiments of the present invention.
Detailed description of the invention
Below, embodiments of the present invention are explained with reference to accompanying drawing.Fig. 1 is the circuit diagram of the pressure setting of embodiments of the present invention.The pressure setting 1 of present embodiment, between flat bench 61 and top workbench 62, be configured with multiple heat coil 63,64 and 65, machined object is inserted between each heat dish, utilize not shown driving mechanism (oil pressure cylinder mechanism etc.) to raise flat bench 61 and make heat dish closer to each other, between heat dish, hot pressing being added to machined object.The pressure setting 1 of present embodiment has: be fixed on the bottom heat dish 63 on flat bench 61; Be fixed on the top heat dish 64 under top workbench 62; And be configured in the hot intermediate heat dish 65 coiled between 64 of bottom heat dish 63 and top, be multistage pressure setting, once can add hot pressing to many group machined objects.In addition, only illustrate an intermediate heat dish 65 in FIG, but also can be arranged above and below and be configured with multiple intermediate heat dish 65 between top heat dish 64 and bottom heat coil 63.
The inside of heat dish 63 ~ 65 is provided with pipeline 63a ~ 65a in bending heat dish.In heat dish, the entrance of pipeline 63a ~ 65a is connected with the heat transfer medium distributary division 43 being configured in the outside that heat is coiled.Similarly, in heat dish, the outlet of pipeline 63a ~ 65a is connected with the heat transfer medium merging part 44 being configured in the outside that heat is coiled.
As shown in Figure 1, heat transfer medium distributary division 43 is connected with high temperature thermoregulation portion 10, middle temperature temperature adjustment portion 20 and low temperature temperature adjustment portion 30 with heat transfer medium merging part 44.
High temperature thermoregulation portion 10 has pump 11 and external heater system 12.Heat transfer medium can be transported to the downstream pipeline 13 be connected with heat transfer medium distributary division 43 by pump 11 from the upstream side pipeline 14 be connected with heat transfer medium merging part 44.External heater system 12 is configured in the upstream side of pump 11, the output of controller 51 pairs of external heater system 12 of pressure setting 1 controls, and makes the temperature (design temperature) flowing to the heat transfer medium of downstream pipeline 13 from upstream side pipeline 14 maintain the high temperature design temperature be defined as between 300 DEG C ~ 400 DEG C.In addition, the molding curve that high temperature design temperature can determine according to the material, shape etc. by machined object suitably carries out setting and changes.
Downstream open and close valve SV11 and upstream side open and close valve SV13 is respectively arranged with in the midway of downstream pipeline 13 and upstream side pipeline 14.Under the state that downstream open and close valve SV11 and upstream side open and close valve SV13 is out, the heat transfer medium after temperature adjustment is carried out by external heater system 12, pipeline 63a ~ 65a in heat dish is transported to via downstream pipeline 13 and heat transfer medium distributary division 43, after heat hot dish, then turn back to external heater system 12 via heat transfer medium merging part 44 and upstream side pipeline 14.Namely, open with upstream side open and close valve SV13 at downstream open and close valve SV11, high temperature thermoregulation portion 10 coil with heat under the state that is connected of pipeline 63a ~ 65a, heat transfer medium after carrying out temperature adjustment by external heater system 12, at the main circulation path Inner eycle formed by pipeline 63a ~ 65a in heat dish and high temperature thermoregulation portion 10, carries out the heating of heat dish.
In addition, between downstream pipeline 13 middle and lower reaches side open and close valve SV11 and pump 11 and between upstream side pipeline 14 middle and upper reaches side open and close valve SV13 and external heater system 12, bypass pipe 15 is provided with.In addition, the midway of bypass pipe 15 is provided with bypass open and close valve SV12.Under the state that downstream open and close valve SV11 and upstream side open and close valve SV13 closes and bypass open and close valve SV12 opens, the heat transfer medium carried by pump 11 is not pipeline 63a ~ 65a in heat transfer medium, but turns back to external heater system 12 by bypass pipe 15.That is, in this condition, heat transfer medium is comprising the secondary circulating path Inner eycle of bypass pipe 15.In this condition, from circulating heat transfer medium to device, the heat of outside transfer is less, therefore, it is possible to the output in order to the temperature of heat transfer medium being maintained the external heater system 12 needed for high temperature is suppressed lower.
Middle temperature temperature adjustment portion 20 has pump 21 and external heater system 22.Heat transfer medium can be transported to the downstream pipeline 23 be connected with heat transfer medium distributary division 43 by pump 21 from the upstream side pipeline 24 be connected with heat transfer medium merging part 44.External heater system 22 is arranged on the upstream side of pump 21, controller 51 pairs of external heater system 22 control, and make the temperature (design temperature) flowing to the heat transfer medium of downstream pipeline 23 from upstream side pipeline 24 maintain the middle temperature design temperature be decided to be between 100 DEG C ~ 200 DEG C.In addition, the molding curve that middle temperature design temperature can determine according to the material, shape etc. by machined object suitably carries out setting and changes.
Downstream open and close valve SV21 and upstream side open and close valve SV23 is respectively arranged with in the midway of downstream pipeline 23 and upstream side pipeline 24.Under the state that downstream open and close valve SV21 and upstream side open and close valve SV23 opens, the heat transfer medium after temperature adjustment is carried out by external heat system 22, pipeline 63a ~ 65a in heat dish is transported to via downstream pipeline 23 and heat transfer medium distributary division 43, after heat hot dish, then turn back to external heater system 22 via heat transfer medium merging part 44 and upstream side pipeline 24.Namely, open with upstream side open and close valve SV23 at downstream open and close valve SV21, in heat dish under the state that is connected with middle temperature temperature adjustment portion 20 of pipeline 63a ~ 65a, heat transfer medium after carrying out temperature adjustment by external heater system 22, at the main circulation path Inner eycle formed by pipeline 63a ~ 65a in heat dish and middle temperature temperature adjustment portion 20, carries out the heating of heat dish.
In addition, the downstream open and close valve SV21 in downstream the pipeline 23 and upstream side open and close valve SV23 between pump 21 and in upstream side pipeline 24 and be provided with bypass pipe 25 between external heater system 22.In addition, the midway of bypass pipe 25 is provided with bypass open and close valve SV22.Under the state that downstream open and close valve SV21 and upstream side open and close valve SV23 closes and bypass open and close valve SV22 opens, the heat transfer medium carried by pump 21 is not pipeline 63a ~ 65a in heat transfer medium, but turns back to external heater system 22 by bypass pipe 25.That is, in this condition, heat transfer medium is comprising the secondary circulating path Inner eycle of bypass pipe 25.In this condition, from the heat transfer medium of circulation to device, the heat of outside transfer is less, the output of the external heater system 22 needed to make the temperature of heat transfer medium maintain moderate temperature can be suppressed lower.
Low temperature temperature adjustment portion 30 has pump 31 and external heater system 32.Heat transfer medium can be transported to the downstream pipeline 33 be connected with heat transfer medium distributary division 43 by pump 31 from the upstream side pipeline 34 be connected with heat transfer medium merging part 44.External heater system 32 is configured in the upstream side of pump 31, the output of controller 51 pairs of external heater system 32 of pressure setting 1 controls, and makes the temperature (design temperature) flowing to the heat transfer medium of downstream pipeline 33 from upstream side pipeline 34 maintain the low temperature design temperature be decided to be between 50 DEG C ~ 100 DEG C.In addition, the molding curve that low temperature design temperature can determine according to the material, shape etc. by machined object suitably carries out setting and changes.
Downstream open and close valve SV31 and upstream side open and close valve SV33 is respectively arranged with in the midway of downstream pipeline 33 and upstream side pipeline 34.The state opened at downstream open and close valve SV31 and upstream side open and close valve SV33 at present, the heat transfer medium after temperature adjustment is carried out by external heater system 32, pipeline 63a ~ 65a in heat dish is transported to via downstream pipeline 33 and heat transfer medium distributary division 43, after heat hot dish, then turn back to external heater system 32 via heat transfer medium merging part 44 and upstream side pipeline 34.Namely, open at downstream open and close valve SV31 and upstream side open and close valve SV33, low temperature temperature adjustment portion 30 be connected to heat dish in pipeline 63a ~ 65a state under, heat transfer medium after carrying out temperature adjustment by external heater system 32, at the main circulation path Inner eycle formed by pipeline 63a ~ 65a in heat dish and low temperature temperature adjustment portion 30, carries out the heating of heat dish.
In addition, between downstream pipeline 33 middle and lower reaches side open and close valve SV31 and pump 31 and between upstream side pipeline 34 middle and upper reaches side open and close valve SV33 and external heater system 32, bypass pipe 35 is provided with.In addition, the midway of bypass pipe 35 is provided with bypass open and close valve SV32.Under the state that downstream open and close valve SV31 and upstream side open and close valve SV33 closes and bypass open and close valve SV32 opens, the heat transfer medium carried by pump 31 is not pipeline 63a ~ 65a in heat transfer medium, but turns back to external heater system 32 by bypass pipe 35.That is, in this condition, heat transfer medium is comprising the secondary circulating path Inner eycle of bypass pipe 35.In this condition, from the heat transfer medium of circulation to device, the heat of outside transfer is less, and that the output of the external heat system 32 needed to make the temperature of heat transfer medium maintain low temperature can be suppressed is lower.
In addition, in upstream side pipeline 34, between external heater system 32 and upstream side open and close valve SV33, branched pipe 38 is provided with.Similarly, branched pipe 37 is also provided with in the pipe arrangement between pump 31 and external heater system 32.Branched pipe 38 is connected with the entrance of cooler 39, and branched pipe 37 is connected with the outlet of cooler 39.In addition, at branched pipe 38, the part that upstream side pipeline 34 carries out branch is provided with tripartite's transfer valve SV34.Tripartite's transfer valve SV34 is for being transported to which in external heater system 32 and cooler 39 valve that switches to by the heat transfer medium of flowing in upstream side pipeline 34.When heat transfer medium is transported to external heater system 32, heat heat transfer medium according to the mode its temperature being maintained low temperature; On the other hand, when heat transfer medium is transported to cooler 39, heat transfer medium is cooled.
Tripartite's transfer valve SV34 in open and close valve SV11 ~ 13 in high temperature thermoregulation portion 10 discussed above, middle temperature temperature adjustment portion 20 and low temperature temperature adjustment portion 30, SV21 ~ 23, SV31 ~ 33 and low temperature temperature adjustment portion 30 controls by controller 51.When adding hot pressing to machined object, controller 51 controls according to the measurement result of temperature sensor 52 of the heat dish being arranged at pressure setting 1 above-mentioned valve, adjusts, make heat dish produce desired by variations in temperature.Below, the method is described.
Fig. 2 represents to add hot pressing with the flow chart of the step making resin formed article shaping for the pressure setting 1 pair of machined object by present embodiment.Below, the step adding hot pressing is described according to this flow chart.In addition, in example below, form the resin material of machined object and start to soften, about 300 DEG C time, start sclerosis about 150 DEG C time, therefore in order, warm design temperature is 170 DEG C, high temperature design temperature is 320 DEG C.In addition, low temperature design temperature is set to 100 DEG C at the atmosphere temperature (about 30 DEG C) of pressure setting 1 and the roughly middle of middle temperature design temperature.
First, machined object is moved into heat dish 63, between 64 and 65 (step S1).Then, raise flat bench 61 and be sandwiched between heat dish (step S2) to make machined object.Now, make the pressure putting on machined object be the degree that heat dish contacts lightly with machined object, instead of the machined object before softening apply excessive pressure so that it is damaged.
Then, low temperature temperature adjustment portion 30 is connected to pipeline 63a ~ 65a (step S3) in heat dish.Now, tripartite's transfer valve SV34 in low temperature temperature adjustment portion 30 is switched by the mode of external heater system 32 according to the heat transfer medium of flowing in upstream side pipeline 34.So as shown in Figure 3, the heat transfer medium heated by the external heater system 32 in low temperature temperature adjustment portion 30 is comprising the main circulation path MR1 in low temperature temperature adjustment portion 30 (thick line portion) Inner eycle, heat dish is being heated to low temperature design temperature by this heat transfer medium.
In addition, now, open and close valve SV11 and SV13 in high temperature thermoregulation portion 10 closes and SV12 opens, the heat transfer medium carried by pump 11 circulation in secondary circulating path SR1 (path passing through bypass pipe 15 and external heater system 12 shown in arrow).Similarly, open and close valve SV21 and SV23 in middle temperature temperature adjustment portion 20 closes and SV22 opens, the heat transfer medium carried by pump 21 circulation in secondary circulating path SR2 (path by bypass pipe pipe 25 and external heater system 22 shown in arrow).
Controller 51 is measured low temperature temperature adjustment portion 30 being connected in heat dish elapsed time after pipeline 63a ~ 65a by built-in timer.Then, after the time measured by timer reaches the very first time determined according to the characteristic of the thermal capacity of being coiled by heat and machined object, controller 51 judges that machined object entirety is heated to low temperature design temperature, then close open and close valve SV31 and SV33 in low temperature temperature adjustment portion 30, or open open and close valve SV32, low temperature temperature adjustment portion 30 is disconnected from pipeline 63a ~ 65a in heat dish.Then, middle temperature temperature adjustment portion 20 is connected to pipeline 63a ~ 65a (step S4) in heat dish.So as shown in Figure 4, the heat transfer medium heated by the external heater system 22 in middle temperature temperature adjustment portion 20, in comprising, main circulation path MR2 (thick line portion) Inner eycle in warm temperature adjustment portion 20, is heated to middle temperature design temperature by this heat transfer medium by heat dish.Then, softened by the machined object that heat dish is heated to middle temperature design temperature.
In addition, now, open and close valve SV11 and SV13 in high temperature thermoregulation portion 10 closes and SV12 opens, and the heat transfer medium therefore carried by pump 11 circulates in secondary circulating path SR1.Similarly, open and close valve SV31 and SV33 in low temperature temperature adjustment portion 20 closes and SV32 opens, the heat transfer medium therefore carried by pump 31 circulation in secondary circulating path SR3 (path passing through bypass pipe 35 and external heater system 32 shown in arrow).
Controller 51 is measured middle temperature temperature adjustment portion 20 being connected in heat dish elapsed time after pipeline 63a ~ 65a by built-in timer.Then, after the time measured by timer reaches the second time determined according to the characteristic of the thermal capacity of being coiled by heat and machined object, controller 51 judges that machined object entirety reaches middle temperature design temperature and softens fully, controller 51 makes flat bench 61 rise, and starts the compacting (step S5) carrying out machined object.When carrying out this compacting, controller 51 maintains the pressing pressure of the regulation driving mechanism of mode to flat bench 61 according to the pressure putting on machined object controls.
Then, controller 51 close in warm temperature adjustment portion 20 open and close valve SV21 and SV23 or open open and close valve SV22, middle temperature temperature adjustment portion 20 is disconnected from pipeline 63a ~ 65a in heat dish.Then, high temperature thermoregulation portion 10 is connected to pipeline 63a ~ 65a (step S6) in heat dish.So as shown in Figure 5, heat dish, comprising circulation in the main circulation path MR3 in high temperature thermoregulation portion 10 (thick line portion), is heated to high temperature design temperature by this heat transfer medium by the heat transfer medium heated by the external heater system 12 in high temperature thermoregulation portion 10.Consequently, machined object is added hot pressing, and resin formed article is able to shaping.
Then, controller 51 cuts out open and close valve SV11 and SV13 in high temperature thermoregulation portion 10 or opens open and close valve SV12, is disconnected in high temperature thermoregulation portion 10 from pipeline 63a ~ 65a in heat dish.Then, low temperature temperature adjustment portion 30 is connected to pipeline 63a ~ 65a in heat dish.Further, the mode flowing to cooler 39 according to the heat transfer medium of flowing in the upstream side pipeline 34 in low temperature temperature adjustment portion 30 switches tripartite's transfer valve SV34.So as shown in Figure 6, in the main circulation path MR1 (thick line portion) comprising low temperature temperature adjustment portion 30, the heat transfer medium of the circulation device 39 that is cooled cools, and by this heat transfer medium, heat dish is cooled to normal temperature (step S7).Like this, after carrying out adding hot pressing, heat dish and resin formed article being cooled and suppresses, the resin formed article that warpage, distortion can not occur when cooling can being obtained thus.
The testing result to the temperature sensor 52 that the temperature of heat dish is measured monitored by controller 51, and judges whether heat dish and the resin formed article be sandwiched between heat dish cool fully according to this testing result.When controller 51 judges that heat dish and resin formed article cool fully, controller 51 makes flat bench 61 decline, and increases heat dish interval (step S8) each other.In addition, the temperature flowing to the heat transfer medium in low temperature temperature adjustment portion 30 in this moment is reduced to normal temperature, open open and close valve SV32 and close open and close valve SV31 and SV33, low temperature temperature adjustment portion 30 is disconnected from pipeline 63a ~ 65a in heat dish, further, the mode flowing to external heater system 32 according to the heat transfer medium of flowing in the upstream side pipeline 34 in low temperature temperature adjustment portion 30 switches tripartite's transfer valve SV34, makes the temperature of heat transfer medium rise to the low temperature of 50 DEG C ~ about 100 DEG C.
Then, will the resin formed article of normal temperature be cooled to from heat dish to take out (step S9).Above, by performing step S 1 ~ S9, hot pressing being added to machined object, can resin formed article be obtained.
In the pressure setting 1 of present embodiment, as mentioned above, when machined object is pressed, in three kinds of temperature adjustment portions 10 ~ 30 that design temperature is different from each other, use as the temperature adjustment portion for heat hot dish successively from the temperature adjustment portion that design temperature is lower.Therefore, when heat hot dish, the variations in temperature in temperature adjustment portion self becomes less, can that heat energy that temperature adjustment portion self consumes suppresses is lower by being used for heating.Therefore, the heat energy major part exported from external heater system is used for heat hot dish, even export lower external heater system, and also can with higher rate of rise in temperature heat hot dish.In addition, because the heat transfer medium in untapped temperature adjustment portion is at secondary circulating path Inner eycle, that the heat being discharged into device outside from heat transfer medium can be suppressed is lower, and therefore the output of the external heater system in temperature adjustment portion is maintained in lower state.Like this, in the pressure setting 1 of present embodiment, the heat being discharged into device outside is less, will can to add the less of Energy suppression that hot pressing peripheral heater system consumes each time.In addition, owing to being configured to switch the different multiple temperature adjustment portions of design temperature successively, therefore, it is possible to suppress energy ezpenditure for heating heat transfer medium, external heater system self, even thus export less external heater system, also can comparatively block ground heat hot dish.
In the present embodiment, be three, but the present invention is not limited to this structure by the quantity set in temperature adjustment portion, the temperature adjustment portion that also can be configured to possess is high temperature use and low temperature etc. two, or possesses more than four temperature adjustment portions.In addition, according to the kind of machined object, also there is the situation not using whole temperature adjustment portions.Such as, when to softening temperature less than 100 DEG C, forming temperature carry out shaping less than the machined object of 200 DEG C, only use low temperature temperature adjustment portion and middle temperature temperature adjustment portion.
Claims (9)
1.-kind of pressure setting, it adds hot pressing to machined object between heat dish, and the feature of this pressure setting is, comprising:
Make to be formed in pipeline in heat dish that the heat transfer medium in described heat dish passes through;
Multiple temperature adjustment portion, the entrance and exit that itself and described heat coil interior pipeline is connected, and the described heat transfer medium in described heat dish in pipeline is moved;
Switching mechanism, any one temperature adjustment portion in described multiple temperature adjustment portion is connected to pipeline in described heat dish by selectively; With
Selection mechanism, its selection will with the temperature adjustment portion that is connected of pipeline in described heat is coiled, and described switching mechanism to be controlled,
Each temperature adjustment portion in described multiple temperature adjustment portion has:
The outer pipeline of the heat dish that in can coiling with described heat respectively, the entrance and exit of pipeline is connected;
To be configured in the outer pipeline of described heat dish and the described heat transfer medium of movement in outer pipeline will to be coiled in described heat and be heated to the heater of the design temperature of regulation; With
Be configured in the outer pipeline of described heat dish interior and carry the pump of described heat transfer medium,
Described multiple temperature adjustment portion comprises: described design temperature is set to the first temperature adjustment portion of the first temperature; Described design temperature is set to the second temperature adjustment portion of second temperature higher than described first temperature; The 3rd temperature adjustment portion of three temperature higher than described second temperature is set to described design temperature,
Described first temperature is higher than atmosphere temperature, temperature lower than the softening beginning temperature of described machined object, described second temperature be higher than described machined object softening beginning temperature, start the temperature of temperature lower than the sclerosis of described machined object, described 3rd temperature is the temperature starting temperature higher than the sclerosis of described machined object.
2. pressure setting as claimed in claim 1, is characterized in that:
Described selection mechanism, is connected to pipeline in described heat dish in described first temperature adjustment portion and after the stipulated time, selects described second temperature adjustment portion as the described temperature adjustment portion that will connect, and switch described switching mechanism.
3. pressure setting as claimed in claim 1, is characterized in that:
Each temperature adjustment portion in described multiple temperature adjustment portion has makes described heater in the outer pipeline of described heat dish and the upstream side of pump and the bypass pipe of downstream bypass,
Described multiple temperature adjustment portion, when not selected by described selection mechanism, makes the described heat transfer medium in the path formed by the described heat outer pipeline of dish and described bypass pipe circulate.
4. pressure setting as claimed in claim 2, is characterized in that:
Each temperature adjustment portion in described multiple temperature adjustment portion has makes described heater in the outer pipeline of described heat dish and the upstream side of pump and the bypass pipe of downstream bypass,
Described multiple temperature adjustment portion, when not selected by described selection mechanism, makes the described heat transfer medium in the path formed by the described heat outer pipeline of dish and described bypass pipe circulate.
5. pressure setting as claimed in claim 3, is characterized in that:
The midway of described bypass pipe is provided with open and close valve, and described selection mechanism does not flow to according to heat transfer medium and is controlled described open and close valve by the mode of the bypass pipe in the temperature adjustment portion selected.
6. pressure setting as claimed in claim 4, is characterized in that:
The midway of described bypass pipe is provided with open and close valve, and described selection mechanism does not flow to according to heat transfer medium and is controlled described open and close valve by the mode of the bypass pipe in the temperature adjustment portion selected.
7. the pressure setting according to any one of claim 1 ~ 6, is characterized in that:
The temperature adjustment portion that described in described multiple temperature adjustment portion, design temperature is minimum, has the cooler for cooling the heat transfer medium flowed in the outer pipeline of this heat dish.
8. pressure setting as claimed in claim 7, is characterized in that:
Described selection mechanism, when cooling described heat dish, selects the temperature adjustment portion that described in described multiple temperature adjustment portion, design temperature is minimum, and is connected to pipeline in described heat dish.
9. pressure setting as claimed in claim 8, is characterized in that:
Described selection mechanism, when cooling described heat dish, makes the described heater by the temperature adjustment portion selected disconnect.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009117626A JP5372596B2 (en) | 2009-05-14 | 2009-05-14 | Press machine |
| JP2009-117626 | 2009-05-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101905529A CN101905529A (en) | 2010-12-08 |
| CN101905529B true CN101905529B (en) | 2014-12-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010242006.1A Expired - Fee Related CN101905529B (en) | 2009-05-14 | 2010-05-14 | Pressure device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5372596B2 (en) |
| CN (1) | CN101905529B (en) |
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| CN1406743A (en) * | 2001-08-31 | 2003-04-02 | 北川精机株式会社 | Method and apparatus for pressing component |
| CN1701942A (en) * | 2004-05-28 | 2005-11-30 | 株式会社小松制作所 | Thermal transfer press device |
| JP2009045814A (en) * | 2007-08-20 | 2009-03-05 | Mitsubishi Heavy Industries Plastic Technology Co Ltd | Method of temperature control of molding mold and temperature controller |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3777887B2 (en) * | 1999-07-26 | 2006-05-24 | 松下電工株式会社 | Manufacturing method of resin molded products |
| JP2006007755A (en) * | 2004-05-28 | 2006-01-12 | Komatsu Ltd | Thermal transfer press device |
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2009
- 2009-05-14 JP JP2009117626A patent/JP5372596B2/en active Active
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2010
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1365881A (en) * | 2000-11-16 | 2002-08-28 | 北川精机株式会社 | Pressurizing device, control method of pressurizing device and hot plate of pressurizing device |
| CN1406743A (en) * | 2001-08-31 | 2003-04-02 | 北川精机株式会社 | Method and apparatus for pressing component |
| CN1701942A (en) * | 2004-05-28 | 2005-11-30 | 株式会社小松制作所 | Thermal transfer press device |
| JP2009045814A (en) * | 2007-08-20 | 2009-03-05 | Mitsubishi Heavy Industries Plastic Technology Co Ltd | Method of temperature control of molding mold and temperature controller |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010264477A (en) | 2010-11-25 |
| JP5372596B2 (en) | 2013-12-18 |
| CN101905529A (en) | 2010-12-08 |
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