CN101900824A - Scintillator packaging thin film and packaging method thereof - Google Patents
Scintillator packaging thin film and packaging method thereof Download PDFInfo
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- CN101900824A CN101900824A CN 201010208591 CN201010208591A CN101900824A CN 101900824 A CN101900824 A CN 101900824A CN 201010208591 CN201010208591 CN 201010208591 CN 201010208591 A CN201010208591 A CN 201010208591A CN 101900824 A CN101900824 A CN 101900824A
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Abstract
The invention relates to a scintillator packaging thin film, comprising a protective layer, which is positioned at the outmost layer of the packaging thin film; a waterproof layer, the water vapor penetration rate of which is not more than 0.1g/m2.day-1, X ray absorption rate of which is not more than 5% and which is positioned at the inner side of the protective layer; a light-absorbing isolation layer; and a non-isotropic optical reflection layer, which selectively reflect visible lights, so that abnormal phenomenon such as crumple, bubble, etc., generated owing to particles and packaging on the surface of the scintillator, does not impact on the imaging of a X ray detector.
Description
Technical field
The present invention relates to a kind ofly in x-ray imaging system, be used to change the packaging film and the method for packing of the scintillator of X ray.
Background technology
In industry and hospitality industry; X-ray detector is used widely; also more and more important as the requisite scintillator of X-ray detector part, wherein have high brightness, high-resolution caesium iodide scintillator is more more and more studied, and the cesium iodide material is a hygroscopic materials; absorb airborne moisture and deliquescence; make the characteristic of scintillator, particularly image resolution ratio reduces greatly, therefore; how to protect scintillator not to be subjected to influence of moisture, it is more particularly important how effectively to encapsulate scintillator.
At present, be the plated film method for packing of Hamamatsu Photonics Co., Ltd as the packaged type of representational cesium iodide, be the method for packing that the patent of WO99/66348, WO02/23219 and JP170092/1998 etc. is announced as the patent No..This caesium iodide scintillator packaged type is the parylene layer of 10um by the CVD method at cesium iodide surface plating one bed thickness at first, the SiO2 film of sputter one deck 200nm then, and last CVD method forms one deck 10um parylene layer.
Yet, utilize CVD method evaporation parylene film and sputter SiO2 layer as being used for making scintillator to avoid the damp proof barrier of influence of moisture.Here, two kinds of equipment of minimum needs are that CVD evaporated device and sputtering equipment are finished this encapsulation, and therefore, there is the very high problem of production cost in this encapsulation technology.Simultaneously, utilize the method for evaporation to encapsulate, must process mask plate protection does not need the place that is capped, as connecting pin etc., has increased the complexity of technology so greatly.In addition; the speed that forms the organic membrane protective seam of Parylene by the CVD method be approximately 100 to 2000 dusts/minute; therefore the scintillator protective seam that forms 20um needs 2000 minutes to 100 minutes, and there is the lower problem of throughput rate in this existing encapsulation technology.
Summary of the invention
In order to address the above problem, the object of the present invention is to provide that a kind of high efficiency, technology is simple, the packaging film and the method for packing of the scintillator of low production cost.
In order to achieve the above object, the present invention adopts following technical scheme:
Technical scheme one:
A kind of scintillator packaging film, it comprises:
Layer protective layer, this protective seam is in the outermost layer of packaging film;
One deck water barrier, the moisture-vapor transmission of this water barrier is smaller or equal to 0.1g/m
2Day
-1, the X ray absorptivity is smaller or equal to 5%, described water barrier is in the inboard of described protective seam;
One deck extinction separation layer, this layer are used to prevent scintillator and water barrier generation chemical reaction, and can absorb visible light;
One deck non-isotropy optical reflecting layer, this reflection horizon is optionally reflected visible light, allow the low-angle visible light that penetrates from the scintillator back side evenly reflect back in the scintillator, allow the wide-angle visible transmission that penetrates from the scintillator back side absorb to the extinction separation layer of back and by the extinction separation layer; Described low-angle visible light is and the angle of the surface normal direction visible lights less than 45 degree, and described wide-angle visible light be that angle with the surface normal direction is more than or equal to 45 visible lights of spending.
Preferably, described water barrier is a metal film, and its thickness is 10～80um.
Preferably, described water barrier is an aluminium foil.
Preferably, described extinction separation layer is a black thin film, and material is macromolecular material or inorganic dielectric material.
Preferably, described macromolecular material is PET or Teflon.
Preferably, described inorganic dielectric material is SiO
x, SiN
x, SiN
xO
y
Preferably, contain titanium dioxide granule in the described non-isotropic optical reflecting layer, the granularity of described titanium dioxide granule is 0.3um～0.6um.
Preferably, described non-isotropy optical reflecting layer inboard also is provided with one deck adhesive linkage.
Preferably, contain bonding agent in the described non-isotropy optical reflecting layer, described titanium dioxide granule is entrained in the described bonding agent, and the glue content in the described bonding agent and the part by weight of titania are between 0.1～10.
Preferably, described bonding agent is a pressure sensitive adhesive, adopts oil-based solvent in the described bonding agent.
In the above technical scheme, packaging film is the film of sandwich construction, and protective seam wherein has certain rigidity and scratching resistent property, is in the packaging film outermost layer, and the protection packaging film is not scratched and damages.Water barrier has very low moisture-vapor transmission, and very low X ray absorptivity, is in the inboard of anti-scratch layers, prevents that mainly aqueous vapor from seeing through, and the protection scintillator is not hydrolyzed, and generally selects metal material or inorganic material, as aluminium, silicon dioxide etc.The extinction separation layer has certain visible light transmissivity and physical strength, mainly scintillator and water barrier is kept apart, and prevents scintillator and water barrier generation chemical reaction, influences the optical effect of scintillator and the water resistance of packaging film.Non-isotropy optical reflecting layer, this reflection horizon mainly play diffusion of visible light and reflex,, the not imaging that can produce its X-ray detectors of anomalous effects such as wrinkle, bubble because of the particle or the encapsulation of scintillator surface.
Second technical scheme:
A kind of method for packing of scintillator packaging film, it comprises the steps:
1) scintillator aligning to be packaged is positioned in the annular seal space, and fixing;
2) packaging film is cut into and the corresponding size of scintillator size to be packaged, then packaging film is aimed at the upper surface that is positioned over scintillator to be packaged;
3) with described annular seal space vacuum pumping state, with packaging film and scintillator surface pressing;
4) edge closely packed.
Preferably, in step (3), utilize flexible surface with packaging film and scintillator surface pressing.
Preferably, in step (4), utilize hot melt adhesive insulative water-proof fillet that scintillator is carried out the edge hot sealing, the moisture permeability of its hot melt adhesive insulative water-proof fillet is smaller or equal to 0.15g/m
2Day
-1
This technical scheme, encapsulation is simple, convenient, cost is low.
Description of drawings
Accompanying drawing 1 is the packaging film sectional view of the scintillator of embodiment one;
Accompanying drawing 2 is the method for packing process flow diagram of the scintillator of embodiment one;
Accompanying drawing 3 is the design sketch after the scintillator of embodiment one encapsulates;
Embodiment
Below in conjunction with drawings and Examples the present invention is further described:
Embodiment one:
Packaging film as shown in Figure 1, this packaging film is a sandwich construction, mainly comprises protective seam 1, water barrier 2, extinction barrier layer 3, non-isotropy optical reflecting layer 4 and easy-stripping type ply of paper 5 from outside to inside.
Present embodiment selects the macromolecular material mylar as the anti-oxidation protective seam 1 of anti-scratch, comes the protection packaging film, and polyester is a water white transparency, and high temperature resistant, scratch-resistant, ageing-resistant, corrosion-resistant, and the film of protection packaging all the life is not scratched and oxidation.The thickness of its polyester film is generally chosen 20um.
Non-isotropy optical reflecting layer 4, the 4 pairs of visible lights in this reflection horizon optionally reflect, and allow from low-angle (spending less than 45 with the angle of the surface normal direction) visible light of scintillator back side ejaculation, evenly reflect back in the scintillator; Allow from wide-angle (spending more than or equal to the 45) visible light of scintillator back side ejaculation with the angle of surface normal direction; be transmitted to the extinction barrier layer 3 of back and absorbed by extinction barrier layer 3, thus the imaging that can not produce its X-ray detectors of anomalous effects such as wrinkle, bubble because of the particle or the encapsulation of scintillator surface.In the present embodiment, utilize TiO
2The scattering process of material realizes the diffuse reflection to visible light.In addition, in the present embodiment, bonding agent also mixes in this non-isotropy optical reflecting layer 4, play bonding effect (bonding agent also can be established one deck separately), be specially: select oiliness acrylic pressure sensitive adhesive as adhesive linkage, oiliness acrylic pressure sensitive adhesive is a water white transparency, and does not contain hydrosolvent, doped Ti O in the acrylic pressure sensitive adhesive
2Particle is as the diffuse reflector of light, its TiO
2Median size be 0.36um, the ratio of doping is 1: 2 (TiO
2Quality: acrylic pressure sensitive adhesive solid content), its scattering layer effect is prevent scintillator surface unusual, and particle etc. influence detector image-forming.
Easily tear release layer 5 and be polyester material, polyester layer has compared with the paper release layer and has an even surface, and easily removes, and characteristics such as abrasion-proof and temperature-resistant and surface strength help keeping the flatness of scattering adhesive linkage and protection scattering adhesive linkage to be difficult for by effects such as foreign object pollutions.
This packaging film; be by the laminated film of film complex technique with protective seam 1, water barrier 2, extinction barrier layer 3 with its synthetic a kind of sandwich construction; cover the surface that is coated in extinction barrier layer 3 and form non-isotropy optical reflecting layer 4 through covering will the mix acrylic pressure sensitive adhesive of TiO2 particle of adhesive process then, the release layer 5 that easily tears that is covered with polyester material at last gets final product.
Describe in detail below and utilize the encapsulation process of above-mentioned packaging film the scintillator that is grown in polysilicon X-ray detector planar surface.
At first, determine to be grown in the overall dimensions of the scintillator of polysilicon X-ray detector planar surface, parameters such as useful area;
Its encapsulation process as shown in Figure 2, its concrete steps are as described below.
Step S201: cut packaging film;
Step S202: aim at and place the growth scintillator in an annular seal space, and fixing;
Step S203: aim to place the packaging film that cuts on carrier, and utilize vacuum to fix, tear then and easily tear release layer 5;
Step S204: aim at counter-rotating and place carrier on the growth scintillator, turn off vacuum valve, place packaging film on the growth scintillator;
Step S205: annular seal space is vacuumized;
Step S206: utilize flexible silica gel, in annular seal space, packaging film is pressed down, make packaging film and scintillator well bonding;
Step S207: turn off the annular seal space vacuum valve,, open seal chamber, take out the growth scintillator of the described packaging film of pressing to wherein venting;
Step S208: the growth scintillator to the pressing packaging film carries out the edge sealing, and adopting anti-moisture permeability is 0.12g/m
2Day
-1The hot melt adhesive fillet of insulation growth scintillator edge is carried out hot sealing;
The edge sealing function of the hot melt adhesive waterproof fillet of above-mentioned steps 208, on the one hand, prevent aqueous vapor from the packaging film edge penetration in scintillator, on the other hand, play an insulating effect, prevent that metal water barrier edge is short-circuited in back Dao Bangding technology in the packaging film.
The design sketch that above-mentioned packaging technology is implemented as shown in Figure 3, can find out obviously that the scintillator that is grown in polysilicon X-ray detector planar surface is sealed completely, and the connecting pin around the X-ray detector flat board is not capped, and can descend to go on foot nation easily smoothly and decide technology.
The foregoing description only is explanation technical conceive of the present invention and characteristics, and its purpose is to allow the personage who is familiar with this technology can understand content of the present invention and enforcement according to this, can not limit protection scope of the present invention with this.All equivalences that spirit is done according to the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (13)
1. scintillator packaging film, it is characterized in that: it comprises:
Layer protective layer (1), this protective seam (1) is in the outermost layer of packaging film;
One deck water barrier (2), the moisture-vapor transmission of this water barrier (2) is smaller or equal to 0.1g/m
2Day
-1, the X ray absorptivity is smaller or equal to 5%, described water barrier is in the inboard of described protective seam;
One deck extinction separation layer (3), this layer are used to prevent scintillator and water barrier generation chemical reaction, and absorb visible light;
One deck non-isotropy optical reflecting layer (4), this non-isotropy optical reflecting layer (4) optionally reflects visible light, allow the low-angle visible light that penetrates from the scintillator back side evenly reflect back in the scintillator, allow the wide-angle visible transmission that penetrates from the scintillator back side absorb to the extinction separation layer (3) of back and by extinction separation layer (3); Described low-angle visible light is and the angle of the surface normal direction visible lights less than 45 degree, and described wide-angle visible light be that angle with the surface normal direction is more than or equal to 45 visible lights of spending.
2. scintillator packaging film according to claim 1 is characterized in that: described water barrier (2) is a metal film, and its thickness is 10～80um.
3. scintillator packaging film according to claim 2 is characterized in that: described water barrier (2) is an aluminium foil.
4. scintillator packaging film according to claim 1 is characterized in that: described extinction separation layer (3) is a black thin film, and material is macromolecular material or inorganic dielectric material.
5. scintillator packaging film according to claim 4 is characterized in that: described macromolecular material is PET or Teflon.
6. scintillator packaging film according to claim 4 is characterized in that: described inorganic dielectric material is SiO
x, SiN
x, SiN
xO
y
7. scintillator packaging film according to claim 1 is characterized in that: contain titanium dioxide granule in the described non-isotropic optical reflecting layer (4), the granularity of described titanium dioxide granule is 0.3um～0.6um.
8. scintillator packaging film according to claim 7 is characterized in that: described non-isotropy optical reflecting layer (4) inboard also is provided with one deck adhesive linkage.
9. scintillator packaging film according to claim 7, it is characterized in that: contain bonding agent in the described non-isotropy optical reflecting layer (4), described titanium dioxide granule is entrained in the described bonding agent, and the glue content in the described bonding agent and the part by weight of titania are between 0.1～10.
10. scintillator packaging film according to claim 9 is characterized in that: described bonding agent is a pressure sensitive adhesive, adopts oil-based solvent in the described bonding agent.
11. the method for packing based on scintillator packaging film as claimed in claim 1, it comprises the steps:
1) scintillator aligning to be packaged is positioned in the annular seal space, and fixing;
2) packaging film is cut into and the corresponding size of scintillator size to be packaged, then packaging film is aimed at the upper surface that is positioned over scintillator to be packaged;
3) with described annular seal space vacuum pumping state, with packaging film and scintillator surface pressing;
4) edge sealing.
12. method for packing according to claim 11 is characterized in that: in step (3), utilize flexible surface with packaging film and scintillator surface pressing.
13. method for packing according to claim 11 is characterized in that: in step (4), utilize hot melt adhesive insulative water-proof fillet that scintillator is carried out the edge hot sealing, the moisture permeability of its hot melt adhesive insulative water-proof fillet is smaller or equal to 0.15g/m
2Day
-1
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| CN2010102085913A CN101900824B (en) | 2010-06-24 | 2010-06-24 | Scintillator packaging thin film and packaging method thereof |
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|---|---|---|---|
| CN2010102085913A CN101900824B (en) | 2010-06-24 | 2010-06-24 | Scintillator packaging thin film and packaging method thereof |
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| CN101900824B CN101900824B (en) | 2012-05-09 |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102093676A (en) * | 2010-12-06 | 2011-06-15 | 宁波东旭成化学有限公司 | Method for preparing optical reflective film |
| CN102139517A (en) * | 2010-12-23 | 2011-08-03 | 福建福晶科技股份有限公司 | Method for cutting water/oxygen-sensitive rare-earth halide crystal |
| CN104020486A (en) * | 2014-06-10 | 2014-09-03 | 平生医疗科技（昆山）有限公司 | Anti-dazzle film packing radiation detector crystal panel and manufacturing method thereof |
| CN104126132A (en) * | 2011-12-30 | 2014-10-29 | 圣戈本陶瓷及塑料股份有限公司 | Scintillation detection device with encapsulated scintillator |
| CN104158529A (en) * | 2014-08-08 | 2014-11-19 | 孙宗远 | Device and method for controlling working state of circuit by sensing X-rays |
| CN104157320A (en) * | 2014-08-22 | 2014-11-19 | 平生医疗科技（昆山）有限公司 | Scintillator panel and manufacture method thereof |
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| CN105988132A (en) * | 2014-09-23 | 2016-10-05 | 中国科学技术大学 | X-ray detector and packaging method thereof |
| CN106252372A (en) * | 2016-09-26 | 2016-12-21 | 上海奕瑞光电子科技有限公司 | Radiation image sensor and preparation method thereof |
| CN107238851A (en) * | 2017-05-09 | 2017-10-10 | 华北电力大学 | Sodium iodide or caesium iodide scintillator encapsulating structure |
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| WO2018150529A1 (en) * | 2017-02-17 | 2018-08-23 | 野洲メディカルイメージングテクノロジー株式会社 | Scintillator module, scintillator sensor unit, and scintillator module production method |
| CN109541669A (en) * | 2018-12-26 | 2019-03-29 | 北京纳米维景科技有限公司 | A kind of high-resolution radiation detection device and preparation method thereof |
| CN110376630A (en) * | 2019-07-18 | 2019-10-25 | 江苏康众数字医疗科技股份有限公司 | A kind of manufacturing method and image detector of flat radiation image detector |
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| CN102093676B (en) * | 2010-12-06 | 2012-10-10 | 宁波东旭成化学有限公司 | Method for preparing optical reflective film |
| CN102093676A (en) * | 2010-12-06 | 2011-06-15 | 宁波东旭成化学有限公司 | Method for preparing optical reflective film |
| CN102139517A (en) * | 2010-12-23 | 2011-08-03 | 福建福晶科技股份有限公司 | Method for cutting water/oxygen-sensitive rare-earth halide crystal |
| CN104126132B (en) * | 2011-12-30 | 2017-06-09 | 圣戈本陶瓷及塑料股份有限公司 | The flash detecting device of the scintillator with encapsulation |
| CN104126132A (en) * | 2011-12-30 | 2014-10-29 | 圣戈本陶瓷及塑料股份有限公司 | Scintillation detection device with encapsulated scintillator |
| CN105190360A (en) * | 2013-05-08 | 2015-12-23 | 皇家飞利浦有限公司 | Gamma radiation detection device |
| CN105190360B (en) * | 2013-05-08 | 2019-06-28 | 皇家飞利浦有限公司 | Gamma radiation detecting devices |
| CN104241199A (en) * | 2013-06-06 | 2014-12-24 | 株式会社东芝 | Manufacturing method for radioactive ray detector and radioactive ray detector |
| CN104241199B (en) * | 2013-06-06 | 2017-09-12 | 东芝电子管器件株式会社 | The manufacture method and radiation detector of radiation detector |
| CN104020486A (en) * | 2014-06-10 | 2014-09-03 | 平生医疗科技（昆山）有限公司 | Anti-dazzle film packing radiation detector crystal panel and manufacturing method thereof |
| CN104020486B (en) * | 2014-06-10 | 2016-07-13 | 平生医疗科技（昆山）有限公司 | A kind of anti-dazzling film encapsulation radiation detector crystal panel and preparation method thereof |
| CN104158529A (en) * | 2014-08-08 | 2014-11-19 | 孙宗远 | Device and method for controlling working state of circuit by sensing X-rays |
| CN104157320A (en) * | 2014-08-22 | 2014-11-19 | 平生医疗科技（昆山）有限公司 | Scintillator panel and manufacture method thereof |
| CN105988132A (en) * | 2014-09-23 | 2016-10-05 | 中国科学技术大学 | X-ray detector and packaging method thereof |
| CN106252372A (en) * | 2016-09-26 | 2016-12-21 | 上海奕瑞光电子科技有限公司 | Radiation image sensor and preparation method thereof |
| WO2018150529A1 (en) * | 2017-02-17 | 2018-08-23 | 野洲メディカルイメージングテクノロジー株式会社 | Scintillator module, scintillator sensor unit, and scintillator module production method |
| JP6454451B1 (en) * | 2017-02-17 | 2019-01-16 | 野洲メディカルイメージングテクノロジー株式会社 | Scintillator module, scintillator sensor unit, and scintillator module manufacturing method |
| US10871581B2 (en) | 2017-02-17 | 2020-12-22 | Yasu Medical Imaging Technology Co., Ltd. | Scintillator module, scintillator sensor unit, and scintillator module production method |
| CN107238851A (en) * | 2017-05-09 | 2017-10-10 | 华北电力大学 | Sodium iodide or caesium iodide scintillator encapsulating structure |
| CN108107060A (en) * | 2017-11-30 | 2018-06-01 | 上海奕瑞光电子科技股份有限公司 | Flat panel detector based on fexible film encapsulation and preparation method thereof |
| CN109541669A (en) * | 2018-12-26 | 2019-03-29 | 北京纳米维景科技有限公司 | A kind of high-resolution radiation detection device and preparation method thereof |
| CN110376630A (en) * | 2019-07-18 | 2019-10-25 | 江苏康众数字医疗科技股份有限公司 | A kind of manufacturing method and image detector of flat radiation image detector |
| CN110376630B (en) * | 2019-07-18 | 2021-07-06 | 江苏康众数字医疗科技股份有限公司 | Manufacturing method of flat-plate radioactive ray image detector and image detector |
| CN113636158A (en) * | 2021-08-10 | 2021-11-12 | 上海烁泰科技有限公司 | Packaging process of scintillator panel |
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