CN101894857A - Organic light emitting device - Google Patents
Organic light emitting device Download PDFInfo
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- CN101894857A CN101894857A CN2010101115875A CN201010111587A CN101894857A CN 101894857 A CN101894857 A CN 101894857A CN 2010101115875 A CN2010101115875 A CN 2010101115875A CN 201010111587 A CN201010111587 A CN 201010111587A CN 101894857 A CN101894857 A CN 101894857A
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- cover plate
- organic electroluminescence
- electroluminescence device
- chamfering
- encapsulation cover
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Abstract
The invention relates to an organic light emitting device, in particular to a design of a packaging cover plate of the organic light emitting device. The organic light emitting device comprises a substrate and the packaging cover plate, wherein the substrate is provided with an organic light emitting unit; the packaging cover plate and the substrate form a closed space in which the organic light emitting unit is arranged; an electrode lead of the organic light emitting unit is connected to a driving chip which is adjacent to the edge on one side of the substrate; and the edge of the packaging cover plate is provided with a chamfer. The technical scheme of the invention can effectively prevent fragments produced in a cutting and fragmenting process from entering a narrow slit between the substrate and the packaging cover plate and being blocked therein and avoid the damage to the electrode lead.
Description
Technical field
The present invention relates to a kind of organic electroluminescence device, relate in particular to the encapsulation cover plate design of organic electroluminescence device.
Background technology
Along with the arriving of Development of Multimedia Technology and information-intensive society, more and more higher to the flat-panel monitor performance demands.Newly occurred three kinds of Display Techniques in recent years: plasma display, Field Emission Display and display of organic electroluminescence have all remedied the deficiency of cathode ray tube and LCD to a certain extent.Wherein, a series of advantages such as display of organic electroluminescence has from main light emission, low-voltage DC driven, solidifies entirely, the visual angle is wide, color is abundant, compare with LCD, display of organic electroluminescence does not need backlight, the visual angle is big, power is low, and its response speed can reach 1000 times of LCD, and its manufacturing cost but is lower than the LCD of equal resolution.Therefore, display of organic electroluminescence has broad application prospects, and is counted as the utmost point and composes one of following flat panel display of competitiveness.
Organic electroluminescence device (Organic Light Emitting Devices, abbreviation OLED) basic structure is: form organic light-emitting units on a glass substrate, comprise each layers such as anode, organic luminous layer, negative electrode successively, anode, negative electrode rely in the non-light-emitting area position and draw, focus on one side or a few limit, carry out nation with chip for driving and decide.In addition, because OLED is along with increase service time, aqueous vapor in the environment and oxygen are easy to infiltrate in the display device, make peel off between metal electrode and the organic luminous layer, material cracking and anodizing, and then the generation dim spot, this can significantly reduce luminescent quality such as the luminous intensity of display device and the luminous uniformity.So on the glass substrate of OLED display device, finish after the evaporation processing procedure of metal electrode and organic light emission body thin film, with encapsulation cover plate it is encapsulated again, luminescence unit is protected in the confined space of being made up of glass substrate and encapsulation cover plate.In the OLED manufacture process, actual fabrication technology is first justifying preparation, after preparation is finished, with justifying OLED cutting splitting, makes discrete device again.Can produce some small fragments in the cutting splitting process, the narrow gap that in a single day these fragments enter between substrate and encapsulation cover plate just is easy to be stuck, shown in Fig. 1 b, can cause damage to contact conductor, also be unfavorable for follow-up process for filling colloid into, and be difficult to these fragments are washed fully by the cleaning means.
Summary of the invention
The purpose of this invention is to provide a kind of organic electroluminescence device that can address the above problem.
The objective of the invention is to be achieved through the following technical solutions:
A kind of organic electroluminescence device, comprise substrate, dispose organic light-emitting units on the substrate, also comprise encapsulation cover plate, encapsulation cover plate and substrate form a confined space, organic light-emitting units is positioned at confined space, and the contact conductor of organic light-emitting units is connected to and the adjacent chip for driving of substrate one lateral edges, and the edge of above-mentioned encapsulation cover plate has chamfering.
Above-mentioned chamfering is positioned on the lateral edges of encapsulation cover plate.
Above-mentioned chamfering is positioned on the encapsulation cover plate lateral edges adjacent with chip for driving.
Above-mentioned chamfering can also be positioned on two opposite edges of encapsulation cover plate.
Above-mentioned chamfering is positioned on the encapsulation cover plate lateral edges adjacent with chip for driving and on the opposite edges.
Can have chamfering on every edge of above-mentioned encapsulation cover plate.
The fillet surface of above-mentioned chamfering is a cambered surface.
The fillet surface of above-mentioned chamfering is an inner concave arc surface, and its cambered surface radius is 0.1-1.0mm.
The fillet surface of above-mentioned chamfering is the plane, and the projection width of fillet surface on the encapsulation cover plate plane is 0.1-1.0mm.
Above-mentioned chamfering is processed by sandblast, turning or chemical etching mode.
The present invention provides a kind of organic electroluminescence device by above technical scheme, can prevent effectively that the fragment that produces in the cutting splitting process from entering and being stuck in the narrow gap between substrate and encapsulation cover plate, avoided contact conductor is damaged.
Description of drawings
Fig. 1 a prior art schematic diagram;
AA ' the schematic cross-section of Fig. 1 b Fig. 1 a;
Fig. 2 a embodiment of the invention 1 structural representation Fig. 1;
Fig. 2 b embodiment of the invention 1 structural representation Fig. 2;
Fig. 2 c embodiment of the invention 1 effect schematic diagram;
Fig. 3 a embodiment of the invention 2 structural representation Fig. 1;
Fig. 3 b embodiment of the invention 2 structural representation Fig. 2;
Fig. 4 a embodiment of the invention 3 structural representation Fig. 1;
Fig. 4 b embodiment of the invention 3 structural representation Fig. 2;
Fig. 5 embodiment of the invention 4 structural representations;
Fig. 6 embodiment of the invention 5 structural representations.
Wherein,
Substrate: 1-5,2-1,3-1; Encapsulation cover plate: 1-4,2-2,3-2,4-1,5-1,6-1;
Chip for driving: 1-3,2-4,3-4; Chamfering: 2-3,3-3,4-2,5-2,6-2;
Organic light-emitting units: 1-6,2-8; Fragment: 1-9,2-5;
Drying sheet: 1-7,2-7; Packaging plastic: 1-8,2-9;
Anode tap: 1-1; Cathode leg: 1-2; Contact conductor: 2-6.
Embodiment
The present invention will be further described below in conjunction with embodiment and accompanying drawing.
Shown in Fig. 1 a and Fig. 1 b, the substrate 1-5 of organic electroluminescence device and encapsulation cover plate 1-4 form a confined space by packaging plastic 1-8 in the prior art, organic light-emitting units 1-6 and drying sheet 1-7 are placed in this confined space, and anode tap 1-1 draws with chip for driving 1-3 from the right side of substrate 1-5 with cathode leg 1-2 and links to each other.Shown in Fig. 1 b, the small fragment 1-9 that produces in the cutting splitting process enters the narrow gap between substrate 1-5 and encapsulation cover plate 1-4 easily and is stuck, this can cause damage to contact conductor, also be unfavorable for follow-up process for filling colloid into, and be difficult to these fragments 1-9 is washed fully by the cleaning means.
Embodiment 1
Fig. 2 a and Fig. 2 b are the structural representation of the embodiment of the invention 1, as shown in the figure, the edge of the encapsulation cover plate 2-2 of organic electroluminescence device has chamfering 2-3, this chamfering 2-3 is positioned on the lateral edges L of encapsulation cover plate 2-2 adjacent driven chip 2-4, the fillet surface of this chamfering 2-3 is an inner concave arc surface, and cambered surface radius R is 1.0mm.This chamfering 2-3 is processed by the sandblast mode.Shown in Fig. 2 c, when in the cutting splitting process, producing fragment 2-5, even fragment 2-5 enters the slit between substrate 2-1 and encapsulation cover plate 2-2, because encapsulation cover plate 2-2 edge has chamfering 2-3, make slit between substrate 2-1 and encapsulation cover plate 2-2 much larger than the size of fragment, therefore fragment 2-5 can not be stuck, thereby has avoided the damage to contact conductor 2-6.
Embodiment 2
Fig. 3 a and Fig. 3 b are the structural representation of the embodiment of the invention 2, and as shown in the figure, the edge of the encapsulation cover plate 3-2 of organic electroluminescence device has chamfering 3-3, and chamfering 3-3 is positioned at the lateral edges L of encapsulation cover plate 3-2 adjacent driven chip 3-4
1Go up and opposite edges L
2On, the fillet surface of both sides chamfering is inner concave arc surface, cambered surface radius R
1And R
2Be respectively 0.5mm and 0.1mm.This chamfering 3-3 is processed by the chemical etching mode.
Embodiment 3
Fig. 4 a and Fig. 4 b are the structural representation of the embodiment of the invention 3, as shown in the figure, every edge of the encapsulation cover plate 4-1 of organic electroluminescence device all has chamfering 4-2, and the fillet surface of each chamfering 4-2 is the plane, and the projection width W of each fillet surface on the encapsulation cover plate plane is 0.1mm.Described chamfering 4-2 is processed by the turning mode.
Embodiment 4
Fig. 5 is the structural representation of the embodiment of the invention 4, as shown in the figure, every edge of the encapsulation cover plate 5-1 of organic electroluminescence device all has chamfering 5-2, and the fillet surface of each chamfering 5-2 is the plane, and the projection width W of each fillet surface on the encapsulation cover plate plane is 0.5mm.Other are with embodiment 3.
Embodiment 5
Fig. 6 is the structural representation of the embodiment of the invention 5, as shown in the figure, every edge of the encapsulation cover plate 6-1 of organic electroluminescence device all has chamfering 6-2, and the fillet surface of each chamfering 6-2 is the plane, and the projection width W of each fillet surface on the encapsulation cover plate plane is 1mm.Other are with embodiment 3.
Though the present invention discloses as above with preferred embodiment; yet it is not in order to limit the present invention; anyly be familiar with this technology personage; without departing from the spirit and scope of the present invention; when being used for a variety of modifications and variations; therefore, protection scope of the present invention is as the criterion when the claim with application defines.
Claims (12)
1. organic electroluminescence device comprises:
Substrate;
Dispose organic light-emitting units on the substrate;
Encapsulation cover plate, described encapsulation cover plate and substrate form a confined space, and organic light-emitting units is positioned at confined space;
The contact conductor of described organic light-emitting units is connected to and the adjacent chip for driving of substrate one lateral edges;
It is characterized in that the edge of described encapsulation cover plate has chamfering.
2. organic electroluminescence device according to claim 1 is characterized in that, described chamfering is positioned on the lateral edges of encapsulation cover plate.
3. organic electroluminescence device according to claim 2 is characterized in that, described chamfering is positioned on the encapsulation cover plate edge adjacent with chip for driving.
4. organic electroluminescence device according to claim 2 is characterized in that, described chamfering is positioned on two opposite edges of encapsulation cover plate.
5. organic electroluminescence device according to claim 4 is characterized in that, described chamfering is positioned on the encapsulation cover plate lateral edges adjacent with chip for driving and on the opposite edges.
6. organic electroluminescence device according to claim 4 is characterized in that, all has chamfering on every edge of described encapsulation cover plate.
7. according to one of any described organic electroluminescence device of claim 1-6, it is characterized in that the fillet surface of described chamfering is a cambered surface.
8. organic electroluminescence device according to claim 7 is characterized in that, the fillet surface of described chamfering is an inner concave arc surface.
9. organic electroluminescence device according to claim 8 is characterized in that, the cambered surface radius of described inner concave arc surface is 0.1-1.0mm.
10. according to one of any described organic electroluminescence device of claim 1-6, it is characterized in that the fillet surface of described chamfering is the plane.
11. organic electroluminescence device according to claim 10 is characterized in that, the projection width of described fillet surface on the encapsulation cover plate plane is 0.1-1.0mm.
12., it is characterized in that described chamfering is processed by sandblast, turning or chemical etching mode according to the described organic electroluminescence device of claim 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101115875A CN101894857B (en) | 2010-02-08 | 2010-02-08 | Organic light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101115875A CN101894857B (en) | 2010-02-08 | 2010-02-08 | Organic light emitting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101894857A true CN101894857A (en) | 2010-11-24 |
| CN101894857B CN101894857B (en) | 2012-11-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101115875A Expired - Fee Related CN101894857B (en) | 2010-02-08 | 2010-02-08 | Organic light emitting device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105449113A (en) * | 2014-08-14 | 2016-03-30 | 固安翌光科技有限公司 | Screen body packaging cover, screen body and screen body packaging and cutting method |
| CN109373243A (en) * | 2018-11-28 | 2019-02-22 | 江苏集萃有机光电技术研究所有限公司 | A kind of OLED lamp piece and lamps and lanterns |
| CN113439331A (en) * | 2019-01-16 | 2021-09-24 | 凸版印刷株式会社 | Substrate for package and method for manufacturing the same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5455386A (en) * | 1994-01-14 | 1995-10-03 | Olin Corporation | Chamfered electronic package component |
| CN101442109B (en) * | 2008-08-20 | 2011-08-10 | 昆山维信诺显示技术有限公司 | Organic electroluminescent device and down-lead structure, mask plate, drive chip thereof |
-
2010
- 2010-02-08 CN CN2010101115875A patent/CN101894857B/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105449113A (en) * | 2014-08-14 | 2016-03-30 | 固安翌光科技有限公司 | Screen body packaging cover, screen body and screen body packaging and cutting method |
| CN105449113B (en) * | 2014-08-14 | 2018-02-23 | 固安翌光科技有限公司 | One kind screen body cap, screen body and the encapsulation of screen body and cutting method |
| CN109373243A (en) * | 2018-11-28 | 2019-02-22 | 江苏集萃有机光电技术研究所有限公司 | A kind of OLED lamp piece and lamps and lanterns |
| CN109373243B (en) * | 2018-11-28 | 2023-11-14 | 江苏集萃有机光电技术研究所有限公司 | OLED lamp sheet and lamp |
| CN113439331A (en) * | 2019-01-16 | 2021-09-24 | 凸版印刷株式会社 | Substrate for package and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101894857B (en) | 2012-11-07 |
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Granted publication date: 20121107 Termination date: 20130208 |