CN101888764B - 气流导罩及使用该气流导罩的电子装置 - Google Patents

气流导罩及使用该气流导罩的电子装置 Download PDF

Info

Publication number
CN101888764B
CN101888764B CN200910302339.6A CN200910302339A CN101888764B CN 101888764 B CN101888764 B CN 101888764B CN 200910302339 A CN200910302339 A CN 200910302339A CN 101888764 B CN101888764 B CN 101888764B
Authority
CN
China
Prior art keywords
air
cover
flow
top board
fan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200910302339.6A
Other languages
English (en)
Other versions
CN101888764A (zh
Inventor
官志彬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taizhou Wisdom Software Park Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN200910302339.6A priority Critical patent/CN101888764B/zh
Priority to US12/626,576 priority patent/US8077458B2/en
Publication of CN101888764A publication Critical patent/CN101888764A/zh
Application granted granted Critical
Publication of CN101888764B publication Critical patent/CN101888764B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

一种电子装置，包括一基座、装设于所述基座内的至少一风扇、一设置有至少一电子元件的主板及一气流导罩，所述气流导罩包括一顶板及两支撑所述顶板的挡板，所述顶板与所述两挡板之间形成一具有两开口端的气流通道，所述电子元件收容于所述气流通道内，所述气流通道的一开口端正对所述风扇，所述气流导罩的顶板邻近所述正对风扇的开口端设有若干通孔，用以降低噪音。

Description

气流导罩及使用该气流导罩的电子装置
技术领域
本发明是关于一种气流导罩及使用该气流导罩的电子装置。
背景技术
电子装置，如电脑等，为了满足散热需要，通常在发热电子元件上装设一气流导罩，使该气流导罩的出风口一端正对一风扇，通过该风扇与气流导罩的配合可将电子元件产生的热量集中快速的排出电子装置。然而，风扇叶片转动时，电子装置内的气流压力梯度会发生剧烈变化，从而产生气动噪音。如果气流导罩设计不良，将导致电子装置内气动噪音明显。
发明内容
鉴于以上，有必要提供一种可减小气动噪音的气流导罩及使用该气流导罩的电子装置。
一种气流导罩，包括一顶板及两垂直于所述顶板向下延伸的挡板，所述顶板与所述两挡板之间形成一具有两开口端的气流通道，所述顶板邻近一开口端设有若干贯穿该顶板上表面与下表面的通孔。
一种电子装置，包括一基座、装设于所述基座内的至少一风扇、一设置有至少一电子元件的主板及一气流导罩，所述气流导罩包括一顶板及两支撑所述顶板的挡板，所述顶板与所述两挡板之间形成一具有两开口端的气流通道，所述电子元件收容于所述气流通道内，所述气流通道的一开口端正对所述风扇，所述气流导罩的顶板邻近所述正对风扇的开口端设有若干贯穿该顶板上表面与下表面的通孔。
相较现有技术，上述气流导罩及电子装置，通过在气流导罩设置通孔，可减小系统内的气流压力梯度的变化，从而可以降低气动噪音。
附图说明
图1是本发明电子装置第一实施方式的立体分解图。
图2是图1的立体组装图。
图3是本发明电子装置第二实施方式的立体组装图。
具体实施方式
请参照图1与图2，为本发明电子装置的第一实施方式。该第一实施方式中的电子装置10包括一基座12、一主板13、若干风扇151及一气流导罩20。该基座12设有一底板121及两相对的侧板123，该基座12的两相对端于所述两侧板123之间分别形成一进风口124与一出风口125。该主板13装设于该底板121上，该主板13上装设有若干电子元件134。这些风扇151组成一风扇组15，并排设置于该底板121邻近出风口125处，用于将该主板13上的电子元件134发出的热量抽出至该电子装置10外。该气流导罩20可装设于该主板13上，该气流导罩20包括一顶板21及两垂直于该顶板21向下延伸的挡板22。该顶板21与所述两挡板22之间形成一具有两开口端的气流通道23。该顶板21邻近一开口端设有若干减音区24，每一减音区24设有若干呈阵列排列的贯穿该顶板上表面与下表面的通孔241。这些减音区24间隔排列，分别对应该基座12的这些风扇151。
将该气流导罩20装设于该主板13上时，该主板13上的电子元件134收容于该气流导罩20的气流通道23内，该气流导罩20的设有减音区24的开口端正对该基座12上的这些风扇151，且该顶板21上的这些减音区24分别正对这些风扇151的上方。该气流导罩20的两挡板22分别位于该风扇组15的两侧，这些风扇151可将该气流导罩20的气流通道23内的热量抽出。
该电子装置10工作时，该风扇组15的这些风扇151运转，将该气流导罩20的气流通道23内的热量抽出，以给该主板13上的这些电子元件134散热。该电子装置10的气流压力梯度发生变化，尤其是在该气流导罩20靠近这些风扇151的位置气流压力梯度变化最大。此时，该气流导罩20顶板21上的这些减音区24的通孔241可以将气流通道23内的气流部分释放到气流导罩20外，以减小气流压力梯度的变化，从而可以降低气动噪音。
请参照图3，为本发明电子装置的第二实施方式。该第二实施方式中的电子装置40包括一底板421、两侧板423、一主板43、由若干风扇451组成的一风扇组45及一气流导罩30。其中，该底板421、两侧板423、主板43及由若干风扇451组成的风扇组45的结构与第一实施方式中的对应元件的结构相同。该气流导罩30的结构与第一实施方式中的气流导罩20的结构基本相同，包括一顶板31及两垂直于该顶板31向下延伸的挡板32。区别在于，该顶板31邻近该底板421上的这些风扇451设置一连续的减音区34，该减音区34正对这些风扇451的上方设有若干呈阵列排列的贯穿该顶板上表面与下表面的通孔341。

Claims (6)

1.一种气流导罩，包括一顶板及两垂直于所述顶板向下延伸的挡板，所述顶板与所述两挡板之间形成一具有两开口端的气流通道，其特征在于：所述顶板邻近一开口端设有若干贯穿该顶板上表面与下表面的通孔。
2.如权利要求1所述的气流导罩，其特征在于：所述若干通孔呈阵列排列，并形成若干间隔的减音区。
3.一种电子装置，包括一基座、装设于所述基座内的至少一风扇、一设置有至少一电子元件的主板及一气流导罩，所述气流导罩包括一顶板及两支撑所述顶板的挡板，所述顶板与所述两挡板之间形成一具有两开口端的气流通道，所述电子元件收容于所述气流通道内，所述气流通道的一开口端正对所述风扇，其特征在于：所述气流导罩的顶板邻近所述正对风扇的开口端设有若干贯穿该顶板上表面与下表面的通孔。
4.如权利要求3所述的电子装置，其特征在于：所述风扇有若干个，所述气流导罩的顶板上的通孔分别对应所述若干个风扇形成若干间隔的减音区。
5.如权利要求4所述的电子装置，其特征在于：所述减音区分别正对所述若干风扇的上方。
6.如权利要求3至5中任意一项所述的电子装置，其特征在于：所述基座设有一出风口，所述风扇装设于所述基座邻近所述出风口处，用于向所述基座外抽风。
CN200910302339.6A 2009-05-15 2009-05-15 气流导罩及使用该气流导罩的电子装置 Active CN101888764B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200910302339.6A CN101888764B (zh) 2009-05-15 2009-05-15 气流导罩及使用该气流导罩的电子装置
US12/626,576 US8077458B2 (en) 2009-05-15 2009-11-25 Airflow guiding cover and electronic device having the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200910302339.6A CN101888764B (zh) 2009-05-15 2009-05-15 气流导罩及使用该气流导罩的电子装置

Publications (2)

Publication Number Publication Date
CN101888764A CN101888764A (zh) 2010-11-17
CN101888764B true CN101888764B (zh) 2014-08-20

Family

ID=43068338

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910302339.6A Active CN101888764B (zh) 2009-05-15 2009-05-15 气流导罩及使用该气流导罩的电子装置

Country Status (2)

Country Link
US (1) US8077458B2 (zh)
CN (1) CN101888764B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8270171B2 (en) * 2010-05-25 2012-09-18 Cisco Technology, Inc. Cooling arrangement for a rack mounted processing device
CN102693745B (zh) * 2011-03-23 2015-03-25 温州泓呈祥科技有限公司 散热装置及其应用的电子装置
GB2503407B (en) * 2011-10-10 2015-12-09 Control Tech Ltd Barrier device
TW201325416A (zh) * 2011-12-12 2013-06-16 Hon Hai Prec Ind Co Ltd 電子裝置及其導風罩
TW201328553A (zh) * 2011-12-16 2013-07-01 Hon Hai Prec Ind Co Ltd 電子裝置散熱系統
CN103188913A (zh) * 2011-12-29 2013-07-03 鸿富锦精密工业（深圳）有限公司 导风罩及具有该导风罩的电子装置
CN103313566A (zh) * 2012-03-08 2013-09-18 鸿富锦精密工业（深圳）有限公司 风扇固定装置
US8773852B2 (en) * 2012-06-21 2014-07-08 Breakingpoint Systems, Inc. Air flow management device for use in an electronics system
CN103809711B (zh) * 2012-11-12 2017-07-14 英业达科技有限公司 电子装置
CN103903340B (zh) * 2012-12-27 2016-10-12 鸿富锦精密工业(武汉)有限公司 自动售货机
US20150185792A1 (en) * 2013-12-26 2015-07-02 Shih-Wun Li DUAL-layer SYSTEM COMPUTER ENCLOSURE
CN105224040B (zh) * 2015-10-15 2019-03-22 徐州工业职业技术学院 一种具有消音功能的计算机服务器
CN105843346A (zh) * 2016-03-28 2016-08-10 朱虹斐 低噪音计算机主板
CN107101358A (zh) * 2017-06-06 2017-08-29 广东美的暖通设备有限公司 空调器的电控箱及空调器
WO2019121530A1 (en) * 2017-12-20 2019-06-27 Panasonic Automotive Systems Europe Gmbh Airflow guiding device
CN108429155B (zh) * 2018-04-03 2019-07-23 伊发控股集团有限公司 安全型户外配电柜

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6914779B2 (en) * 2002-02-15 2005-07-05 Microsoft Corporation Controlling thermal, acoustic, and/or electromagnetic properties of a computing device
CN1959592A (zh) * 2005-11-01 2007-05-09 鸿富锦精密工业（深圳）有限公司 散热系统
US7408773B2 (en) * 2006-11-27 2008-08-05 Dell Products L.P. Reinforced air shroud

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5957194A (en) * 1996-06-27 1999-09-28 Advanced Thermal Solutions, Inc. Plate fin heat exchanger having fluid control means
US6104608A (en) * 1997-10-30 2000-08-15 Emc Corporation Noise reduction hood for an electronic system enclosure
US6154368A (en) * 1998-09-14 2000-11-28 Lucent Technologies, Inc. Device and method for dissipating thermal energy of electronic circuit components
TW484721U (en) * 2000-11-06 2002-04-21 Giga Byte Tech Co Ltd Improved airflow guiding structure of server
US6667883B1 (en) * 2002-08-29 2003-12-23 Proxim Corporation Forced-air cooling of a transceiver unit
US6678157B1 (en) * 2002-09-17 2004-01-13 Sun Microsystems, Inc. Electronics assembly with cooling arrangement
US6958906B2 (en) * 2003-04-11 2005-10-25 Shan Ping Wu Method and apparatus for cooling a modular computer system with dual path airflow
TWM244718U (en) * 2003-08-22 2004-09-21 Hon Hai Prec Ind Co Ltd Heat dissipating device employing air duct
US7035102B2 (en) * 2004-01-08 2006-04-25 Apple Computer, Inc. Apparatus for air cooling of an electronic device
US7283359B2 (en) * 2005-12-15 2007-10-16 International Business Machines Corporation Method and apparatus for acoustic noise reduction in a computer system having a vented cover
US20070235168A1 (en) * 2006-04-10 2007-10-11 Super Micro Computer, Inc. Air flow diversion device for dissipating heat from electronic components
US7474528B1 (en) * 2006-04-10 2009-01-06 Sun Microsystems, Inc. Configurable flow control air baffle

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6914779B2 (en) * 2002-02-15 2005-07-05 Microsoft Corporation Controlling thermal, acoustic, and/or electromagnetic properties of a computing device
CN1959592A (zh) * 2005-11-01 2007-05-09 鸿富锦精密工业（深圳）有限公司 散热系统
US7408773B2 (en) * 2006-11-27 2008-08-05 Dell Products L.P. Reinforced air shroud

Also Published As

Publication number Publication date
CN101888764A (zh) 2010-11-17
US8077458B2 (en) 2011-12-13
US20100290187A1 (en) 2010-11-18

Similar Documents

Publication Publication Date Title
CN101888764B (zh) 气流导罩及使用该气流导罩的电子装置
US8373986B2 (en) Enclosure of electronic device
US20120327589A1 (en) Computer system with airflow guiding duct
US20080062636A1 (en) Hard disk drive case
US8081453B2 (en) Adhesive air guiding device and motherboard having the same
US7948755B1 (en) Cooling system and electronic device using the same
US8632046B2 (en) Mounting apparatus for fan
CN103164003A (zh) 电子装置散热系统
TW201305794A (zh) 電子裝置
US8737060B2 (en) Computer system with airflow guiding duct
US8950726B2 (en) Mounting apparatus for fans
US20140133974A1 (en) Cooling fan and cooling device with cooling fan
US20120120595A1 (en) Computer system with airflow guiding duct
CN102622063A (zh) 散热系统
CN103793017A (zh) 电子装置
CN104717869B (zh) 电子装置及其散热模组
US20090195981A1 (en) Heat dissipating air flow channel structure of electronic device
US20140127011A1 (en) Mounting apparatus for fans
CN102469742A (zh) 电子装置
US20130010420A1 (en) Bracket for expansion card and electronic device having the same
CN103379795A (zh) 散热装置
TW201328561A (zh) 電子裝置
TW201042233A (en) Airflow guiding cover and electronic device having the same
US20100284148A1 (en) Electronic device enclosure
CN201181440Y (zh) 一种amc装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20160204

Address after: Tianhe District Tong East Road Guangzhou city Guangdong province 510665 B-101 No. 5, room B-118

Patentee after: Guangdong Gaohang Intellectual Property Operation Co., Ltd.

Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two

Patentee before: Hongfujin Precise Industry (Shenzhen) Co., Ltd.

Patentee before: Hon Hai Precision Industry Co., Ltd.

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20161010

Address after: 225599 Cao village, Jiangyan Town, Jiangyan District, Jiangsu, Taizhou

Patentee after: Taizhou wisdom Software Park Co., Ltd.

Address before: Tianhe District Tong East Road Guangzhou city Guangdong province 510665 B-101 No. 5, room B-118

Patentee before: Guangdong Gaohang Intellectual Property Operation Co., Ltd.