201042233 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明是關於一種氣流導罩及使用該氣流導罩的電子裝 置。 【先前技術】 [0002] 電子裝置，如電腦等，為了滿足散熱需要，通常在發熱 電子元件上裝設一氣流導罩，使該氣流導罩的出風口一 端正對一風扇，透過該風扇與氣流導罩的配合可將電子 元件產生的熱量集中快速的排出電子裝置。然而，風扇 Ο 葉片轉動時，電子裝置内的氣流壓力梯度會發生劇烈變 化，從而產生氣動噪音。如果氣流導罩設計不良，將導 致電子裝置内氣動噪音明顯。 【發明内容】 [0003] 鑒於以上，有必要提供一種可減小氣動嗓音的氣流導罩 及使用該氣流導罩的電子裝置。. :: ；；：. ... ,： [0004] 〇 一種氣流導罩，包括一頂板專真矜該頂板向下延伸 的擋板，該頂板與該兩擋板之間形成一具有兩開口端的 氣流通道，該頂板鄰近一開口端設有複數通孔。 [0005] 一種電子裝置，包括一基座、裝設於該基座内的至少一 風扇、一設置有至少一電子元件的主機板及一氣流導罩 ，該氣流導罩包括一頂板及兩支撐該頂板的擋板，該頂 板與該兩擋板之間形成一具有兩開口端的氣流通道，該 電子元件收容於該氣流通道内，該氣流通道的一開口端 正對該風扇，該氣流導罩的頂板鄰近該正對風扇的開口 端設有複數通孔。 098116824 表單編號A0101 第3頁/共10頁. 0982028528-0 201042233 [0006] 相較先前技術，上述氣流導罩及電子裝置，透過在氣流 導罩設置通孔，可減小電子裝置内的氣流壓力梯度的變 化’從而可以降低氣動噪音。 【實施方式】 [0007] 請參照圖1與圖2，為本發明電子裝置的第一實施方式。 該第一實施方式中的電子裝置10包括一基座12、一主機 板13、複數風扇151及一氣流導罩2〇。該基座丨2設有一 底板121及兩相對的側板123，該基座12的兩相對端於該 兩侧板12 3之間分別形成一進風口 12 4與一出風口 12 5。 .. ' ... . ... 該主機板13裝設於該底板121上，讓主機板13上装設有複 數電子元件134。該等風扇151組成一風扇组15，並排設 置於該底板121鄰近出風口 125處，用於將該主機板13上 的電子元件134發出的熱量抽出至該電子裝置1〇外。該氣 流導罩20可裝設於該主機板13上，該氣流導罩2〇包括一 頂板21及兩垂直於該頂板21向下延伸的擋板22。該頂板 21與該兩擔板22之間形成一具有兩開口端的氣流通道23 。該頂板21鄰近一開只端設有複數減音區24，每一減音 區24設有複數呈陣列排列的通孔241。該等減音區24間隔 排列’分別對應該基座12的該等風扇151。 [〇〇〇8] 將該氣流導罩20裝設於該主機板13上時，該主機板13上 的電子元件134收容於該氣流導罩20的氣流通道23内，該 氣流導罩20的設有減音區24的開口端正對該基座12上的 該等風扇151，且該頂板21上的該等減音區24分別正對該 等風扇151的上方。該氣流導罩20的兩擋板22分別位於該 風扇組15的兩侧，該等風扇151可將該氣流導罩20的氣流 098116824 表單編號A0101 第4頁/共10頁 0982028528-0 201042233 通道23内的熱量抽出。 [0009] ❹ [0010] 該電子裝置10工作時，該風扇組15的該等風扇151運轉， 將該氣流導罩20的氣流通道23内的熱量抽出，以給該主 機板13上的該等電子元件134散熱。該電子裝置10的氣流 壓力梯度發生變化，尤其是在該氣流導罩20靠近該等風 扇151的位置氣流壓力梯度變化最大。此時，該氣流導罩 20頂板21上的該等減音區24的通孔241可以將氣流通道 23内的氣流部分釋放到氣流導罩20外，以減小氣流壓力 梯度的變化，從而可以降低氣動噪音。 請參照圖3，為本發明電子裝置的第二實施方式。該第二 實施方式中的電子裝置40包括一底板421、兩側板423、 〇 一主機板43、由複數風扇451組成的一風扇組45及一氣流 導罩30。其中，該底板421、兩側板423、主機板43及由 複數風扇451組成的風扇組45的結構與第一實施方式中的 對應元件的結構相同。該氣流導罩30的結構與第一實施 方式中的氣流導罩20的結構基本相同，包括一頂板31及 兩垂直於該頂板31向下延伸的擋板32。區別在於，該頂 板31鄰近該底板421上的該等風扇451設置一連續的減音 區34，該減音區34正對該等風扇451的上方設有複數呈陣 列排列的通孔341。 [0011] 綜上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士爰依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 098116824 表單編號Α0101 第5頁/共10頁 0982028528-0 201042233 【圖式簡單說明】 [0012] 圖1是本發明電子裝置第一實施方式的立體分解圖。 [0013] 圖2是圖1的立體組裝圖。 [0014] 圖3是本發明電子裝置第二實施方式的立體組裝圖。 【主要元件符號說明】 電子裝置 10 ' 40 基座 12 底板 121 、 421 侧板 123 、 423 進風口 124 出風口 125 主機板 13、43 電子元件 134 風扇組 15、45 風扇 151 > 451 氣流導罩 20 > 30 頂板 21 ' 31 檔板 22 > 32 氣流通道 23 減音區 24 ' 34 通孔 241 、 341 098116824 表單編號A0101 第6頁/共10頁 0982028528-0201042233 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to an air flow guide and an electronic device using the air flow guide. [Previous Art] [0002] In order to meet the heat dissipation requirements of an electronic device, such as a computer, an air flow guide is usually disposed on the heat-generating electronic component such that one end of the air outlet of the air flow guide faces a fan through the fan and The cooperation of the airflow guide can concentrate the heat generated by the electronic components and quickly discharge the electronic device. However, when the fan 叶片 blade rotates, the pressure gradient of the airflow in the electronic device changes drastically, thereby generating aerodynamic noise. If the airflow guide is poorly designed, it will cause significant aerodynamic noise in the electronics. SUMMARY OF THE INVENTION [0003] In view of the above, it is necessary to provide an airflow guide that can reduce a pneumatic noise and an electronic device using the airflow guide. :::;:. ... , : [0004] 气流 an airflow guide cover comprising a top plate and a baffle extending downwardly from the top plate, the top plate and the two baffles forming a An air flow passage at the open end, the top plate being provided with a plurality of through holes adjacent to an open end. An electronic device includes a base, at least one fan mounted in the base, a main board provided with at least one electronic component, and an air flow guide, the air flow guide includes a top plate and two supports a baffle plate of the top plate, an air flow passage having two open ends formed between the top plate and the two baffles, the electronic component being received in the air flow passage, an open end of the air flow passage being opposite to the fan, the air flow guide The top plate is provided with a plurality of through holes adjacent to the open end of the facing fan. 098116824 Form No. A0101 Page 3 of 10. 0982028528-0 201042233 [0006] Compared with the prior art, the airflow guide and the electronic device can reduce the airflow pressure in the electronic device by providing a through hole in the airflow guide. The gradient changes 'and thus reduce the aerodynamic noise. Embodiments [0007] Referring to FIG. 1 and FIG. 2, a first embodiment of an electronic device of the present invention is shown. The electronic device 10 in the first embodiment includes a base 12, a main board 13, a plurality of fans 151, and an air flow guide 2'. The base cymbal 2 is provided with a bottom plate 121 and two opposite side plates 123. The opposite ends of the base 12 define an air inlet 12 and an air outlet 12 5 between the two side plates 12 3 . . . ' . . . The motherboard 13 is mounted on the bottom plate 121, and the motherboard 13 is provided with a plurality of electronic components 134. The fans 151 form a fan assembly 15 and are disposed at the bottom plate 121 adjacent to the air outlet 125 for extracting heat from the electronic component 134 on the motherboard 13 to the outside of the electronic device 1. The air flow guide 20 can be mounted on the main board 13, and the air flow guide 2 includes a top plate 21 and two baffles 22 extending downwardly from the top plate 21. An air flow passage 23 having two open ends is formed between the top plate 21 and the two support plates 22. The top plate 21 is provided with a plurality of sound reduction regions 24 adjacent to an open end, and each of the sound reduction regions 24 is provided with a plurality of through holes 241 arranged in an array. The sound attenuating areas 24 are spaced apart from the fans 151 corresponding to the susceptor 12, respectively. When the air flow guide cover 20 is mounted on the main board 13, the electronic component 134 on the main board 13 is received in the air flow passage 23 of the air flow guide 20, and the air flow guide 20 is The open ends of the sound attenuating zone 24 are directed to the fans 151 on the base 12, and the sound attenuating zones 24 on the top plate 21 are respectively above the fans 151. The two baffles 22 of the airflow guide cover 20 are respectively located at two sides of the fan assembly 15, and the fan 151 can flow the airflow guide 20 with the airflow 098116824. Form No. A0101 Page 4 / 10 pages 0982028528-0 201042233 Channel 23 The heat inside is extracted. [0010] When the electronic device 10 is in operation, the fans 151 of the fan group 15 operate to extract heat from the air flow passage 23 of the air flow guide 20 to give the same on the motherboard 13 Electronic component 134 dissipates heat. The airflow pressure gradient of the electronic device 10 changes, especially when the airflow guide 20 is near the fan 151, the airflow pressure gradient changes the most. At this time, the through holes 241 of the sound reduction regions 24 on the top plate 21 of the air flow guide cover 20 can release the air flow portion in the air flow passage 23 to the outside of the air flow guide cover 20 to reduce the change of the air flow pressure gradient, thereby Reduce aerodynamic noise. Please refer to FIG. 3, which is a second embodiment of the electronic device of the present invention. The electronic device 40 of the second embodiment includes a bottom plate 421, two side plates 423, a main board 43, a fan group 45 composed of a plurality of fans 451, and an air flow guide cover 30. The structure of the bottom plate 421, the side plates 423, the main board 43, and the fan group 45 composed of the plurality of fans 451 is the same as that of the corresponding elements in the first embodiment. The structure of the air flow guide 30 is substantially the same as that of the air flow guide 20 of the first embodiment, and includes a top plate 31 and two baffles 32 extending downwardly from the top plate 31. The difference is that the top plate 31 is provided with a continuous sound reduction zone 34 adjacent to the fans 451 on the bottom plate 421. The sound reduction zone 34 is provided with a plurality of through holes 341 arranged in an array above the fan 451. [0011] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. 098116824 Form No. Α0101 Page 5 of 10 0982028528-0 201042233 [Brief Description of the Drawings] [0012] FIG. 1 is an exploded perspective view of a first embodiment of an electronic device according to the present invention. 2 is an assembled, isometric view of FIG. 1. 3 is an assembled, isometric view of a second embodiment of an electronic device of the present invention. [Main component symbol description] Electronic device 10 ' 40 Base 12 Base plate 121, 421 Side plate 123, 423 Air inlet 124 Air outlet 125 Main board 13, 43 Electronic components 134 Fan group 15, 45 Fan 151 > 451 Air flow guide 20 > 30 Top plate 21 ' 31 baffle 22 > 32 Air flow passage 23 Sound reduction zone 24 ' 34 Through hole 241 , 341 098116824 Form number A0101 Page 6 / Total 10 page 0982028528-0