CN101886262B - Wet etching machine bench and method for eliminating silicon wafer etching difference - Google Patents
Wet etching machine bench and method for eliminating silicon wafer etching difference Download PDFInfo
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- CN101886262B CN101886262B CN2009100572654A CN200910057265A CN101886262B CN 101886262 B CN101886262 B CN 101886262B CN 2009100572654 A CN2009100572654 A CN 2009100572654A CN 200910057265 A CN200910057265 A CN 200910057265A CN 101886262 B CN101886262 B CN 101886262B
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Abstract
The invention discloses a wet etching machine bench, comprising a silicon wafer position sensor and washers, wherein the silicon wafer position sensor can detect positions and number of the silicon wafers; a mechanical arm of the wet etching machine bench can take, put the silicon wafers and change the positions of the silicon wafers to be etched on the wet etching machine bench; and the washers can control a terminal to receive information of the positions and the number of the silicon wafers and control the mechanical arm to take and put the silicon wafers and the washers. The invention also discloses a method for eliminating silicon wafer etching difference, which comprises the following steps: 1. enabling the silicon wafers to enter the wet etching machine bench; 2. detecting the positions and the number of the silicon wafers and transmitting the information to the control terminal; 3. judging whether the silicon wafers in the batch are in full batch, and respectively controlling so that the equidistance position of the front of each silicon wafer is provided with the silicon wafers or the washers; 4. carrying out an etching operation and taking the washers out; and 5. restoring the positions of the silicon wafers. In the invention, the difference of the silicon wafer etching is eliminated through improving the wet etching machine bench, controlling the mechanical arm to regulate the positions of the silicon wafers and increasing the washer sections.
Description
Technical field
The present invention relates to unicircuit and make the field, particularly a kind of wet etching machine bench and the method for utilizing this wet etching machine bench elimination silicon wafer etching difference.
Background technology
In a lot of wet etching machine bench, the processing mode of silicon chip is a batch mode of operation.Generally be divided into full batch job and non-full batch job.When wet etching machine bench is full batch job, silicon chip can be placed according to 1 to 25 or 25 to 1 order.First piece of silicon chip of each batch compared with other silicon chips, and its front is not have other silicon chip to block; When wet etching machine bench is non-full batch job, then except first piece the silicon chip, also having other silicon chip fronts does not have equidistant silicon chip to block.
We find in the production of reality; Always the silicon chip than other is little to be in first piece the actual etch amount of silicon chip; Such as in the etching of BOE (buffer oxide film etching agent) to sull, when full batch job, the etch amount of first piece of silicon chip can be than follow-up silicon chip about little 20A.As shown in Figure 1, be the number of silicon chip in the X-coordinate, ordinate zou is the etch amount of silicon chip, the visible wherein pairing ordinate zou of first silicon chip, promptly the etch amount of first silicon chip than the little 20A of follow-up silicon chip about.
Cause the reason of above-mentioned etching difference to be, first piece of silicon chip causes when follow-up tank cleans because the front does not have stopping of other silicon chips, and the chemical liquid on first piece of silicon chip can be washed faster, so cause etch amount littler than follow-up silicon chip.And in the technology making processes of a complete unicircuit; Tend to comprise the wet etching operation of a lot of steps; After the multistep accumulation; The thickness difference of first piece of silicon chip and follow-up silicon chip can be considerable, just has very big-difference such as the sull height on the STI (shallow trench isolation), all can be influential to the key parameter and the safety of follow-up technological process and device.
Summary of the invention
Technical problem to be solved by this invention provides a kind of wet etching machine bench can reduce the etching difference between the silicon chip when the etching silicon chip, the present invention also provides a kind of method of utilizing wet etching machine bench to eliminate silicon wafer etching difference for this reason.
For solving the problems of the technologies described above, the technical scheme of wet etching machine bench of the present invention is to comprise the silicon chip position transducer; It can detect the number of silicon chip silicon chip on residing position and wet etching machine bench on the wet etching machine bench; The mechanical manipulator of wet etching machine bench can pick and place silicon chip and change the position of silicon chip to be etched on wet etching machine bench, also comprises washer, and this washer can be inserted on the wet etching machine bench through mechanical manipulator; Terminal is connected with the silicon chip position transducer; Accept the relevant silicon chip position and the information of number that the silicon chip position transducer detects, and terminal is connected with mechanical manipulator, controls mechanical manipulator and pick and place silicon chip and washer.
The technical scheme that the present invention eliminates the method for silicon wafer etching difference is may further comprise the steps:
1) silicon chip gets into wet etching machine bench;
2) the silicon chip position transducer detects the number of silicon chip silicon chip on residing position and wet etching machine bench on the wet etching machine bench, and gives terminal with this information transmission;
3) terminal judges whether the silicon chip of this batch is full batch; If full batch; Then terminal is controlled mechanical manipulator before first piece of silicon chip, apart from the place insertion washer that first silicon chip distance is distance between continuous two silicon chips, if not full criticizing, then the position of silicon chip is put in order in the mechanical hand adjustment of terminal control; Silicon chip is arranged successively continuously, and before first piece of silicon chip, first silicon chip distance of distance place insertion washer that be distance between continuous two silicon chips;
4) carry out the etching operation, and after whole operations of etching are accomplished, take out washer;
5) terminal control mechanical manipulator returns to step 2 with the adjustment of silicon chip position) time the position.
The present invention is through the improvement to wet etching machine bench, through the position of controlling the whole silicon chip of mechanical hand adjustment and the difference that increases catch phase method elimination silicon chip erosion.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the present invention is done further detailed explanation:
The silicon wafer etching difference synoptic diagram of Fig. 1 for causing by the silicon chip position in the prior art;
Fig. 2, Fig. 3 are flowage structure synoptic diagram of the present invention;
Fig. 4 is a schematic flow sheet of the present invention.
Embodiment
Wet etching machine bench of the present invention, except comprising the parts of common wet etching machine bench, can realize also having following characteristic outside the function of common wet etching machine bench:
The silicon chip position transducer that comprises wet etching machine bench; Confirm except being connected with terminal board batch with silicon chip be correct; Can also detect the number of silicon chip silicon chip on residing position and wet etching machine bench on the wet etching machine bench, and with the information transmission of above-mentioned position and number in terminal.
Comprise terminal, on the one hand, be connected, receive the information transmitted of silicon chip position transducer, judge through this information whether the silicon chip of operation is full batch with the silicon chip position transducer.On the other hand; Be connected with mechanical manipulator; And terminal can be controlled Robot actions silicon chip and washer, and silicon chip and washer are placed into the appropriate location on the wet etching machine bench, and silicon chip is recovered the original position and washer is placed in the washer storing unit.
Comprise washer, this washer can be used for being placed on the silicon chip front that comes first, makes piece silicon chip front of winning that a silicon chip also arranged, thus when tank cleans, the soup on first piece of silicon chip not relatively other wafers be cleaned faster.This washer can be placed into through the mechanical manipulator of wet etching machine bench on the wet etching machine bench, also can take away from wet etching machine bench through mechanical manipulator.Because this washer need often be placed and remove, and deposits and reclaim washer for ease, can also comprise the supply and the retrieving arrangement of a washer in the present invention, in order to deposit, to provide and to reclaim washer.
Mechanical manipulator in the wet etching machine bench not only can be whole place silicon chip and shift out silicon chip to wet etching machine bench from wet etching machine bench, realize will a collection ofly wanting in the prior art silicon chip of etching to be loaded into wet etching machine bench and after the operation completion, this batch silicon chip removed from wet etching machine bench.In the present invention, mechanical manipulator can also be operated independent silicon chip, moves the position of this silicon chip on wet etching machine bench.And this mechanical manipulator can be by terminal, thus according to program with silicon slice placed in predefined position, equally can be according to predefined program in the terminal, be initial silicon chip residing position on wet etching machine bench with the location restore of silicon chip.In addition, mechanical manipulator can be got washer equally from the washer storing unit, and on wet etching machine bench, loads washer, perhaps after operation is accomplished, washer is taken off from wet etching machine bench, and is placed in the washer storing unit.
Usually when one-stop operation began, mechanical manipulator was placed on silicon chip to be etched on the wet etching machine bench earlier, then the position and the number of silicon chip position transducer perception silicon chip; Again through terminal control mechanical manipulator with silicon chip since the continuous arrangement of first silicon chip; Mechanical manipulator adds washer first piece of silicon chip front again, and the distance of this washer and first piece of silicon chip equates with distance between two silicon chips of placing continuously, and then carries out the wet etching operation; After operation is accomplished; Terminal control mechanical manipulator is earlier taken away washer, and is put in the washer storing unit, and then silicon chip is returned to initial position.
Utilize wet etching machine bench of the present invention to eliminate the method for silicon wafer etching difference, may further comprise the steps:
At first, as shown in Figure 2, before carrying out the etching operation, may further comprise the steps, the first step is placed the entering wet etching machine bench by the mechanical manipulator of terminal control with the silicon chip that needs carry out etching.In the leftmost figure of Fig. 2, be placed the into silicon chip of wet etching machine bench, have the space between some silicon chip, so the distance between silicon chip and the silicon chip is different, and first piece of silicon chip front do not stop silicon chip yet.
In second step, the silicon chip position transducer detects the number of silicon chip silicon chip on residing position and wet etching machine bench on the wet etching machine bench, and gives terminal with this information transmission.
In the 3rd step, terminal judges according to silicon chip position transducer information transmitted whether the silicon chip of this batch is full batch.If full batch, then terminal control mechanical manipulator before first piece of silicon chip, first silicon chip distance of distance place insertion washer that be distance between continuous two silicon chips.If not full batch, then the position of the whole silicon chip of the mechanical hand adjustment of terminal control control is arranged silicon chip successively continuously, and before first piece of silicon chip, first silicon chip distance of distance place insertion washer that be distance between continuous two silicon chips; What between silicon chip to be etched, have vacant position just is not full batch, when not being when completely criticizing, like Fig. 2 intermediary figure; The position of the whole silicon chip of the mechanical hand adjustment of terminal control control when silicon chip is arranged successively continuously, comes first piece of silicon chip first position of wet etching machine bench; Perhaps first piece of silicon chip is not placed on first position of wet etching machine bench, but the silicon chip that guarantees the back arranges continuously, and the centre does not have the room; For another example shown in the rightmost figure of Fig. 2; Mechanical manipulator added that washer, the purpose of doing like this were before first piece of silicon chip, guarantee that all there is the silicon chip of stopping in the place of the preceding same distance of each piece silicon chip to be etched; Make that the liquor strength situation in the operation process of silicon chip to be etched is identical, thereby guarantee to be positioned at the homogeneity of the silicon chip erosion of different positions.
As shown in Figure 3, after carrying out the etching operation, comprise following step, in the 4th step, when carrying out the etching operation, the sequence of positions between the silicon chip is shown in the figure on Fig. 3 left side.Then, after whole operations of etching were accomplished, shown in Fig. 3 intermediary figure, terminal control mechanical manipulator took out washer from wet etching machine bench, and washer is placed in the washer storing unit;
In the 5th step, shown in the figure on Fig. 3 the right, terminal control mechanical manipulator returns to step 2 with the adjustment of silicon chip position) time the position, the position among the figure on the left side among Fig. 2 just.Take out silicon chip at last again, perhaps carry out other operation.
The present invention judges through on wet etching machine bench, adding the silicon chip position transducer whether the silicon chip in the wet etching machine bench is full batch; Terminal is completely criticized two kinds of situation and is made that through Robot actions silicon chip and washer all there are silicon chip or washer existence in the place of same distance before each piece silicon chip to be etched respectively with non-according to full batch; Make the residing soup environmental facies of each piece silicon chip to be etched together, thereby improve the silicon chip erosion homogeneity.
Claims (6)
1. a wet etching machine bench is characterized in that, comprises the silicon chip position transducer; It can detect the number of silicon chip silicon chip on residing position and wet etching machine bench on the wet etching machine bench; The mechanical manipulator of wet etching machine bench can pick and place silicon chip and change the position of silicon chip to be etched on wet etching machine bench, also comprises washer, and this washer can be inserted on the wet etching machine bench through mechanical manipulator; Terminal is connected with the silicon chip position transducer; Accept the relevant silicon chip position and the information of number that the silicon chip position transducer detects, and terminal is connected with mechanical manipulator, controls mechanical manipulator and pick and place silicon chip and washer.
2. wet etching machine bench according to claim 1; It is characterized in that; Terminal comprises the control of mechanical manipulator: the control mechanical manipulator is arranged silicon chip and the position of washer on wet etching machine bench again according to preset method, and after the operation completion, control mechanical manipulator with the location restore of silicon chip to the original position.
3. wet etching machine bench according to claim 2 is characterized in that, preset method is arranged for making silicon chip successively continuously, and before first piece of silicon chip, first silicon chip distance of distance place insertion washer that is distance between continuous two silicon chips.
4. wet etching machine bench according to claim 1 is characterized in that, also comprises the supply and the retrieving arrangement of washer, in order to deposit, to provide and to reclaim washer.
5. a method of eliminating silicon wafer etching difference is characterized in that, may further comprise the steps:
1) silicon chip gets into wet etching machine bench;
2) the silicon chip position transducer detects the number of silicon chip silicon chip on residing position and wet etching machine bench on the wet etching machine bench, and gives terminal with this information transmission;
3) terminal judges whether the silicon chip of this batch is full batch; If full batch; Then terminal control mechanical manipulator before first piece of silicon chip, first silicon chip distance of distance be distance between continuous two silicon chips washer is inserted in the place, if not full batch, then terminal control control mechanical manipulator before first piece of silicon chip, first silicon chip distance of distance place insertion washer that is distance between continuous two silicon chips; If not full batch; Then the position of the whole silicon chip of the mechanical hand adjustment of terminal control control is arranged silicon chip successively continuously, and before first piece of silicon chip, first silicon chip distance of distance place insertion washer that be distance between continuous two silicon chips;
4) carry out the etching operation, and after whole operations of etching are accomplished, take out washer;
5) terminal control mechanical manipulator returns to step 2 with the adjustment of silicon chip position) time the position.
6. the method for elimination silicon wafer etching difference according to claim 5; It is characterized in that, ought not be full batch in the step 3), the position of the whole silicon chip of the mechanical hand adjustment of terminal control control; When silicon chip is arranged successively continuously, first piece of silicon chip come first position of wet etching machine bench.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2009100572654A CN101886262B (en) | 2009-05-15 | 2009-05-15 | Wet etching machine bench and method for eliminating silicon wafer etching difference |
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| CN2009100572654A CN101886262B (en) | 2009-05-15 | 2009-05-15 | Wet etching machine bench and method for eliminating silicon wafer etching difference |
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| CN101886262A CN101886262A (en) | 2010-11-17 |
| CN101886262B true CN101886262B (en) | 2012-04-18 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103985660B (en) * | 2014-05-30 | 2017-11-07 | 上海集成电路研发中心有限公司 | Wet etch systems, wet etching method |
| CN115881529B (en) * | 2023-02-06 | 2023-05-12 | 合肥新晶集成电路有限公司 | Wet etching method, device, system, computer equipment and medium |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100394576C (en) * | 2005-12-09 | 2008-06-11 | 北京圆合电子技术有限责任公司 | Silicon chip transmitting system with visual sensor and transmitting method thereof |
| CN100479095C (en) * | 2005-12-09 | 2009-04-15 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method for controlling formula in silicon chip etching technology |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100394576C (en) * | 2005-12-09 | 2008-06-11 | 北京圆合电子技术有限责任公司 | Silicon chip transmitting system with visual sensor and transmitting method thereof |
| CN100479095C (en) * | 2005-12-09 | 2009-04-15 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method for controlling formula in silicon chip etching technology |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20131219 |
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Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
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Effective date of registration: 20131219 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Huahong NEC Electronics Co., Ltd. |