CN101878452A - Remover liquid composition and method for removing resin layer by using the same - Google Patents

Remover liquid composition and method for removing resin layer by using the same Download PDF

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Publication number
CN101878452A
CN101878452A CN2008801180381A CN200880118038A CN101878452A CN 101878452 A CN101878452 A CN 101878452A CN 2008801180381 A CN2008801180381 A CN 2008801180381A CN 200880118038 A CN200880118038 A CN 200880118038A CN 101878452 A CN101878452 A CN 101878452A
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remover composition
quality
resin bed
composition
described remover
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CN101878452B (en
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金成正夫
佐口琢哉
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Henkel AG and Co KGaA
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Henkel Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen

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  • Engineering & Computer Science (AREA)
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  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Detergent Compositions (AREA)
  • Paints Or Removers (AREA)

Abstract

Disclosed is a remover liquid composition which is excellent in ability of removing a resin layer such as a color filter, a photoresist and an overcoat, while having anti-corrosion effects on metal-containing members such as metal wirings. This remover liquid composition contains an alkanol amine, an aromatic alcohol and an anti-corrosive agent.

Description

Remover composition, used the stripping means of the resin bed of this remover composition
Technical field
The present invention relates to remover composition and used the stripping means of the resin bed of this remover composition, this remover composition is to the fissility excellence of resin beds such as color filter (color filter), photoresist, finishing coat, interlaminar resin interlayer, orientation rete, has the corrosion protection effect that contains the member of metal species for metal wiring or reflectance coating, light shield layer etc. especially concurrently.
Background technology
Use in the manufacturing process of color filter remover with colour filter (color filter layer) never the well-founded plate peel off, glass substrate is regenerated.
In addition, in semiconductor device manufacturing process, after the mask that has carried out desired resist formed, the etching of carrying out the conductive layer of non-masks area formed Wiring pattern, then removed resist layer not with stripper, comprised the resist layer on the Wiring pattern.
About the remover that uses in these operations, for example as described below various removers have been proposed.
In the patent documentation 1, put down in writing the colour filter remover of the aqueous solution formation that contains alkanediol, surfactant and alkali cpd.
In the patent documentation 2, put down in writing the stripper of the ammonium salt of the compound that in solvent, contains inorganic base and have 2 above carboxyls at least.
In the patent documentation 3; put down in writing the resist stripper; its removing of accumulating film of sidewall protection as resist is used liquid; comprise and be selected from sugar alcohol, isopropyl alcohol, dimethyl sulfoxide (DMSO) and 1, at least a kind of material in 3-dimethyl-2-imidazolone, hydramine, water and quaternary ammonium hydroxide as required.
In the patent documentation 4, put down in writing the photoresist stripper, it contains nitrogenous organic hydroxy compounds, water-miscible organic solvent, water and benzotriazole based compound.
In the patent documentation 5, put down in writing the surface conditioning agent of the aluminum wiring semiconductor substrate that contains quaternary ammonium hydroxide and sugar alcohol.
In the patent documentation 6, put down in writing the anticorrosive additive stripping liquid controlling composition, it is characterized in that containing at least a kind that is selected from N-alkyl alkanolamine, dimethyl sulfoxide (DMSO) and the N-N-methyl-2-2-pyrrolidone N-.
In the patent documentation 7, put down in writing the photoresist stripper that contains quaternary ammonium hydroxide, water-soluble amine, water, corrosion inhibitor and water-miscible organic solvent.
But, in the situation of in the past remover, take place sometimes rough sledding such as metal wiring corrosion, on the other hand, in the situation of the few remover of corrosion, peel off the effect deficiency sometimes.
Patent documentation 1: the spy opens flat 11-021483 communique
Patent documentation 2: the spy opens the 2002-129067 communique
Patent documentation 3: the spy opens flat 07-028254 communique
Patent documentation 4: the spy opens the 2001-188363 communique
Patent documentation 5: the spy opens flat 04-048633 communique
Patent documentation 6: the spy opens flat 08-087118 communique
Patent documentation 7: the spy opens the 2003-255565 communique
Summary of the invention
The problem that invention will solve
Among the present invention, be purpose so that the remover of peeling off effect and the equal excellence of corrosion protection result to be provided.
The means that are used to deal with problems
The present invention relates to remover composition, it is used to peel off resin bed, contains alkanolamine, aromatic series alcohols and corrosion inhibitor.
The invention effect
Remover composition of the present invention contains alkanolamine, aromatic series alcohols and corrosion inhibitor as essential composition, by the cooperative effect of these compositions, can realize the remover that two kinds of performances of fissility and corrosion are excellent especially.
Particularly, provide remover, it uses when being adapted at making SIC (semiconductor integrated circuit) or liquid crystal display circuit, can realize simultaneously that height peels off effect and enough corrosion protection results to metal wiring (particularly Al system and Cu are).
In addition, provide remover, the bad strippable substrate that produces the manufacturing process of the colour filter that it can be expeditiously forms colour filter from the array distribution does not corrode the array metal wiring (particularly Al system and Cu are) on the substrate that utilizes again basically.
Embodiment
As previously mentioned, remover composition contains alkanolamine, aromatic series alcohols and corrosion inhibitor, preferably also contains water.
Alkanolamine can for have primary, secondary, uncle is amino and the compound of pure property OH base, for example, be formula (1):
R 2 3-aN-(R 1OH) a(1) Biao Shi compound.Wherein, a represents 1～3 integer, R 1Expression alkylidene, oxyalkylene, a are in the situation more than 2, a plurality of R 1Each other can be identical, also can be different.As alkylidene, be preferably straight chain, branching or the cyclic alkylidene of carbon number 1～12, the straight chain or the branch-like alkylidene of preferred especially carbon number 1～8.As oxyalkylene, preferably by-(CH 2CH 2O) m-CH 2CH 2The group of-(m is 1～6, is preferably 1～3) expression.
R 2Expression H or alkyl, a is 1 o'clock, 2 R 2Can be identical, also can be different.As alkyl, straight chain, branch-like or the cyclic alkyl of preferred carbon number 1～12 are in particular carbon number 1～6, the most preferably straight chain or the branch-like alkyl of carbon number 1～4.In addition, the preference chain alkanolamine is uncle or secondary amine, therefore, and preferred at least 1 R 2Be H.
In addition, R 1And/or R 2Can form ring jointly with N together more than 2.
As alkanolamine, can enumerate monoethanolamine, diethanolamine, triethanolamine, 2-(2-amino ethoxy) ethanol, N particularly, N-dimethylethanolamine, N, N-diethyl ethanolamine, N, N-dibutyl monoethanolamine, N-methylethanolamine, N-ehtylethanolamine, N-butylethanolamine, N methyldiethanol amine, monoisopropanolamine, diisopropanolamine, triisopropanolamine etc., they can use separately, perhaps also can more than 2 kinds and use.
Wherein,, preferably use monoethanolamine, isopropanolamine, diethanolamine, 2-(2-amino ethoxy) ethanol, most preferably use monoethanolamine from the viewpoint of performance.
In addition, alkanolamine is in remover composition more than the shared preferred 5 quality % of ratio, more preferably more than the 10 quality %, further more than the preferred 15 quality %.On the other hand, from the viewpoint of suitable performance, below the preferred 70 quality %, more preferably below the 50 quality %, further below the preferred 30 quality %.
As the aromatic series alcohols, can enumerate compound with aromatic group and alcohol OH base.As aromatic group, preferably can have alkyl (preferred carbon number 1～4), alkoxy (preferred carbon number 1～4), OH, halogen, NO 2Etc. substituent phenyl.Preferred compound is by general formula (2):
[changing 1]
Figure GPA00001141931900041
The compound of expression, in the formula, R 3Expression alkylidene, oxyalkylene, as alkylidene, the straight chain or the branch-like alkylidene of preferred carbon number 1～8, the alkylidene of preferred especially carbon number 1～3.As oxyalkylene, preferably by
-(CH 2CH 2O) m-CH 2CH 2-
(wherein, m is 1～6, preferred 1～3, preferred especially 1) and
-(OCH 2CH 2) p-
The group of (wherein, p is 1～6, preferred 1～3, preferred especially 1) expression.In addition, the phenyl in the formula (2) can also can have for example aforesaid substituting group for not replacing.
As the aromatic series alcohols, can enumerate benzylalcohol, phenylethyl alcohol, hydroxy-benzyl alcohol (to hydroxy-benzyl alcohol, adjacent hydroxy-benzyl alcohol), p-hydroxyphenylethanol etc. particularly, also can be with combination more than 2 kinds.
Wherein, from the viewpoint of performance, preferred benzylalcohol, phenylethyl alcohol, hydroxy-benzyl alcohol, preferred especially benzylalcohol.
In addition, aromatic series alcohols shared ratio in remover composition, from the enough viewpoints of performance, more than the preferred 20 quality %, more preferably more than the 30 quality %, further more than the preferred 50 quality %, on the other hand, from the viewpoint of suitable performance, below the preferred 80 quality %, more preferably below the 70 quality %, further below the preferred 60 quality %.
As corrosion inhibitor,, can use as the known benzotriazole based compound of corrosion inhibitor, aromatic hydroxy compound, the compound that contains sulfydryl, carbohydrate, boric acid and salt thereof, silicate from the viewpoint of performance.They also can make up more than 2 kinds.
As the benzotriazole based compound, can enumerate for example benzotriazole particularly, 5,6-dimethylbiphenyl triazole, I-hydroxybenzotriazole, the 1-methylbenzotrazole, the amino benzotriazole of 1-, 1-phenyl benzotriazole, 1-methylol benzotriazole, 1-benzotriazole methyl formate, 5-benzotriazole formic acid, 1-methoxyl-benzotriazole, 1-(2, the 2-dihydroxy ethyl)-benzotriazole, 1-(2, the 3-dihydroxypropyl) benzotriazole, perhaps as " イ Le ガ メ Star ト " series by チ バ ス ペ シ ヤ リ テ イ one ケ ミ カ Le ズ commercially available 2,2 '-{ [(4-methyl isophthalic acid H-benzotriazole-1-yl) methyl] imino group } di-methylcarbinol, 2,2 '-{ [(5-methyl isophthalic acid H-benzotriazole-1-yl) methyl] imino group } di-methylcarbinol, 2,2 '-{ [(4-methyl isophthalic acid H-benzotriazole-1-yl) methyl] imino group } bis ethane, or 2,2 '-{ [(4-methyl isophthalic acid H-benzotriazole-1-yl) methyl] imino group } bis propane etc.Wherein, preferably use 1-(2, the 3-dihydroxypropyl)-benzotriazole, 2,2 '-{ [(4-methyl isophthalic acid H-benzotriazole-1-yl) methyl] imino group } di-methylcarbinol, 2,2 '-{ [(5-methyl isophthalic acid H-benzotriazole-1-yl) methyl] imino group } di-methylcarbinol etc.Can use the benzotriazole based compound more than a kind or 2 kinds.
As aromatic hydroxy compound, can enumerate cresols, xylenols, catechol, resorcinol, p-dihydroxy-benzene, pyrogallol, 1,2,4-benzenetriol, saligenin, to hydroxy-benzyl alcohol, adjacent hydroxy-benzyl alcohol, p-hydroxyphenylethanol, para-aminophenol, m-aminophenol, diaminophenol, aminoresorcinol, P-hydroxybenzoic acid, septichen, 2,4-dihydroxy-benzoic acid, 2,5-dihydroxy-benzoic acid, 3,4-dihydroxy-benzoic acid, 3,5-dihydroxy-benzoic acid etc., wherein, preferred catechol.These compounds can cooperate separately or combination cooperation more than 2 kinds.
As the compound that contains sulfydryl, preferably has the compound of the structure of hydroxyl and/or carboxyl in the α position of the carbon atom that combines with sulfydryl, at least one of β position.As such compound, can enumerate 1-thioglycerol, 3-(2-aminophenyl sulphur)-2-hydroxypropyl mercaptan, 3-(2-hydroxyethyl sulphur)-2-hydroxypropyl mercaptan, 2 mercaptopropionic acid and 3-mercaptopropionic acid etc. particularly as preferred compound.Wherein, especially preferably use the 1-thioglycerol.Have again, can be also with the compound that contains sulfydryl more than 2 kinds.
As carbohydrate, monosaccharide, polysaccharide and their glycitols can be enumerated, glyceraldehyde, threose, erythrose, arabinose, wood sugar, ribose, ribulose, xylulose, glucose, mannose, galactose, Tagatose, allose, altrose, gulose, idose, talose, sorbose, psicose, fructose of carbon number 3～6 for example etc. can be enumerated particularly; Threitol, antierythrite, ribitol, arabitol, xylitol, talitol, D-sorbite, mannitol, iditol, galactitol etc.Wherein, from aspects such as dissolubility or dispersivenesses, glucose, mannose, galactose, arabitol, D-sorbite, mannitol, xylitol etc. are fit to, from the viewpoint of water-soluble and performance, and D-sorbite most preferably.Also can be also with the carbohydrate more than 2 kinds.
As boric acid and salt thereof, can enumerate borates such as boric acid, ammonium borate, sodium borate, potassium borate.In addition, as silicate, can enumerate sodium silicate, potassium silicate etc.
In addition, corrosion inhibitor shared ratio in remover composition, from the enough viewpoints of performance, more than the preferred 0.01 quality %, more preferably more than the 0.1 quality %, further more than the preferred 1 quality %, on the other hand, from the viewpoint of suitable performance, below the preferred 10 quality %, more preferably below the 5 quality %, further below the preferred 3 quality %.
Have, when water existed, water was in remover composition more than the shared preferred 5 quality % of ratio again, more preferably more than the 10 quality %, further more than the preferred 15 quality %, on the other hand, below the preferred 50 quality %, more preferably below the 40 quality %, further below the preferred 30 quality %.
Except above composition, also can in the scope of not damaging effect of the present invention, add other composition as required.As such composition, can enumerate quaternary ammonium hydroxide, amine, organic solvent class, surfactant, inorganic base, sequestrant etc.Corrosion reduced when quaternary ammonium hydroxide and inorganic base added in a large number, and therefore in the situation of adding, preferably the scope below 10 quality % is used.Preferably do not add yet.As quaternary ammonium hydroxide, can enumerate tetramethylammonium hydroxide, tetraethylammonium hydroxide, hydroxide tetrapropylammonium, hydroxide trimethyl ethyl ammonium, hydroxide trimethyl (2-hydroxyethyl) ammonium, hydroxide triethyl (2-hydroxyethyl) ammonium, hydroxide tripropyl (2-hydroxyethyl) ammonium, hydroxide trimethyl (1-hydroxypropyl) ammonium etc. particularly.As inorganic base, can enumerate NaOH, potassium hydroxide, sodium carbonate, sal tartari.As the organic solvent class, can enumerate N, N-dimethyl acetamide, N, dinethylformamide, N-N-methyl-2-2-pyrrolidone N-, dimethyl sulfoxide (DMSO), carbitol acetic acid esters, methoxyl acetoxy-propane, diglycol monotertiary alkyl ether, diglycol dialkyl ether, gamma-butyrolacton, 1,3-dimethyl-2-imidazolone and alcohols etc.
Preferably, remover composition of the present invention is used for existing in the bottom of resin bed to be stripped the purposes of the member that comprises metal.As metal, can enumerate the elemental metals and the alloy that comprise Cu, Al, Mo, W and Ni, especially preferably comprise the metal of Cu or Al.
In 1 embodiment of the present invention,, comprise minus and eurymeric photoresist, can advantageously use as the photoresist stripper.As such photoresist, can enumerate the eurymeric photoresist that (i) contains naphthoquinones two triazo-compounds and novolac resin, (ii) contain by the acidic compound that exposes, decompose with acid and to make the compound that the dissolubility for aqueous alkali increases and the eurymeric photoresist of alkali soluble resin, (iii) contain by the acidic compound that exposes, eurymeric photoresist with alkali soluble resin of the group that increases for the dissolubility of aqueous alkali with the acid decomposition, (iv) contain by the acidic compound of light, the negative photoresist of crosslinking chemical and alkali soluble resin etc., but be not limited to them.
Stripper of the present invention and use its stripping means in the substrate of highly integrated, densification, also has excellent effect, and can prevent the corrosion for various metal wirings, metal level etc. effectively in the peeling off of modification photoresist film.
As the example of the member that comprises metal species, preference is as being selected from the member of distribution, reflectance coating and light shield layer.As wiring material, can be for Al, Cu and comprise at least a alloy in these metals, contain the composition of these metal species.Have, among the present invention, so-called Cu distribution can be for being the Cu alloy distribution that contains other metal such as Al of main composition (for example content is the above degree of 90 quality %) with Cu, and can be pure Cu distribution again.In addition, among the present invention, so-called Al distribution can also can be pure Al distribution for being the Al alloy distribution that contains other metal such as Cu of main composition (for example content is the above degree of 90 quality %) with Al.
In 1 embodiment of the present invention, remover composition of the present invention, the stripper that can be used as colour filter advantageously works.That is, the bad substrate of color filter is contacted with remover composition of the present invention, colour filter is peeled off, can carry out the regeneration of glass base plate for color filter from glass substrate.There is no particular restriction for the method for contact stripper, for example, can enumerate the method that bad substrate be impregnated in stripper.Also the bad substrate of color filter can be contained in the box etc. of regulation, contact, also can in contact, shake etc.
In 1 embodiment of the present invention, colour filter is formed by photoresist.Remover composition of the present invention, be fit to remove the pixel that forms by photoresist, the pixel that forms of negative-type photosensitive resins such as novolaks system, acrylic acid series for example, be coated with stripper of the present invention with infusion process, gunite etc. at the glass substrate that reclaims, the pixel that remains in substrate is peeled off clean, recyclable glass base plate for color filter.Have again, stripper of the present invention except the peeling off of the pixel of the substrate that is used to reclaim, the stripper of the various resists when also making as color filter.
The member that uses the color filter of stripper of the present invention preferably to have the containing metal class in the bottom of color filter, array distribution (particularly Al system and Cu are) for example also can be used for peeling off of the color filter that forms on the substrate of the member that does not have containing metal class such as array distribution.
In addition, except purposes, in 1 embodiment of the present invention, also be advantageously used in the peeling off of resin bed of non-photosensitive as the stripper of photo-sensitive resin.As the resin bed of non-photosensitive, can enumerate the colour filter and the protective seam of non-photosensitive.For example, the remaining substrate of protective seam is contacted with stripper, protective seam is removed.Especially, can be fit to peel off for protect color filter setting, as finishing coat of the resin bed of non-photosensitive etc.
1 embodiment of the present invention relates to the method that remover composition is contacted with resin bed and resin bed is peeled off.As the method that makes it to contact, can enumerate dipping, coating, injection etc., but be not limited to them.Temperature during as contact, preferred more than 40 ℃ from fully peeling off the viewpoint of resin bed, more preferably more than 50 ℃, further preferred more than 60 ℃, on the other hand, from making the sufficient viewpoint of corrosion protection result, preferred below 80 ℃, more preferably below 75 ℃, further preferred below 70 ℃.In addition, as duration of contact, from fully peeling off the viewpoint of resin bed, preferred more than 1 minute, more preferably more than 3 minutes, further preferred more than 5 minutes, on the other hand, from making the sufficient viewpoint of corrosion protection result, preferred below 30 minutes, more preferably below 20 minutes, further preferred below 10 minutes.
Embodiment
Below enumerate embodiment and comparative example illustrates the present invention, but the present invention is not limited to these embodiment.
＜disbonded test A 〉
The eurymeric photoresist of coating 1 μ m bed thickness has carried out 1 minute prebake conditions under 90 ℃ on silicon wafer.Jie is exposed it by photomask, and dipping developed in 60 seconds in tetramethylammonium hydroxide (TMAH).Baking after under 100 ℃ it being carried out 2 minutes.It is carried out dry etch process, make test film.It was flooded 10 minutes in 70 ℃ remover composition, after the pure water washing, observe surface state with scanning electron microscope (SEM).
Result according to the observation, following evaluation fissility.
A: the residue of failing to confirm to have,
B: confirm to have residue a little,
C: confirm residue in a large number.
＜disbonded test B 〉
The negative-type photosensitive pigmentary resin of coating 2 μ m bed thickness on glass blank uses hot plate after 1 minute, to use high-pressure sodium lamp to expose with the exposure of 200mj 90 ℃ of following prebake conditions.With hot plate 200 ℃ down with 30 minutes with its heat curing, make test film.It was flooded 10 minutes in 70 ℃ remover composition, after the pure water washing, observe surface state with scanning electron microscope (SEM).
Result according to the observation, following evaluation fissility.
A: the residue of failing to confirm to have,
B: confirm to have residue a little,
C: a large amount of affirmations have residue.
＜corrosion test 〉
A l and Cu were flooded 30 minutes in 70 ℃ remover composition with the silicon substrate of 1 μ m thickness film forming respectively, order according to isopropyl alcohol (IPA) and pure water is washed, thickness before and after handling calculates corrosion speed, also carries out the observation of surface state with SEM.
According to the above, following evaluation corrosivity.
A: corrosion speed is less than 1nm/ minute,
B: corrosion speed is more than 1nm/ minute and less than 10nm/ minute,
C: corrosion speed is to observe corrosion more than 10nm/ minute or with SEM.
＜embodiment 1～6, comparative example 1～10 〉
Make remover composition with forming shown in the table 1, carry out disbonded test and corrosion test.Should illustrate that the MEA in the table represents monoethanolamine, MIPA represents monoisopropanolamine, and TEA represents triethanolamine, and BA represents benzylalcohol, and FA represents phenylethyl alcohol, and NMP represents N-Methyl pyrrolidone, and DMSO represents dimethyl sulfoxide (DMSO), and TMAH represents tetramethylammonium hydroxide.In addition, the numeral in the parantheses is the quality % with respect to whole remover compositions.
[table 1]
Figure GPA00001141931900101
Evaluation result shown in the table 2.
[table 2]
Disbonded test A Disbonded test B Corrosion test (Al) Corrosion test (Cu)
Embodiment 1 ??A ??A ??A ??A
Embodiment 2 ??A ??A ??A ??A
Embodiment 3 ??A ??A ??A ??A
Embodiment 4 ??A ??A ??A ??A
Embodiment 5 ??A ??A ??A ??A
Embodiment 6 ??A ??A ??B ??B
Comparative example 1 ??B ??C ??A ??A
Comparative example 2 ??B ??C ??A ??A
Comparative example 3 ??B ??C ??A ??A
Comparative example 4 ??B ??C ??A ??A
Disbonded test A Disbonded test B Corrosion test (Al) Corrosion test (Cu)
Comparative example 5 ??B ??C ??A ??A
Comparative example 6 ??B ??C ??A ??A
Comparative example 7 ??B ??C ??A ??A
Comparative example 8 ??B ??C ??A ??A
Comparative example 9 ??B ??C ??C ??C
Comparative example 10 ??A ??B ??C ??C
＜embodiment 7～15 〉
Except with the modulation of composition shown in the table 3 remover composition, make remover composition similarly to Example 1, carry out disbonded test and corrosion test.Evaluation result shown in the table 4.
[table 3]
Figure GPA00001141931900111
[table 4]
Disbonded test A Disbonded test B Corrosion test (Al) Corrosion test (Cu)
Embodiment 7 ??A ??A ??A ??A
Embodiment 8 ??A ??A ??A ??A
Embodiment 9 ??A ??A ??A ??A
Embodiment 10 ??A ??B ??A ??A
Disbonded test A Disbonded test B Corrosion test (Al) Corrosion test (Cu)
Embodiment 11 ??A ??B ??A ??A
Embodiment 12 ??B ??B ??A ??A
Embodiment 13 ??A ??A ??B ??B
Embodiment 14 ??A ??B ??A ??A
Embodiment 15 ??A ??B ??B ??A
Utilizability on the industry
Remover composition of the present invention is suitable for peeling off of resin layer.

Claims (13)

1. remover composition, it is used to peel off resin bed, contains the combination of alkanolamine, aromatic series alcohols and corrosion inhibitor.
2. the described remover composition of claim 1 is characterized in that, also contains water.
3. claim 1 or 2 described remover compositions is characterized in that, described alkanolamine contains at least a kind that is selected from monoethanolamine, isopropanolamine, diethanolamine, triethanolamine and 2-(2-amino ethoxy) ethanol.
4. each described remover composition of claim 1～3, wherein, described aromatic series alcohols contains and is selected from least a in benzylalcohol, phenylethyl alcohol and the hydroxy-benzyl alcohol.
5. each described remover composition of claim 1～4, wherein, described corrosion inhibitor contains at least a kind that is selected from benzotriazole based compound, aromatic hydroxy compound, the compound that contains sulfydryl, carbohydrate, boric acid and salt thereof, the silicate.
6. each described remover composition of claim 1～5, wherein,
Described alkanolamine shared ratio in described remover composition is 5～70 quality %,
Described aromatic series alcohols shared ratio in described remover composition is 5～80 quality %,
Described corrosion inhibitor shared ratio in described remover composition is 0.01～10 quality %,
Described water shared ratio in described remover composition is 0～60 quality %.
7. each described remover composition of claim 1～6, wherein,
Described resin bed comprises at least a kind the layer that is selected from colour filter, photoresist layer and finishing coat, interlaminar resin interlayer, the orientation rete.
8. each described remover composition of claim 1～7, wherein, described resin bed is for comprising the layer that forms on the member of metal species.
9. the described remover composition of claim 8, wherein, described metal is at least a metal that comprises Cu and Al.
10. the described remover composition of claim 8, wherein, described member is selected from distribution, reflectance coating and light shield layer.
11. the described remover composition of claim 7, wherein, described resin bed is eurymeric or negative photoetching glue layer.
12. the stripping means of resin bed, it has the operation that each described remover composition of claim 1～11 is contacted with resin bed.
13. the manufacturing thing, its stripping means by having claim 12 is as the manufacture method manufacturing of 1 operation.
CN200880118038.1A 2007-10-17 2008-10-17 Remover liquid composition and method for removing resin layer by using the same Active CN101878452B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-270273 2007-10-17
JP2007270273 2007-10-17
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CN101878452B (en) 2015-01-07
JPWO2009051237A1 (en) 2011-03-03

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