CN101876627B - Optical power meter technology-based method for detecting interface bonding state of laser scratch - Google Patents
Optical power meter technology-based method for detecting interface bonding state of laser scratch Download PDFInfo
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- CN101876627B CN101876627B CN2010101249456A CN201010124945A CN101876627B CN 101876627 B CN101876627 B CN 101876627B CN 2010101249456 A CN2010101249456 A CN 2010101249456A CN 201010124945 A CN201010124945 A CN 201010124945A CN 101876627 B CN101876627 B CN 101876627B
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Abstract
The invention discloses an optical power meter technology-based method for detecting the interface bonding state of a laser scratch and relates to the technical field of laser detection and material performance detection. In the method, the intensity change of reflected light on a loading point of a coating under laser loading is detected by using an optical power meter on line and in real time so as to obtain the critical point of an interfacial failure and interface bonding intensity is represented by a laser power parameter corresponding to the critical point. A measure result is laser quasi-static loading, so that the critical value of coating (membrane) stripping is less than a dynamic measured value and is closer to a practical interface bonding intensity.
Description
Technical field
Apparatus of the present invention relate to laser detection and material property detection technique field; Refer in particular to the laser scratch device that a kind of film base interface and coating interface bond strength detect, the variation of adopting the light power meter real-time online to detect coating load(ing) point place intensity of reflected light under laser loads obtains the critical point of interfacial failure.
Background of invention
Coating technology is a kind of important surface treatment and the compound advanced technology of material, and its core is to guarantee that coating has the good binding performance with matrix in lifetime.Problems of measurement to coating one substrate combinating strength; Chinese scholars is launched a series of researchs; And multiple bond strength detection methods such as scarification, indentation method, laser slabbing method are proposed, make a general survey of these methods and remain in problems such as testing result instability or distinct methods testing result difference are bigger.
The laser scratch method combines the traditional scarification and the advantage of laser measuring technique, is a kind of novel measured thin film technology.The Feng Aixin of Jiangsu University, Zhang Yongkang, Zhou Ming thanks to Hua Kun, and Cai Lanli measures the face bond strength with quasistatic laser scratch circle and applies for a patent: the quasistatic laser scratch measuring method and the device of interface bond strength, application number: 02138512; It is characterized in that surperficial quasistatic heating is peeled off the film generation to film test piece with the long pulse infrared laser beam, laser beam forms cut at film surface, and detection signal is transferred to the signal acquisition testing system and detects judgement.This method than traditional contact cut have cut mechanism clear and definite, can directly detect sample, non-cpntact measurement, advantage such as widely applicable; But exist too such as: apparatus is comparatively loaded down with trivial details; And can not set up the relation between complete laser power and film rheobase, film base interfacial failure destroyed critical localisation can't make problems such as accurate judgement.
Optical power meter technology is a new and high technology of having a bright future, and utilizes light power meter to detect and has following advantage:
1. not influenced by objective environment.Light power meter mainly is to analyze through gathering light intensity numerical value, not influenced by objective factors such as sound wave, temperature, thereby laser is to the quasistatic loading procedure on test specimen surface in can accurate recording cut process.
2. display mode is directly perceived.The light intensity numerical value that light power meter is gathered can pass through the real-time and computing machine communication of data-interface, and feedback data is plotted curve automatically, and display mode is directly perceived, is convenient to operator's observation analysis.
Summary of the invention
The present invention seeks to provide a kind of method for detecting interface bonding state of laser scratch based on optical power meter technology; Critical point through light power meter real-time online detection coating variation acquisition interfacial failure of load(ing) point place intensity of reflected light under laser loads characterizes interface bond strength with the pairing laser power parameter of critical point.Typical film based system is detected, set up a kind of research and detect the anchoring strength of coating experimental technique.
The related system of this method is made up of cut system, piece fixture system, work system, detection system, control system and support, it is characterized in that: comprise that also the light power meter real-time online detects the critical point of coating variation acquisition interfacial failure of load(ing) point place intensity of reflected light under laser loads.
Wherein, said cut system includes semiconductor laser, laser bundle-enlarging collimation system, catoptron, plus lens, and wherein, laser bundle-enlarging collimation system is positioned at laser instrument light-emitting window position, and catoptron is between laser bundle-enlarging collimation system and plus lens.
Wherein, said piece fixture system includes test specimen and anchor clamps, wherein, test specimen by the anchor clamps clamping on worktable, test specimen be positioned at plus lens under.
Wherein, Said work system includes one dimension electronic control translation stage X, one dimension electronic control translation stage Z, two-dimentional electronic control translation stage; Wherein, Said catoptron is installed on the one dimension electronic control translation stage X, and said plus lens is installed on the one dimension electronic control translation stage Z, and said piece fixture system is installed on the two-dimentional electronic control translation stage.Worktable is by rack bearing.
Wherein, said detection system is provided with power meter, microscope, CCD imaging system, links to each other with industrial computer, be distributed in sample around.
Wherein, Said control system includes power source of semiconductor laser and control, motion control card, industrial computer and servomotor; Wherein, Power source of semiconductor laser and be controlled at semiconductor laser and industrial computer between, motion control is stuck between two-dimentional automatically controlled translational worktable and the industrial computer, servomotor is installed on one dimension electronic control translation stage and the two-dimentional electric translation stage.
Implementation process of the present invention is following:
Through adopting monopulse laser that coating is carried out the single-point single load,, adopt light power meter to detect load(ing) point place intensity of reflected light in the time of loading along with the increase of laser energy has formed the discrete cut of point-like that the degree of depth increases gradually.Since the laser energy that loads and the intensity of reflected light numerical value of power meter collection when film does not destroy with equal slope linear increment (as shown in Figure 4,0～b section of laser intensity straight line, a of intensity of reflected light curve～b section), i.e. laser intensity P
I=Kt, intensity of reflected light P
R1=Kt-A, wherein K, A＞0 are constant; Along with the destruction of film, it is coarse that the surface becomes, and reflectivity reduces, and this moment, intensity of reflected light was P
R2=K
1T-A, K
1Less than K, and constantly reduce (b of intensity of reflected light curve～c section among Fig. 4) with the destruction of film, when interfacial failure, reflectivity and detected intensity of reflected light descend suddenly, i.e. slope curve (the K of intensity of reflected light
1-t) curve generation step, then knee point is the criterion of film base interfacial failure, is the critical point of interfacial failure.
(4) the cut time is made as t, and the SF of light power meter is made as f,, always gathering sample number is S=t/ (1/f)=tf, draw to the flex point time be t
i, then the pairing number of samples of flex point is made as S
i=S * (t
i/ t)=t
iF, the laser energy maximal value of loading is P, then being used for the laser power of bond strength at characterization of membrane base interface is P
i=P * (S
i/ S)=P (t
i/ t).
In the said method, said laser power range of adjustment is at 0～200W, and thickness is about 50 μ m, and spot diameter is unsuitable excessive, is approximately 1mm, and cut speed selection effect between 0.5～1mm is comparatively obvious.
This method adopts semiconductor laser to excite the continuous laser that strengthens gradually as external drive source; Laser at first irradiation at coating surface; Because laser energy is less during beginning; Coating surface load(ing) point place breaks still very level and smooth, and the photosensitive sensor of light power meter at one end can absorb whole load(ing) point place reflected light photons.Increase along with laser energy has formed plasma stock wave at coating surface, causes coating generation plastic yield, and it is uneven that coating surface becomes, and the light of reflection is because scattering has only part to be absorbed by sensor.Along with the continuous increase of laser energy, this scattering phenomenon is more obvious, and the photon number that is absorbed by sensor is few more, peels off from matrix until coating.The light intensity numerical value that power meter is gathered is real-time and computing machine communication through interface, and system program runs a curve at window (being para-curve) according to the data of power meter collection, and its flex point is the critical point of interfacial failure.Microscope and CCD imaging system auxiliary detection are carried out all-the-way tracking to this cut process.Detected picture signal is all passed on the industrial computer, carry out information stores by industrial computer.
The bond strength compared with techniques of the present invention and existing laser measurement coating (film) basal body interface has following characteristics:
1. utilize light power meter to detect, mechanism obviously, succinctly.Utilize the laser quasistatic loading surperficial in the light power meter system accurate recording cut process to test specimen; Increase along with laser energy; Formed plasma stock wave at coating surface, caused coating generation plastic yield, further the generating material warpage with peel off; Then cause that the surface forms flex point to the variation of laser absorption rate, can characterize interfacial combined function with the pairing laser energy of flex point.
2. the result who records loads for the laser quasistatic, and the critical value that coating (film) is peeled off is little than the kinetic measurement value, more near actual interface bond strength.
3. display mode is directly perceived.The light intensity numerical value that light power meter is gathered can pass through the real-time and computing machine communication of data-interface, and feedback data is plotted curve automatically, and display mode is directly perceived, is convenient to operator's observation analysis.
4. the variation of microscopic examination surface after laser loads taken record by the CCD camera and made testing result more reliable.
Description of drawings
The structured flowchart and the description of drawings of apparatus of the present invention specific embodiment are following:
The system architecture synoptic diagram of Fig. 1 semiconductor laser cut measurement mechanism
Fig. 2 work system front view
Fig. 3 work system vertical view
Fig. 4 laser intensity and intensity of reflected light and time chart
Near the microphoto of the actual cut effect of position Fig. 5 cut coating flex point
1, semiconductor laser; 2, power source of semiconductor laser and control thereof; 3, laser bundle-enlarging collimation system; 4, catoptron; 5, plus lens; 6, power meter; 7, reflective mirror; 8, microscope; 9, CCD imaging system; 10, workpiece; 11, anchor clamps; 12, two-dimentional electronic control translation stage; 13, motion control card; 14, industrial computer; 15, support; 16, one dimension electronic control translation stage X; 17, servomotor; 18, one dimension electronic control translation stage Z; 19, two-dimentional electronic control translation stage Y; 20, two-dimentional electronic control translation stage X; 21, laser intensity; 22, flex point; 23, intensity of reflected light; 24, coating
Specific embodiments
By shown in Figure 1 be the structural representation of long pulse infrared laser cut and pick-up unit, Fig. 2 and Fig. 3 are work system front view and vertical view.Semiconductor laser light source 1 sends continuous infrared laser through making laser at the light beam of the laser instrument slow-axis direction collimation more that becomes behind the laser bundle-enlarging collimation system 3; Laser beam makes beam direction change 90 degree through catoptron 4 then; Light beam through catoptron 4 converges at a bit after being fixed on the plus lens 5 on the one dimension electronic control translation stage 18; This point directly vertically affacts on the two-dimentional electronic control translation stage 19 of support 15 supports through catoptron 4 backs that are fixed on the one dimension electronic control translation stage 16 again; Test specimen is placed on the anchor clamps 11 of this two dimension electronic control translation stage; Can move any of directions X and Y direction through two-dimension translational platform 19 and 20, drive the motion of workpiece, will form a cut at surface of the work like this.In the process of cut; Industrial computer 14 can be controlled the size of semiconductor laser light source 1 output power; One dimension electronic control translation stage 16 and two-dimentional electronic control translation stage 20 are done the translation motion of directions X under can the control of each comfortable industrial computer 14; Two dimension electronic control translation stage 19,20 can be under the control action of industrial computer 14 in the translation of directions X and Y direction, the moving of one dimension electronic control translation stage 16 and one dimension electronic control translation stage 18 can drive moving of the plus lens 6 placed on it and completely reflecting mirror 4 respectively.These translation motions freely bring great convenience for scratch experiment and Laser Processing.In the process of cut, in order to obtain one on the surface of workpiece, can realize through the output power size that industrial computer 14 and Control Software are controlled semiconductor laser light source 1 by the shallow cut mark that slowly deepens.In the process of cut; In order to obtain the cut that width does not wait on the surface of workpiece; Can be placed on the plus lens 5 of the automatically controlled platform 18 of one dimension respectively and the distance that is placed between the catoptron 4 of one dimension electronic control translation stage 16 realizes through adjustment; When change between plus lens 5 and the completely reflecting mirror 4 apart from the time, the size of the spot diameter that then on this completely reflecting mirror 4, obtains can change, thus the size that reflexes to the hot spot of surface of the work also can obtain change.
Detection system is made up of power meter 6, microscope 8, CCD imaging system 9 and industrial computer 14 etc.At test specimen during by the process of laser beam cut; The laser beam that semiconductor laser 1 sends acts on a bit of test specimen surface; Detect by power meter 6 through after the reflection of test specimen; Power meter 6 is transferred to industrial computer 14 to detected light intensity signal; Two-dimentional electronic control translation stage 19 drives test specimen and does the translation of Y direction under the control action of industrial computer 14 so simultaneously, and the power of lasing light emitter is implemented control by industrial computer 14, and last CCD imaging system 9 is carried out all-the-way tracking to this cut process down the auxiliary of white light source.The power signal that all power meters 6 detect, microscope 8 all passes on the industrial computer 14 with CCD imaging system 9 detected picture signals, carries out information stores by industrial computer 14.
Following examples are used to explain the present invention, but are not used for limiting scope of the present invention.
With a block length 150mm, wide 100mm, the thick 1.5mm that is about, the trade mark are 304 corrosion resistant plate process 1000# coated abrasive working, and its surface average roughness is approximately Ra1.6, evenly is coated with the coating of the about 50 μ m of last layer thickness again.The laser scratch experiment parameter is following: laser power increases to 50W from the 0W linearity, spot diameter 1mm, cut speed 0.75mm/s, cut length 100mm, cut time 133.3, number of sampling 83.
Let industrial computer Control work platform drive the coating sample and make the about 133.3s of linear uniform motion with the speed of 0.75mm/s; Gathered burnt infrared laser light beam direct radiation on the coating specimen surface through focus lamp simultaneously; Laser power also increases to 50W from the 0W linearity at 133.3s in the time, like this will be at the long cut of the standardized road 100mm of coating specimen surface.Meanwhile, the situation of change of load(ing) point intensity of reflected light in light power meter detection in real time and the recording laser cut overall process.
The variation that as can be seen from Figure 4 coating surface demonstrates two stages significantly along with the variation and the passing of time of laser energy during laser scratch.This and theoretical analysis expected result are consistent.Flex point in the curve promptly is coating splits away off critical localisation from matrix concrete reflection.Fig. 5 is the microphoto that finds near the actual cut effect of the position corresponding turning point on the long cut coating of the 100mm that drawn of corresponding diagram 4.Can find out that from microphoto coating is coarse rough and uneven in surface, obvious with basal body interface, show that coating splits away off from matrix fully.Because the frequency of light power meter sampling is 0.625Hz, the used time is t=80s when establishing light power meter and sampling flex point.When laser scratch speed is 0.75mm/s; What set is cut at 133.3s in the time, and laser power is increased to 50W from the 0W linearity, so; Can calculate when sampled point S=83 * (50/133.3)=50, corresponding laser power is P=50 * (50/83) ≈ 30W.That is to say that the corresponding laser power in turning point place is approximately 30W, i.e. the bond strength at film base interface among the embodiment for this reason.
Claims (2)
1. method for detecting interface bonding state of laser scratch based on optical power meter technology; It is characterized in that: the film that is coated on the workpiece is carried out the single-point single load through adopting monopulse laser; Along with the increase of laser energy has formed the discrete cut of point-like that the degree of depth increases gradually, adopt light power meter to detect load(ing) point place intensity of reflected light in the time of loading; Since the laser energy that loads and the intensity of reflected light numerical value of light power meter collection when film does not destroy with equal slope linear increment, i.e. laser intensity P
I=Kt, intensity of reflected light P
R1=Kt-A, wherein K, A＞0 are constant; Along with the destruction of film, it is coarse that the surface becomes, and reflectivity reduces, and this moment, intensity of reflected light was P
R2=K
1T-A, K
1Less than K, and constantly reduce with the destruction of film, when interfacial failure, reflectivity and detected intensity of reflected light descend suddenly, i.e. the slope curve K of intensity of reflected light
1-t curve generation step, then knee point is the criterion of thin film based interfacial failure, is the critical point of interfacial failure; If the cut time is t, the SF of light power meter is made as f,, always gathering sample number is S=t/ (1/f)=tf, draw to the flex point time be t
i, then the pairing number of samples of flex point is made as S
i=S * (t
i/ t)=t
iF, the laser energy maximal value of loading is P, the laser power that then is used for characterizing the bond strength at thin film based interface is P
i=P * (S
i/ S)=P (t
i/ t).
2. detection method as claimed in claim 1 is characterized in that: the laser power range of adjustment is at 0～200W, and coating thickness is 50 μ m, and spot diameter is 1mm, and the cut speed selection is between 0.5～1mm.
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| CN102706801B (en) * | 2012-06-20 | 2014-05-28 | 江苏大学 | Method and device for measuring weak bonding strength of coating interface |
| CN115046921B (en) * | 2022-08-11 | 2022-12-02 | 四川至臻光电有限公司 | Testing method and testing device for representing film adhesion of plastic optical element |
| CN116754578B (en) * | 2023-08-18 | 2023-11-03 | 国镓芯科(成都)半导体科技有限公司 | Detection system for wafer scratch and detection method of system |
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| CN1272621C (en) * | 2002-10-30 | 2006-08-30 | 江苏大学 | Far ultraviolet laser scratch measuring method and device for interface bonding strength |
| CN1296698C (en) * | 2002-10-30 | 2007-01-24 | 江苏大学 | Quasi-static laser scratch measuring method and device for interface bonding strength |
| CN101876628A (en) * | 2010-03-16 | 2010-11-03 | 江苏大学 | Optimization process-based method for rapidly detecting bonding state of coating interface |
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