CN101875482B - Apparatuses for fabricating micro patterns using laser diode array and methods for fabricating micro patterns - Google Patents
Apparatuses for fabricating micro patterns using laser diode array and methods for fabricating micro patterns Download PDFInfo
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- CN101875482B CN101875482B CN 200910170556 CN200910170556A CN101875482B CN 101875482 B CN101875482 B CN 101875482B CN 200910170556 CN200910170556 CN 200910170556 CN 200910170556 A CN200910170556 A CN 200910170556A CN 101875482 B CN101875482 B CN 101875482B
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Abstract
Apparatuses for fabricating micro patterns using a laser diode array and methods for fabricating micro patterns are presented. The apparatus includes a laser diode array having at least one laser diode wherein light emitted from each laser diode is focused by a convex lens onto a second material layer attached to a first material layer. At least one driving shaft drives motion of the first and the second material layers. An adjustment means is used for adjusting the gap and pitch between adjacent laser diodes.
Description
Technical field
The invention relates to a kind of laser diode device, be particularly to diode laser matrix and make the equipment of micro drawing and the manufacture method of micro drawing.
Background technology
Display pannel continues towards large scale and pliability development.For reaching the effect of making fast and accurately, manufacture method comprises gold-tinted developing manufacture process, laser processing procedure, ink jet printing processing procedure and hot writing head (thermalprint head) printing process.
Tradition gold-tinted developing manufacture process is ripe semiconductor mainstream technology, and its processing procedure complexity and automated production cost are high.Moreover, CO
2The laser processing procedure also is the process technique of at present reality employing, yet one bar pattern (pattern) is comprised of several patterns, easy wired vestige between each bar pattern, and speed of production is slow, and the laser thermal source is unstable and quality is wayward.On the other hand, ink jet printing processing procedure low cost of manufacture, however ink-jet drop is difficult for all materials of coating, and because of the volatilization of drop and crooked, easily cause the problem of pattern quality shakiness.
Tradition micro-bit phase difference (micro retarder) micro-bit phase difference plate of structure comprises the zone of two different phasic differences, can be by process infrared C O
2LASER HEATING is processed and without crossing laser treatment, is formed the phasic difference plate that alternately differs zones of different.US Patent No. 6,498,679 discloses and uses infrared C O
2The lasing light emitter heating, fabricating patterned phasic difference film.A fine rule is only processed in each laser scanning, is made of the figure line of tool phase difference many adjacent fine rules.
Summary of the invention
The object of the present invention is to provide a kind of diode laser matrix to make the equipment of micro drawing and the manufacture method of micro drawing, can make fast the film material of micro drawing.
One embodiment of the invention provide a kind of diode laser matrix to make the equipment of micro drawing, and comprising: a diode laser matrix has at least one laser diode; Wherein light transmission one lens focus that sends of each laser diode is at one second material layer that is positioned on one first material layer.
Another embodiment of the present invention provides a kind of diode laser matrix to make the equipment of micro drawing, comprise: a diode laser matrix has at least one laser diode, and wherein light transmission one lens focus that sends of each laser diode is at one second material layer that is positioned on one first material layer; At least one axle drives, to drive the movement of the first material layer and the second material layer; And an adjusting device, to adjust the spacing between each laser diode.
Another embodiment of the present invention provides a kind of manufacture method of micro drawing, comprising: a diode laser matrix manufacturing equipment is provided, and this diode laser matrix has at least one laser diode; Light transmission one lens focus that each laser diode is wherein sent forms micro drawing on this first material layer whereby at one second material layer that is positioned on one first material layer.
Diode laser matrix of the present invention is made the equipment of micro drawing and the manufacture method of micro drawing, utilizes the light Xiao Yi of diode laser matrix to arrange the characteristic of producing, and can make fast the film material of micro drawing.
For the present invention can be become apparent, embodiment cited below particularly, and cooperate appended accompanying drawing, be described in detail below:
Description of drawings
Fig. 1 is the configuration diagram that shows the use diode laser matrix manufacturing micro drawing equipment of one embodiment of the invention;
Fig. 2 A and 2B are the configuration diagram that shows according to the diode laser matrix of the embodiment of the invention;
Fig. 3 A and 3B show the configuration diagram of making micro drawing equipment according to the diode laser matrix of the embodiment of the invention;
Fig. 4 A and 4B show the according to another embodiment of the present invention configuration diagram of diode laser matrix; And
Fig. 5 A and 5B are the processing work structural representations that shows according to the embodiment of the invention.
[primary clustering symbol description]
The equipment of 100～diode laser matrix processing and manufacturing micro drawing;
110～diode laser matrix;
120～condenser lens;
130～pedestal;
140～processing work;
150～precision bearing motor;
205～X-Y-Z axle trace rule platform;
210～diode laser matrix;
220～laser diode;
225～radiating component (heat sink);
230～condenser lens;
240～focus lamp Z-axle is in platform;
300a, 300b～diode laser matrix is made the device of micro drawing;
310～diode laser matrix;
320～processing work;
325～micro drawing;
330～laser diode measurement light source;
340～detector;
The direct of travel of X～processing work;
The direction of measurement of Y～laser diode measurement light source;
400a, 400b～diode laser matrix;
410a, 410b～fixed mount;
420a, 420b～a plurality of laser diodes;
510～the first material layers;
The micro drawing that 515A, 515B～difference differ;
520～the second material layers.
The specific embodiment
Below describe and be accompanied by the example of description of drawings in detail with each embodiment, as reference frame of the present invention.In accompanying drawing or specification description, similar or identical part is all used identical figure number.And in the accompanying drawings, the shape of embodiment or thickness can enlarge, and to simplify or convenient the sign.Moreover, the part of each assembly will be described respectively explanation in the accompanying drawing, it should be noted that, the assembly that does not illustrate among the figure or describe, for having the form of usually knowing known to the knowledgeable in the affiliated technical field, in addition, the ad hoc fashion that specific embodiment only uses for disclosing the present invention, it is not to limit the present invention.
One embodiment of the invention provide the equipment of a kind of use diode laser matrix (laser diode array) at processing or manufacturing micro drawing.More particularly, by the small-sized volume of diode laser matrix and the low characteristic of cost, be applied in the technology of making micro drawing.
Fig. 1 is the configuration diagram that shows the diode laser matrix manufacturing micro drawing equipment of one embodiment of the invention use.In Fig. 1, the equipment 100 that a kind of diode laser matrix is made micro drawing comprises a diode laser matrix 110, it has at least one laser diode, and wherein light transmission one lens 120 that send of each laser diode focus on one second material layer that is positioned on one first material layer.According to the embodiment of the invention, by single laser diode (laser diode), perhaps the array (laser diode array) that consists of of a plurality of laser diodes is erected on the bracing frame and is fixed on the pedestal 130.Processing work 140, for example wish is made the soft board of micro drawing, has one second material layer and is arranged on the first material layer.Processing work 140 is arranged on pedestal 130 or the control platform and drives by at least one axle of a precision bearing motor 150 controls, to drive the movement of the first material layer and the second material layer.In one embodiment, this driving shaft is the translational speed speed mode of adjusting first and second material layer.
Fig. 2 A and 2B are the configuration diagram that shows according to the diode laser matrix of the embodiment of the invention.See also Fig. 2 A, diode laser matrix 210 can be comprised of a plurality of laser diode processing modules independently, for example 8 laser diode processing modules row that stagger.The optical wavelength that this each laser diode sends is positioned at near-infrared and visible-range.The laser diode 220 of each laser diode processing module (being illustrated at Fig. 2 B) is fixed on the X-Y-Z axle trace rule platform 205, and a radiating component (heat sink) 225 is fixed in laser diode 220 another sides, in order to derive superfluous heat.One condenser lens, 230 fixed-focus mirror Z-axles are on platform 240.X-Y-Z axle trace rule platform 205 is an adjusting device, to adjust the spacing between each laser diode 210.In one embodiment, the distance between the adjacent laser diode is by this adjusting device adjustment.Whole diode laser matrix is by this adjusting device rotation or tilts.In addition, the Z-axle is an extra adjusting device in platform 240, to adjust or to move the relative distance of each lens 230 and each laser diode 210.This extra adjusting device also can be in order to adjust or to move the relative distance of each lens 230 and processing work (for example the first and second material layers).In another embodiment, this extra adjusting device can be controlled by X, Y, Z three axial adjustment move modes the relative distance of each lens and each laser diode, so that each lens and each laser diode are the coaxial concentricity arrangement that aligns.
Fig. 3 A shows the according to another embodiment of the present invention configuration diagram of diode laser matrix manufacturing micro drawing device.In another embodiment, also further diode laser matrix is made the technology of micro drawing film, the binomial function is added in design, the one function is for checking the permeability variations of phase difference film (retardation), another function is for manufacturing simultaneously little phase difference film (μ-retarder), therefore can produce fast and can promote fine ratio of product, have manufacturing competitive advantage.See also Fig. 3 A, the device 300a that diode laser matrix is made micro drawing comprises that diode laser matrix 310, one processing works 320 are arranged at diode laser matrix 310 belows.Laser diode measurement light source 330 and detector 340 are arranged at respectively the above and below of processing work 320, are adding the variation that differs of micro drawing 325 on the workpiece 320 in man-hour in order to measure.In this embodiment, measurement light source 330 and detector 340 are to arrange with the pattern of array, for example row of three shown in the 3A figure or more closely arrangement.In the processing procedure of making the micro drawing film, the direction of measurement of laser diode measurement light source is to carry out along Y-direction, and the direct of travel of processing work 320 is to move along directions X.In another embodiment, measurement light source 330 and detector 340 can be single assortment and are integrated in diode laser matrix 310, and the diode laser matrix shown in Fig. 3 B is made the device 300b of micro drawing.It should be noted that by laser diode measurement light source 330 and detector 340 to consist of at least one LASER Light Source detection system, with diode laser matrix synchronous production and sync check.Although the embodiment of the invention is that LASER Light Source detection system take penetration is as example, it is the not homonymy that laser diode measurement light source 330 and detector 340 lay respectively at processing work 320, yet will be appreciated that, also can select reflective LASER Light Source detection system, laser diode measurement light source 330 and detector 340 are arranged at the same side of processing work 320.
Fig. 4 A and 4B show the according to another embodiment of the present invention configuration diagram of diode laser matrix.See also Fig. 4 A, described diode laser matrix 400a can comprise that the array (for example square formation or matrix) of the two dimension that a plurality of laser diode 420a consist of is fixed on the fixed mount 410a.Other selects a ground, sees also Fig. 4 B, and diode laser matrix 400b can comprise that the array (for example rhombus square formation or rhombus matrix) of the two dimension that a plurality of laser diode 420b consist of is fixed on the fixed mount 410b.Perhaps, utilize the anglec of rotation of diode laser matrix 400a of a rotating control assembly control chart 4A to control the spacing between the adjacent laser diode.
Fig. 5 A and 5B are the processing work structural representations that shows according to the embodiment of the invention.The processing work that is used for diode laser matrix manufacturing micro drawing comprises that the second material layer 520 is arranged on the first material layer 510.The first material layer 510 can be the film material of a wish micro drawing.In another embodiment, the second material layer 520 can be the laser absorption film, but the black PET film of absorbing laser for example.The second material layer 520 is to invest on the first material layer 510 with glue or electrostatic paster.Perhaps, this second material layer 520 is one directly to be formed at and to contain the dyestuff colorant layer on the first material layer 510.Utilize laser diode (laser diode) power that provides (power) to produce infrared (IR) light; second material layer 520 (for example black protective film or laser absorption layer) of direct irradiation on the first material layer 510; to form micro drawing 515A, 515B orderly and that the tool difference differs (shown in Fig. 5 B), remove at last or take off the second material layer 520 on the first material layer 510.
When carrying out the process of diode laser matrix manufacturing micro drawing, each laser can be fixed on the test mechanical arm, in order to testing laser diode (testing robot of laser diode).On the path of wanting the micro drawing film; utilizing the precision bearing motor will want the micro drawing film drives; and utilize laser diode (laserdiode) power that provides (power) to produce infrared (IR) light, the black protective film (perhaps laser absorption layer) of direct irradiation on the film of wish manufacturing micro drawing.Because that employed black protective film (or laser absorption layer) has is high temperature resistant, reflection source and be difficult for the characteristic that allows light penetrate not; so that the light that laser diode is launched is changed into heat energy in the utmost point short time, and then utilize this heat energy to form micro drawing on film.Will be appreciated that, utilize manufacture method and the device of described diode laser matrix (laser diode array) processing micro drawing film, cooperate the precision bearing motor, with the speed control that the film material of wanting micro drawing drives, can consist of the diode laser matrix equipment of quick production.Moreover, diode laser matrix can be designed to scanning (scan) various different spacing (pitch) line image.In another embodiment, utilize black protective film (or laser absorption layer for example, it is removed after need being coated with (coating) again), after the laser diode processing and manufacturing, tear off and get final product (that is, can take full advantage of the useless characteristic of original diaphragm).
In another embodiment, arrange the characteristic of producing by the light Xiao Yi that uses diode laser matrix (shown in Fig. 3 A, 3B), can make fast the film material of micro drawing, above-mentioned characteristic just seems extremely important at the film material of large scale micro drawing manufacturing.Its cardinal principle is to allow infrared light that laser diode sends directly see through convex lens, focuses on wish and makes black protective film (or laser absorption layer) on the film material of little figure.It should be noted that this black protective film have high temperature resistant, be difficult for printing opacity and be difficult for the material behavior of light reflection.Therefore; can be absorbed by black protective film easily by light source that laser diode sends and convert thermal source to; because black protective film is flattened on wish and makes on the film material surface of micro drawing; to avoid scraping for the diaphragm material injuring infringement; therefore absorb infrared light and produce temperature (for example above 65 ℃ time) when black protective film; then the wish that fits of this and black protective film (absorbed layer) is made the film material of micro drawing, and the film material that makes wish make micro drawing because of the impact of black protective film (or laser absorption layer) thermal source conduction is heated and produces line image (for example micro-bit phase difference changes (retardation)).Therefore, black protective film one can be worked as the diaphragm of wanting micro drawing film material and be used, and two can work as absorbed layer is transformed into thermal source with the light absorption of laser diode and makes micro drawing film material.Produce the micro drawing film material that pattern or phasic difference change when laser diode processing black protective film after, as long as tear black protective film off.In another embodiment, if use the mode of laser absorption layer, then can first laser absorption layer be coated on the film material (retarder) of wanting micro drawing, after Laser Processing, remove again laser absorption layer.Thus, then micro drawing film material can be made fast and obtain.
Moreover; in another embodiment; its basic conception is for being erected at a laser diode (or diode laser matrix) in the wish micro drawing film material path of the test arm (testing robot of laser diode) for this laser diode; utilizing the precision bearing motor will want micro drawing film material drives; and utilizing power that laser diode provides to produce infrared light, direct irradiation is at the black protective film (or laser absorption layer) of wanting on the micro drawing film material.Because that the black protective film (or laser absorption layer) that uses has is high temperature resistant, reflection source and be difficult for the characteristic that allows light penetrate not, therefore the light of Laser emission can be changed into heat at the utmost point in the short time, and then utilize this thermal source to form micro drawing on the film material.
Therefore; utilize the arrangement mode (for example diode laser matrix being designed to scan various spacing line image) of various diode laser matrix; get final product single treatment multiple bar chart sample (pattern); cooperate the black protective film (for example laser absorption layer) of research and development that light is transformed into thermal source; allow the thermal source of black protective film (laser absorption layer); affect the film material of lower one deck and produce structure or phasic difference variation; that is produce hot with the light indirect (being received by black protective film or laser absorption layer) that the little diode laser matrix of volume is launched; utilize this thermal source to make fast micro drawing film material; after the irradiation black protective film (or laser absorption layer) that laser diode is launched is complete, can tear black protective film and (or utilize the mode of laser absorption layer; then need be coated on first on the film of wish processing; after Laser Processing, remove again laser absorption layer); then can obtain micro drawing on the film material, have the low manufacturing advantage of quick manufacturing and production cost.
In another embodiment, utilize diode laser matrix (for example Fig. 3 A, 3B are shown in the equipment of making micro drawing), (for example the peak power output of laser diode can be 3W by diode laser matrix (the laser diode array) characteristic that volume is little and cost is low, wavelength can be 808nm), cooperate laser diode controller (reference current control can be 0 to ± 4A) be used in the Application in manufacture of micro-bit phase difference film, can solve traditional C O
2The laser volume is large, cost is high, be applied to make the slow-footed problem of micro-bit phase difference film.Moreover the spacing between the adjacent laser diode (pitch) is the capable of regulating mode, is used for making the line image of various different spacing (pitch).In addition, this diode laser matrix (laser diode array) is rotatable and oblique arrangement also, reach scanning (scan) mode (shown in Fig. 4 A, 4B) of different spacing (pitch), using at the film material of large scale micro drawing processing is to have very much one of technology of potentiality.
Though the present invention discloses as above with various embodiment; so it is not to limit scope of the present invention; have in the technical field under any and usually know the knowledgeable; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking the scope that claims define.
Claims (25)
1. the equipment of a diode laser matrix manufacturing micro drawing is characterized in that, comprising:
One diode laser matrix has a plurality of laser diodes;
Wherein light transmission one lens focus that sends of each laser diode is at one second material layer that is positioned on one first material layer; And
One adjusting device is to adjust the spacing between each laser diode in this diode laser matrix.
2. diode laser matrix according to claim 1 is made the equipment of micro drawing, it is characterized in that this second material layer is to invest on this first material layer with glue or electrostatic paster.
3. diode laser matrix according to claim 1 is made the equipment of micro drawing, it is characterized in that this second material layer is the laser absorption film.
4. diode laser matrix according to claim 1 is made the equipment of micro drawing, it is characterized in that this second material layer is the black laser absorbing film.
5. diode laser matrix according to claim 1 is made the equipment of micro drawing, it is characterized in that, this second material layer is one directly to be formed at and to contain the dyestuff colorant layer on this first material layer.
6. diode laser matrix according to claim 1 is made the equipment of micro drawing, it is characterized in that, this first material layer is the film material of a wish micro drawing.
7. diode laser matrix according to claim 1 is made the equipment of micro drawing, it is characterized in that this first material layer is a phasic difference film.
8. diode laser matrix according to claim 1 is made the equipment of micro drawing, it is characterized in that the optical wavelength that this each laser diode sends is positioned at near-infrared and visible-range.
9. the equipment of a diode laser matrix manufacturing micro drawing is characterized in that, comprising:
One diode laser matrix has a plurality of laser diodes, and wherein light transmission one lens focus that sends of each laser diode is at one second material layer that is positioned on one first material layer;
At least one axle drives, to drive the movement of the first material layer and the second material layer; And
One adjusting device is to adjust the spacing between each laser diode in this diode laser matrix.
10. diode laser matrix according to claim 9 is made the equipment of micro drawing, it is characterized in that this driving shaft is the translational speed speed mode of adjusting first and second material layer.
11. diode laser matrix according to claim 9 is made the equipment of micro drawing, it is characterized in that, also comprises an extra adjusting device, to adjust or to move the relative distance of each lens and each laser diode.
12. diode laser matrix according to claim 11 is made the equipment of micro drawing, it is characterized in that this extra adjusting device is the relative distance of controlling each lens and each laser diode by X, Y, Z three axial adjustment move modes.
13. diode laser matrix according to claim 9 is made the equipment of micro drawing, it is characterized in that, also comprises an extra adjusting device, to adjust or to move the relative distance of each lens and this first material layer.
14. diode laser matrix according to claim 9 is made the equipment of micro drawing, it is characterized in that, each lens and each laser diode are the coaxial concentricity arrangement that aligns.
15. diode laser matrix according to claim 9 is made the equipment of micro drawing, it is characterized in that the distance between the adjacent laser diode is by this adjusting device adjustment.
16. diode laser matrix according to claim 9 is made the equipment of micro drawing, it is characterized in that, whole diode laser matrix is by this adjusting device rotation or tilts.
17. diode laser matrix according to claim 9 is made the equipment of micro drawing, it is characterized in that, also comprises at least one LASER Light Source detection system, with this diode laser matrix synchronous production and sync check.
18. the manufacture method of a micro drawing is characterized in that, comprising:
One diode laser matrix manufacturing equipment is provided, and this diode laser matrix has a plurality of laser diodes and an adjusting device, the spacing in this this diode laser matrix of adjusting device capable of regulating between each laser diode;
Light transmission one lens focus that each laser diode is wherein sent is at one second material layer that is positioned on one first material layer, to form micro drawing on this first material layer.
19. the manufacture method of micro drawing according to claim 18 is characterized in that, this second material layer is to invest on this first material with glue or electrostatic paster.
20. the manufacture method of micro drawing according to claim 18 is characterized in that, this second material layer is the laser absorption film.
21. the manufacture method of micro drawing according to claim 18 is characterized in that, this second material layer is the black laser absorbing film.
22. the manufacture method of micro drawing according to claim 18 is characterized in that, this second material layer is one directly to be formed at and to contain the dyestuff colorant layer on this first material.
23. the manufacture method of micro drawing according to claim 18 is characterized in that, this first material layer is the film material of a wish micro drawing.
24. the manufacture method of micro drawing according to claim 18 is characterized in that, this first material layer forms a phasic difference film.
25. the manufacture method of micro drawing according to claim 18 is characterized in that, the optical wavelength that this each laser diode sends is positioned at near-infrared and visible-range.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17357809P | 2009-04-28 | 2009-04-28 | |
| US61/173,578 | 2009-04-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101875482A CN101875482A (en) | 2010-11-03 |
| CN101875482B true CN101875482B (en) | 2013-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200910170556 Expired - Fee Related CN101875482B (en) | 2009-04-28 | 2009-09-10 | Apparatuses for fabricating micro patterns using laser diode array and methods for fabricating micro patterns |
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| CN (1) | CN101875482B (en) |
| TW (1) | TWI404282B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN213457632U (en) | 2020-11-30 | 2021-06-15 | 中强光电股份有限公司 | Light source module and projection device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1412623A (en) * | 2001-12-26 | 2003-04-23 | 威盛电子股份有限公司 | Base plate exposure device and method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0524374A (en) * | 1991-07-19 | 1993-02-02 | Canon Inc | Original plate for printing |
| TW473654B (en) * | 1999-12-24 | 2002-01-21 | Ind Tech Res Inst | Micro-retarder |
| JP2004351440A (en) * | 2003-05-28 | 2004-12-16 | Miyachi Technos Corp | Laser beam machining apparatus |
-
2009
- 2009-08-31 TW TW98129223A patent/TWI404282B/en not_active IP Right Cessation
- 2009-09-10 CN CN 200910170556 patent/CN101875482B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1412623A (en) * | 2001-12-26 | 2003-04-23 | 威盛电子股份有限公司 | Base plate exposure device and method |
Non-Patent Citations (3)
| Title |
|---|
| JP特开2002-90922A 2002.03.27 |
| JP特开2004-351440A 2004.12.16 |
| JP特开平5-24374A 1993.02.02 |
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| Publication number | Publication date |
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| TWI404282B (en) | 2013-08-01 |
| TW201039518A (en) | 2010-11-01 |
| CN101875482A (en) | 2010-11-03 |
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