CN101874230A

CN101874230A - Driving module and electronic device provided with the same

Info

Publication number: CN101874230A
Application number: CN200880118792A
Authority: CN
Inventors: 久米章
Original assignee: Seiko Instruments Inc
Current assignee: Seiko Instruments Inc
Priority date: 2007-11-26
Filing date: 2008-11-25
Publication date: 2010-10-27
Also published as: EP2226696A4; EP2226696A1; US20110000207A1; KR20100092455A; WO2009069570A1; JP5107682B2; JP2009128708A

Abstract

An SMA wire (10) is supplied with power from a pair of electrodes (9a, 9b) through a pair of wire holding members (15A, 15B). Thus, in a driving module (1) for driving a lens frame (4), the pair of wire holding members (15A, 15B) and the pair of electrodes (9a, 9b) are configured to have the same heat capacity.

Description

Driver module and the electronic equipment that possesses this driver module

Technical field

The electronic equipment that the present invention relates to driver module and possess this driver module.For example, the present invention relates to drive optical system or movable member, the electronic equipment that carries out the focal position adjustment or be suitable for use as the driver module of actuator and possess this driver module.

Background technology

In the prior art, for example, such drive unit has been proposed: in having the miniaturized electronicss such as portable phone of camera function,, utilize the flexible of the shape memory alloy wire shown in the patent documentation 1 for example in order to drive the driven member of imaging lens unit etc.

In the drive unit shown in this patent documentation 1, be provided with as the 1st picture frame that lensed driven member is installed and become the 2nd picture frame of the supporter of this picture frame, other component parts such as these picture frames and spring members form incorporate driver module by utilizing screw, fixing means such as bonding to connect.In addition,, hanged up shape memory alloy wire (SMA wire rod), produced Joule heat by making electric current flow through this shape memory alloy wire at this incorporate driver module.Then, this heating is shunk shape memory alloy wire, the acting force of antagonistic spring parts and lens unit is sling and lens unit is moved along its axis direction.

In addition, the both ends of SMA wire rod are arranged on the difference position spaced of the upper end of the 2nd picture frame, and in the central position of length direction, the SMA wire rod is with respect to the 1st picture frame and tensioning ground frame ends lower end at the 1st picture frame at lower end side and card.And flexible printed board electrically is connected in the both ends of SMA wire rod, this flexible printed board along the side of the 2nd picture frame and below bending and disposing.

Patent documentation 1: TOHKEMY 2007-46561 communique

Summary of the invention

, in the drive unit shown in the above-mentioned patent documentation 1,, the flexible printed board bending is disposed, thereby exist the artificial problem of assembling cost in order to supply an electric current to the SMA wire rod.

In addition, because arrive the length of arrangement wire difference at the both ends of SMA wire rod, thereby the thermal capacity difference of wiring, generate heat at the SMA wire rod, the heat dissipation characteristics of heat that is passed to wiring is in the both ends of SMA wire rod difference, thereby produces asymmetric Temperature Distribution in the both sides that the card stop bit of SMA wire rod is put.Therefore, in a side's of SMA wire rod end side and the opposing party's end side, the amount of contraction difference of length direction exists the problem that can not carry out stable driving because driven member moves obliquely.In addition, also exist the card that produces the 1st picture frame the part of SMA wire rod and the SMA wire rod problem of the movement resolution variation of the phenomenon of friction and driven member is mutually only arranged.And the burden that also exists left and right sides either party's wire rod becomes the possibility of big and permanance variation.

The present invention will solve the problem that prior art has, and its purpose is, provides a kind of assembling is become easily and the electronic equipment that makes the stable driver module of drive actions and possess this driver module.

In order to solve above-mentioned problem, in the described invention of claim 1, constitute, possess: driven member, both ends any has the 1st fixed pin portion that is made of thermoplastic resin at least; Supporter becomes along certain orientation and moves the tubular that holds this driven member freely, two ends any has the 2nd fixed pin portion that is made of the thermoplastic resin that extends along described certain orientation at least; Plate spring component, be stacked in the end of the tube end of described supporter and described driven member and dispose with the state layer that inserts described the 2nd fixed pin portion of described the 1st fixed pin portion run through described driven member and described supporter from equidirectional respectively, give acting force along described certain orientation to described driven member; Shape memory alloy wire, tensioning ground frame be at the tube peripheral part of described supporter, and described driven member card is ended place, centre position at length direction, resists the acting force of described plate spring component and drive described driven member; Plate member connects and the electrical insulators of laminated configuration constitutes by in a side's of described supporter tube end side described the 2nd fixed pin portion being inserted; The a pair of wire rod holding member that thermal capacity equates mutually, control the end of described shape memory alloy wire, with the state configuration of fixed position sidepiece in described supporter and described plate member, and the portion of terminal that is used to accept the supply of electric current extends to the scope of the thickness of the sidepiece that surpasses described plate member; And power supply part, have and electrically be connected with the described portion of terminal of described each wire rod holding member respectively and pair of electrodes that thermal capacity equates mutually, on described plate member, described the 2nd fixed pin portion that insertion is run through this plate member inserts perforation and laminated configuration, wherein, by riveting the leading section of described the 1st fixed pin portion and described the 2nd fixed pin portion respectively, described plate spring component and described driven member are fixed on described the 1st fixed pin portion, described plate spring component and described supporter are fixed on described the 2nd fixed pin portion, and described power supply part is fixed by the leading section of described the 2nd fixed pin portion of riveted joint.

According to the present invention, driven member is contained in the supporter, rivet the leading section of each the 1st fixed pin portion, the 2nd fixed pin portion and fixing plate spring component.And the power supply part laminated configuration is on plate member, and the plate member laminated configuration is fixed on power supply part on the plate member by the leading section of riveting the 2nd fixed pin portion at supporter.The state configuration that shape memory alloy wire is controlled by the wire rod holding member respectively with both ends is at the sidepiece of supporter, and the portion of terminal of each wire rod holding member electrically is connected with the electrode of power supply part respectively, can accept the supply of electric current.

And, by electric current being supplied to the electrode of power supply part respectively, utilize Joule heat that shape memory alloy wire is heated, marmem is shunk, thereby can drive driven member in a certain direction.

At this moment, because the thermal capacity of each wire rod holding member, each electrode equates respectively mutually, thereby become identical characteristic at the heat dissipation characteristics that passes through wire rod holding member and electrode of the both end sides of shape memory alloy wire.As a result, because the Temperature Distribution of shape memory alloy wire becomes the distribution of symmetry in the longitudinal direction, thereby the amount of contraction of marmem becomes identical in the both sides that the card stop bit of driven member is put.

The described invention of claim 2 is in driver module according to claim 1, constitutes, and described power supply part is made of the electrode of pair of metal plate, and the electrode of this pair of metal plate is made of identical materials and has an identical volume.

According to the present invention, because power supply part is made of the electrode of pair of metal plate, the electrode of this pair of metal plate is made of identical materials and has an identical volume, thereby can easily form the electrode that thermal capacity equates according to the allocation position of the shape of supporter or electrode.

In addition, owing to can easily change the shape of electrode, thereby can easily change the resistance of power supply part or the terminal position of electrode etc.

In the described invention of claim 3, in electronic equipment, constitute, possess driver module according to claim 1 and 2.

According to the present invention, owing to possess driver module according to claim 1 and 2, thereby possess and claim 1 or the identical effect of 2 described inventions.

Description of drawings

Fig. 1 is used to illustrate the pattern stereographic map of the driver module of the 1st embodiment of the present invention to the state of substrate installation.

Fig. 2 is the exploded perspective view that the summary of the driver module of demonstration the 1st embodiment of the present invention constitutes.

Fig. 3 is the pattern stereographic map that shows that the inside of assembled state of the driver module of the 1st embodiment of the present invention constitutes.

Fig. 4 is the sectional view along the A-A line of Fig. 3.

Fig. 5 is the sectional view along the B-B line of Fig. 3 when the sectional view of the B-B line of Fig. 3 and driven member move.

Fig. 6 is the stereographic map and the C planar view thereof of the driven member that uses in the driver module of the 1st embodiment of the present invention.

Fig. 7 is that the stereographic map and the D thereof of the supporter that uses in the driver module of the 1st embodiment of the present invention looks back view.

Fig. 8 is the planimetric map of the plate spring component used in the driver module of the 1st embodiment of the present invention.

Fig. 9 is the planimetric map and the front view (FV) of the plate member used in the driver module of the 1st embodiment of the present invention.

Figure 10 is that the E of Fig. 9 (b) looks back view.

Figure 11 is the planimetric map of the power supply part that uses in the driver module of the 1st embodiment of the present invention.

Figure 12 is the back view of the cover that uses in the driver module of the 1st embodiment of the present invention.

Figure 13 is the surface of the electronic equipment of the 2nd embodiment of the present invention, the stereo appearance figure and the F-F sectional view thereof at the back side.

Embodiment

Below, with reference to accompanying drawing, embodiments of the present invention are described.In institute's drawings attached, even the different situation of embodiment, also identical symbol to identical or suitable parts mark, and omit common explanation.

[the 1st embodiment]

Driver module to the 1st embodiment of the present invention describes.

Fig. 1 is used to illustrate the pattern stereographic map of the driver module of the 1st embodiment of the present invention to the state of substrate installation.Fig. 2 is the exploded perspective view that the summary of the driver module of demonstration the 1st embodiment of the present invention constitutes.Fig. 3 is the pattern stereographic map that shows that the inside of assembled state of the driver module of the 1st embodiment of the present invention constitutes.Fig. 4 is the sectional view along the A-A line of Fig. 3.Fig. 5 (a) is the sectional view along the B-B line of Fig. 3.Fig. 5 (b) is the sectional view along the B-B line of Fig. 3 of driven member when moving.Fig. 6 (a) is the stereographic map of the driven member that uses in the driver module of the 1st embodiment of the present invention.Fig. 6 (b) is the C planar view of Fig. 6 (a).Fig. 7 (a) is the stereographic map of the supporter that uses in the driver module of the 1st embodiment of the present invention.Fig. 7 (b) is that the D of Fig. 7 (a) looks back view.Fig. 8 is the planimetric map of the plate spring component used in the driver module of the 1st embodiment of the present invention.Fig. 9 (a) and (b) are planimetric map and front view (FV)s of the plate member used in the driver module of the 1st embodiment of the present invention.Figure 10 is that the E of Fig. 9 (b) looks back view.Figure 11 is the planimetric map of the power supply part that uses in the driver module of the 1st embodiment of the present invention.Figure 12 is the back view of the cover that uses in the driver module of the 1st embodiment of the present invention.

In addition, in a part of accompanying drawing,, for example suitably omit lens unit 12 component parts such as grade and illustrate in order to be easy to observe.

As shown in Figure 1, the driver module of present embodiment forms box-shaped as a whole.This driver module 1 assembling and finishing is located in the electronic equipment etc., can embed or be bonded on the substrate 2 and fix, and this substrate 2 is supplied to driver module 1 with control signal or electric power.

On substrate 2, be provided with a pair of weld part 3 and imaging apparatus 30, this a pair of weld part 3 is connected and supply capability with the power supply part of driver module 1 described later.

As shown in Figure 2, driver module 1 is with lens frame 4, the module frame 5 that becomes supporter that becomes driven member, the last leaf spring 6 that becomes plate spring component and following leaf spring 7, module lower plate 8, power supply part 9, marmem (Shape Memory Alloy, being designated hereinafter simply as SMA) wire rod 10, cover be 11 as main component parts, constitutes 1 actuator by stacked these component parts integratedly.

Shown in Fig. 3,4, under the assembled state of these parts, the inboard of lens frame 4 insert module frames 5, last leaf spring 6, following leaf spring 7 are fixed by riveted joint with the state from these lens frame 4 of illustrated above-below direction clamping and module frame 5, module lower plate 8, power supply part 9 carry out stacked from these illustrated lower side according to this order, be separately fixed at together by riveted joint from the below of lens frame 5, the cover 11 that covers these duplexers from upper side is fixed on module lower plate 8.

In addition, the symbol M among the figure is the hypothetical axis of the driver module 1 consistent with the optical axis of lens unit 12, the driving direction of expression lens frame 4.Below, for simple declaration, in the explanation of each component parts that decomposes, reference position or direction during sometimes also based on assembling with the position relation of axis M.For example, even in component parts, do not exist under the situation of clear and definite circle, barrel surface, as long as can not misread, sometimes also will abbreviate direction of principal axis as along the direction of axis M, will be that footpath direction, the Zhou Fangxiang of the circle at center abbreviates footpath direction, Zhou Fangxiang as with axis M.

In addition, only otherwise statement especially in advance, above-below direction is meant that axis M is configured on the vertical and the installed surface of driver module 1 becomes above-below direction in the configuration of situation of vertical below.

In these component parts, shown in Fig. 2, Fig. 6 (a), the lens frame 4 that becomes driven member forms tubular as a whole, is formed with internal thread at the inner peripheral surface 4F of the accommodation section 4A of the tubular that runs through its central authorities and form coaxially with axis M.And, lens unit 12 (with reference to Fig. 4,5) can be threadedly engaged with and be fixed on accommodation section 4A, this lens unit 12 remains on lens barrel with suitable lens or lens combination, and this lens barrel is formed with external thread at peripheral part.

Outside wall surface 4B in lens frame 4, teat 4C axially extends and is provided with, this teat 4C separates the interval of 90 degree along Zhou Fangxiang, outstanding towards the footpath direction outside, upper end and bottom at these each teat 4C, on by the end face 4a, the 4b that constitute with axis M plane orthogonal, be respectively equipped with 4 upside fixed pin 13A (the 1st fixed pin portion) and 4 downside fixed pin 13B (the 1st fixed pin portion), this upside fixed pin 13A and downside fixed pin 13B are outstanding towards the above and below along axis M respectively.

Upside fixed pin 13A is used to keep leaf spring 6, and downside fixed pin 13B is used to keep leaf spring 7 down.

Position during the overlooking of upside fixed pin 13A and downside fixed pin 13B also can be distinguished different, but in the present embodiment, is configured in the coaxial position parallel with axis M.Therefore, the insertion of upside fixed pin 13A, the downside fixed pin 13B of last leaf spring 6, following leaf spring 7 connects position commonization respectively.

In addition, each center of upside fixed pin 13A and the footpath direction of downside fixed pin 13B also can be different, but in the present embodiment, are configured on the same circumference.Therefore, each center is configured to the square lattice shape.

In the footpath of the lens frame 4 direction outside, direction protrusion 4D is provided with in the mode that the lower end side from 1 teat 4C projects to the direction outside, footpath.The projected direction of direction protrusion 4D and each upside fixed pin 13A and each downside fixed pin 13B's is that the angle position of the Zhou Fangxiang at center is set at from the position relation of the integral multiple deviation angle θ (still, θ is an acute angle) of 90 degree with axis M.That is, with when foursquare cornerwise mode disposes, each upside fixed pin 13A and each downside fixed pin 13B are configured in from the position of all foursquare diagonal line skew certain angle θ at direction protrusion 4D.

As shown in Figure 3, this direction protrusion 4D is used for SMA wire rod 10 card is ended at its front end key 4D1 of portion, by the contraction of this SMA wire rod 10 direction protrusion 4D is mentioned and moves it to the top (arrow (a) direction).

In addition, shown in Fig. 2, Fig. 6 (a) and (b),, be provided with the retainer 4E of the tab shape that extends from the sidepiece of each teat 4C along Zhou Fangxiang along the bottom of the outside wall surface 4B of lens frame 4.

Each retainer 4E has level and smooth stop surface 4E1 in the above, the axial set positions of stop surface 4E1 for when lens frame 4 along axis M upward (arrow (a) direction) move a certain distance when above, with the position of stop receiving portion 5E (with reference to Fig. 5 (the b)) butt of module frame 5 described later.

In addition, in the present embodiment, lens frame 4 is integrally formed by the thermoplastic resin that can carry out the riveted joint of hot riveting or ultrasound wave such as polycarbonate (PC), liquid crystal polymer (LCP) resin etc.

Shown in Fig. 2, Fig. 7 (a) and (b), module frame 5 is parts of tubular, and the profile when overlooking forms the essentially rectangular shape as a whole, and, portion is formed with the accommodation section 5A that is made of the through hole that forms coaxially with axis M in the central, and lens frame 4 is contained in the 5A of this accommodation section.

At the upper and lower of module frame 5 four jiaos, be formed with

end face

5a, 5b,

end face

5a, 5b are by constituting with axis M plane orthogonal, be provided with 4 upside fixed pin 14A (the 2nd fixed pin portion) towards the top from end face 5a, in addition, be provided with 4 downside fixed pin 14B (the 2nd fixed pin portion) towards the below from end face 5b.

Upside fixed pin 14A is used to keep leaf spring 6, and downside fixed pin 14B is used to keep leaf spring 7, module lower plate 8, power supply part 9 down.

Distance setting between end face 5a, the 5b is the identical distance of distance between end face 4a, the 4b with lens frame 4.

One jiao bottom in module frame 5 is formed with otch 5B, and the groove width during the overlooking of otch 5B has the size of the axially chimeric movably direction protrusion 4D to lens frame 4.This otch 5B be used for lens frame 4 from below in the insert module frame 5 and under the state that holds, the direction protrusion 4D of lens frame 4 is connected, make the front end key 4D1 of portion of direction protrusion 4D project to the direction outside, footpath of module frame 5, and, carry out the location of the Zhou Fangxiang of lens frame 4.

In the present embodiment, because otch 5B is located at such position, thereby as Fig. 7 (b) shown in, near the downside fixed pin 14B the otch 5B avoids otch 5B and is formed on the position of leaving from the line of the intersection point of the corner portion of connection axis M and profile.That is, this downside fixed pin 14B is provided with respect to otch 5B adjacency along Zhou Fangxiang.

In contrast, other 3 downside fixed pin 14B are located at respectively on the line that the intersection point with the axis M and the profile of corner portion is connected, and are along the L word shape of the profile of module frame 5 and dispose.So when overlooking, 4 downside fixed pin 14B are configured in asymmetric position.

On the other hand, the position during the overlooking of upside fixed pin 14A also can be different with the configuration of downside fixed pin 14B, but in the present embodiment, are configured in the coaxial position parallel with axis M respectively.Therefore, upside fixed pin 14A, the downside fixed pin 14B on last leaf spring 6, the following leaf spring 7 inserts position commonization of difference that connects.

And, shown in Fig. 7 (b), when overlooking, if with the intersection point of the side of module frame 5 as Q1, Q2, Q3, Q4, so, the axle center of each upside fixed pin 14A, each downside fixed pin 14B lay respectively at a Q1, Q2, Q3, Q4 near, and, be configured on the line of line segment K1, K2 that a Q1, Q2, Q3, Q4 and axis M are connected, K3, K4 or near.That is, line segment k1, k2, k3, k4 that the axle center of each upside fixed pin 14A of river, each downside fixed pin 14B is connected with axis M overlap with line segment K1, K2, K3, K4, and perhaps the low-angle with the following degree of 30 degree intersects.

In addition, shown in Fig. 7 (a), with 2 corner portions of the otch 5B adjacency of module frame 5, side in the direction side identical with the corner portion that is provided with otch 5B, be provided with a pair of fastening groove 5C, this a pair of fastening groove 5C is used to install wire

rod holding member

15A, 15B (with reference to Fig. 2,3), and this wire

rod holding member

15A, 15B keep SMA wire rod 10.In the present embodiment, the 9C of pair of terminal portion that wire rod holding member 15A is located at power supply part 9 is from the side of the outstanding side of driver module 1, and the 9C of pair of terminal portion that wire rod holding member 15B is located at power supply part 9 is not from the side of the outstanding side of driver module 1.

Wire

rod holding member

15A, 15B are that the end with SMA wire rod 10 is riveted on the electroconductive components such as sheet metal that form the key shape that the end forms, by being entrenched in fastening groove 5C from the side, thus location and the end that keeps SMA wire rod 10.

In addition, wire

rod holding member

15A, 15B use stamping-out to become the sheet metal of identical shaped, same material, same thickness, and for example, the sheet metal that is formed by copper, aluminium, stainless steel etc. is as the different shape of overbending direction of only riveting.Therefore, mutual thermal capacity becomes equal.As shown in Figure 3, wire

rod holding member

15A, 15B possess the portion of terminal 15a of sheet in the side with the riveted joint position opposite of SMA wire rod 10, under the state of installing with respect to module frame 5, portion of terminal 15a projects to the below of the module lower plate 8 of the below that is laminated in module frame 5 a little.

In addition, the SMA wire rod 10 that two ends are kept by a pair of wire

rod holding member

15A, 15B ends the front end key 4D1 of portion of the direction protrusion 4D of the lens frame 4 of giving prominence at the otch 5B from module frame from the below card, by the tension force of SMA wire rod, via the front end key 4D1 of portion to lens frame 4 application of force upward.

In the 5A of the accommodation section of module frame 5, shown in Fig. 7 (a) and (b), stop receiving portion 5E is arranged to the shape that each retainer 4E of lens frame 4 can be inserted from the below, and stop receiving portion 5E is the outside and axially be formed up to the recess of the pars intermedia of upper end side from lower end side from internal face 5D towards the footpath direction.

Stop receiving portion 5E has the face of the accepting 5E1 of stop surface 4E1 that can butt retainer 4E in axial lower side.Thus, shown in Fig. 5 (b), if lens frame 4 is along its axis M (arrow (a) direction) mobile predetermined distance upward, then the face of the accepting 5E1 of each stop receiving portion 5E respectively with the stop surface 4E1 butt of each retainer 4E, thereby lens frame 4 mobile being limited upward.That is, stop receiving portion 5E is construed as limiting the position limit portion of the moving range of lens frame 4, retainer 4E constitute with can be provided with the mode of the position limit portion butt of module frame 5 by position limit portion.

In addition, in the present embodiment, shown in Fig. 7 (b), the formation position during the overlooking of stop receiving portion 5E be located at from the center (axis M) of accommodation section 5A towards the position that line segment K1, K2, K3, the K4 of the corner portion of the rectangular-shaped profile of module frame 5 intersects.

By such formation, apply big impact from the outside even driver module is fallen etc., lens frame 4 can not surpass stop receiving portion 5E the face of accepting 5E1 the position and move to the diagram top.

In the present embodiment, such restriction site is set for, lens frame 4 with cover 11 collisions, and last leaf spring 6, down the distortion of leaf spring 7 for example becomes elastic region etc. and is out of shape below the boundary.

In addition, since stop receiving portion 5E be located at from the center of accommodation section 5A towards the position that line segment K1, K2, K3, the K4 of the corner portion of the rectangular-shaped profile of module frame 5 intersects, thereby in lens frame 5, in the corner portion of the rectangular-shaped profile that projects to the direction outside, footpath from accommodation section 5A, can effectively utilize the zone of footpath direction.

Therefore,, the profile of module frame 5 is increased, thereby miniaturization, lightness become possibility even stop receiving portion 5E is located at the inboard of module frame 5.

In addition, in the present embodiment, module frame 5 is similarly integrally formed by the thermoplastic resin that can carry out the riveted joint of hot riveting or ultrasound wave such as polycarbonate (PC), liquid crystal polymer (LCP) resin etc. with lens frame 4.

As shown in Figure 4, in module frame 5 and the upper and lower separately that is inserted into the lens frame 4 in the module frame 5, be laminated with leaf spring 6 and following leaf spring 7 respectively.

In the present embodiment, as shown in Figure 8, last leaf spring 6 is to be punched into identical shaped flat plate spring component with following leaf spring 7, is made of rubber-like sheet metals such as for example stainless (SUS) steel plates.

As shown in Figure 8, shape about last leaf spring 6 (following leaf spring 7), profile when overlooking for the identical essentially rectangular shape in end of the upside (downside) of module frame 5, be formed with the opening 6C (7C) of the round shape coaxial and bigger a little than the inner peripheral surface 4F of lens frame 4 with axis M at central portion, opening 6C (7C) is a ring-type as a whole.

Near 3 corner portions of last leaf spring 6 (following leaf spring 7) and 1 corner portion, corresponding with the allocation position of the upside fixed pin 14A (downside fixed pin 14B) of the corner portion that is formed at

module frame

5 and 1 corner portion near, be provided with and can insert 4 the through hole 6B (7B) that run through each upside fixed pin 14A (downside fixed pin 14B) respectively.In the present embodiment, insert among the through hole 6B (7B) that connects at the upside fixed pin 14A (downside fixed pin 14B) that will be formed at the some Q2 of Fig. 7 (b), the corresponding corner of Q4 portion, one side is the standard circular hole, the opposing party is an elliptical aperture, becomes possibility with respect to the location with in the axis M plane orthogonal of module frame 5.

In addition, at last leaf spring 6 (following leaf spring 7), corresponding with the allocation position of the upside fixed pin 13A that is formed at lens frame 4 (downside fixed pin 13B), be provided with and can insert 4 the through hole 6A (7A) that run through each upside fixed pin 13A (downside fixed pin 13B) respectively.

That is, in the present embodiment, each through hole 6A (7A) be formed on respect to the corresponding straight line L1 of the line segment K1 of Fig. 7 (b) from the position of integral multiple deviation angle θ of 90 degree.In the present embodiment, by angle θ being set at appropriate value as such configuration, thereby allocation position separately can be set at, with being configured to angle θ is that 0 ° situation is compared, through hole 6A (7A) be positioned at axis M be the center circle the circle footpath and what dispose through hole 6B (7B) is that the difference of diameter in circle footpath of the circle at center diminishes with axis M.

In addition, in the footpath of opening 6C (7C) the direction outside, be formed with ring portion 6F (7F), 4 slit portion 6D (7D), form along the overlapping roughly quadrant of footpath direction arc along near the position of the mutually relative through hole 6A (7A) in angular direction is extended with semicircle arcuation roughly along Zhou Fangxiang from clipping axis M.

Thus, formed 4 6E of spring portion (7E) and extended near the through hole 6A (7A) plate spring component respectively singly, these 4 6E of spring portion (7E) from the rectangular-shaped framework in the outside of last leaf spring 6 (following leaf spring 7) with roughly 1/4th circular-arc extension.

As shown in Figure 2, run through the through hole 7B of following leaf spring 7 and each downside fixed pin 13B of the lens frame 4 that is contained in module frame 5 in is run through under the state of through hole 7A of time leaf spring 7 at each the downside fixed pin 14B that makes module frame 5, module lower plate 8 and module frame 5 between clip down leaf spring 7 and stacked from lower side, with respect to the end face 5b of module frame 5 and with the fixing rectangular-shaped profile frame of leaf spring 7 down of pressed state.

As Fig. 9 (a), shown in Figure 10, the shape of module lower plate 8 is the plate-shaped members that have with the roughly the same rectangular-shaped profile of the profile of module frame 5, at central portion, is that the opening 8A of the circular shape at center connects along thickness direction and forms with axis M.And, the time be laminated in 8a side above the leaf spring 7 down in assembling, with the corresponding position of allocation position of each downside fixed pin 13B of lens frame 4, be formed with the recess 8B that is used to avoid 4 U word shapes interfering with caulking part described later.

In addition, corresponding in each corner portion of the periphery that is positioned at module lower plate 8 with the allocation position of each downside fixed pin 14B of module frame 5, be formed with and make these downside fixed pins 14B insert the through hole 8C that connects respectively.

In addition, as Fig. 9 (b), shown in Figure 10,8b below module lower plate 8 is formed with the 8D of wall portion that projects to the below along opening 8A.In the present embodiment, above distance between 8a and the following 8b be h1, above the distance of end 8c of 8a and the 8D of wall portion be h2 (still, h1＜h2).The end face 8c of the 8D of wall portion constitutes the installed surface with substrate 2 butts.At this, distance h 2 is set at when below power supply part 9 is riveted on during 8b, more projects to the height of lower side than caulking part.

In addition, the 8D of wall portion have by appropriate setpoint distance h2 carry out with respect to substrate 2 axis M direction, be the function of positioned spacer of the location of optical axis direction.

In the present embodiment, the material of module lower plate 8 adopts the synthetic resin with electric insulating quality and light-proofness.

Therefore, shown in Fig. 5 (a), the 8D of wall portion has by cover the imaging apparatus 30 be located on the substrate 2 from the side carrying out the function of the shading piece of shading around the imaging apparatus 30.

In addition, module lower plate 8 is owing to have electric insulating quality, thereby becomes with respect to leaf spring 7 down and with the fixing insulating element of power supply part 9 of electric insulation state.In addition, also become the insulating element that keeps the electric insulation state with respect to the substrate 2 of end face 8c institute butt.

As shown in figure 11, in the present embodiment, power supply part 9 is made of pair of

electrodes

9a, 9b, and this pair of

electrodes

9a, 9b are made of tabular sheet metal respectively.

Electrode

9a, 9b constitute by the sheet metal of polyline shaped, and this sheet metal possesses along the 9B of wiring portion of the roughly L word shape of the profile of module lower plate 8 and projects to the portion of terminal 9C in the outside of the profile of module lower plate 8 from the end of wiring portion.And, at each 9B of wiring portion, be provided with 2 through hole 9A, through hole 9A make below module lower plate 8 8b project to the downside fixed pin 14B of module frame 5 of below, along the profile of module lower plate 8 and 2 adjacent downside fixed pin 14B insert perforation respectively, and

electrode

9a, 9b are positioned with respect to module frame 5.

In the present embodiment, as shown in Figure 3, the portion of terminal 9C of

electrode

9a, 9b is provided with in the mode that the side of the side that wire rod holding member 15A is installed from module frame 5 projects to the direction outside, footpath side by side.

Therefore, for the portion of terminal 15a with wire rod holding member 15A electrically is connected to electrode 9a, the side on the 9B of wiring portion between through hole 9A and the portion of terminal 9C is provided with the conductive connection part 9D that is cut into concavity.

In addition, for the portion of terminal 15a with wire rod holding member 15B electrically is connected to electrode 9b, the side on the 9B of wiring portion between 2 through hole 9A is provided with the conductive connection part 9D that is cut into concavity.

In addition, owing to

electrode

9a, 9b use the metal material that for example copper, aluminium, stainless steel etc. are identical and form identical volume, thereby mutual thermal capacity equates.In addition, the shape of

electrode

9a, 9b is an example, can be according to the size of the thermal capacity of necessity or resistance and form suitable size, shape in the scope of 8b below module lower plate 8.

As the means that each conductive connection part 9D and portion of terminal 15a electrically are connected, can adopt the bonding of scolding tin for example or conductive adhesive.

Like this, in the present embodiment, the thermal capacity of electrode 9a, the 9b of power supply part 9 is identical, even form different shape, also can easily be installed in module lower plate 8, thereby for example the projected direction of portion of terminal 9C or extrusion position also can be according to the configurations of the shape of the substrate 2 of mounting object or weld part 3 and change easily.In addition, material by changing

electrode

9a, 9b or shape etc., also can easily change resistance, even thereby under the different situation of the resistance specification of the controller of the Current Control of for example carrying out SMA wire rod 10, also can deal with by only changing electrode 9a, 9b.Therefore, can improve common assimilability with the part of the corresponding driver module of various requirement specification significantly.

Shown in Fig. 2,4,12, cover 11 be can be outer the side wall portion 11D of embedding ground overlay module frame 5 extend to lower side from the outer edge of top 11E and be formed with the parts of rectangular-shaped opening 11C in lower side, to be provided with axis M be the opening 11A of the round shape at center to the central portion of 11E in the above.The size of opening 11A becomes the size that lens unit 12 can be come in and gone out.

In addition, as shown in figure 12, the rear side of 11E in the above, along the Zhou Fangxiang of opening 11A and with the corresponding position of allocation position of each upside fixed pin 13A of lens frame 4, be formed with the recess 11B that is used to avoid 4 U word shapes interfering with caulking part 16 described later.

Even the degree of depth of recess 11B is set in stop surface 4E1 and the position of accepting face 5E1 butt, the caulking part 16 and the cover 11 also discontiguous degree of depth.Recess 11B also can be the recess that extend out to the top, but in the present embodiment, the wall thickness of recess 11B is a thin-walled, forms recess 11B in the scope of the thickness of slab of cover 11, thus above the outside surface of 11E be the plane.

Assemble method to the driver module 1 of such formation describes in order.

In the 1st operation, at first, in the accommodation section 5A of below insert module frame 5, making the end face 4a of each the end face 5a of module frame 5 and lens frame 4 consistent is equal height with lens frame 4.Then, each through hole 6A, the 6B with last leaf spring 6 inserts perforation respectively at each upside fixed pin 14A of module frame 5 and each upside fixed pin 13A of lens frame 4.

Subsequently, each through

hole

6A, 6B that connects leaf spring 6 and the leading section that projects to each upside fixed

14A, 13A of top are carried out hot riveting, form caulking part 16,17 (with reference to Fig. 3,4) respectively by the heater chip that does not show among the figure.

At this moment, the end face 4a of lens frame 4 and the end face 5a of module frame 5 arrange at grade, do not make the flat leaf spring 6 shifting grounds configuration of going up, and can carry out hot riveting.Therefore, owing to there is no need to pin the last leaf spring 6 of distortion, thereby can easily carry out hot riveting.The generation of rocking etc. that in addition, can prevent that distortion owing to last leaf spring 6 from causing.

In addition because the height that can make each heater chip is for common, even thereby form

caulking part

16,17 simultaneously, also can reduce the deviation of riveted joint precision.

Then, in the 2nd operation, each through hole 7A of following leaf spring 7 is inserted perforation each downside fixed pin 13B in lens frame 4 respectively, at this moment, with each through hole 7B, each through hole 8C of module lower plate 8, each through hole 9A of power supply part 9 of leaf spring 7 insert perforation each downside fixed pin 14B of portion in module frame 5 simultaneously down.Subsequently, each through hole 7A that connects down leaf spring 7 and the leading section that projects to each downside fixed pin 13B of below are carried out hot riveting, form caulking part 18 (with reference to Fig. 4) by heater chip.

At this moment, because the direction of principal axis distance between the direction of principal axis distance between end face 4a, the 4b of lens frame 4 and end face 5a, the 5b of module frame 5 equates, thereby end face 4b, 5b arrange at grade, do not make flat 7 distortion of leaf spring down and laminated configuration module lower plate 8, hot riveting can be carried out, thereby generation can be prevented owing to rocking of causing of the following distortion of leaf spring 7 etc.

In addition because the height that can make each heater chip is for common, even thereby form caulking part 18 simultaneously, also can reduce the deviation of riveted joint precision.

Then, in the 3rd operation, hot riveting is carried out in the bottom of each downside fixed pin 14B that connects these through

holes

7B, 8C, 9A and project to the below, form caulking part 19 (with reference to Fig. 4) by heater chip.

At this moment because the height that can make each heater chip is for common, even thereby form caulking part 19 simultaneously, also can reduce the deviation of riveted joint precision.

In addition, owing to be formed with recess 8B in module lower plate 8, thereby the caulking part 18 that forms in the 2nd operation does not contact with module lower plate 8.

By carrying out the operation of these the 1st～the 3rd operations, with last leaf spring 6, following leaf spring 7, module lower plate 8, the power supply part 9 stacked both ends that are fixed on lens frame 4 and module frame 5.

In the present embodiment, because upside fixed pin 13A and downside fixed pin 13B and upside fixed pin 14A and downside fixed pin 14B are provided with respectively coaxially, thereby in the riveted joint of the 1st～the 3rd operation, the position that is used for forming respectively on the plane of heater chip of

caulking part

16,18 and

caulking part

17,19 is common respectively.Therefore, in each riveted joint, owing to there is no need to change the heater chip position, thereby can efficient rivet operation well.

Like this, compare,, solidify required time weak point, thereby can reduce built-up time by plate spring component is carried out hot riveting with the situation of fixing by bonding grade.In addition, needn't worry that the generation etc. owing to gas pollutes part.In addition, can carry out stable fixing for a long time.

In addition, the situation of the screw different with using coefficient of thermal expansion etc. is compared, and is difficult to that generation is become flexible etc.As a result, can improve the reliability of fixed part.

In addition, owing to do not use retaining element such as screw, thereby become the simple formation of having cut down the part number, more lightness, miniaturization.Especially because as lens frame 4 lightness of driven member, thereby at a high speed, the driving of low power consumption becomes possibility.

Then, in the 4th operation, make a pair of wire rod holding member 15A, the 15B that SMA wire rod 10 are installed at front end only block fastening groove 5C respectively, for example, keep, be fixed on module frame 5 by means such as chimeric or bonding at 2 places of module frame 5.At this moment, the front end key 4D1 of portion that the central portion card of SMA wire rod 10 is ended at direction protrusion 4D, and, set up in the mode that supports this front end key 4D1 of portion from downside.

At this moment, each portion of terminal 15a of wire

rod holding member

15A, 15B projects to the below of module lower plate 8, and card ends and to dispose as the conductive connection part 9D of electrode 9a, the 9b of the power supply part 9 that is fixed in module lower plate 8 or near conductive connection part 9D respectively.

So, use for example scolding tin or conductive adhesive etc., each portion of terminal 15a is electrically connected with respect to conductive connection part 9D respectively.

Promptly, in the present embodiment, dispose power supply part 9 to insert the mode that connects at downside fixed pin 14B, then with its riveted joint and be fixed on the leading section of downside fixed pin 14B, from the side of module frame 5 wire

rod holding member

15A, 15B are embedded fastening groove 5C, thereby the wiring till the end of near SMA wire rod 10 electrically connects, and can connect up by so simple operation.With with respect to module frame 5 and three-dimensionallyly different around the situation of joining for example lead or flexible base, board etc., such assembling operation can be assembled by the action of a direction, thereby can extremely easily assemble.Therefore, assemble automatically and also become easy.

Then, in the 5th operation, cover cover 11 from the top of module frame 5, side wall portion 11D and module lower plate 8 are engaged.For example, be arranged on side wall portion 11D and engage, perhaps bonding or welding and engaging side wall portion 11D and module lower plate 8 by embedding by engaging pawl etc.

At this moment,

caulking part

16,17 is in respectively the state that separates with respect to the back side of the top 11E of cover 11.

More than, finish the assembling of driver module 1 body.

Then, in the 6th operation, make the portion of terminal 9C of driver module 1 and weld part 3 (with reference to Fig. 1) contraposition on the substrate 2, driver module 1 is installed on the substrate 2.Then, by means such as scolding tin or electric conductivity adhesivess, portion of terminal 9C is electrically connected with respect to weld part 3.At this moment, because caulking part 19 becomes the lower height of height than the 8D of wall portion of module lower plate 8, thereby separate with substrate 2.

Fixing means such as that the installation of driver module 1 on substrate 2 can be adopted is bonding, embedding.

Substrate 2 also can be the independently parts that are attached to driver module 1, also can be the parts that are connected to electronic equipment etc., are configured in electronic equipment etc.

Then, in the 7th operation, lens unit 12 is threaded in the lens frame 4 installs by covering 11 opening 11A.

Like this, lens unit 12 is installed at last, be because do not pollute the lens of lens unit 12 because of assembling operation, perhaps adhere to rubbish etc., but under the situation of the driver module 1 that for example dispatches from the factory with the goods state that lens unit 12 is installed, perhaps cover 11 opening 11A than the littler situation of the profile of lens unit 12 under, for example in the situation of double as aperture diaphragm etc. down, also can in the 5th operation or the 6th operation, implement the 7th operation.

Then, the action to driver module 1 describes.

Driver module 1 is under the state that does not supply power to portion of terminal 9C, from the tension force of SMA wire rod 10 and

caulking part

16,18 places from leaf spring 6 and following leaf spring 7 dynamic balance that acts on lens frame 4 of the acting force etc. of the application of force flexibly, shown in Fig. 5 (a), the lens frame 4 that lens unit 12 is installed is remained on axial certain position.

If electric power is supplied to power supply part 9 from portion of terminal 9C, then for example electrode 9a, wire rod holding member 15A, SMA wire rod 10, wire rod maintaining part 15b, electrode 9b conducting respectively, thereby electric current flows through SMA wire rod 10.Thus, produce Joule heat in SMA wire rod 10, the temperature of SMA wire rod 10 rises, if surpass the starting temperature of transformation of SMA wire rod 10, then the SMA wire rod is contracted to and the corresponding length of temperature.

As a result, the direction protrusion 4D of lens frame 4 moves to top ((a) direction among the figure).Thus, last leaf spring 6, down leaf spring 7 is out of shape respectively, with the corresponding elastic recovering force application of force of deflection to lens frame 4.Then, in the position of the equalization of strain of this elastic recovering force and SMA wire rod 10, lens frame 4 stops.

At this moment, in the present embodiment because last leaf spring 6, down leaf spring 7 constitutes parallel springs, even thereby lens frame 4 not along axial guiding parts etc., also can correctly go up and move along axis M.Therefore, can cut down part number and miniaturization.In addition, do not load owing to do not produce yet, thereby can realize low power consumption with respect to the slip of guiding parts.

In addition, if stop the supply of electric power, then SMA wire rod 10 can extend, and lens frame 4 moves to the equilibrium position of below ((b) direction among the figure).

Like this, by control electric power quantity delivered, can drive lens frame 4 along axis M direction.

In addition, when some is unusual, for example, when when falling, being subjected to impulsive force or electric power control when becoming instability etc., under the situation that the amount of movement of SMA10 excess shrinkage and lens frame 4 becomes excessive, in the present embodiment, owing to possess retainer 4E, stop receiving portion 5E, thereby the position of lens frame 4 is restricted to certain boundary value.Therefore, owing to preventing that lens frame 4 and cover 11 from colliding or upward leaf spring 6, following leaf spring 7 are out of shape above the distortion boundary, thereby can improve reliability.

Driver module 1 according to present embodiment, because by the fixing power supply part 9 of riveted joint, thereby assembling is become easily and drive actions is stablized, wherein, power supply part 9 laminated configuration have pair of

electrodes

9a, 9b that thermal capacity equates mutually in module lower plate 8.

[the 2nd embodiment]

Then, the electronic equipment to the 2nd embodiment of the present invention describes.

Figure 13 (a) and (b) are the surface of the electronic equipment of the 2nd embodiment of the present invention, the stereo appearance figure at the back side.Figure 13 (c) is the F-F sectional view of Figure 13 (b).

The portable phone that has camera 20 of the present embodiment shown in Figure 13 (a) and (b) is an example of electronic equipment that possesses the driver module 1 of the 1st above-mentioned embodiment.

The portable phone 20 that has a camera possesses inside and outside cover 22 and is subjected to the 22a of words portion, send the device of the well-known portable phones such as control circuit portion that do not show among the 22b of words portion, operating portion 22c, liquid crystal display part 22d, antenna part 22e, the figure to constitute.

And, shown in Figure 13 (b), cover 22 in the rear side of a side that is provided with liquid crystal display part 22d, be provided with the window 22A that extraneous light is seen through, shown in Figure 13 (C), the opening 11A of driver module 1 is provided with the driver module 1 of above-mentioned the 1st embodiment in the face of the window 22A of cover 22 along the mode of the normal direction of window 22A with axis M.

And driver module 1 and substrate 2 are mechanically, electrically be connected.

The control circuit portion that does not show among substrate 2 and the figure is connected, thereby can supply power to driver module 1.

According to such formation, the light of penetrating window 22A can be accumulated in the lens unit 12 that do not show among the figure of driver module 1 and imaging on imaging apparatus 30.And, by suitable electric power is supplied to driver module 1 from control circuit portion, can drives lens unit 12 and carry out the focal position adjustment and photograph along axis M direction.

According to such portable phone that has camera 20, owing to possess the driver module 1 of above-mentioned the 1st embodiment, thereby assembling is become easily and make drive actions stable.Therefore, can reduce manufacturing cost.In addition, can improve the focusing precision that the focal position is adjusted.

In addition, in the above description, in the example of driven member, be illustrated, but, then also can be driven member constituting by 1 plate spring component maintenance as long as driving precision is in the permissible range by the situation of a pair of plate spring component clamping.In this case, the 1st fixed pin portion and the 2nd fixed pin portion end that only is located at a side of driven member and supporter respectively gets final product.

In addition, in the above description, utilize the heat of heater chip and the leading section of the 1st fixed pin portion, the 2nd fixed pin portion is riveted, but the riveted joint means are not limited to this.For example, also can use the vibration of ultrasonic vibrator to rivet.

In addition, in the above description, though in the example of the situation that the 1st fixed pin portion, the 2nd fixed pin portion is integrally formed in driven member, supporter respectively, be illustrated, also can with the 1st fixed pin portion and the 2nd fixed pin portion any is bonded on the driven member or the supporter that are made of other materials as minute body component and forms at least.That is, the material of driven member, supporter is not limited to the thermoplastic resin that can rivet.

In addition, in above-mentioned invention, though with module frame 5 integrally as the parts of essentially rectangular shape and be illustrated, be not limited to the essentially rectangular shape, also can be polygon-shaped.In this case, rectangular-shaped corner portion can be replaced into polygon-shaped corner portion.

In addition, in the above description, though be illustrated in the example of the situation that power supply part is made of

electrode

9a, 9b, power supply part also can adopt 1 bar printing substrate of the wiring that is formed with 2 systems etc.

In addition, in the above description, though be illustrated in the example of the situation of use driver module in the focus adjusting mechanism of lens unit, the purposes of driver module is not limited to this.For example, also can be used as and make driven member move to the suitable actuator of target location and in other parts, use.For example, can be threadedly engaged with rod unit etc., perhaps lens frame 4 be changed into other shapes and as suitable actuator to replace lens unit 12.That is, driven member is not limited to the parts of tubular, also can be the parts of column.

In addition, in the above description, though be illustrated in the example of the portable phone that has camera as the electronic equipment that uses driver module, the kind of electronic equipment is not limited to this.Also can be used for for example digital camera, the built-in optical devices such as camera of PC, can also in electronic equipments such as information read storage device or printer, be used as the actuator that makes driven member move to the target location.

In addition, if the inscape of above-mentioned illustrated each embodiment is possible technically, so, can be in the scope of technical conceive of the present invention appropriate combination and implementing.

Claims

1. driver module possesses:

Driven member, both ends any has the 1st fixed pin portion that is made of thermoplastic resin at least;

Supporter becomes along certain orientation and moves the tubular that holds this driven member freely, two ends any has the 2nd fixed pin portion that is made of the thermoplastic resin that extends along described certain orientation at least;

Plate spring component, be stacked in the end of the tube end of described supporter and described driven member and dispose with the state layer that inserts described the 2nd fixed pin portion of described the 1st fixed pin portion run through described driven member and described supporter from equidirectional respectively, give acting force along described certain orientation to described driven member;

Shape memory alloy wire, tensioning ground frame be at the tube peripheral part of described supporter, and described driven member card is ended place, centre position at length direction, resists the acting force of described plate spring component and drive described driven member;

Plate member connects and the electrical insulators of laminated configuration constitutes by in a side's of described supporter tube end side described the 2nd fixed pin portion being inserted;

The a pair of wire rod holding member that thermal capacity equates mutually, control the end of described shape memory alloy wire, with the state configuration of fixed position sidepiece in described supporter and described plate member, and the portion of terminal that is used to accept the supply of electric current extends to the scope of the thickness of the sidepiece that surpasses described plate member; And

Power supply part, have and electrically be connected with the described portion of terminal of described each wire rod holding member respectively and pair of electrodes that thermal capacity equates mutually, on described plate member, described the 2nd fixed pin portion that insertion is run through this plate member inserts and connects and laminated configuration, wherein

By riveting the leading section of described the 1st fixed pin portion and described the 2nd fixed pin portion respectively, described plate spring component and described driven member are fixed on described the 1st fixed pin portion, described plate spring component and described supporter are fixed on described the 2nd fixed pin portion,

Described power supply part is fixed by the leading section of described the 2nd fixed pin portion of riveted joint.

2. driver module according to claim 1 is characterized in that described power supply part is made of the electrode of pair of metal plate, and the electrode of this pair of metal plate is made of identical materials and has an identical volume.

3. an electronic equipment possesses driver module according to claim 1 and 2.