CN101865938A - Probe card assembly and probe base therein - Google Patents
Probe card assembly and probe base therein Download PDFInfo
- Publication number
- CN101865938A CN101865938A CN200910135009A CN200910135009A CN101865938A CN 101865938 A CN101865938 A CN 101865938A CN 200910135009 A CN200910135009 A CN 200910135009A CN 200910135009 A CN200910135009 A CN 200910135009A CN 101865938 A CN101865938 A CN 101865938A
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- probe
- noise removing
- wafer
- card assembly
- test
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- 239000000523 sample Substances 0.000 title claims abstract description 196
- 238000012360 testing method Methods 0.000 claims abstract description 90
- 235000012431 wafers Nutrition 0.000 description 38
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention provides a probe card assembly and a probe base therein, wherein the probe card assembly mainly comprises a main body, a probe base arranged in the center of the main body and a plurality of testing probes arranged in the probe base. The pointed ends of the testing probes extend out from the probe base for contacting a wafer to be tested in a wafer test, and the other ends of the testing probes are electrically connected with the main body. The probe base further comprises a plurality of noise-eliminating probes, each of which has a first end and a second end , wherein the first end is electrically connected with the grounded terminal of the main body, the second end is free from the contact with the wafer to be tested in the wafer test and is not contacted with an adjacent testing probe, and a gap of 5-30 microns is arranged between the outer edge of each noise-eliminating probe and the outer edge of the adjacent testing probe.
Description
Technical field
Relevant a kind of probe card assembly of the present invention and probe base wherein particularly are applied to the probe card assembly of wafer sort and probe base wherein.
Background technology
In semi-conductive wafer fabrication technology, the preceding good and the bad of wafer cutting for chip on the testing wafer (die), must use high performance probe (probe card) to carry out wafer sort, such as the U.S. Pat in the prior art 7304488, US7271603, US7053638 etc. exposure.Have accurate test probe on the probe, be used for contacting with wafer to be measured, turning circuit, and carry out testing electrical property, be to create with electrical specification and the usefulness of guaranteeing chip according to design specification.In recent years, the integrated circuit component of working at high speed and high-frequency operation is in vogue, so tester table also wants the energy high-frequency to adapt with probe.When but the conventional cantilever-type probe card is applied in high-frequency test, because electromagnetic interference (EMI) and noise problem that probe microclearanceization and high-frequency signal produce are very serious, making often needs the test result instability to carry out the extra program of resurveying, and has reduced test accuracy and usefulness.Therefore, how to improve existing probe card configuration to address the above problem, real is that industry is required.
Summary of the invention
Therefore, the purpose of this invention is to provide a kind of probe card assembly and wherein probe base, the noise that can effectively reduce high-frequency test and produced and reduce noise in the environment to promote the accuracy of high-frequency test.
A kind of probe card assembly is provided according to an aspect of the present invention, be used for wafer sort, this probe card assembly consists predominantly of a body, one is arranged at the probe base at this body center position, and a plurality of test probes that are arranged in this probe base, described test probe most advanced and sophisticated also stretches out from this probe base, when wafer sort in order to contact a wafer to be measured, the other end of described test probe and this body electrically connect, be characterized in: this probe base further comprises a plurality of noise removing pins, each noise removing needle set has first end and second end, this first end is electrically connected to the earth terminal of this body, this second end contact measured wafer not when wafer sort, and each noise removing pin does not contact its contiguous test probe, and the outer rim of the outer rim test probe adjacent thereto of each noise removing pin has a gap, and this gap is between 5～30 microns.
A kind of probe card assembly is provided according to a further aspect of the invention, be used for wafer sort, include a body, one is arranged at the probe base at this body center position, and a plurality of test probes that are arranged in this probe base, described test probe most advanced and sophisticated also stretches out from this probe base, when wafer sort in order to contact a wafer to be measured, the other end of described test probe and this body electrically connect, be characterized in: this probe base further comprises a plurality of noise removing pins, each noise removing needle set has first end and second end, this first end is electrically connected to the earth terminal of this body, this second end contact measured wafer not when wafer sort, and each noise removing pin does not contact its contiguous test probe, and the distance at the center, pin footpath of the pin of each noise removing pin center, footpath test probe adjacent thereto is between 85～150 microns.
Provide a kind of probe base according to another aspect of the invention, for being used in the probe card assembly of wafer sort, this probe base is arranged at the central part of this probe card assembly, a plurality of test probes are arranged in this probe base, described test probe most advanced and sophisticated also stretches out from this probe base, when wafer sort in order to contact a wafer to be measured, be characterized in, this probe base comprises: a plurality of noise removing pins, each noise removing needle set has first end and second end, this first end is electrically connected to the earth terminal of this probe card assembly, this second end contact measured wafer not when wafer sort, and each noise removing pin does not contact its contiguous test probe, and the outer rim of the outer rim test probe adjacent thereto of each noise removing pin has a gap, and this gap is between 5～30 microns.
A kind of probe base is provided according to a further aspect of the present invention, for being used in the probe card assembly of wafer sort, this probe base is arranged at the central part of this probe card assembly, a plurality of test probes are arranged in this probe base, described test probe most advanced and sophisticated also stretches out from this probe base, when wafer sort in order to contact a wafer to be measured, be characterized in, this probe base comprises: a plurality of noise removing pins, each noise removing needle set has first end and second end, this first end is electrically connected to the earth terminal of this probe card assembly, this second end contact measured wafer not when wafer sort, and each noise removing pin does not contact its contiguous test probe, and the distance at the center, pin footpath of the pin of this noise removing pin center, footpath test probe adjacent thereto is between 85～150 microns.
The useful technique effect of probe card assembly provided by the invention and probe base wherein is: when being used for wafer sort, by a plurality of noise removing pins are set in the probe base, and the noise removing pin is given ground connection, the noise that can effectively reduce high-frequency test and produced, and can reduce noise in the environment, to promote the accuracy of high-frequency test.
Description of drawings
Fig. 1 is a preferred embodiment synoptic diagram of probe card assembly of the present invention and probe base.
Fig. 2 be a preferred embodiment of the present invention probe base along test probe and noise removing needle shaft to cut-open view.
Fig. 3 be of the present invention first and the probe base of the 3rd preferred embodiment along test probe and noise removing pin cut-open view radially.
Fig. 4 be of the present invention second and the probe base of the 4th preferred embodiment along test probe and noise removing pin cut-open view radially.
Embodiment
Because the present invention discloses a kind of probe card assembly and probe base wherein, be used for the test of wafer, wherein the use principle of probe card assembly and probe base and basic function know usually that for correlative technology field has the knowledgeable can understand, so, no longer do complete description with explanation hereinafter.Simultaneously, with the accompanying drawing that is hereinafter contrasted, be to express the structural representation relevant with feature of the present invention, also do not need to be chatted bright hereby earlier according to the complete drafting of physical size.
At first please refer to Fig. 1, first preferred embodiment of the present invention shown in the figure is a kind of probe card assembly 100, consists predominantly of body 11, is arranged at the probe base 12 and a plurality of test probes 13 that are arranged in the probe base 12 of body 11 central parts.Above-mentioned body 11 is mainly printed circuit board (PCB) (Printed Circuit Board, PCB), wherein probe base 12 is formed by epoxy resin (epoxy), for on a pedestal, furnishing a lot of test probe 13 earlier, and the fixing above-mentioned test probe 13 of infusion epoxy resin, and form a probe base 12, and then this probe base 12 is fixed on the body 11.Please refer to Fig. 2, be the cut-open view of probe base 12.The tip of test probe 13 can be stretched out from probe base 12, in order to contact a wafer to be measured, carries out wafer sort, and the other end of test probe 13 and body 11 electrically connect.Probe base 12 further comprises a plurality of noise removing pins 14, and noise removing pin 14 has first end 141 and second end 142.First end 141 is electrically connected to the ground plane in the pcb board of the earth terminal 111 of body 11 or body 11, by ground connection with noise removing.Second end 142 is adjacent to the position of test probe 13 contact measured wafers, and second end 142 can be imbedded in the probe base 12, can also protrude in outside the probe base 12.But what give special heed to is, second end 142 when wafer sort, contact measured wafer not, and these noise removing pins 14 can not touch contiguous test probe 13 yet.By this, noise removing pin 14 can not destroy the test signal of contiguous test probe 13 because of contact, but can eliminate the high frequency noise in test probe 13 environment because of the effect of inductive effect and ground connection, and then promotes the accuracy of high-frequency test.In the prior art, since adjacent one another are extremely near between the test probe 13, cross-talk (crosstalk) easily takes place, and signal interferes with each other easily; And this situation is solved effectively by noise removing pin 14 proposed by the invention.Please refer to Fig. 3, it is the cut-open view of Fig. 1 along A to A, noise removing pin 14 is preferable with the diagonal line point of crossing that is arranged at its four contiguous test probes 13, and the outer rim of the outer rim of noise removing pin 14 test probe 13 adjacent thereto, has 5～30 microns gap W1.Further, the present invention shows that through the result that experiment test obtains the outer rim of the outer rim of these noise removing pins 14 test probe 13 adjacent thereto is at 10～25 microns gap W
iThe time, the noise that more can effectively reduce high-frequency test and produced, certainly, the demand of visual actual fabrication is designed to the gap that other meets the present embodiment condition.
Please continue with reference to figure 1, Fig. 2 and Fig. 4, the present invention further proposes second preferred embodiment, be a kind of probe card assembly 100, consist predominantly of body 11, be arranged at body 11 central parts probe base 12, be arranged at a plurality of test probes 13 and a plurality of noise removing pin 14 in the probe base 12.Please continue with reference to figure 2, noise removing pin 14 has first end 141 and second end 142.First end 141 is electrically connected to the ground plane in the pcb board of the earth terminal 111 of body 11 or body 11, by ground connection with noise removing.Second end 142 is adjacent to the position that test probe 13 touches wafer to be measured, second end 142 can be imbedded in the probe base 12, can also slightly protrude in outside the probe base 12, but second end 142 is when wafer sort, do not touch wafer to be measured, and these noise removing pins 14 can not touch contiguous test probe 13 yet.By this, these noise removing pins 14 can not destroy the test signal of contiguous test probe 13 because of contact, but can eliminate the noise in test probe 13 environment because of the ground connection effect, and then promote the accuracy of high-frequency test.Please continue with reference to figure 4, it is the cut-open view of Fig. 1 along A-A, these noise removing pins 14 are preferable with the diagonal line point of crossing that is arranged at its four contiguous test probes 13, and the center, pin footpath of the pin of noise removing pin 14 center, footpath test probe 13 adjacent thereto, have 85～150 microns distance W
2Further, the result that the present invention obtains through experiment test, the center, pin footpath of pin center, the footpath test probe 13 adjacent thereto of these noise removing pins 14 is 90～145 microns distance W
2The time, the noise that more can effectively reduce high-frequency test and produced, certainly, the demand of visual actual fabrication is designed to distance in the heart in other pin that meets present embodiment condition footpath.
The present invention further proposes one the 3rd preferred embodiment, is a kind of probe base, and for being used in the probe card assembly of wafer sort, its feature probe base 12 in first preferred embodiment as described above is described.
The present invention further proposes one the 4th preferred embodiment, is a kind of probe base, and for being used in the probe card assembly of wafer sort, its feature probe base 12 in second preferred embodiment as described above is described.
The above is preferred embodiment of the present invention only, is not in order to limit the right of applying for a patent of the present invention; Simultaneously above description should be understood and be implemented for the special personage who knows the present technique field, so other does not break away from the equivalence of being finished under the disclosed spirit and change or modification, all should be included in the claim.
Claims (10)
1. probe card assembly, be used for wafer sort, this probe card assembly consists predominantly of probe base and a plurality of test probe that is arranged in this probe base that a body, is arranged at this body center position, described test probe most advanced and sophisticated also stretches out from this probe base, when wafer sort in order to contact a wafer to be measured, the other end of described test probe and this body electrically connect, and it is characterized in that:
This probe base further comprises a plurality of noise removing pins, each noise removing needle set has first end and second end, this first end is electrically connected to the earth terminal of this body, this second end contact measured wafer not when wafer sort, and each noise removing pin does not contact its contiguous test probe, and the outer rim of the outer rim test probe adjacent thereto of each noise removing pin has a gap, and this gap is between 5～30 microns.
2. probe card assembly according to claim 1 is characterized in that, wherein second end of each noise removing pin is to imbed in this probe base or protrude in outside this probe base.
3. probe card assembly according to claim 1 is characterized in that, wherein each noise removing pin just is positioned at the diagonal line point of crossing of its four contiguous test probes.
4. probe card assembly according to claim 1 is characterized in that, wherein the gap of the outer rim of the outer rim test probe adjacent thereto of each noise removing pin is between 10～25 microns.
5. probe card assembly, be used for wafer sort, include probe base and a plurality of test probe that is arranged in this probe base that a body, is arranged at this body center position, described test probe most advanced and sophisticated also stretches out from this probe base, when wafer sort in order to contact a wafer to be measured, the other end of described test probe and this body electrically connect, and it is characterized in that:
This probe base further comprises a plurality of noise removing pins, each noise removing needle set has first end and second end, this first end is electrically connected to the earth terminal of this body, this second end contact measured wafer not when wafer sort, and each noise removing pin does not contact its contiguous test probe, and the distance at the center, pin footpath of the pin of each noise removing pin center, footpath test probe adjacent thereto is between 85～150 microns.
6. probe card assembly according to claim 5 is characterized in that, wherein second end of each noise removing pin is to imbed in this probe base or protrude in outside this probe base.
7. probe card assembly according to claim 5 is characterized in that, wherein each noise removing pin just is positioned at the diagonal line point of crossing of its four contiguous test probes.
8. probe card assembly according to claim 5 is characterized in that, wherein the distance at the center, pin footpath of the pin of each noise removing pin center, footpath test probe adjacent thereto is between 90～145 microns.
9. probe base, for being used in the probe card assembly of wafer sort, this probe base is arranged at the central part of this probe card assembly, a plurality of test probes are arranged in this probe base, described test probe most advanced and sophisticated also stretches out from this probe base, in order to contact a wafer to be measured, this probe base is characterised in that when wafer sort:
This probe base further comprises a plurality of noise removing pins, each noise removing needle set has first end and second end, this first end is electrically connected to the earth terminal of this probe card assembly, this second end contact measured wafer not when wafer sort, and each noise removing pin does not contact its contiguous test probe, and the outer rim of the outer rim test probe adjacent thereto of each noise removing pin has a gap, and this gap is between 5～30 microns.
10. probe base, for being used in the probe card assembly of wafer sort, this probe base is arranged at the central part of this probe card assembly, a plurality of test probes are arranged in this probe base, described test probe most advanced and sophisticated also stretches out from this probe base, in order to contact a wafer to be measured, this probe base is characterised in that when wafer sort:
This probe base further comprises a plurality of noise removing pins, each noise removing needle set has first end and second end, this first end is electrically connected to the earth terminal of this probe card assembly, this second end contact measured wafer not when wafer sort, and each noise removing pin does not contact its contiguous test probe, and the distance at the center, pin footpath of the pin of this noise removing pin center, footpath test probe adjacent thereto is between 85～150 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910135009A CN101865938A (en) | 2009-04-14 | 2009-04-14 | Probe card assembly and probe base therein |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910135009A CN101865938A (en) | 2009-04-14 | 2009-04-14 | Probe card assembly and probe base therein |
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| Publication Number | Publication Date |
|---|---|
| CN101865938A true CN101865938A (en) | 2010-10-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910135009A Pending CN101865938A (en) | 2009-04-14 | 2009-04-14 | Probe card assembly and probe base therein |
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| CN (1) | CN101865938A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102081111A (en) * | 2010-12-06 | 2011-06-01 | 上海华岭集成电路技术股份有限公司 | Probe card |
| CN104297534A (en) * | 2013-07-15 | 2015-01-21 | 旺矽科技股份有限公司 | Cantilever type high-frequency probe card |
| CN109983769A (en) * | 2016-11-29 | 2019-07-05 | 李诺工业股份有限公司 | Camera model test device |
| CN110850126A (en) * | 2018-08-03 | 2020-02-28 | 均豪精密工业股份有限公司 | Detection system, probe device and panel detection method |
| CN111141938A (en) * | 2018-11-02 | 2020-05-12 | 旺矽科技股份有限公司 | Probe module suitable for multiple units to be tested with inclined conductive contacts |
-
2009
- 2009-04-14 CN CN200910135009A patent/CN101865938A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102081111A (en) * | 2010-12-06 | 2011-06-01 | 上海华岭集成电路技术股份有限公司 | Probe card |
| CN104297534A (en) * | 2013-07-15 | 2015-01-21 | 旺矽科技股份有限公司 | Cantilever type high-frequency probe card |
| CN109983769A (en) * | 2016-11-29 | 2019-07-05 | 李诺工业股份有限公司 | Camera model test device |
| CN109983769B (en) * | 2016-11-29 | 2020-12-29 | 李诺工业股份有限公司 | Camera module testing device |
| CN110850126A (en) * | 2018-08-03 | 2020-02-28 | 均豪精密工业股份有限公司 | Detection system, probe device and panel detection method |
| CN111141938A (en) * | 2018-11-02 | 2020-05-12 | 旺矽科技股份有限公司 | Probe module suitable for multiple units to be tested with inclined conductive contacts |
| CN111141938B (en) * | 2018-11-02 | 2021-10-29 | 旺矽科技股份有限公司 | Probe module suitable for multiple units to be tested with inclined conductive contacts |
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Open date: 20101020 |