CN101859760A - Packaging structure of surface-mount device infrared receiver - Google Patents
Packaging structure of surface-mount device infrared receiver Download PDFInfo
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- CN101859760A CN101859760A CN 201010159310 CN201010159310A CN101859760A CN 101859760 A CN101859760 A CN 101859760A CN 201010159310 CN201010159310 CN 201010159310 CN 201010159310 A CN201010159310 A CN 201010159310A CN 101859760 A CN101859760 A CN 101859760A
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- signal amplification
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Abstract
The invention relates to a packaging structure of a surface-mount device infrared receiver, which mainly comprises a support, epoxy resin glue, a photosensitive receiving diode, a signal amplification IC and an inner shielding sheet; the support mainly comprises a metal sheet and a frame, the frame is made of high-temperature plastic or high-temperature resin, and the metal sheet is provided with pins; the frame is arranged on the metal sheet, and a mounting socket for the photosensitive receiving diode, the signal amplification IC and the inner shielding sheet is arranged in the frame; the photosensitive receiving diode, the signal amplification IC and the inner shielding sheet are mounted in the mounting socket, and the inner shielding sheet is used for shielding light and electrons from interfering the photosensitive receiving diode and the signal amplification IC; the signals of the photosensitive receiving diode and the signal amplification IC are led out by the pins, and the epoxy resin glue is filled in the mounting socket by a glue dispenser to seal the photosensitive receiving diode, the signal amplification IC and the inner shielding sheet in the mounting socket.
Description
Technical field
The present invention relates to a kind of encapsulating structure of surface-mount device infrared receiver.
Background technology
It mainly is applicable to infrared receiving terminal on the electrical equipment that has remote control.Traditional surface-mount device infrared receiver its mainly by mold encapsulation, the shortcoming of mold encapsulation is that its raw material are expensive, need by import, and waste of material seriously and plant equipment price height and production efficiency low.
Summary of the invention
The object of the present invention is to provide a kind of encapsulating structure of the surface-mount device infrared receiver that can reduce production costs greatly.
For achieving the above object, the invention provides a kind of encapsulating structure of surface-mount device infrared receiver, it mainly is made up of support, epoxide-resin glue, photosensitive reception diode, signal amplification IC, inner shield sheet.
This support mainly is made up of five metals sheet and framework, and this framework adopts high temperature plastics or high-temperature resin to make, and this five metals sheet is provided with pin.
This framework is arranged on the five metals sheet, is provided with photosensitive reception diode, signal amplification IC, inner shield sheet installation hole in this framework.
This photosensitive reception diode, signal amplify IC and are contained in this installation hole, and by the inner shield sheet comes shielded from light and the photosensitive reception diode of duplet, signal amplify IC interference.
This photosensitive reception diode, signal amplify the signal of IC draws by pin, and epoxide-resin glue is poured on this installation hole by point gum machine, and photosensitive reception diode, signal amplification IC, inner shield sheet are sealed in this installation hole.
The present invention has the following advantages: it can reduce production costs greatly, and does not influence the signal reception of photosensitive reception diode.
Description of drawings
Fig. 1 is the rack assumption diagram of the encapsulating structure of a kind of surface-mount device infrared receiver of the present invention.
Fig. 2 is the structure chart of the encapsulating structure of a kind of surface-mount device infrared receiver of the present invention.
Embodiment
See also Fig. 1 to Fig. 2, a kind of encapsulating structure of surface-mount device infrared receiver, it mainly is made up of support 1, epoxide-resin glue 2, photosensitive reception diode (figure does not show), signal amplification IC (figure does not show), inner shield (figure does not show).
This support 1 mainly is made up of five metals sheet 11 and framework 12, and this framework 12 adopts high temperature plastics or high-temperature resin to make, and this five metals sheet 11 is provided with pin 3.
This framework 12 is arranged on and is provided with photosensitive reception diode on the five metals sheet 11 in this framework 12, signal amplifies IC, inner shield sheet installation hole 4.
This photosensitive reception diode, signal amplify IC and are contained in this installation hole 4, and by the inner shield sheet comes shielded from light and the photosensitive reception diode of duplet, signal amplify IC interference.
This photosensitive reception diode, signal amplify the signal of IC draws by pin 3, and epoxide-resin glue 2 is poured on this installation hole 4 by point gum machine, and photosensitive reception diode, signal amplification IC, inner shield sheet are sealed in this installation hole 4.
The present invention can reduce production costs greatly, and does not influence the signal reception of photosensitive reception diode.
The above; it only is preferred embodiment of the present invention; be not that the present invention is done any pro forma restriction; though the present invention discloses as above with preferred embodiment; yet be not in order to limit the present invention; any those skilled in the art; in not breaking away from the technical solution of the present invention scope; when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations; in every case be the content that does not break away from technical solution of the present invention; according to technical spirit of the present invention to any simple modification that above embodiment did; equivalent variations and modification all still belong in the protection range of technical solution of the present invention.
Claims (1)
1. the encapsulating structure of a surface-mount device infrared receiver, it mainly is made up of support, epoxide-resin glue, photosensitive reception diode, signal amplification IC, inner shield sheet, it is characterized in that: this support mainly is made up of five metals sheet and framework, this framework adopts high temperature plastics or high-temperature resin to make, and this five metals sheet is provided with pin; This framework is arranged on the five metals sheet, is provided with photosensitive reception diode, signal amplification IC, inner shield sheet installation hole in this framework; This photosensitive reception diode, signal amplify IC and are contained in this installation hole, and by the inner shield sheet comes shielded from light and the photosensitive reception diode of duplet, signal amplify IC interference; This photosensitive reception diode, signal amplify the signal of IC draws by pin, and epoxide-resin glue is poured on this installation hole by point gum machine, and photosensitive reception diode, signal amplification IC, inner shield sheet are sealed in this installation hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010159310 CN101859760A (en) | 2010-04-26 | 2010-04-26 | Packaging structure of surface-mount device infrared receiver |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010159310 CN101859760A (en) | 2010-04-26 | 2010-04-26 | Packaging structure of surface-mount device infrared receiver |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101859760A true CN101859760A (en) | 2010-10-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010159310 Pending CN101859760A (en) | 2010-04-26 | 2010-04-26 | Packaging structure of surface-mount device infrared receiver |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101859760A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050285039A1 (en) * | 2004-06-29 | 2005-12-29 | Ronny Ludwig | Gas sensor module for the spectroscopic measurement of a gas concentration |
| CN2807359Y (en) * | 2005-06-07 | 2006-08-16 | 佛山市国星光电科技有限公司 | Paster type integral infrared receiver |
| CN1885537A (en) * | 2005-06-21 | 2006-12-27 | 天水华天科技股份有限公司 | Photoelectric integrative infrared receiver and packaging method |
| CN101123036A (en) * | 2007-03-02 | 2008-02-13 | 哈尔滨海格科技发展有限责任公司 | Compound encapsulation infrared receiver |
| CN101582420A (en) * | 2009-06-26 | 2009-11-18 | 哈尔滨海格科技发展有限责任公司 | Focusing infrared receiver with built-in reflective cup |
-
2010
- 2010-04-26 CN CN 201010159310 patent/CN101859760A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050285039A1 (en) * | 2004-06-29 | 2005-12-29 | Ronny Ludwig | Gas sensor module for the spectroscopic measurement of a gas concentration |
| CN2807359Y (en) * | 2005-06-07 | 2006-08-16 | 佛山市国星光电科技有限公司 | Paster type integral infrared receiver |
| CN1885537A (en) * | 2005-06-21 | 2006-12-27 | 天水华天科技股份有限公司 | Photoelectric integrative infrared receiver and packaging method |
| CN101123036A (en) * | 2007-03-02 | 2008-02-13 | 哈尔滨海格科技发展有限责任公司 | Compound encapsulation infrared receiver |
| CN101582420A (en) * | 2009-06-26 | 2009-11-18 | 哈尔滨海格科技发展有限责任公司 | Focusing infrared receiver with built-in reflective cup |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20101013 |