TW201130061A - Electronic device with vertical conductive connectors and method thereof - Google Patents

Electronic device with vertical conductive connectors and method thereof

Info

Publication number
TW201130061A
TW201130061A TW099105467A TW99105467A TW201130061A TW 201130061 A TW201130061 A TW 201130061A TW 099105467 A TW099105467 A TW 099105467A TW 99105467 A TW99105467 A TW 99105467A TW 201130061 A TW201130061 A TW 201130061A
Authority
TW
Taiwan
Prior art keywords
electronic device
vertical conductive
conductive connectors
encapsulation
conducting
Prior art date
Application number
TW099105467A
Other languages
Chinese (zh)
Other versions
TWI450348B (en
Inventor
Chung-Tao Chang
Yin-Yi Tsai
Chun-San Hsu
Wei-Hsiung Yang
Cheng-Ding Wang
Original Assignee
Tripod Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tripod Technology Corp filed Critical Tripod Technology Corp
Priority to TW099105467A priority Critical patent/TWI450348B/en
Publication of TW201130061A publication Critical patent/TW201130061A/en
Application granted granted Critical
Publication of TWI450348B publication Critical patent/TWI450348B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Abstract

Provided herein is a method of forming vertical connecting terminals in an encapsulation of an electronic apparatus. The method includes providing a substrate, which has an electronic device and at least one terminal pad thereon; mounting a conducting bump on the terminal pad of the substrate; molding the conducting bump with a encapsulation; forming at least one via in the encapsulation to expose a portion of the conducting bump; and filling the via with a conducting material which physically connects with the conducting bump. A device thereof is also provided.
TW099105467A 2010-02-25 2010-02-25 Electronic device with vertical conductive connectors and method thereof TWI450348B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW099105467A TWI450348B (en) 2010-02-25 2010-02-25 Electronic device with vertical conductive connectors and method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099105467A TWI450348B (en) 2010-02-25 2010-02-25 Electronic device with vertical conductive connectors and method thereof

Publications (2)

Publication Number Publication Date
TW201130061A true TW201130061A (en) 2011-09-01
TWI450348B TWI450348B (en) 2014-08-21

Family

ID=50180097

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099105467A TWI450348B (en) 2010-02-25 2010-02-25 Electronic device with vertical conductive connectors and method thereof

Country Status (1)

Country Link
TW (1) TWI450348B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI570842B (en) * 2015-07-03 2017-02-11 矽品精密工業股份有限公司 Electronic package and method for fabricating the same
TWI637836B (en) * 2016-04-06 2018-10-11 綠點高新科技股份有限公司 Method of manufacturing insert-molded article, product of the method, and housing of electronic device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100833589B1 (en) * 2006-03-29 2008-05-30 주식회사 하이닉스반도체 Stack package
TWI368303B (en) * 2007-12-21 2012-07-11 Packaging substrate structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI570842B (en) * 2015-07-03 2017-02-11 矽品精密工業股份有限公司 Electronic package and method for fabricating the same
TWI637836B (en) * 2016-04-06 2018-10-11 綠點高新科技股份有限公司 Method of manufacturing insert-molded article, product of the method, and housing of electronic device

Also Published As

Publication number Publication date
TWI450348B (en) 2014-08-21

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