CN101854790A - 散热装置 - Google Patents

散热装置 Download PDF

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Publication number
CN101854790A
CN101854790A CN200910301203A CN200910301203A CN101854790A CN 101854790 A CN101854790 A CN 101854790A CN 200910301203 A CN200910301203 A CN 200910301203A CN 200910301203 A CN200910301203 A CN 200910301203A CN 101854790 A CN101854790 A CN 101854790A
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substrate
fan
radiator
heat abstractor
fixed
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CN101854790B (zh
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周家兴
叶振兴
陈晓竹
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200910301203.3A priority Critical patent/CN101854790B/zh
Priority to US12/468,825 priority patent/US8240363B2/en
Publication of CN101854790A publication Critical patent/CN101854790A/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热装置,包括一散热器、一风扇及一固定支架,该风扇的一侧开设若干固定孔,该固定支架包括一基板及两分别自该基板的两边缘同向延伸形成的可弹性变形的侧板,该基板与该两侧板之间形成一容置该风扇的安装空间,该基板开设一可让空气在该散热器与该风扇之间流通的气流口,该固定支架的基板借助若干固定件固定在该散热器,这些固定件的头部突出于该基板并分别容置于该风扇的相应的固定孔内,每一侧板于远离该基板的一端向该安装空间的方向突设有一弹性卡持该风扇的另一相对侧的扣持部,从而大大方便了风扇的组装。

Description

散热装置
技术领域
本发明涉及一种散热装置,特别涉及一种为电脑中央处理器散热的散热装置。
背景技术
一般,电脑主机中央处理器(Central Processing Unit,缩写为CPU)的散热问题是通过在其上方安装一由导热材料制成的散热器来解决的。且为了加强空气对流,通常会用螺丝在散热器上安装一风扇,以为CPU更好地散热。但是,这种使用螺丝固定风扇的方式在装拆风扇时均须借助螺丝起子等辅助工具来实现,操作极为不便,从而造成组装的繁琐。
发明内容
本发明要解决的技术问题是提供一种便于组装的散热装置。
一种散热装置,包括一散热器、一风扇及一固定支架,该风扇的一侧开设若干固定孔,该固定支架包括一基板及两分别自该基板的两边缘同向延伸形成的可弹性变形的侧板,该基板与该两侧板之间形成一容置该风扇的安装空间,该基板开设一可让空气在该散热器与该风扇之间流通的气流口,该固定支架的基板借助若干固定件固定在该散热器,这些固定件的头部突出于该基板并分别容置于该风扇的相应的固定孔内,每一侧板于远离该基板的一端向该安装空间的方向突设有一弹性卡持该风扇的另一相对侧的扣持部。
该散热装置通过使该固定支架的两侧板发生弹性变形而让该风扇容置于该固定支架的安装空间内,并借助该两侧板恢复变形而让其扣持部弹性卡持该风扇的另一侧边缘,而这些固定件的头部分别容置于该风扇的相应的固定孔内,即将该风扇固定于该固定支架的安装空间内,使组装变得非常方便。
附图说明
下面参照附图结合具体实施方式对本发明做进一步的说明。
图1是本发明散热装置的较佳实施方式的立体分解图。
图2是图1的部分立体组装图。
图3是图1的立体组装图。
具体实施方式
请参照图1,本发明散热装置的较佳实施方式,包括一可用于为CPU散热的散热器10、一固定支架20及一风扇40。该散热器10于顶部设一大致呈方形的支撑板12。该支撑板12于中部开设一通风口14,于其四端角分别开设一锁固孔16。这些锁固孔16是靠近该通风口14的边缘的位置开设的。
该固定支架20包括一基板22及两分别自该基板22的两相对侧边一同向上延伸形成的侧板24。该基板22与该两侧板24之间形成一用于容置该风扇40的安装空间26。该基板22于中部的位置开设一对应该支撑板12的通风口14的气流口222,于四角的位置分别开设一对应该支撑板12的锁固孔16的通孔224。每一侧板24的顶部内侧向相对的侧板24的方向(即向该安装空间26的方向)垂直延伸形成一长条状的扣持部242。每一侧板24的外表面自靠近该基板22的位置向该基板22的延伸方向延伸形成若干第一加强肋244,以增加相应侧板24的强度。每一扣持部242的上表面与相应的侧板24的连接处形成若干第二加强肋246,以增加相应扣持部242与对应侧板24的连接强度。
该风扇40于其一侧的四个角处分别开设一对应该固定支架20的相应通孔224的固定孔42。
请继续参照图2及图3,组装时,用若干固定件(如图中的螺丝100)分别穿过该固定支架20的基板22的通孔224并锁固于该支撑板12的相应锁固孔16内,即将该固定支架20固定于该散热器10上。此时,该固定支架20的气流口222与该支撑板12的通风口14相对。
要安装该风扇40时,向外扳动该固定支架20的侧板24而使其发生弹性变形,将该风扇40置于该固定支架20的安装空间26内,并让这些固定件的头部分别容置于该风扇40的相应固定孔42内。松释该固定支架20的侧板24,从而该固定支架20的侧板24恢复变形而抵靠于该风扇40的相应侧面,而该两侧板24的扣持部242则分别弹性卡持该风扇40上与开设这些固定孔42的一侧相对的另一侧边缘,即方便地将该风扇40固定。当该风扇40运转时,该散热器10上的热空气便经由该支撑板12的通风口14及该固定支架20的气流口222而被该风扇40抽走,或者,该风扇40将吸入的冷气经由该固定支架20的气流口222及该支撑板12的通风口14吹向该散热器10。
要取下该风扇40时,再次向外扳动该固定支架20的侧板24,使该两侧板24的扣持部242分别脱离该风扇40的顶部边缘,这样,即可很轻松地将该风扇40从该固定支架20的安装空间26内取出。
在其他实施方式中,该固定支架20的两侧板24可分别自该基板22的两相邻侧边一同向上延伸形成,或者,自该基板22的三个侧边一同向上延伸形成三个侧板24。
从上可知,由于该散热装置通过使该固定支架20的两侧板24发生弹性变形而让该风扇40容置于该固定支架20的安装空间26内,并借助该两侧板24恢复变形而让其扣持部242弹性卡持该风扇40的另一侧边缘,而这些固定件的头部分别容置于该风扇40的相应的固定孔42内,即将该风扇40固定于该安装空间26内,使组装变得非常方便。

Claims (6)

1.一种散热装置,包括一散热器及一风扇,该风扇的一侧开设若干固定孔,其特征在于:该散热装置还包括一固定支架,该固定支架包括一基板及两分别自该基板的两边缘同向延伸形成的可弹性变形的侧板,该基板与该两侧板之间形成一容置该风扇的安装空间,该基板开设一可让空气在该散热器与该风扇之间流通的气流口,该固定支架的基板借助若干固定件固定在该散热器,这些固定件的头部突出于该基板并分别容置于该风扇的相应的固定孔内,每一侧板于远离该基板的一端向该安装空间的方向突设有一弹性卡持该风扇的另一相对侧的扣持部。
2.如权利要求1所述的散热装置,其特征在于:该基板于靠近该气流口的边缘的位置开设若干通孔,这些固定件分别穿过该基板的通孔并锁固于该散热器而将该基板固定于该散热器。
3.如权利要求2所述的散热装置,其特征在于:该散热器上设有一支撑板,该支撑板开设一正对该基板的气流口的通风口,该支撑板于靠近该通风口的边缘的位置开设有若干正对该基板的通孔的锁固孔,这些固定件穿过该基板的通孔后分别锁固于该支撑板的相应锁固孔而将该基板固定于该散热器的支撑板。
4.如权利要求1所述的散热装置,其特征在于:每一侧板的扣持部为顺着该远离基板的一端的延伸方向形成。
5.如权利要求1所述的散热装置,其特征在于:每一侧板的外表面自靠近该基板的位置向该基板的延伸方向延伸形成若干第一加强肋。
6.如权利要求1所述的散热装置,其特征在于:每一扣持部的外表面与相应的侧板的连接处形成若干第二加强肋。
CN200910301203.3A 2009-03-30 2009-03-30 散热装置 Expired - Fee Related CN101854790B (zh)

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CN200910301203.3A CN101854790B (zh) 2009-03-30 2009-03-30 散热装置
US12/468,825 US8240363B2 (en) 2009-03-30 2009-05-19 Heat dissipation apparatus

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101998810B (zh) * 2009-08-27 2015-03-25 赛恩倍吉科技顾问(深圳)有限公司 散热装置
CN102469751A (zh) * 2010-11-17 2012-05-23 鸿富锦精密工业(深圳)有限公司 风扇固定装置
US12092132B2 (en) 2021-03-05 2024-09-17 Spectronik Pte. Ltd. Mounting device for a fan unit

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US6662412B2 (en) * 2001-08-03 2003-12-16 Tsan-Wen Chuang Buckle of IC heat dissipating device
CN2750473Y (zh) * 2004-07-08 2006-01-04 鸿富锦精密工业(深圳)有限公司 风扇固定架
US7089999B1 (en) * 2005-03-10 2006-08-15 Chaun-Choung Technology Corp. Hood retaining structure for heat-dissipating device
US20070004942A1 (en) * 2005-06-30 2007-01-04 Laurent Garel Method of preparation of an alkyne with an optically active hydroxyl group in the beta or gamma position of a triple bond and intermediates obtained
CN101072487A (zh) * 2006-05-12 2007-11-14 富准精密工业(深圳)有限公司 风扇固定装置
CN101311877A (zh) * 2007-05-25 2008-11-26 佛山市顺德区汉达精密电子科技有限公司 散热风扇之固定结构

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Publication number Priority date Publication date Assignee Title
US7130192B2 (en) * 2004-04-27 2006-10-31 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating device
US20070044942A1 (en) * 2005-08-24 2007-03-01 Xingwen Mou Bottom plate of a radiator for a CPU

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6662412B2 (en) * 2001-08-03 2003-12-16 Tsan-Wen Chuang Buckle of IC heat dissipating device
CN2750473Y (zh) * 2004-07-08 2006-01-04 鸿富锦精密工业(深圳)有限公司 风扇固定架
US7089999B1 (en) * 2005-03-10 2006-08-15 Chaun-Choung Technology Corp. Hood retaining structure for heat-dissipating device
US20070004942A1 (en) * 2005-06-30 2007-01-04 Laurent Garel Method of preparation of an alkyne with an optically active hydroxyl group in the beta or gamma position of a triple bond and intermediates obtained
CN101072487A (zh) * 2006-05-12 2007-11-14 富准精密工业(深圳)有限公司 风扇固定装置
CN101311877A (zh) * 2007-05-25 2008-11-26 佛山市顺德区汉达精密电子科技有限公司 散热风扇之固定结构

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US8240363B2 (en) 2012-08-14
US20100246126A1 (en) 2010-09-30

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