CN101853821B - Cooling method of power-type diode and special cooling fin - Google Patents
Cooling method of power-type diode and special cooling fin Download PDFInfo
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- CN101853821B CN101853821B CN2010101477096A CN201010147709A CN101853821B CN 101853821 B CN101853821 B CN 101853821B CN 2010101477096 A CN2010101477096 A CN 2010101477096A CN 201010147709 A CN201010147709 A CN 201010147709A CN 101853821 B CN101853821 B CN 101853821B
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- detent projection
- heat conductor
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Abstract
The invention relates to a cooling method of a power-type diode. A heat conductor is directly packed outside a diode body and is used for cooling. The heat conductor is a cylindrical integral structure; the inner wall of the heat conductor is matched with the appearance of the diode, so that the cylindrical heat conductor can be tightly stuck to the periphery of the diode; the outer wall of the cylindrical heat conductor is provided with a plurality of ledges which are axially and evenly arranged around the cylindrical heat conductor; the length directions of the ledges are same as the axial direction of the cylindrical heat conductor; and the ledges form an air channel. The invention also relates to a special cooling fin realizing the cooling method. The cooling fin is a cylindrical integral structure; the inner wall of the cooling fin is matched with the appearance of the diode; the outer wall of the cylindrical cooling fin is provided with a plurality of ledges which are axially and evenly arranged around the cylindrical cooling fin; the length directions of the cooling fins are same as the axial direction of the cylindrical cooling fins; and the ledges form an air channel. The technical scheme solves the cooling problems of the power-type diode and is simple and easy to apply, and the required cooling fins can be manufactured by using traditional materials and equipment.
Description
Technical field
The invention belongs to electronic power components heat radiation field, specifically is a kind of heat dissipating method and special-purpose fin of power-type diode.
Background technology
In the prior art, heat sink applications is extensive, and especially for some power-type electronic devices, SMD Application Of Radiator is very extensive.For power-type diode, because its shape is special, general patch-type radiator can't be accomplished with device surface closely connected.Conventional processing method is to strike out the cast shape with aluminium sheet, is compressed on the diode again, and its processing charges are higher, are difficult for volume production, and another kind is to increase the element internal space, the cooling of giving free rein to, and its DeGrain, and increase manufacturing cost.
Summary of the invention
In order to solve the problems referred to above that exist in the prior art, the present invention proposes a kind of heat dissipating method and special-purpose fin of new power-type diode, and concrete technical scheme is following:
A kind of heat dissipating method of new power-type diode directly is wrapped in the outside of diode body with heat carrier, utilizes the heat carrier heat radiation; This heat carrier is columnar overall structure; The heat carrier inwall matches with the diode external form, makes cylindrical heat conductor can be closely connected peripheral at diode; Said cylindrical heat conductor outer wall is provided with a plurality of axial evenly distributed fins around cylindrical heat conductor, and the length direction of fin is axially identical with cylindrical heat conductor.
Said cylindrical heat conductor is provided with one with cylindrical axial identical and through the axial opening of heat carrier; The angle [alpha] of opening is less than 45 degree, and circle tube inner wall and power diode must closely cooperate, and the circle tube inner wall diameter is slightly less than the power diode diameter.Because middle opening radiator when mounted can form elasticity by nature, deformation is close to around the diode.When said cylindrical heat conductor was installed on the diode, opening was towards diode below, promptly with user mode under the suffered gravity direction of diode in opposite directions, can under user mode, not influence the absorption of opening like this to the heat carrier heat.
All be provided with detent projection on each fin, this convexity can make heat distributed more fully through the fin length direction.Detent projection on each fin has a plurality of, and a plurality of detent projection are arranged in parallel.A plurality of detent projection on each fin, along said cylindrical heat conductor radially, from inside to outside; Spacing becomes greatly successively, and promptly protruding density diminishes, and can adapt to the distribution of heat on the heat carrier like this; At the temperature higher position better radiating effect is arranged; The lower from cost consideration, also can obtain better result with less material.
Said fin is perpendicular to the outer wall of cylindrical heat conductor, and this mode makes the air channel better effects if.Through experiment, under other structure same cases, fin becomes 30 degree angles with the outer wall of cylindrical heat conductor, and radiating efficiency is 5 ℃/20s; 60 degree angles, radiating efficiency are 7 ℃/20s; An angle of 90 degrees, radiating efficiency are 11 ℃/20s.
The height of said a plurality of fins is different, low more with the near more fin height of said extended distance; The height of a plurality of fins according to itself and extended distance from the near to the remote, successively from low to high.The quantity of the detent projection on the said fin is corresponding with the height of fin, and promptly fin is high more, and the quantity of detent projection is many more.These two kinds of structural portion can make at the diode heat distributes on the direction, and radiating effect is better.
The present technique scheme can also be used for the heat radiation of the similar electronic product of other shapes except being applied to power-type diode.
Much more compared with prior art, the present technique scheme has solved the heat dissipation problem of power-type diode, need not radiator fan etc., also in encapsulation, do and to design because of heat dissipation problem without Chip Packaging producer.In addition, the present technique scheme is simple, can make required fin with current material and equipment.
Description of drawings
Fig. 1 is the radial section sketch map of fin among the embodiment.
Fig. 2 is the axial sides sketch map of fin among the embodiment.
Embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is described further.
A kind of heat dissipating method of new power-type diode directly is wrapped in the outside of diode body with heat carrier, utilizes the heat carrier heat radiation, and in this example, this heat carrier is a fin, and this fin is columnar overall structure; The heat carrier inwall matches with the diode external form, makes cylindrical heat conductor can be closely connected peripheral at diode; Said cylindrical heat conductor outer wall is provided with a plurality of axial evenly distributed fins 1 around cylindrical heat conductor, and the length direction of fin 1 is axially identical with cylindrical heat conductor; A plurality of fins constitute the air channel; Said cylindrical heat conductor is provided with one with cylindrical axial identical and through the axial opening 3 of heat carrier; The opening angle α of opening 3 is less than 45 degree; Said fin 1 is perpendicular to the outer wall of cylindrical heat conductor.
All be provided with detent projection 3 on each fin 1, this convexity 3 is through fin 1 length direction; Detent projection 3 on each fin 1 has a plurality of, and a plurality of detent projection 3 are arranged in parallel; A plurality of detent projection on each fin 1 along said cylindrical heat conductor radially, from inside to outside, it is big that spacing becomes successively; The quantity of the detent projection 3 on the said fin 1 is corresponding with the height of fin 1, and promptly fin 1 is high more, and the quantity of detent projection 3 is many more; The height of said a plurality of fins is different: along diode short transverse under the user mode, the position is low more, and corresponding fin 1 is low highly more, and promptly according to its position from low to high, the height of a plurality of fins is increased by low successively gradually.
The a direction is said axial among Fig. 2.
Claims (9)
1. the heat dissipating method of a power-type diode is the outside that directly is wrapped in the diode body with heat carrier, utilizes the heat carrier heat radiation; This heat carrier is columnar overall structure; The heat carrier inwall matches with the diode external form, makes cylindrical heat conductor can be closely connected peripheral at diode; Said cylindrical heat conductor outer wall is provided with a plurality of axial evenly distributed fins around cylindrical heat conductor, and the length direction of fin is axially identical with cylindrical heat conductor; A plurality of fins constitute the air channel, it is characterized in that said cylindrical heat conductor is provided with one with cylindrical axial identical and through the axial opening of heat carrier; The angle [alpha] of opening is less than 45 degree.
2. according to the heat dissipating method of the said power-type diode of claim 1, when it is characterized in that said cylindrical heat conductor is installed on the diode, opening is towards the diode below, promptly with user mode under the suffered gravity direction of diode identical.
3. according to the heat dissipating method of the said power-type diode of claim 2, it is characterized in that all being provided with detent projection on each fin, this convexity is through the fin length direction.
4. according to the heat dissipating method of the said power-type diode of claim 3, it is a plurality of to it is characterized in that detent projection on each fin has, and a plurality of detent projection are arranged in parallel; A plurality of detent projection on each fin, along said cylindrical heat conductor radially, from inside to outside, it is big that spacing becomes successively.
5. according to the heat dissipating method of the said power-type diode of claim 4, it is characterized in that the outer wall of said fin perpendicular to cylindrical heat conductor.
6. according to the heat dissipating method of the said power-type diode of claim 5; The height that it is characterized in that said a plurality of fins is different: along diode short transverse under the user mode; The position is low more; Corresponding fin height is low more, and promptly according to its position from low to high, the height of a plurality of fins is increased by low successively gradually.
7. according to the heat dissipating method of the said power-type diode of claim 6, it is characterized in that the quantity of the detent projection on the said fin is corresponding with the height of fin, promptly fin is high more, and the quantity of detent projection is many more.
8. special-purpose fin of realizing the arbitrary said method of claim 1～7, this fin of its characteristic is columnar overall structure; The fin inwall matches with the diode external form, makes the cylindrical shape fin can be closely connected peripheral at diode; Said cylindrical shape fin outer wall is provided with a plurality of axial evenly distributed fins around the cylindrical shape fin, and the length direction of fin is axially identical with the cylindrical shape fin; A plurality of fins constitute the air channel; Said cylindrical shape fin is provided with one with cylindrical axial identical and through the axial opening of fin; The angle [alpha] of opening is less than 45 degree; Said fin is perpendicular to the outer wall of cylindrical shape fin.
9. said according to Claim 8 fin is characterized in that all being provided with detent projection on each fin, and this convexity is through the fin length direction; Detent projection on each fin has a plurality of, and a plurality of detent projection are arranged in parallel; A plurality of detent projection on each fin, along said cylindrical shape fin radially, from inside to outside, it is big that spacing becomes successively; The quantity of the detent projection on the said fin is corresponding with the height of fin, and promptly fin is high more, and the quantity of detent projection is many more; The height of said a plurality of fins is different: along diode short transverse under the user mode, the position is low more, and corresponding fin height is low more, and promptly according to its position from low to high, the height of a plurality of fins is increased by low successively gradually.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101477096A CN101853821B (en) | 2010-04-15 | 2010-04-15 | Cooling method of power-type diode and special cooling fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101477096A CN101853821B (en) | 2010-04-15 | 2010-04-15 | Cooling method of power-type diode and special cooling fin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101853821A CN101853821A (en) | 2010-10-06 |
| CN101853821B true CN101853821B (en) | 2012-05-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010101477096A Expired - Fee Related CN101853821B (en) | 2010-04-15 | 2010-04-15 | Cooling method of power-type diode and special cooling fin |
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Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7096678B2 (en) * | 2004-09-01 | 2006-08-29 | Gelcore Llc | Method and apparatus for increasing natural convection efficiency in long heat sinks |
| CN101451697B (en) * | 2007-12-07 | 2010-08-25 | 富准精密工业(深圳)有限公司 | LED lamp |
| CN201681824U (en) * | 2010-04-15 | 2010-12-22 | 镇江市东亚电子散热器有限公司 | Radiating fin for power-type diode |
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| CN101853821A (en) | 2010-10-06 |
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