CN101852928A - Removal method of anisotropic conductive adhesive of liquid crystal display - Google Patents
Removal method of anisotropic conductive adhesive of liquid crystal display Download PDFInfo
- Publication number
- CN101852928A CN101852928A CN200910048878A CN200910048878A CN101852928A CN 101852928 A CN101852928 A CN 101852928A CN 200910048878 A CN200910048878 A CN 200910048878A CN 200910048878 A CN200910048878 A CN 200910048878A CN 101852928 A CN101852928 A CN 101852928A
- Authority
- CN
- China
- Prior art keywords
- anisotropy conductiving
- conductiving glue
- lcd
- removal method
- lytic agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Liquid Crystal (AREA)
Abstract
The invention relates to a removal method of an anisotropic conductive adhesive of a liquid crystal display, which at least comprises the followings steps: coating an anisotropic conductive adhesive solvent at a pressing area of two elements, so that the anisotropic conductive adhesive solvent is permeated into the anisotropic conductive adhesive so as to dissolve the anisotropic conductive adhesive and form a dissolving area; tearing the dissolving area so as to allow the dissolved anisotropic conductive adhesive to be exposed; scraping and removing the dissolved anisotropic conductive adhesive with a scraper, and allowing the undissolved anisotropic conductive adhesive to be exposed; and repeating the steps until the two elements are fully separated.
Description
Technical field
The invention relates to a kind of removal method of anisotropy conductiving glue of LCD, especially, the invention relates to a kind of method of using lytic agent to remove the LCD anisotropy conductiving glue.
Background technology
Along with electronic product towards gently, thin, short, littleization fast development, various portable electric products are LCD (Liquid Crystal Display nearly all; LCD) as display panel, particularly shooting with video-corder projector, mobile computer, on the products such as mobile phone or personal digital assistant device, LCD has been important composition assembly.LCD is except liquid crystal panel, in the control purposes of its peripheral necessary interlock chip for driving as display signal.Generally speaking, the interface engagement technique of liquid crystal panel and drive IC system is broadly divided into following several: the automatic coating technique of coil type crystal grain (Tape Automated Bonding; TAB), crystal grain-glass bond technology (Chip on Glass; COG), crystal grain-soft board joining technique (Chip on Flex; COF).But above-mentioned no matter which kind of engagement technique, all need press and technology in use anisotropy conductiving glue (Anisotropic Conductive Film; ACF) as the intermediary that connects two components and parts, thereby in final product, be easy to produce, such is had the LCD product of defective, pressing again after factory often needs it is removed photoresist such as circuit short circuit or disconnecting equipressure and defective.
The existing technology of removing photoresist, be by heat gun to ACF glue spot heating, make it softening, progressively strike off the ACF glue that has softened by a hard scraping blade then, as shown in Figure 1.Wherein liquid crystal module 10 comprises substrate 101, external circuits plate 102, anisotropy conductiving glue 103.After 11 pairs of anisotropy conductiving glue 103 spot heating of heat gun, strike off this part anisotropy conductiving glue with scraping blade 12, thereby reach the purpose of separating base plate and peripheral circuit plate.
Yet, the above-mentioned technology of removing photoresist, because heat gun can only carry out spot heating to ACF, and the ACF after softening still has certain clinging power, when striking off with scraping blade, be easy to the pin of substrate or circuit board is partly formed damage, whole liquid crystal module is scrapped, form the waste of industrial cost.
Summary of the invention
In view of this, purpose of the present invention is exactly the removal method at the anisotropy conductiving glue that a kind of LCD is provided, and makes in LCD heavy industry process, guarantees can not form damage to liquid crystal module after ACF tears glue open.
According to purpose of the present invention, a kind of anisotropy conductiving glue removal method of LCD is proposed, this method comprises at least: the pressing zone at two elements applies the anisotropy conductiving glue lytic agent, make this anisotropy lytic agent infiltrate this anisotropy conductiving glue, dissolving this part anisotropy conductiving glue, and form dissolve area; Tear this dissolve area, to expose the anisotropy conductiving glue that those have dissolved; Strike off the anisotropy conductiving glue that those have dissolved with scraper, and expose those undissolved anisotropy conductiving glues; Repeat above-mentioned steps, until this two elements is separated fully.
The present invention is elaborated with specific embodiment below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 be in the known techniques liquid crystal module tear the glue synoptic diagram open.
Fig. 2 is a liquid crystal module structural drawing of the present invention.
Fig. 3 is a kind of embodiment synoptic diagram of coating ACF lytic agent of the present invention.
Fig. 4 is the synoptic diagram of the ACF of striking off of the present invention.
Fig. 5 is the another kind of embodiment synoptic diagram of coating ACF lytic agent of the present invention
Fig. 6 is the liquid crystal module of the present invention synoptic diagram that removes photoresist.
Embodiment
Below in conjunction with embodiment the present invention is elaborated.Please refer to Fig. 2, Fig. 2 is a liquid crystal module structural drawing of the present invention, and wherein liquid crystal module 21 comprises substrate 211, flexible PCB (FlexiblePrinted Circuit; FPC) 212 and the ACF glue 213 of adhesive base plate 211 and FPC212.During operation, need FPC212 is turned down up along dotted line, to expose ACF glue 213.
Fig. 3 is the synoptic diagram according to first embodiment of coating ACF lytic agent of the present invention.As shown in Figure 3, be stained with the ACF lytic agent at an end of cotton rod or non-dust cloth 22, its Main Ingredients and Appearance is alcohol, formic acid and surfactant.This lytic agent is coated to makes its reaction dissolving on the ACF glue 213.Use scraper 23 to strike off the ACF glue of this dissolving then, as shown in Figure 4.
Fig. 5 is the synoptic diagram of the another kind of embodiment of coating ACF lytic agent of the present invention.Wherein, after use dropper 24 is drawn lytic agents, be instilled on the ACF glue 213 outside being exposed to and make its dissolving.
Fig. 6 uses the liquid crystal module of the present invention synoptic diagram that removes photoresist, please in conjunction with Fig. 3, Fig. 4 reference in the lump.At first FPC is folded to the substrate top, exposed portions serve ACF glue.The cotton rod 22 that use speckles with lytic agent is coated to this lytic agent on the ACF glue, treat its reaction dissolving after, tear this part pressure that has not had viscous force and zone, strike off the ACF glue that has dissolved with scraper then, undissolved ACF glue continues to be exposed simultaneously.Repeat above-mentioned steps, until peeling off FPC212 and substrate 211 fully.At last FPC212 and the substrate 211 peeled off are done inspection, to guarantee that in the process of removing photoresist this two elements does not sustain damage because of pullling or scratching.
Though it should be noted that only mentioning FPC in the literary composition directly is connected with substrate, between FPC and pcb board as long as utilization ACF, can peel off with method of the present invention as two bonding circuit components.
In sum, the method of the anisotropy conductiving glue of removal LCD provided by the invention, be to utilize on anisotropy conductiving glue, to apply lytic agent, make its reaction dissolving, thereby lose original viscous force, utilize scraper to remove ACF glue fully again, thereby realize can not producing the mode of removing photoresist of damage element.
By the above detailed description of preferred embodiments, hope can be known description feature of the present invention and spirit more, and is not to come claim scope of the present invention is limited with above-mentioned disclosed preferred embodiment.On the contrary, its objective is that hope can contain in the scope of claim of being arranged in of various changes and tool equality institute of the present invention desire application.
Claims (6)
1. the anisotropy conductiving glue removal method of a LCD is characterized in that:
This method comprises at least:
Apply the anisotropy conductiving glue lytic agent in the pressing of two elements zone, make this anisotropy lytic agent infiltrate this anisotropy conductiving glue, dissolving this part anisotropy conductiving glue, and form dissolve area;
Tear this dissolve area, to expose the anisotropy conductiving glue that those have dissolved;
Strike off those with scraper and dissolved anisotropy conductiving glue, and expose those undissolved anisotropy conductiving glues;
Repeat above-mentioned steps, until this two elements is separated fully.
2. the anisotropy conductiving glue removal method of LCD as claimed in claim 1 is characterized in that: the principal ingredient of described lytic agent is alcohol, formic acid and surfactant.
3. the anisotropy conductiving glue removal method of LCD as claimed in claim 1, it is characterized in that: the method for described coating anisotropy conductiving glue lytic agent is after picking this lytic agent with cotton rod or non-dust cloth, to be coated on this anisotropy conductiving glue.
4. the anisotropy conductiving glue removal method of LCD as claimed in claim 1, it is characterized in that: the method for described coating anisotropy conductiving glue lytic agent is after drawing this lytic agent with dropper, to be instilled on this anisotropy conductiving glue.
5. the anisotropy conductiving glue removal method of LCD as claimed in claim 1 is characterized in that: the regional pressing zone for flexible PCB and printed circuit board (PCB) of described two elements pressing, perhaps the pressing zone of flexible PCB and glass substrate.
6. the anisotropy conductiving glue removal method of LCD as claimed in claim 1 is characterized in that: after separating two elements, tested in the former pressing zone of this two elements, have or not the situation of scratch with inspection.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910048878A CN101852928A (en) | 2009-04-01 | 2009-04-01 | Removal method of anisotropic conductive adhesive of liquid crystal display |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910048878A CN101852928A (en) | 2009-04-01 | 2009-04-01 | Removal method of anisotropic conductive adhesive of liquid crystal display |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101852928A true CN101852928A (en) | 2010-10-06 |
Family
ID=42804480
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910048878A Pending CN101852928A (en) | 2009-04-01 | 2009-04-01 | Removal method of anisotropic conductive adhesive of liquid crystal display |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101852928A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103412418A (en) * | 2013-07-15 | 2013-11-27 | 彩虹(佛山)平板显示有限公司 | LCM reworking method |
-
2009
- 2009-04-01 CN CN200910048878A patent/CN101852928A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103412418A (en) * | 2013-07-15 | 2013-11-27 | 彩虹(佛山)平板显示有限公司 | LCM reworking method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104698689B (en) | A kind of anisotropic conductive film, display device and its repair method | |
CN100397160C (en) | Method for recovering poor product ni packaging technique of liquid crystal module with anisotropic conducting film | |
CN101281303A (en) | Method for restoring LCD module short circuit | |
TWI558570B (en) | Display apparatus, fabricating method thereof and optical adhesive | |
CN101852928A (en) | Removal method of anisotropic conductive adhesive of liquid crystal display | |
CN105307416B (en) | A kind of flexible board device recovery method and reclaimer | |
CN102455527B (en) | LCD (liquid crystal display) module recovery method | |
CN103745663A (en) | Easy-dismantling display device | |
CN100498447C (en) | Assembling method for LCD module group | |
JP2001242448A (en) | Method of removing polarizing plate and method of manufacturing liquid crystal device by using the method | |
CN101666929B (en) | Press fit device | |
CN105700207A (en) | Preparation method of frame adhesive curing rate test sample and frame adhesive curing rate testing method | |
CN100504417C (en) | Multifunctional detecting platform for liquid crystal display panel and its detecting method | |
US20090078454A1 (en) | Electronic circuit connecting structure of flat display panel substrate | |
CN1996113A (en) | Method for removing protective film of polarization plate | |
TWI484251B (en) | The heavy method of the display device | |
KR101524975B1 (en) | Tool for chip-removal | |
CN1826048B (en) | Method for binding IC chip and flexible circuitboard on panel display | |
KR101416582B1 (en) | A device for bonding double sided fpcb and a method thereof | |
CN104470238A (en) | Modifying method for hot pressed golden finger warping of repaired flexible printed circuit board | |
JP2009036894A (en) | Flexible substrate separator for display panel | |
CN104570442A (en) | Assembly method of liquid-crystal display device | |
CN220473819U (en) | Structure of three-section type tearing release film | |
JP2011039116A (en) | Device and method for mounting fpd panel | |
CN108519690A (en) | A kind of softening agent and liquid crystal cell method for splitting |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20101006 |