CN101849444B - 平板天线部件以及具备其的等离子体处理装置 - Google Patents

平板天线部件以及具备其的等离子体处理装置 Download PDF

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Publication number
CN101849444B
CN101849444B CN2009801009072A CN200980100907A CN101849444B CN 101849444 B CN101849444 B CN 101849444B CN 2009801009072 A CN2009801009072 A CN 2009801009072A CN 200980100907 A CN200980100907 A CN 200980100907A CN 101849444 B CN101849444 B CN 101849444B
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China
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center
openings
flat antenna
antenna member
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Expired - Fee Related
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CN2009801009072A
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English (en)
Chinese (zh)
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CN101849444A (zh
Inventor
植田笃
足立光
田才忠
福田良则
本乡俊明
吉冈正雄
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/3222—Antennas

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
CN2009801009072A 2008-03-14 2009-03-13 平板天线部件以及具备其的等离子体处理装置 Expired - Fee Related CN101849444B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-065635 2008-03-14
JP2008065635A JP2009224455A (ja) 2008-03-14 2008-03-14 平面アンテナ部材およびこれを備えたプラズマ処理装置
PCT/JP2009/054922 WO2009113680A1 (ja) 2008-03-14 2009-03-13 平面アンテナ部材、及び、これを備えたプラズマ処理装置

Publications (2)

Publication Number Publication Date
CN101849444A CN101849444A (zh) 2010-09-29
CN101849444B true CN101849444B (zh) 2012-08-29

Family

ID=41065337

Family Applications (1)

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CN2009801009072A Expired - Fee Related CN101849444B (zh) 2008-03-14 2009-03-13 平板天线部件以及具备其的等离子体处理装置

Country Status (5)

Country Link
US (1) US20110114021A1 (enExample)
JP (1) JP2009224455A (enExample)
KR (1) KR20100122894A (enExample)
CN (1) CN101849444B (enExample)
WO (1) WO2009113680A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI693100B (zh) 2014-05-16 2020-05-11 美商應用材料股份有限公司 噴頭組件及處理腔室

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8884526B2 (en) 2012-01-20 2014-11-11 Taiwan Semiconductor Manufacturing Co., Ltd. Coherent multiple side electromagnets
CN103647128B (zh) * 2013-12-23 2016-05-11 西南交通大学 一种高功率径向线密封窗
KR20160002543A (ko) 2014-06-30 2016-01-08 세메스 주식회사 기판 처리 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3136054B2 (ja) * 1994-08-16 2001-02-19 東京エレクトロン株式会社 プラズマ処理装置
EP1439571A1 (en) * 2001-10-19 2004-07-21 Naohisa Goto DEVICE AND METHOD FOR MICROWAVE PLASMA PROCESSING, AND MICROWAVE POWER SUPPLY DEVICE
CN101036420A (zh) * 2004-10-07 2007-09-12 东京毅力科创株式会社 微波等离子体处理装置
CN101133688A (zh) * 2005-03-04 2008-02-27 东京毅力科创株式会社 微波等离子体处理装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03191073A (ja) * 1989-12-21 1991-08-21 Canon Inc マイクロ波プラズマ処理装置
JPH11251299A (ja) * 1998-03-03 1999-09-17 Hitachi Ltd プラズマ処理方法および装置
JPH11260594A (ja) * 1998-03-12 1999-09-24 Hitachi Ltd プラズマ処理装置
JP3430053B2 (ja) * 1999-02-01 2003-07-28 東京エレクトロン株式会社 プラズマ処理装置
JP4478352B2 (ja) * 2000-03-29 2010-06-09 キヤノン株式会社 プラズマ処理装置及びプラズマ処理方法並びに構造体の製造方法
JP4504511B2 (ja) * 2000-05-26 2010-07-14 忠弘 大見 プラズマ処理装置
JP4598247B2 (ja) * 2000-08-04 2010-12-15 東京エレクトロン株式会社 ラジアルアンテナ及びそれを用いたプラズマ装置
JP3914071B2 (ja) * 2002-03-12 2007-05-16 東京エレクトロン株式会社 プラズマ処理装置
JP2004235434A (ja) * 2003-01-30 2004-08-19 Rohm Co Ltd プラズマ処理装置
US6998565B2 (en) * 2003-01-30 2006-02-14 Rohm Co., Ltd. Plasma processing apparatus
US20080190560A1 (en) * 2005-03-04 2008-08-14 Caizhong Tian Microwave Plasma Processing Apparatus
JP4997826B2 (ja) * 2006-05-22 2012-08-08 東京エレクトロン株式会社 平面アンテナ部材及びこれを用いたプラズマ処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3136054B2 (ja) * 1994-08-16 2001-02-19 東京エレクトロン株式会社 プラズマ処理装置
EP1439571A1 (en) * 2001-10-19 2004-07-21 Naohisa Goto DEVICE AND METHOD FOR MICROWAVE PLASMA PROCESSING, AND MICROWAVE POWER SUPPLY DEVICE
CN101036420A (zh) * 2004-10-07 2007-09-12 东京毅力科创株式会社 微波等离子体处理装置
CN101133688A (zh) * 2005-03-04 2008-02-27 东京毅力科创株式会社 微波等离子体处理装置

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP特开平11-251299A 1999.09.17
JP特开平11-297494A 1999.10.29
JP特许第3136054号B2 2001.02.19

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI693100B (zh) 2014-05-16 2020-05-11 美商應用材料股份有限公司 噴頭組件及處理腔室

Also Published As

Publication number Publication date
KR20100122894A (ko) 2010-11-23
JP2009224455A (ja) 2009-10-01
US20110114021A1 (en) 2011-05-19
WO2009113680A1 (ja) 2009-09-17
CN101849444A (zh) 2010-09-29

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Granted publication date: 20120829

Termination date: 20140313