CN101847678A - Photoelectric conveying or receiving device and manufacture method thereof - Google Patents
Photoelectric conveying or receiving device and manufacture method thereof Download PDFInfo
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- CN101847678A CN101847678A CN200910247185A CN200910247185A CN101847678A CN 101847678 A CN101847678 A CN 101847678A CN 200910247185 A CN200910247185 A CN 200910247185A CN 200910247185 A CN200910247185 A CN 200910247185A CN 101847678 A CN101847678 A CN 101847678A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention relates to a photoelectric conveying or receiving device and a manufacture method thereof. The photoelectric conveying or receiving device comprises a substrate, a first conductive layer, a second conductive layer and a photoelectric conversion chip, wherein the substrate is provided with an upper surface and a groove and made of composite material, the groove is defined by a bottom and an inner side wall which extends upwards from the bottom to the upper surface, the first conductive layer and the second conductive layer are formed by activating the composite material of the substrate with laser, the first conductive layer is arranged at the bottom surface of the groove and extends outwards along the inner side wall of the groove and the upper surface of the substrate, the second conductive layer is electrically insulated from the first conductive layer and extends outwards along the upper surface of the substrate, and the photoelectric conversion chip is arranged on the bottom surface of the groove and respectively and electrically connected with the first conductive layer and the second conductive layer on the bottom surface.
Description
Technical field
The present invention is about photoelectricity transmission or the receiving system and the manufacture method thereof of a kind of photoelectricity transmission or receiving system and manufacture method thereof, particularly a kind of little luminous scattering angle.
Background technology
Along with making rapid progress of science and technology, for lighting device people in life increasing selection is arranged also, to fluorescent lamp, lighting device is constantly weeded out the old and bring forth the new from traditional osram lamp.Opto-electronic conversion chip in recent years, power consumption is low, component life long, need not warm up lamp time, reaction speed reaches the little advantage of volume soon because of it has, thereby its application is more and more extensive.
General known opto-electronic conversion chip is arranged on the traditional printing circuit board, and in addition circuit links, and transmits or receiving system to constitute a photoelectricity.Yet because of the characteristic of opto-electronic conversion chip, the light that it sent has bigger luminous scattering angle usually.When being applied to need to concentrate the light that be sent when being radiated at specific objective, just need to use a bowl shaped structure, with convection light.The thickness that is limited to general printed circuit board (PCB) is limited, if not expensive special thickness printed circuit board (PCB), all need usually to be provided with in addition a reflection cover on the circuit board and the opto-electronic conversion chip around.Yet this measure also significantly increases complexity and the manufacturing cost on the processing procedure.
As shown in Figure 1, for addressing the above problem, known photoelectricity transmits or receiving system 1 utilizes the injection molding mode, penetrates conduction and nonconducting plastics simultaneously, to form two conductive plastics parts 11 and to be folded in wherein a non-conductive parts of plastics 12.Thereafter, utilize the metal coating processing procedure only metal level can be plated on can conductive body characteristic, known techniques with two conductive layers 14 only plated film on above-mentioned two conductive plastics parts 11.15 of opto-electronic conversion chips be arranged at that photoelectricity transmits or a bottom of a groove 111 of receiving system 1 on, and electrically connect one of them of conductive layer 14.At last, utilize a lead 16 electrically connect opto-electronic conversion chips 15 to wherein another of conductive layer 14.By being coated with the high depth groove 111 of metal level (conductive layer 14), known photoelectricity transmits or the receiving system 1 suitable light that can concentrate opto-electronic conversion chip 15 to be sent, reaches the purpose of little luminous angle of scattering.
Need special instruction person at this, photoelectricity shown in Figure 1 transmits or receiving system 1 is made through a large amount of, conduction and nonconducting plastics that the while injection molding is one, behind above-mentioned every processing procedure, at last a plurality of photoelectricity be a strip of linking to each other are transmitted or receiving system 1 semi-finished product cut and above-mentioned photoelectricity transmits or receiving system 1, therefore two conductive plastics parts 11 only illustrate on the part of material line in Fig. 1, be formed with conductive layer 14, and draw the part that the material line is arranged, then be the face of cutting, be not formed with conductive layer 14.Therefore, (promptly whole perpendicular to the mounting plane installation) uprightly is installed, will be made photoelectricity transmission or receiving system 1 contact installed surface to cut face as if known photoelectricity transmission or receiving system 1.Yet, scolding tin or other only can combine with the conductive layer 14 of metal material as the metal material that circuit connects, cause scolding tin or other can't keep a firm hand on the face of cutting as the metal material that circuit connects, and only can be attached on the conductive layer 14 of two sides, vertically installed photoelectricity is transmitted or receiving system 1 can't be firmly only with scolding tin electrically connect or fixing, and must otherwise do further fixing again.
Above-mentioned known photoelectricity transmits or receiving system 1, it is with the injection molding processing procedure, penetrate conduction and nonconducting plastics simultaneously, forming two conductive plastics parts 11 and to be folded in wherein non-conductive parts of plastics 12, so that it is difficult to accurately control the shape of conductive plastics part 11 and non-conductive parts of plastics 12.Therefore, above-mentioned photoelectricity transmission or receiving system 1 are difficult to further minification.In view of this, providing a kind of photoelectricity to transmit or receiving system, have the characteristic that volume is little, reliability is high and luminous scattering angle is little, is the industry target demanding urgently making great efforts for this reason.
Summary of the invention
A purpose of the present invention provides a kind of photoelectricity transmission or receiving system and manufacture method thereof, makes the luminous scattering angle of this photoelectricity transmission or receiving system little, can further reduce size and improve reliability.
For reaching above-mentioned purpose, the photoelectricity of first embodiment of the invention transmits and receiving system comprises a substrate, one first conductive layer, one second conductive layer and an opto-electronic conversion chip.This substrate has a upper surface and a groove, and this groove is defined by a bottom surface and a madial wall that extends upwardly to this upper surface by this bottom surface.This person of noting, this substrate is made of a composite material, and this composite material is fitted and can be formed a conductor layer at this composite material surface by laser activation.This first conductive layer utilizes this composite material of this substrate of laser activation and forms.This first conductive layer is arranged on a first of this bottom surface of this groove, and stretches out along this madial wall of this groove and this upper surface of this substrate.This second conductive layer also utilizes this composite material of this substrate of laser activation and forms, and is electrically insulated with this first conductive layer.This second conductive layer is arranged on a second portion of this bottom surface of this groove, and stretches out along this madial wall of this groove and this upper surface of this substrate.This opto-electronic conversion chip be arranged on this bottom surface of this groove and respectively with this bottom surface of this groove on this first conductive layer and this second conductive layer electrically connect.
Make being used to of first embodiment of the invention that above-mentioned photoelectricity transmits and the manufacture method of receiving system comprises following steps: (a) provide this substrate, have this upper surface and this groove, this groove is defined by this bottom surface and by this madial wall that this bottom surface extends upwardly to this upper surface, wherein this substrate is made of composite material, and this composite material is fitted and can be formed conductor layer at this composite material surface by laser activation; (b) this upper surface of part of this first, this madial wall of part and this substrate of this bottom surface of this groove is implemented laser radiation, and form this first conductive layer; (c) this upper surface of part of this second portion, this madial wall of part and this substrate of this bottom surface of this groove is implemented laser radiation, and form this second conductive layer, wherein this second conductive layer and this first conductive layer are electrically insulated; And (d) this opto-electronic conversion chip is arranged on this bottom surface of this groove, and respectively with this bottom surface on this first conductive layer and this second conductive layer electrically connect.
For reaching above-mentioned purpose, the photoelectricity of second embodiment of the invention transmits or receiving system comprises a substrate, one first conductive layer, one second conductive layer and an opto-electronic conversion chip.This substrate has a upper surface and a groove, and this groove is defined by a bottom surface and a madial wall that extends upwardly to this upper surface by this bottom surface.This person of noting, this substrate is made by a composite material, and this composite material is fitted and can be formed a conductor layer at this composite material surface by laser activation.This first conductive layer utilizes this composite material of this substrate of laser activation and forms.This first conductive layer is arranged on this bottom surface of this groove, and stretches out along this madial wall of this groove and this upper surface of this substrate.This second conductive layer also utilizes this composite material of this substrate of laser activation and forms, and is electrically insulated with this first conductive layer.This second conductive layer is arranged on outside this bottom surface of groove, and stretches out along this upper surface of this substrate.This opto-electronic conversion chip is arranged on this bottom surface of this groove and electrically connects with this first conductive layer and this second conductive layer respectively.
Make being used to of second embodiment of the invention that above-mentioned photoelectricity transmits or the manufacture method of receiving system comprises following steps: (a) form this substrate, have this upper surface and this groove, this groove is defined by this bottom surface and by this madial wall that this bottom surface extends upwardly to this upper surface; (b) this substrate is implemented laser radiation, and form this first conductive layer, wherein this first conductive layer is formed at this bottom surface of this groove, and stretches out along this madial wall of this groove and this upper surface of this substrate; (c) this substrate is implemented laser radiation, and form this second conductive layer, wherein this second conductive layer is formed at outside this bottom surface of this groove, and stretches out and be electrically insulated with this first conductive layer along this upper surface of this substrate; (d) this opto-electronic conversion chip is arranged on this bottom surface of this groove, and electrically connects with this first conductive layer and this second conductive layer respectively.
For above-mentioned purpose of the present invention, technical characterictic and advantage can be become apparent, hereinafter be elaborated with the preferred embodiment conjunction with figs..
Description of drawings
Fig. 1 is that known photoelectricity transmits or receiving system;
Fig. 2 is the photoelectricity transmission of the first embodiment of the present invention or the stereogram of receiving system;
Fig. 3 A is the photoelectricity transmission of the first embodiment of the present invention or the front view of receiving system;
Fig. 3 B is the photoelectricity transmission of the first embodiment of the present invention or the right view of receiving system;
Fig. 3 C is the photoelectricity transmission of the first embodiment of the present invention or the rearview of receiving system;
Fig. 3 D is the photoelectricity transmission of the first embodiment of the present invention or the following view of receiving system;
Fig. 4 is that the photoelectricity of the first embodiment of the present invention transmits or the template schematic diagram of receiving system when a large amount of manufacturing;
Fig. 5 is the photoelectricity transmission of the second embodiment of the present invention or the stereogram of receiving system; And
Fig. 6 is that the photoelectricity of the second embodiment of the present invention transmits or the template schematic diagram of receiving system when a large amount of manufacturing.
[main element symbol description]
1 photoelectricity transmits or receiving system 11 conductive plastics parts
111 grooves, 12 non-conductive parts of plastics
14 conductive layers, 15 opto-electronic conversion chips
16 leads, 17 grooves
2 photoelectricity transmit or receiving system 21 substrates
210 upper surfaces, 211 grooves
212 pads, 213 sides
214 lower surfaces, 22 laser treated region
23 non-conductive districts, 241 first conductive layers
242 second conductive layers, 25 opto-electronic conversion chips
26 leads, 28 templates
5 photoelectricity transmit or receiving system 51 substrates
510 upper surfaces, 511 grooves
512 pads, 513 sides
52 laser treated region, 53 non-conductive districts
541 first conductive layers, 542 second conductive layers
55 opto-electronic conversion chips, 56 leads
57 grooves, 58 templates
D depth H thickness
L length W width
Embodiment
Photoelectricity of the present invention transmits or receiving system utilizes molded interconnection element laser guidance structure (MoldedInterconnect Device-Laser Direct Structure, MID-LDS) photoelectricity of made small size, high-reliability and the little luminous scattering angle of technology transmits or receiving system.So-called MID-LDS is a kind of processing procedure of molded case circuit, its employed carrier is a composite of using a kind of special doping metals atom, and carrier is via laser radiation, bond in the composite between contained metallic atom can be interrupted by laser, cause the metal tape electric charge and possess the bond attraction, therefore, after metallizing, can form metal level on the surface of laser treatment.
Use above-mentioned MID-LDS technology, the photoelectricity of first embodiment of the invention transmits or the structure of receiving system 2 please refer to Fig. 2.Photoelectricity transmission of the present invention or receiving system 2 comprise distinguishes 22, one a non-conductive district 23 and an opto-electronic conversion chip 25 in a substrate 21, the dual-laser place.Substrate 21 has a upper surface 210 and is formed with a groove 211, and groove 211 is defined by a bottom surface 211a and a madial wall 211b who is connected with the upper surface 210 of bottom surface 211a and substrate 21.Opto-electronic conversion chip 25 is arranged on the bottom surface 211a of groove 211, and opto-electronic conversion chip 25 for example is a light-emitting diode chip for backlight unit or a light sensation chip.
Opto-electronic conversion chip 25 is arranged on the bottom surface 211a of groove 211, and electrically connects with first conductive layer 241 of groove 211 and second conductive layer 242.In addition, be noted that, first conductive layer 241 on the 211a of the bottom surface of groove 211 can for example be a crystal bonding area, opto-electronic conversion chip 25 is arranged on the crystal bonding area and with crystal bonding area and electrically connects, and second conductive layer 242 can for example be a routing district, therefore, opto-electronic conversion chip 25 can electrically connect with the routing district by a lead 26.Because lead 26 of the present invention is by second conductive layer 242 on the bottom surface 211a of routing processing procedure electric connection opto-electronic conversion chip 25 and groove 211, therefore, finish solid brilliant routing processing procedure at the bottom surface of groove 211 211a, do not need the routing district is arranged on outside the groove 211 as known techniques, so the light shape that photoelectricity of the present invention transmits or receiving system produces is preferable, and compared to known techniques, because lead 26 distance is short, therefore not easy fracture and reliability height.In addition, a sealing (figure does not show) is arranged in the groove 211, and coats opto-electronic conversion chip 25 and lead 26, and sealing has the effect of support wire 26 and protection opto-electronic conversion chip 25 and lead 26.
In addition, first conductive layer 241 of the present invention and second conductive layer 242 are sandwich construction.Wherein, first conductive layer 241 and second conductive layer 242 respectively comprise a copper plate, a nickel coating and a Gold plated Layer in regular turn.Copper plate is formed on the laser treated region 22 on the substrate 21 with the plated film processing procedure, and nickel coating then is formed on the copper plate so that electroplating process is corresponding, and Gold plated Layer is formed on the nickel coating so that electroplating process is corresponding.
Please refer to Fig. 2 to Fig. 3 d, wherein the present invention is by the MID-LDS processing procedure, and utilize laser radiation in be laser treated region 22 with first conductive layer 241 and second conductive layer 242 of growing up, and make photoelectricity of the present invention transmit or receiving system 2 can accurately be controlled the position that conductive layer is grown up.Utilize the injection molding technology compared to known photoelectricity transmission or receiving system 1, be difficult to accurately control the shaping of conductive plastics part 11 and non-conductive parts of plastics 12, and further minification, photoelectricity transmission of the present invention or receiving system 2 not only size can further reduce, more because the reduction of size, transmit or receiving system 1 compared to known photoelectricity, photoelectricity of the present invention transmits or the lead 26 of receiving system 2 can more shorten.Point glue is on lead 26 time, dimension reduction and more easy, and lead 26 easy fracture more not.
As shown in Figure 1, because of known photoelectricity transmits or a large amount of manufacturing of receiving system 1 warp, the semi-finished product that conduction of injection molding and plastics dielectric material insert and put mutually behind every processing procedure, cut shaping at last again.Therefore, cut and be not formed with conductive layer 14 on the face, known photoelectricity is transmitted or receiving system 1 when upright installation (promptly whole install) perpendicular to mounting plane, only can fix with the conductive layer 14 and the scolding tin of two sides.Yet photoelectricity of the present invention transmits or receiving system 2 is used the MID-LDS processing procedure, and therefore laser radiation accurately can break through the injection molding processing procedure restriction of known photoelectricity transmission or receiving system 1.Photoelectricity of the present invention transmits or receiving system 2 can design the face of cutting two sides in about photoelectricity transmission or receiving system 2, makes the side 213 that is connected with the upper surface 210 of substrate 21 be subjected to the irradiation of laser, and is formed with pad 212.By this, photoelectricity transmits or receiving system 2 can utilize the pad 212 that is positioned at side 213 and weldering invests on the printed circuit board (PCB) (figure does not illustrate), so that vertical installation photoelectricity of the present invention transmits or receiving system 2, become a Quartering shot type photoelectricity by this and transmit or receiving system 2.
In addition, first conductive layer 241 and second conductive layer 242 may extend to the lower surface 214 with respect to upper surface 210 of substrate 21, shown in Fig. 3 C.By this, photoelectricity of the present invention transmits or receiving system 2 is suitable for lower surface 214 formation pads 212 to weld with a printed circuit board (PCB) (figure does not illustrate), and the opening of groove 211 is made progress, and therefore, photoelectricity transmits or receiving system 2 can be provided with up.In addition, greatly increase, therefore, significantly increase affixed stability owing to link the affixed area of material with other circuit.
Please continue to consult shown in Fig. 3 A to Fig. 3 D, by the MID-LDS processing procedure, photoelectricity transmit or receiving system 2 compared to known techniques size reduction significantly, and the groove 211 by high-aspect-ratio (aspect ratio) transmits photoelectricity or the luminous scattering angle of receiving system 2 significantly dwindles.Transmit or receiving system 1 with respect to known photoelectricity, photoelectricity of the present invention transmits or receiving system 2 is applied to how different miniaturized devices.In a practical application, photoelectricity transmits or the receiving system 2 suitable signals that can be applicable to remote controller transmit recipient.
Preferably, photoelectricity transmits or the groove 211 of receiving system 2 has a depth D that is essentially 1.145mm.Substrate 21 has a length L, a width W and is parallel to a thickness H of the depth D of groove 211.Preferably, length L is essentially 2.3mm, and width W is that 2.25mm and thickness H are 1.6mm.This person of noting, photoelectricity of the present invention transmits or the aforementioned dimensions of receiving system 2 is not in order to limit scope of the present invention, is of the present invention one preferable enforcement aspect only, has same concept person of the present invention, does not limit at this.
The present invention is used to make the photoelectricity transmission described in first embodiment or the manufacture method of receiving system 2, and referring again to Fig. 2, at first execution in step (a) provides a substrate 21, and substrate 21 has a upper surface 210 and is formed with a groove 211.Groove 211 is to reach the madial wall 211b that is connected with the upper surface 210 of bottom surface 211a and substrate 21 by bottom surface 211a to be defined.Substrate 21 is made by composite material, and by laser activation, can form a conductor layer at composite material surface.In step (a), be a large amount of manufacturings, the applied composite material of MID-LDS is injected a mould (figure does not show), and be shaped just like a template 28 shown in Figure 4.Template 28 comprises a plurality of substrates 21 that in a row link to each other, and each substrate 21 has groove 211.Template 28 after successive process is handled, after cut, become the present invention each independently photoelectricity transmit or receiving system 2.
After the step (a), execution in step (b).In step (b), to the bottom surface 211a of part groove 211 first partly, the part upper surface 210 of part madial wall 211b and substrate 21 implements laser radiations, and forms first conductive layer 241.Moreover, in step (c), the second portion of the bottom surface 211a of groove 211, the madial wall 211b of another part and the upper surface 210 of substrate 21 another part are implemented laser radiations, and form second conductive layer 242.Need illustrate that at this step (b) and step (c) are preferably carried out simultaneously, that is simultaneously dual-laser treatment region 22 be implemented laser radiations, and form first conductive layer 241 and second conductive layer 242 simultaneously in above-mentioned laser treated region 22.In addition, first conductive layer 241 and second conductive layer 242 can extend on the side 213 of substrate 21 and form pad 212, and wherein side 213 is connected with the upper surface 210 of substrate 21, so that vertical installation photoelectricity transmission of the present invention or receiving system 2.Perhaps, shown in Fig. 3 C, first conductive layer 241 and second conductive layer 242 may extend to the lower surface 214 with respect to the upper surface 210 of substrate 21, to weld with a printed circuit board (PCB) (figure does not illustrate).
Wherein, pass through the bottom surface 211a of grooves 211 downwards from the upper surface 210 of substrate 21 without the non-conductive district 23 of laser radiation, upwards extend to the upper surface 210 of substrate 21 again towards the madial wall 211b of groove 211 along the bottom surface 211a of groove 211, therefore, non-conductive district 23 divides into first conductive layer 241 and second conductive layer 242 with laser treated region 22, and is electrically insulated each other.
In step (b), the detailed formation step of first conductive layer 241 is as follows: (b1) change plating one copper plate on the laser treated region 22 wherein on the substrate 21; (b2) electroplate a nickel coating on copper plate; (b3) electroplate a Gold plated Layer on nickel coating.In the same manner, in step (c), the detailed formation step of second conductive layer 242 is as follows: (c1) change plating one copper plate on another laser treated region 22 on the substrate 21; (c2) electroplate a nickel coating on copper plate; (c3) electroplate a Gold plated Layer in nickel coating.Preferably, in step (b) and the step (c), two copper plates of first conductive layer 241 and second conductive layer 242 form simultaneously, and two nickel coatings form simultaneously, and two Gold plated Layer form simultaneously.
After forming first conductive layer 241 and second conductive layer 242, in step (d), an opto-electronic conversion chip 25 is arranged on the bottom surface 211a of groove 211, and respectively with the bottom surface 211a of groove 211 on first conductive layer 241 and second conductive layer 242 electrically connect.
In step (d) afterwards, manufacture method of the present invention more comprises step (e) enforcement one manufacture procedure of adhesive to coat opto-electronic conversion chip 25 and lead 26.Owing to lead 26 distances reduce, correspondingly the length of the sealing that must coat reduces thereupon, therefore transmits or receiving system 1 compared to known photoelectricity, the simpler and easy and also more increase of reliability of the some glue processing procedure of photoelectricity transmission of the present invention or receiving system 2.
After finishing above-mentioned processing procedure, carry out one at last and cut processing procedure, make each photoelectricity transmission or receiving system 2 on the template 28 that is formed at as shown in Figure 4 cut separately, form the present invention's photoelectricity as shown in Figure 2 at last and transmit or receiving system 2.The formed photoelectricity of manufacture method of the present invention transmits or receiving system 2, and its detailed dimensions such as above-mentioned is not given unnecessary details at this.Wherein, in the present invention, above-mentionedly cut the bearing of trend that direction is parallel to non-conductive district 23.By this, a plurality of photoelectricity that cut out transmit or receiving system 2, when vertical installation, are formed with the pad 212 of first conductive layer 241 and second conductive layer 242 on its side 213, and it all can combine with scolding tin or other metal bond material.Pad 212 more can extend to the lower surface 214 of substrate 21 with respect to upper surface 210 from first conductive layer 241 and second conductive layer 242, therefore when horizontal installation, photoelectricity transmits or receiving system 2 suitable following surfaces 214 are engaged in printed circuit board (PCB), makes groove 211 open front face up.Therefore, transmit or receiving system 1 compared to known photoelectricity, photoelectricity transmits or receiving system 2 can more firmly be fixed.The detailed structure of above-mentioned first embodiment does not limit photoelectricity of the present invention and transmits or receiving system, and main purpose of the present invention still is the The Application of Technology in conjunction with MID-LDS.
Please refer to Fig. 5, it describes photoelectricity transmission of second embodiment of the invention or the structure of receiving system 5.With first embodiment similarly, photoelectricity transmits or receiving system 5 comprises and distinguishes 52, one a non-conductive district 53 and an opto-electronic conversion chip 55 in a substrate 51, the dual-laser place.Substrate 51 has a upper surface 510 and is formed with a groove 511, groove 511 is to extend upwardly to the madial wall 511b that the upper surface 510 of substrate 51 is connected by a bottom surface 511a and by bottom surface 511a to be defined, opto-electronic conversion chip 55 is arranged on the bottom surface 511a of groove 511, and opto-electronic conversion chip 55 can be that a light-emitting diode chip for backlight unit, a light sensation chip or the two function have concurrently.Wherein, the element that in second embodiment, repeats, it acts on all with identical described in first embodiment, repeats no more in this.So, the difference part is the position that (one) conductive layer is provided with; And (two) substrate 51 more comprises a groove 57.
Specifically, as before described in first embodiment, substrate 51 is also made by the applied composite of above-mentioned MID-LDS, and composite comprises and mixes as metallic atoms such as copper.And after laser treatment, form dual-laser treatment region 52 and non-conductive district 53 in substrate 51.Wherein, non-conductive district 53 divides into two electrical opposite conductive layers with laser treated region 52.Must the person of paying special attention to, be that with the first embodiment difference first conductive layer 541 is arranged at the bottom surface 511a of groove 511, and preferably first conductive layer 541 is covered with in the bottom surface of groove 511 511a; Second conductive layer 542 is arranged at outside the bottom surface 511a of groove 511 at least, on the upper surface 510 of substrate 51, and preferably second conductive layer 542 be arranged at groove 511 all outside.
Similarly, opto-electronic conversion chip 55 is arranged on the bottom surface 511a of groove 511, and electrically connects with first conductive layer, 541 second conductive layers 542 of groove 511.In detail, first conductive layer 541 on the 511a of the bottom surface of groove 511 can for example be a crystal bonding area, opto-electronic conversion chip 55 is arranged on the crystal bonding area and with crystal bonding area and electrically connects, and second conductive layer 542 can for example be a routing district, therefore, opto-electronic conversion chip 55 can electrically connect with the routing district by a lead 56.Yet, different with first embodiment be in, the upper surface 510 of the substrate 51 among second embodiment more forms a groove 57, and it is in order to link groove 511 and routing district (that is second conductive layer 542), and wherein lead 56 links opto-electronic conversion chip 55 and routing district via groove 57.
Similar in appearance to first embodiment, the photoelectricity of second embodiment of the invention transmits or receiving system 5 also can design the face of cutting two sides in about photoelectricity transmission or receiving system 5, make the side 513 that is connected with the upper surface 510 of substrate 51 be subjected to the irradiation of laser, and be formed with pad 512.By this, photoelectricity transmits or receiving system 5 can utilize the pad 512 that is positioned at side 513 and weldering invests on the printed circuit board (PCB) (figure does not illustrate), so that vertical installation photoelectricity of the present invention transmits or receiving system 5, become a Quartering shot type photoelectricity by this and transmit or receiving system 5.Except that this, first conductive layer 541 and second conductive layer 542 more extend to a lower surface with respect to upper surface 510 of substrate 51.By this, photoelectricity of the present invention transmits or receiving system 5 is suitable for lower surface formation pad 512 to weld with a printed circuit board (PCB) (figure does not illustrate), and the opening of groove 511 is made progress, and therefore, the photoelectricity of second embodiment transmits or receiving system 5 can be provided with up.In addition, greatly increase, therefore, significantly increase affixed stability owing to link the affixed area of material with other circuit.
In addition, a sealing (figure does not show) also can be arranged in groove 511 and the groove 57, and coats opto-electronic conversion chip 55 and lead 56, and sealing has the effect of support wire 56 and protection opto-electronic conversion chip 55 and lead 56.Person more, first conductive layer 541 of second embodiment and second conductive layer 542 also are sandwich construction.Wherein, first conductive layer 541 and second conductive layer 542 respectively comprise a copper plate, a nickel coating and a Gold plated Layer in regular turn.Copper plate is formed on the laser treated region 52 on the substrate 51 with the plated film processing procedure, and nickel coating then is formed on the copper plate so that electroplating process is corresponding, and Gold plated Layer is formed on the nickel coating so that electroplating process is corresponding.
The present invention is used to make the photoelectricity transmission of second embodiment or the method for receiving system 5, and please equally with reference to Fig. 5, at first execution in step (a) provides a substrate 51, and substrate 51 has a upper surface 510 and is formed with a groove 511 and a groove 57.Groove 511 is to reach the madial wall 511b that is connected with the upper surface 510 of bottom surface 511a and substrate 51 by bottom surface 511a to be defined.Substrate 51 is made by composite material, and by laser activation, can form a conductor layer at composite material surface.In step (a), be a large amount of manufacturings, the applied composite material of MID-LDS is injected a mould (figure does not show), and be shaped just like a template 58 shown in Figure 6.Wherein, template 58 is that with template 28 differences of Fig. 4 template 58 more comprises groove 57.Similarly, template 58 comprises a plurality of substrates 51 that in a row link to each other, and each substrate 51 has groove 511 and groove 57.Template 58 after successive process is handled, after cut, become the present invention each independently photoelectricity transmit or receiving system 5.
After the step (a), execution in step (b).In step (b), the bottom surface 511a of groove 511, the madial wall 511b of groove 511 and the upper surface 510 of substrate 51 are implemented laser radiation, and form first conductive layer 541.Preferably, in step (b), all carry out laser radiation at the bottom surface 511a of groove 511.Moreover, in step (c), to outside the bottom surface 511a of groove 511 and the upper surface 510 of substrate 51 implement laser radiations, and form second conductive layer 542.Preferably, in step (c), the upper surface 510 of the whole outer and substrate 51 of groove 511 is implemented laser radiations, and form second conductive layer 542.Need illustrate that at this step (b) and step (c) are preferably carried out simultaneously, that is simultaneously dual-laser treatment region 52 be implemented laser radiations, and form first conductive layer 541 and second conductive layer 542 simultaneously in above-mentioned laser treated region 52.
In addition, first conductive layer 541 and second conductive layer 542 can extend on the side 513 of substrate 51 and form pad 512, and wherein side 513 is connected with the upper surface 510 of substrate 51, so that vertical installation photoelectricity transmission of the present invention or receiving system 5.First conductive layer 541 and second conductive layer 542 more extend to the lower surface 514 with respect to the upper surface 510 of substrate 51, to weld with a printed circuit board (PCB) (figure does not illustrate).
In step (b), the detailed formation step of first conductive layer 541 is as follows: (b1) change plating one copper plate in the laser treated region on the substrate 51 52 on one of them; (b2) electroplate a nickel coating on copper plate; (b3) electroplate a Gold plated Layer on nickel coating.In the same manner, in step (c), the detailed formation step of second conductive layer 542 is as follows: (c1) change plating one copper plate on another laser treated region 52 on the substrate 51; (c2) electroplate a nickel coating on copper plate; (c3) electroplate a Gold plated Layer in nickel coating.Preferably, in step (b) and the step (c), two copper plates of first conductive layer 541 and second conductive layer 542 form simultaneously, and two nickel coatings form simultaneously, and two Gold plated Layer form simultaneously.
After forming first conductive layer 541 and second conductive layer 542, in step (d), an opto-electronic conversion chip 55 is arranged on the bottom surface 511a of groove 511, and respectively with the bottom surface 511a of groove 511 on first conductive layer 241 and second conductive layer 242 electrically connect.In step (d) afterwards, manufacture method of the present invention more comprise step (e) implement a manufacture procedure of adhesive in groove 511 and groove 57 to coat opto-electronic conversion chip 55 and lead 56.
After finishing above-mentioned processing procedure, carry out one at last and cut processing procedure, make each photoelectricity transmission or receiving system 5 on the template 58 that is formed at as shown in Figure 6 cut separately, form the present invention's photoelectricity as shown in Figure 5 at last and transmit or receiving system 5.Wherein, identical among the mode that cuts and first embodiment, do not giving unnecessary details in this.
In sum, photoelectricity transmission of the present invention or receiving system and manufacture method thereof adopt the technology of MID-LDS, it is too complicated to improve known photoelectricity transmission or receiving system processing procedure, and big, the luminous scattering angle of volume reaches the high disappearance of cost greatly, reaches the purpose that processing procedure is simple, volume is little, luminous scattering angle is little and cost is low.Moreover, photoelectricity transmission of the present invention or receiving system and manufacture method thereof are suitable can be utilized with a kind of mould injection molding, passes through to change the design drawing of laser radiation again, and is more made the product of shaping tool different designs, the product design variation is significantly promoted, and mold exchange more.
The foregoing description only is illustrative principle of the present invention and effect thereof, and explains technical characterictic of the present invention, but not is used to limit protection category of the present invention.Any personage who is familiar with present technique person all can be under the situation of know-why of the present invention and spirit, can unlabored change or the arrangement of the isotropism scope that all belongs to the present invention and advocated.Therefore, claims are listed as described later for the scope of the present invention.
Claims (47)
1. a photoelectricity transmits or receiving system, comprises:
One substrate, have a upper surface and a groove, this groove is defined by a bottom surface and a madial wall that extends upwardly to this upper surface by this bottom surface, and wherein this substrate is made of a composite material, and this composite material is fitted and can be formed a conductor layer at this composite material surface by laser activation;
One first conductive layer is arranged on a first of this bottom surface of this groove, and stretches out along this madial wall of this groove and this upper surface of this substrate, and wherein this first conductive layer utilizes this composite material of this substrate of laser activation and forms;
One second conductive layer, be electrically insulated with this first conductive layer, this second conductive layer is arranged on a second portion of this bottom surface of this groove, and stretch out along this madial wall of this groove and this upper surface of this substrate, wherein this second conductive layer utilizes this composite material of this substrate of laser activation and forms; And
One opto-electronic conversion chip, be arranged on this bottom surface of this groove and respectively with this bottom surface of this groove on this first conductive layer and this second conductive layer electrically connect.
2. photoelectricity as claimed in claim 1 transmits or receiving system, it is characterized in that this composite material comprises the applied composite material of a molded interconnection element laser guidance structure.
3. photoelectricity as claimed in claim 1 transmits or receiving system, it is characterized in that, this first conductive layer on this bottom surface of this groove is a crystal bonding area, this second conductive layer on this bottom surface of this groove is a routing district, this opto-electronic conversion chip is arranged on this crystal bonding area and electrically connects with this crystal bonding area, and this opto-electronic conversion chip and this routing district electrically connect by a lead.
4. photoelectricity as claimed in claim 3 transmits or receiving system, it is characterized in that, more comprises a sealing, is arranged in this groove, and coats this opto-electronic conversion chip and this lead.
5. photoelectricity as claimed in claim 1 transmits or receiving system, it is characterized in that this opto-electronic conversion chip is a light-emitting diode chip for backlight unit or a light sensation chip.
6. photoelectricity as claimed in claim 1 transmits or receiving system, it is characterized in that this first conductive layer more comprises a copper plate.
7. photoelectricity as claimed in claim 6 transmits or receiving system, it is characterized in that this first conductive layer more comprises a nickel coating, is formed on this copper plate.
8. photoelectricity as claimed in claim 7 transmits or receiving system, it is characterized in that this first conductive layer more comprises a Gold plated Layer, is formed on this nickel coating.
9. photoelectricity as claimed in claim 1 transmits or receiving system, it is characterized in that this second conductive layer more comprises a copper plate.
10. photoelectricity as claimed in claim 9 transmits or receiving system, it is characterized in that this second conductive layer more comprises a nickel coating, is formed on this copper plate.
11. photoelectricity as claimed in claim 10 transmits or receiving system, it is characterized in that this second conductive layer more comprises a Gold plated Layer, is formed on this nickel coating.
12. photoelectricity as claimed in claim 1 transmits or receiving system, it is characterized in that, more comprise a pad, this pad is arranged on the side of this substrate, this side is connected with this upper surface of this substrate, and this pad extends from this first conductive layer or this second conductive layer.
13. a photoelectricity transmits or the manufacture method of receiving system, comprises the following step:
(a) provide a substrate, have a upper surface and a groove, this groove is defined by a bottom surface and a madial wall that extends upwardly to this upper surface by this bottom surface, wherein this substrate is made of a composite material, and this composite material is fitted and can be formed a conductor layer at this composite material surface by laser activation;
(b) this upper surface of part of a first, this madial wall of part and this substrate of this bottom surface of this groove is implemented laser radiation, and form one first conductive layer;
(c) this upper surface of part of a second portion, this madial wall of part and this substrate of this bottom surface of this groove is implemented laser radiation, and form one second conductive layer, wherein this second conductive layer and this first conductive layer are electrically insulated;
(d) an opto-electronic conversion chip is arranged on this bottom surface of this groove, and respectively with this bottom surface of this groove on this first conductive layer and this second conductive layer electrically connect.
14. manufacture method as claimed in claim 13 is characterized in that, this composite material comprises the applied composite material of a molded interconnection element laser guidance structure.
15. manufacture method as claimed in claim 13 is characterized in that, step (b) comprises following step:
(b1) change plating one copper plate.
16. manufacture method as claimed in claim 15 is characterized in that, step (b) more comprises following step:
(b2) electroplate a nickel coating on this copper plate.
17. manufacture method as claimed in claim 16 is characterized in that, step (b) more comprises following step:
(b3) electroplate a Gold plated Layer on this nickel coating.
18. manufacture method as claimed in claim 13 is characterized in that, step (c) comprises following step:
(c1) change plating one copper plate.
19. manufacture method as claimed in claim 18 is characterized in that, step (c) more comprises following step:
(c2) electroplate a nickel coating on this copper plate.
20. manufacture method as claimed in claim 19 is characterized in that, step (c) more comprises following step:
(c3) electroplate a Gold plated Layer on this nickel coating.
21. manufacture method as claimed in claim 13, it is characterized in that, this first conductive layer on this bottom surface of this groove is a crystal bonding area, this second conductive layer on this bottom surface of this groove is a routing district, and in step (d), this opto-electronic conversion chip is arranged on this crystal bonding area and electrically connects with this crystal bonding area, and this opto-electronic conversion chip and this routing district electrically connect by a lead.
22. manufacture method as claimed in claim 13 is characterized in that, this opto-electronic conversion chip is a light-emitting diode chip for backlight unit or a light sensation chip.
23. manufacture method as claimed in claim 13 is characterized in that, more comprises following step after step (d):
(e) apply a sealing, to coat this opto-electronic conversion chip and this lead.
24. manufacture method as claimed in claim 13 is characterized in that, this first conductive layer or this second conductive layer more extend to form a pad, and this pad is arranged on the side of this substrate, and this side is connected with this upper surface of this substrate.
25. a photoelectricity transmits or receiving system, comprises:
One substrate, have a upper surface and a groove, this groove is defined by a bottom surface and a madial wall that extends upwardly to this upper surface by this bottom surface, and wherein this substrate is made by a composite material, and this composite material is fitted and can be formed a conductor layer at this composite material surface by laser activation;
One first conductive layer is arranged on this bottom surface of this groove, and stretches out along this madial wall of this groove and this upper surface of this substrate, and wherein this first conductive layer utilizes this composite material of this substrate of laser activation and forms;
One second conductive layer, be arranged on groove this bottom surface outside, and stretch out and be electrically insulated with this first conductive layer along this upper surface of this substrate, wherein this second conductive layer utilizes this composite material of this substrate of laser activation and forms; And
One opto-electronic conversion chip is arranged on this bottom surface of this groove and electrically connects with this first conductive layer and this second conductive layer respectively.
26. photoelectricity as claimed in claim 25 transmits or receiving system, it is characterized in that, this photoelectricity transmits or receiving system more comprises a plurality of pads, these pads are arranged on the side of this substrate, this side is connected with this upper surface of this substrate and is suitable engaging with a circuit board surface, and these pads are from this first conductive layer and the extension of this second conductive layer.
27. photoelectricity as claimed in claim 26 transmits or receiving system, it is characterized in that this composite material comprises the applied composite material of a molded interconnection element laser guidance structure.
28. photoelectricity as claimed in claim 27 transmits or receiving system, it is characterized in that, this first conductive layer on this bottom surface of this groove is a crystal bonding area, this second conductive layer is a routing district, this opto-electronic conversion chip is arranged on this crystal bonding area and electrically connects with this crystal bonding area, and this opto-electronic conversion chip and this routing district electrically connect by a lead.
29. photoelectricity as claimed in claim 28 transmits or receiving system, it is characterized in that this substrate more is formed with a groove, link this groove and this routing district, and this lead connects this opto-electronic conversion chip and this routing district via this groove.
30. photoelectricity as claimed in claim 29 transmits or receiving system, it is characterized in that, this photoelectricity transmits or receiving system more comprises a sealing, coats this opto-electronic conversion chip and this lead.
31. photoelectricity as claimed in claim 25 transmits or receiving system, it is characterized in that this opto-electronic conversion chip is a light-emitting diode chip for backlight unit or a light sensation chip.
32. photoelectricity as claimed in claim 25 transmits or receiving system, it is characterized in that this first conductive layer and second conductive layer respectively comprise a copper plate, are formed on this substrate.
33. photoelectricity as claimed in claim 32 transmits or receiving system, it is characterized in that this first conductive layer and second conductive layer respectively comprise a nickel coating, corresponding being formed at respectively on this copper plate.
34. photoelectricity as claimed in claim 33 transmits or receiving system, it is characterized in that this first conductive layer and second conductive layer respectively comprise a Gold plated Layer, corresponding being formed at respectively on this nickel coating.
35. a photoelectricity transmits or the manufacture method of receiving system, comprises the following step:
(a) form a substrate, have a upper surface and a groove, this groove is defined by a bottom surface and a madial wall that extends upwardly to this upper surface by this bottom surface, wherein this substrate is made by a composite material, and this composite material is fitted and can be formed a conductor layer at this composite material surface by laser activation;
(b) this substrate is implemented laser radiation, and form one first conductive layer, wherein this first conductive layer is formed at this bottom surface of this groove, and stretches out along this madial wall of this groove and this upper surface of this substrate;
(c) this substrate is implemented laser radiation, and form one second conductive layer, wherein this second conductive layer is formed at outside this bottom surface of this groove, and stretches out and be electrically insulated with this first conductive layer along this upper surface of this substrate;
(d) an opto-electronic conversion chip is arranged on this bottom surface of this groove, and respectively with this bottom surface of this groove on this first conductive layer and this second conductive layer electrically connect.
36. manufacture method as claimed in claim 35, it is characterized in that, in step (b) and step (c), this first conductive layer or this second conductive layer more extend on the side of this substrate, to form a plurality of pads, this side is connected with this upper surface of this substrate and is suitable to engage with a circuit board surface.
37. manufacture method as claimed in claim 36 is characterized in that, this composite material comprises the applied composite material of a molded interconnection element laser guidance structure.
38. manufacture method as claimed in claim 37, it is characterized in that, this first conductive layer on this bottom surface of this groove is a crystal bonding area, this second conductive layer is a routing district, and in step (d), this opto-electronic conversion chip is arranged on this crystal bonding area and electrically connects with this crystal bonding area, and this opto-electronic conversion chip and this routing district electrically connect by a lead.
39. photoelectricity as claimed in claim 38 transmits or receiving system, it is characterized in that this substrate more is formed with a groove in step (a), link this groove and this routing district, and this lead connects this opto-electronic conversion chip and this routing district via this groove.
40. manufacture method as claimed in claim 39 is characterized in that, more comprises following step after step (d):
(e) apply a sealing, to coat this opto-electronic conversion chip and this lead.
41. manufacture method as claimed in claim 35 is characterized in that, this opto-electronic conversion chip is a light-emitting diode chip for backlight unit or a light sensation chip.
42. manufacture method as claimed in claim 35 is characterized in that, step (b) comprises following step:
(b1) change plating one copper plate on this substrate.
43. manufacture method as claimed in claim 42 is characterized in that, step (b) more comprises following step:
(b2) electroplate a nickel coating on this copper plate.
44. manufacture method as claimed in claim 43 is characterized in that, step (b) more comprises following step:
(b3) electroplate a Gold plated Layer on this nickel coating.
45. manufacture method as claimed in claim 35 is characterized in that, step (c) comprises following step:
(c1) change plating one copper plate on this substrate.
46. manufacture method as claimed in claim 45 is characterized in that, step (c) more comprises following step:
(c2) electroplate a nickel coating on this copper plate.
47. manufacture method as claimed in claim 46 is characterized in that, step (c) more comprises following step:
(c3) electroplate a Gold plated Layer on this nickel coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910247185A CN101847678A (en) | 2009-03-25 | 2009-11-27 | Photoelectric conveying or receiving device and manufacture method thereof |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910132448.8 | 2009-03-25 | ||
| CN200910247185A CN101847678A (en) | 2009-03-25 | 2009-11-27 | Photoelectric conveying or receiving device and manufacture method thereof |
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| Publication Number | Publication Date |
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| CN101847678A true CN101847678A (en) | 2010-09-29 |
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| CN200910247185A Pending CN101847678A (en) | 2009-03-25 | 2009-11-27 | Photoelectric conveying or receiving device and manufacture method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104659625A (en) * | 2013-11-18 | 2015-05-27 | 德昌电机(深圳)有限公司 | Commutator and forming method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104659625A (en) * | 2013-11-18 | 2015-05-27 | 德昌电机(深圳)有限公司 | Commutator and forming method thereof |
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Application publication date: 20100929 |