CN101843179B - 具有至少两个电路板的装置 - Google Patents
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- CN101843179B CN101843179B CN200880113837XA CN200880113837A CN101843179B CN 101843179 B CN101843179 B CN 101843179B CN 200880113837X A CN200880113837X A CN 200880113837XA CN 200880113837 A CN200880113837 A CN 200880113837A CN 101843179 B CN101843179 B CN 101843179B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Hybrid Cells (AREA)
- Inert Electrodes (AREA)
- Combinations Of Printed Boards (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
本发明涉及一种装置,包括:第一电路板(ELP),其具有用于连接元件(VE)的接触的接触面(KF),其中所述接触面(KF)包括中央的触点和环绕该中央的触点的同心环;第二电路板(ZLP);和连接元件(VE),其在第一面与所述第二电路板(ZLP)电气接触并且在与该第一面相对的第二面包括第一弹性元件(FE1)和至少一个第二弹性元件(FE2,FE3),其中该第一弹性元件(FE1)与第一电路板(ELP)的中央的触点电接触并且该至少一个第二弹性元件(FE2,FE3)与第一电路板(ELP)的同心环电接触。
Description
技术领域
本发明涉及一种至少两个电路板的装置。
背景技术
电路板上被安装大量电子组件。如果一个电气设备包括两个电路板,则必要时必须将它们互相电相连,以便能够执行电气设备的总功能。
两个电路板(例如在电路板上安装的高频组件或在一个电路板上安装的高频组件和一个在另一个电路板上安装的控制组件)的电气连接,通过连接元件(例如插塞式连接器)来进行。该连接元件通常一面焊接在电路板上,另一面该连接元件通常包括为了接触而挤压到另一个电路板上的弹性元件。
存在大量连接元件。视弹性元件类型、形状、大小、数量等的不同,另一个待接触的电路板的接触面必须与相应的连接元件在几何上匹配,以保证可靠的接触。
连接元件的预先给出的形状、大小等限制了另一个待接触的电路板的接触面的结构。
发明内容
本发明要解决的技术问题是,提供一种包括第一电路板、连接元件和第二电路板的装置,其中,能够使用不同形状和大小的多个连接元件并且保证在连接元件和两个电路板之间的可靠接触。
上述技术问题通过一种装置解决,该装置包括:
-第一电路板,其具有用于连接元件的接触的接触面,其中,所述接触面包括中央的触点和环绕该中央的触点的同心环;
-第二电路板;和
-连接元件,其在第一面与第二电路板电气接触并且在与该第一面相对的第二面包括第一弹性元件和至少一个第二弹性元件,其中,该第一弹性元件与第一电路板的中央的触点电接触并且所述至少一个第二弹性元件与第一电路板的同心环电接触。
通过按照本发明的解决方案,提出了包括第一电路板、连接元件和第二电路板的装置,其中,可以使用不同形状和大小的多个连接元件并且保证了在连接元件和两个电路板之间的可靠接触。
本发明的扩展在从属权利要求中给出。
以优选方式通过如下扩展本发明装置,使得连接元件包括第一弹性元件和两个第二弹性元件,其中第一弹性元件与中央的触点电接触并且所述两个第二弹性元件与同心环电接触。由此,对于该装置使用具有三个弹性元件的连接元件,其中各个弹性元件是销状的。
以其它优选方式,作为前段所述的替换,通过如下扩展本发明装置,使得第二弹性元件同心地环绕该第一弹性元件。由此,在该装置中使用通常使用的同轴连接元件。
该装置还可以通过其它电路板来补充,其中,分别每两个电路板和一个将该两个电路板互相连接的连接元件(如上面定义地)形成按照本发明的装置。
附图说明
本发明的其它优点在以下结合附图根据四个实施例对本发明的描述中给出。其中,示意性地
图1示出了一种具有带有三个弹性元件的连接元件的装置,
图2示出了具有按照本发明的接触面的第一电路板,
图3组合地示出了图1的装置和图2的接触面,并且
图4示出了图3的装置,其中没有第二电路板,但是具有作为图3的替换的连接元件。
具体实施方式
图1示出了一种装置,包括第一电路板ELP、第二电路板ZLP和连接元件VE,该连接元件包括三个弹性元件FE1、FE2、FE3。该连接元件VE在一面、即其头部与第二电路板ZLP电接触。连接元件VE的三个弹性元件FE1、FE2、FE3分别具有一个长的形状,即所谓的销状。该三个弹性元件FE1、FE2、FE3的每一个都与第一电路板ELP电接触。
“有弹性的”弹性元件FE1、FE2、FE3的使用对于本发明来说并不是绝对必要的。还可以使用刚性的弹性元件,在通常的说法中被称为元件或连接措施。
然而,在实践中之所以使用“有弹性的”弹性元件FE1、FE2、FE3,是因为它们保证在连接元件VE和第一电路板ELP之间的可靠接触,特别是当通过挤压接触进行与第二电路板ZLPZ相连的连接元件VE和第一电路板ELP的组装时。
就可靠的接触来说,“有弹性的”弹性元件FE1、FE2、FE3还保证了比第一和第二电路板ELP、ZLP之间旋转或移动更均衡,而接触不会脱落。
在实践中,本发明适合于专业人员公知的高频板对板电路板。
图2示出了图1的第一电路板ELP,其具有用于连接元件的接触的接触面KF。接触面KF包括中央的触点和围绕该中央的触点的同心环。
图3组合地示出了图1的装置和图2的第一电路板ELP的接触面KF。连接元件VE在上面与第二电路板ZLP电接触。在与连接元件VE的第一面相对的面,即底面,有所述三个弹性元件FE1、FE2、FE3。第一弹性元件FE1与第一电路板ELP的中央的触点电接触。两个第二弹性元件FE2、FE3与第一电路板ELP的同心环电接触。
通过巧妙选择中央的触点的宽度和同心环的宽度,可以采用多个具有销状的弹性元件FE1、FE2、FE3的公知连接元件。当连接元件VE仅包括一个第一弹性元件FE1和一个第二弹性元件FE2、FE3时,也应该被包括在本发明中。因为可以这样设想,图3的弹性元件FE3不存在(在图3中不示出)。
对于本发明重要的是,即使当电路板ELP、ZLP(以及与第二电路板ZLP固定连接的连接元件VE)要互相旋转(直到360度)地接触时,由于第一电路板ELP的接触面KF的形状,也可以容易地实现这点。如已经描述的那样,所述“有弹性的”弹性元件FE1、FE2、FE3还均衡在电路板ELP、ZLP之间的在侧面方向和在垂直方向上的小的间隔容差。因为在实践中通常预先设置与第二电路板ZLP固定连接的连接元件VE的形状和大小,所以第一电路板ELP的接触面KF的特殊几何结构允许不同的预先给出的连接元件VE的接触,而不必改变第一电路板ELP的布置。
图4示出了图3的装置,其中没有第二电路板ZLP,但是具有作为图3的替换的连接元件VE。连接元件VE如在图3中所述,在上表面与第二电路板ZLP相连(此处未示出)。不过为了更好示出连接元件VE的形状,没有示出连接元件VE的上部分和与第二电路板ZLP的接触。
连接元件VE包括两个弹性元件FE1、FE2。第一弹性元件FE1被实施为中央的销并且第二弹性元件FE2同心地环绕该第一弹性元件FE1。连接元件的该类型一般地被称为同轴连接元件。此处也得出本发明的优点,即,当与弹性元件FE1、FE2以及连接元件VE固定连接的第二电路板ZLP要旋转地与第一电路板ELP接触时,也允许在弹性元件FE1、FE2和接触面KF之间的接触。在前面的图中还描述的用于构造接触面KF以及弹性元件FE1、FE2的思路也相应地适用于图4的连接元件VE。
本发明不限于特殊的实施例,而是还包括没有详尽公开的应用,只要是利用了本发明核心。当接触面KF不包括精确的同心环、而是例如椭圆或多边形的时,特别是如此,其中由于弹性元件的宽度的尺寸,尽管如此还可以实现本发明的作用。
Claims (3)
1.一种具有至少两个电路板的装置,包括:
-第一电路板(ELP),其具有用于连接元件(VE)的接触的接触面(KF),其中,所述接触面(KF)包括中央的触点和环绕该中央的触点的同心环;
-第二电路板(ZLP);和
-连接元件(VE),其在第一面与所述第二电路板(ZLP)电气接触并且在与该第一面相对的第二面包括第一弹性元件(FE1)和至少一个第二弹性元件(FE2,FE3),其中,该第一弹性元件(FE1)与第一电路板(ELP)的中央的触点电接触,并且该至少一个第二弹性元件(FE2,FE3)与第一电路板(ELP)的同心环电接触。
2.根据权利要求1所述的装置,其中,所述连接元件(VE)包括所述第一弹性元件(FE1)和两个第二弹性元件(FE2,FE3),其中所述第一弹性元件(FE1)与中央的触点电接触,并且所述两个第二弹性元件(FE2,FE3)与所述同心环电接触。
3.根据权利要求1所述的装置,其中,所述第二弹性元件(FE2)同心地环绕所述第一弹性元件(FE1)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07075955.0 | 2007-11-02 | ||
EP20070075955 EP2056654A1 (de) | 2007-11-02 | 2007-11-02 | Leiterplatte mit Kontaktfläche und Anordnung |
PCT/EP2008/064878 WO2009056645A1 (de) | 2007-11-02 | 2008-11-03 | Leiterplatte mit kontaktfläche und anordnung |
Publications (2)
Publication Number | Publication Date |
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CN101843179A CN101843179A (zh) | 2010-09-22 |
CN101843179B true CN101843179B (zh) | 2012-02-29 |
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ID=39247652
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Application Number | Title | Priority Date | Filing Date |
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CN200880113837XA Expired - Fee Related CN101843179B (zh) | 2007-11-02 | 2008-11-03 | 具有至少两个电路板的装置 |
Country Status (10)
Country | Link |
---|---|
US (1) | US20100321915A1 (zh) |
EP (2) | EP2056654A1 (zh) |
JP (1) | JP2011503860A (zh) |
KR (1) | KR20100103491A (zh) |
CN (1) | CN101843179B (zh) |
AT (1) | ATE510447T1 (zh) |
BR (1) | BRPI0818269A2 (zh) |
MX (1) | MX2010004862A (zh) |
PL (1) | PL2208405T3 (zh) |
WO (1) | WO2009056645A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102010014940B4 (de) * | 2010-04-14 | 2013-12-19 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit Anschlusselementen |
DE102022213011A1 (de) | 2022-12-02 | 2024-06-13 | Zf Friedrichshafen Ag | Leistungsmodul für einen Wandler mit verbesserter Feldabschirmung von Signalpins |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1123959A (zh) * | 1994-08-05 | 1996-06-05 | 惠特克公司 | 电路板用的连接器 |
US5791911A (en) * | 1996-10-25 | 1998-08-11 | International Business Machines Corporation | Coaxial interconnect devices and methods of making the same |
CN2305794Y (zh) * | 1997-09-03 | 1999-01-27 | 鸿海精密工业股份有限公司 | 板对板连接器 |
DE102005017849A1 (de) * | 2005-04-18 | 2006-10-26 | Siemens Ag | Elektronisches Bauteil und Verfahren zur Herstellung einer elektrischen Verbindung |
Family Cites Families (5)
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US4593464A (en) * | 1983-08-15 | 1986-06-10 | Allied Corporation | Method of making a triaxial electrical connector |
JPH0287484A (ja) * | 1988-09-22 | 1990-03-28 | Junkosha Co Ltd | 基板マウント |
US5011066A (en) * | 1990-07-27 | 1991-04-30 | Motorola, Inc. | Enhanced collapse solder interconnection |
AU6337998A (en) * | 1997-02-28 | 1998-09-18 | Cornell Research Foundation Inc. | Self-assembled low-insertion force connector assembly |
US5898574A (en) * | 1997-09-02 | 1999-04-27 | Tan; Wiling | Self aligning electrical component |
-
2007
- 2007-11-02 EP EP20070075955 patent/EP2056654A1/de not_active Withdrawn
-
2008
- 2008-11-03 JP JP2010532560A patent/JP2011503860A/ja active Pending
- 2008-11-03 CN CN200880113837XA patent/CN101843179B/zh not_active Expired - Fee Related
- 2008-11-03 EP EP20080845428 patent/EP2208405B1/de not_active Not-in-force
- 2008-11-03 MX MX2010004862A patent/MX2010004862A/es active IP Right Grant
- 2008-11-03 PL PL08845428T patent/PL2208405T3/pl unknown
- 2008-11-03 BR BRPI0818269 patent/BRPI0818269A2/pt not_active IP Right Cessation
- 2008-11-03 WO PCT/EP2008/064878 patent/WO2009056645A1/de active Application Filing
- 2008-11-03 KR KR1020107012098A patent/KR20100103491A/ko not_active Application Discontinuation
- 2008-11-03 AT AT08845428T patent/ATE510447T1/de active
- 2008-11-03 US US12/740,938 patent/US20100321915A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1123959A (zh) * | 1994-08-05 | 1996-06-05 | 惠特克公司 | 电路板用的连接器 |
US5791911A (en) * | 1996-10-25 | 1998-08-11 | International Business Machines Corporation | Coaxial interconnect devices and methods of making the same |
CN2305794Y (zh) * | 1997-09-03 | 1999-01-27 | 鸿海精密工业股份有限公司 | 板对板连接器 |
DE102005017849A1 (de) * | 2005-04-18 | 2006-10-26 | Siemens Ag | Elektronisches Bauteil und Verfahren zur Herstellung einer elektrischen Verbindung |
Also Published As
Publication number | Publication date |
---|---|
EP2056654A1 (de) | 2009-05-06 |
EP2208405B1 (de) | 2011-05-18 |
EP2208405A1 (de) | 2010-07-21 |
ATE510447T1 (de) | 2011-06-15 |
BRPI0818269A2 (pt) | 2015-04-14 |
MX2010004862A (es) | 2010-11-09 |
PL2208405T3 (pl) | 2011-10-31 |
KR20100103491A (ko) | 2010-09-27 |
WO2009056645A1 (de) | 2009-05-07 |
CN101843179A (zh) | 2010-09-22 |
US20100321915A1 (en) | 2010-12-23 |
JP2011503860A (ja) | 2011-01-27 |
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