CN101837331A - Machine for preparing semi-automatic epoxy resin thin film for wafer-level chip package - Google Patents
Machine for preparing semi-automatic epoxy resin thin film for wafer-level chip package Download PDFInfo
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- CN101837331A CN101837331A CN200910030161A CN200910030161A CN101837331A CN 101837331 A CN101837331 A CN 101837331A CN 200910030161 A CN200910030161 A CN 200910030161A CN 200910030161 A CN200910030161 A CN 200910030161A CN 101837331 A CN101837331 A CN 101837331A
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- epoxy resin
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- stainless steel
- thin film
- driving rolls
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Abstract
The invention discloses a machine for preparing a semi-automatic epoxy resin thin film for wafer-level chip package, comprising an epoxy resin rolling device and an epoxy resin spreading device. The epoxy resin rolling device adopts an automatic multi-level rolling wheel structure to roll epoxy resin, so that the thickness of the epoxy resin thin film can be controlled precisely, and the epoxy resin rolling operation is more convenient and reliable in comparison with the manual epoxy resin rolling operation. The epoxy resin coating device adopts an object stage which can rotate by 90 DEG, so that the wafer on which the epoxy resin is coated does not need to be rotated manually, the production efficiency can be greatly improved, and the production quality can be guaranteed better. An automatic cleaning device which can be matched with the multi-level rolling wheel structure to automatically clean rolling wheels is arranged in the epoxy resin rolling device. The machine can effectively improve the production efficiency of the operation of coating the epoxy resin thin film on the wafer-level chip, and effectively improve the product yield.
Description
Technical field
The present invention relates to the wafer stage chip encapsulation field, the coating field of ultra-thin epoxy resin thin film when relating in particular to the wafer stage chip encapsulation.
Background technology
Epoxy resin is widely used in the microelectronics Packaging field; it is to mix by certain weight ratio via each component; be applied on the wafer that shields of producing the microcavity body structure (being generally glass wafer) after reaching certain viscosity; protectiveness wafer behind the gluing carries out accurate para-linkage with the Silicon Wafer with functional device; the glass wafer that has a microcavity body structure is bonded in the positive closed structure that forms of Silicon Wafer, and this structure can be to completely cutting off protection to the environment sensitive microelectronic component on the Silicon Wafer.
More and more to the miniaturization development, encapsulation technology is also excessive to WLCSP gradually for the microelectronics device.In the encapsulation of microelectronic component crystal wafer chip dimension; the for example encapsulation of micro element such as cmos image sensor, MEMS; need carry out airtight protection to its functional part; common practices be earlier with the glass wafer of Silicon Wafer same size on photoresist photoetching making go out to have certain altitude, with the consistent cavity of chip periphery overall size; on the thin-walled of cavity, apply the very thin epoxy resin thin film of one deck then; then will be coated with glass wafer and Silicon Wafer accurately contraposition in the contraposition machine of glue, and in the bonding machine, carry out bonding at last and finish encapsulation.
The coating quality of epoxy resin glued membrane will directly determine bonding quality on the glass wafer micro-structural, and then influence the final product yield.In the encapsulation of cmos image sensor and MEMS device wafers level, the general requirement of the thickness of epoxy resin glued membrane is 2 microns to 4 microns, total thickness deviation: 0.5 micron, glued membrane must be evenly continuous, can not have to disconnect and gather.
Because the micro-structural on the glass wafer is scraggly " well " font cavity type structure, can only be on cavity wall during gluing gluing, in the cavity epoxide-resin glue can not be arranged, so rotation whirl coating, spray glue and spot gluing equipment all can not satisfy this requirement.
Up till now for it, crystal wafer chip dimension encapsulation factory mostly is and uses the stainless steel roller, and plastic roll prepares glued membrane manually, the steps include: 1) be even smooth thin adhesive layer about 10 microns coating thickness on a slice focussing glass; 2) the operator manual operation has the stainless steel roller of handle, back and forth rolls back and forth on the focussing glass pellicle, after rolling 10-15 minute, can coat one deck 5-6 micron thickness glued membrane on the stainless steel roller; 3) the hand-held stainless steel roller that has rolled behind the glue of operator evenly rolls the glue-line of the coated one deck 3-4 of the micro-structural on glass wafer micron on the glass wafer that makes micro-structural by lithography; 4) glass wafer is revolved turn 90 degrees repeating step 1)～step 3).
The major defect of the above pure manual operation engineering has: one, time-consuming.Be coated with minimum needs of a slice glass wafer operating time 30 minutes, inefficiency has a strong impact on productive rate in scale of mass production, needs a plurality of operator's operations of configuration could satisfy the production demand.In addition, because epoxide-resin glue is after preparing, strict demand is arranged service life, be 30 minutes the service life after general mixed, thus the activity duration that the operator must strict this process of control, otherwise epoxide-resin glue may lose efficacy; Two, require too high to operating personnel.Because pure manual working, the quality of glued membrane quality is controlled with operator's experience fully, thus need cultivate experienced operator for a long time, and require this post operation person's flowability to lack, in case the operator that has the operator to resign more to renew will cause product quality that very great fluctuation process is arranged.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides a kind of machine for preparing semi-automatic epoxy resin thin film for wafer-level chip package, can effectively improve the production efficiency that the wafer stage chip epoxy resin thin film applies operation, and effectively improve the product yield.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of machine for preparing semi-automatic epoxy resin thin film for wafer-level chip package, form by plastic roll device and glue spreading apparatus, to use direction to be benchmark: the plastic roll device comprises driving rolls, first support roller, second support roller, position-limit mechanism and automatic flushing device, described automatic flushing device and position-limit mechanism are fixed positioned on the frame, described driving rolls and first, two support roller activity orientation are in the rack table top, position-limit mechanism is positioned at driving rolls and first, two support rollers top, described driving rolls and first, the relative position of two support rollers is fixed, and described driving rolls and first, two support rollers can rotate and move horizontally relative to rack table, the wheel carrier handle of stainless steel roller can be fixed positioned on the position-limit mechanism, guarantee that the stainless steel roller can not move horizontally when rotating, the stainless steel roller can contact and be limited in first, between two support rollers, driving rolls transmission first support roller, the first support roller transmission stainless steel roller, stainless steel roller transmission second support roller, adopt this multistage roller structure to carry out plastic roll, can accurately control film thickness: first, the thickness of the controlled glue film that rotatablely moves mutually between two support rollers and stainless steel roller; First and second support roller move horizontally the uniformity that can guarantee film thickness, the rack table of described first and second support roller below has the cleaning fluid recovery tube, the upper end of this cleaning fluid recovery tube fixedly is arranged on the rack table, and this cleaning fluid recovery tube is communicated with inside and outside the frame; Glue spreading apparatus comprises base, objective table and rail sliding apparatus, base is located on the rack table, the objective table activity orientation is in the top of base, the bottom activity of objective table wore the top of base and was positioned at the lower space of base, the upper surface of objective table flushes with the upper surface of base, the bottom of described objective table is provided with rotating handles, this rotating handles can drive the objective table rotation, described base is provided with the pair of guide rails carriage, the wheel carrier both sides of described stainless steel roller can be positioned in the rail sliding apparatus and along rail sliding apparatus slides, described objective table is positioned in the middle of this rail sliding apparatus, and the wheel face of described stainless steel roller just can contact described objective table; Be equiped with cleaning fluid in the described automatic flushing device, be arranged with scavenge pipe on the delivery port of this automatic flushing device, the length of this scavenge pipe is more than or equal to the distance of delivery port distance second support roller of automatic flushing device.
Described objective table base relatively rotates 90 degree, thereby can accurately make the wafer that places on the objective table rotate 90 degree.
Described driving rolls and first, the relative position of two support rollers is fixed, and described driving rolls and first, the structure that two support rollers can rotate and move horizontally relative to rack table is: be benchmark to use direction: described frame is provided with servomotor and CD-ROM drive motor, be provided with camshaft again, first connecting rod and at least one second connecting rod, the output of the described servomotor camshaft that is connected, first, two connecting rods are movably set on the camshaft, the camshaft rotation can drive first, two connecting rods move horizontally, one end of described driving rolls is rotationally connected with on the first connecting rod, the other end of the described driving rolls CD-ROM drive motor that is connected, described first, at least one end of two support rollers is rotationally connected with on the second connecting rod.
Movable sleeve is provided with two second connecting rods on the described camshaft, and first and second support roller two ends are rotationally connected with respectively on two second connecting rods.
The wheel carrier both sides of described stainless steel roller can be positioned in the rail sliding apparatus and the structure of sliding along rail sliding apparatus is: this rail sliding apparatus is made up of guide rail and slide construction, described slide construction and guide rail are slidingly matched, the wheel carrier both sides of described stainless steel roller can be fixed positioned on this slide construction, thereby the stainless steel roller can be slided in guide rail with slide construction.
The cleaning fluid of installing is an acetone soln in the described automatic flushing device.
The invention has the beneficial effects as follows: the plastic roll device adopts the automatic multi-step roller structure to carry out plastic roll, can accurately control film thickness, manually plastic roll simple operation and reliable; Glue spreading apparatus adopts the objective table that can do 90 degree rotations, need not the wafer of hand rotation institute gluing, when greatly having improved production efficiency, has better guaranteed the quality of production; In the plastic roll device, automatic flushing device is set, but cooperates the carrying out of multistage roller structure pair roller to clean automatically; In sum, the present invention can effectively improve the production efficiency that the wafer stage chip epoxy resin thin film applies operation, and has effectively improved the product yield.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 be among Fig. 1 A-A to cutaway view;
Fig. 3 is the partial schematic diagram of plastic roll device of the present invention;
Fig. 4 is the partial schematic diagram of glue spreading apparatus of the present invention.
The specific embodiment
Embodiment: a kind of machine for preparing semi-automatic epoxy resin thin film for wafer-level chip package, form by plastic roll device and glue spreading apparatus, to use direction to be benchmark: the plastic roll device comprises driving rolls 1, first support roller 11, second support roller 12, position-limit mechanism 3 and automatic flushing device 7, described automatic flushing device 7 and position-limit mechanism 3 are fixed positioned on the frame, described driving rolls 1 and first, two support rollers 11,12 activity orientation are in the rack table top, position-limit mechanism 3 is positioned at driving rolls 1 and first, two support rollers 11,12 tops, described driving rolls 1 and first, two support rollers 11,12 relative position is fixed, and described driving rolls 1 and first, two support rollers 11,12 can rotate and move horizontally relative to rack table, the wheel carrier handle of stainless steel roller 10 can be fixed positioned on the position-limit mechanism 3, guarantee that stainless steel roller 10 can not move horizontally when rotating, stainless steel roller 10 can contact and be limited in first, two support rollers 11, between 12, driving rolls 1 transmission first support roller 11, first support roller, 11 transmission stainless steel rollers 10, stainless steel roller 10 transmissions second support roller 12, adopt this multistage roller structure to carry out plastic roll, can accurately control film thickness: first, two support rollers 11,12 and the thickness of the controlled glue film that rotatablely moves mutually of 10 on stainless steel roller; First and second support roller 11,12 move horizontally the uniformity that can guarantee film thickness, the rack table of described first and second support roller 11,12 belows has cleaning fluid recovery tube 2, the upper end of this cleaning fluid recovery tube 2 fixedly is arranged on the rack table, and this cleaning fluid recovery tube 2 is communicated with inside and outside the frame; Glue spreading apparatus comprises base 4, objective table 5 and rail sliding apparatus 6, base 4 is located on the rack table, objective table 5 activity orientation are in the top of base 4, the bottom activity of objective table 5 wore the top of base 4 and was positioned at the lower space of base 4, the upper surface of objective table 5 flushes with the upper surface of base 4, the bottom of described objective table 5 is provided with rotating handles 15, this rotating handles 15 can drive objective table 5 rotations, described base 4 is provided with pair of guide rails carriage 6, the wheel carrier both sides of described stainless steel roller 10 can be positioned in the rail sliding apparatus 6 and along rail sliding apparatus 6 and slide, described objective table 5 is positioned in the middle of this rail sliding apparatus 6, and the wheel face of described stainless steel roller 10 just can contact described objective table 5; Be equiped with cleaning fluid in the described automatic flushing device 7, be arranged with scavenge pipe on the delivery port of this automatic flushing device 7, the length of this scavenge pipe is more than or equal to the distance of delivery port distance second support roller 12 of automatic flushing device 7.
Described objective table 5 is base 4 rotations 90 degree relatively, thereby can accurately make the wafer that places on the objective table rotate 90 degree.
Described driving rolls 1 and first, two support rollers 11,12 relative position is fixed, and described driving rolls 1 and first, two support rollers 11,12 structures that can rotate and move horizontally relative to rack table are: be benchmark to use direction: described frame is provided with servomotor 8 and CD-ROM drive motor, be provided with camshaft 9 again, first connecting rod 13 and at least one second connecting rod 14, the output of described servomotor 8 camshaft 9 that is connected, first, two connecting rods 13,14 are movably set on the camshaft 9, camshaft 9 rotations can drive first, two connecting rods 13,14 move horizontally, one end of described driving rolls 1 is rotationally connected with on the first connecting rod 13, the other end of described driving rolls 1 CD-ROM drive motor that is connected, described first, two support rollers 11, at least one end of 12 is rotationally connected with on the second connecting rod 14.
Movable sleeve is provided with two second connecting rods 14 on the described camshaft 9, and first and second support roller 11,12 two ends are rotationally connected with respectively on two second connecting rods 14.
The wheel carrier both sides of described stainless steel roller 10 can be positioned in the rail sliding apparatus 6 and the structure of sliding along rail sliding apparatus 6 is: this rail sliding apparatus 6 is made up of guide rail 61 and slide construction 62, described slide construction 62 is slidingly matched with guide rail 61, the wheel carrier both sides of described stainless steel roller 10 can be fixed positioned on this slide construction 62, thereby the stainless steel roller can be slided in guide rail with slide construction.
The cleaning fluid of installing is an acetone soln in the described automatic flushing device 7.
This routine operating process is as follows:
1. wafer places on the objective table, open machine, stainless steel roller 10 is limited on the plastic roll device: stainless steel roller 10 is placed between first and second support roller 11,12 of plastic roll device, the wheel carrier handle of stainless steel roller 10 is positioned in the position-limit mechanism 3, start position-limit mechanism 3 and make the wheel carrier handle position of stainless steel roller 10 accurately fixing, stainless steel roller 10 can not moved horizontally when rotating.
2. plastic roll: the used for epoxy resin one-shot injector that mixes is got on the stainless steel roller 10 of transferring to the plastic roll device in right amount, open CD-ROM drive motor and servomotor 8, driving rolls 1 transmits first support roller 11, stainless steel roller 10 and second support roller 12 successively and rotates, control the thickness of the epoxy resin glued membrane on the stainless steel roller 10 with this, servomotor 8 driving cam axles 9 rotate and driving rolls 1 and first and second support roller 11,12 level of synchronization are moved, and guarantee the uniformity of film thickness with this.
3. (this time set behind the plastic roll certain hour, can reach requirement with the film thickness on the stainless steel roller 10 and the uniformity is benchmark), stainless steel roller 10 is taken off and transfers on the slide construction 62 of rail sliding apparatus 6 of glue spreading apparatus, wafer is carried out the gluing operation: level promotes the wheel carrier of stainless steel roller 10, the wheel carrier of stainless steel roller 10 is stressed and slide construction 62 that drive glue spreading apparatus slides, thereby makes stainless steel roller 10 roll 10 complete slice wafers along guide rail 61 uniform motion until the stainless steel roller with slide construction 62.
4. taking off stainless steel roller 10 is limited in stainless steel roller 10 on the plastic roll device once more, stir rotating handles 15 with objective table 5 rotations 90 degree, thereby make the wafer that places on the objective table 5 rotate 90 degree, treat to take off behind the stainless steel roller 10 plastic roll certain hours, once more stainless steel roller 10 is placed on the rail sliding apparatus 6 of glue spreading apparatus, once more wafer is carried out the gluing operation, then stainless steel roller 10 is limited on the plastic roll device, open CD-ROM drive motor when opening automatic flushing device 7, allow stainless steel roller 10 while rotating with acetone soln it be cleaned, whole operation is finished.
Claims (6)
1. machine for preparing semi-automatic epoxy resin thin film for wafer-level chip package, it is characterized in that: form by plastic roll device and glue spreading apparatus, to use direction to be benchmark: the plastic roll device comprises driving rolls (1), first support roller (11), second support roller (12), position-limit mechanism (3) and automatic flushing device (7), described automatic flushing device and position-limit mechanism are fixed positioned on the frame, described driving rolls and first, two support roller activity orientation are in the rack table top, position-limit mechanism is positioned at driving rolls and first, two support rollers top, described driving rolls and first, the relative position of two support rollers is fixed, and described driving rolls and first, two support rollers can rotate and move horizontally relative to rack table, the wheel carrier handle of stainless steel roller (10) can be fixed positioned on the position-limit mechanism, the stainless steel roller can contact and be limited in first, between two support rollers, driving rolls transmission first support roller, the first support roller transmission stainless steel roller, stainless steel roller transmission second support roller, described first, two support rollers (11,12) Xia Fang rack table has cleaning fluid recovery tube (2), the upper end of this cleaning fluid recovery tube fixedly is arranged on the rack table, and this cleaning fluid recovery tube is communicated with inside and outside the frame; Glue spreading apparatus comprises base (4), objective table (5) and rail sliding apparatus (6), base is located on the rack table, the objective table activity orientation is in the top of base, the bottom activity of objective table wore the top of base and was positioned at the lower space of base, the upper surface of objective table flushes with the upper surface of base, the bottom of described objective table is provided with rotating handles (15), this rotating handles can drive the objective table rotation, described base is provided with the pair of guide rails carriage, the wheel carrier both sides of described stainless steel roller can be positioned in the rail sliding apparatus and along rail sliding apparatus slides, described objective table is positioned in the middle of this rail sliding apparatus, and the wheel face of described stainless steel roller just can contact described objective table; Described automatic flushing device is equiped with cleaning fluid in (7), is arranged with scavenge pipe on the delivery port of this automatic flushing device, and the length of this scavenge pipe is more than or equal to the distance of delivery port distance second support roller of automatic flushing device.
2. machine for preparing semi-automatic epoxy resin thin film for wafer-level chip package according to claim 1 is characterized in that: described objective table (5) base relatively rotates 90 degree.
3. machine for preparing semi-automatic epoxy resin thin film for wafer-level chip package according to claim 1, it is characterized in that: described driving rolls (1) and first, two support rollers (11,12) relative position is fixed, and described driving rolls and first, the structure that two support rollers can rotate and move horizontally relative to rack table is: be benchmark to use direction: described frame is provided with servomotor (8) and CD-ROM drive motor, be provided with camshaft (9) again, first connecting rod (13) and at least one second connecting rod (14), the output of the described servomotor camshaft that is connected, first, two connecting rods are movably set on the camshaft, the camshaft rotation can drive first, two connecting rods move horizontally, one end of described driving rolls is rotationally connected with on the first connecting rod, the other end of the described driving rolls CD-ROM drive motor that is connected, described first, at least one end of two support rollers is rotationally connected with on the second connecting rod.
4. machine for preparing semi-automatic epoxy resin thin film for wafer-level chip package according to claim 3, it is characterized in that: described camshaft (9) is gone up movable sleeve and is provided with two second connecting rods (14), and first and second support roller (11,12) two ends are rotationally connected with respectively on two second connecting rods.
5. machine for preparing semi-automatic epoxy resin thin film for wafer-level chip package according to claim 1, it is characterized in that: the wheel carrier both sides of described stainless steel roller (10) can be positioned in the rail sliding apparatus (6) and the structure of sliding along rail sliding apparatus is: this rail sliding apparatus (6) is made up of guide rail (61) and slide construction (62), described slide construction and guide rail are slidingly fitted, and the wheel carrier both sides of described stainless steel roller can be fixed positioned on this slide construction.
6. machine for preparing semi-automatic epoxy resin thin film for wafer-level chip package according to claim 1 is characterized in that: the cleaning fluid of installing is an acetone soln in the described automatic flushing device (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910030161A CN101837331A (en) | 2009-03-20 | 2009-03-20 | Machine for preparing semi-automatic epoxy resin thin film for wafer-level chip package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910030161A CN101837331A (en) | 2009-03-20 | 2009-03-20 | Machine for preparing semi-automatic epoxy resin thin film for wafer-level chip package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101837331A true CN101837331A (en) | 2010-09-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910030161A Pending CN101837331A (en) | 2009-03-20 | 2009-03-20 | Machine for preparing semi-automatic epoxy resin thin film for wafer-level chip package |
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| CN (1) | CN101837331A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103157578A (en) * | 2011-12-12 | 2013-06-19 | 鸿富锦精密工业(武汉)有限公司 | Smearing device |
| CN111013950A (en) * | 2019-12-02 | 2020-04-17 | 西安奕斯伟硅片技术有限公司 | Silicon wafer passivation device and method |
-
2009
- 2009-03-20 CN CN200910030161A patent/CN101837331A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103157578A (en) * | 2011-12-12 | 2013-06-19 | 鸿富锦精密工业(武汉)有限公司 | Smearing device |
| CN103157578B (en) * | 2011-12-12 | 2016-04-20 | 赛恩倍吉科技顾问（深圳）有限公司 | Application device |
| CN111013950A (en) * | 2019-12-02 | 2020-04-17 | 西安奕斯伟硅片技术有限公司 | Silicon wafer passivation device and method |
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Application publication date: 20100922 |