CN101828303B - 用于电子设备的天线配置 - Google Patents

用于电子设备的天线配置 Download PDF

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CN101828303B
CN101828303B CN200780101154.8A CN200780101154A CN101828303B CN 101828303 B CN101828303 B CN 101828303B CN 200780101154 A CN200780101154 A CN 200780101154A CN 101828303 B CN101828303 B CN 101828303B
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亚历山大·萨拉宾
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Thomson Licensing SAS
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    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
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Abstract

一种天线配置，尤其适用在例如机顶盒之类的电子设备(100)的前面板组件中。根据一种示例性实施例，该电子设备(100)包括底架(34)、印制电路板和F形天线。该印制电路板包括接地部分(28)和电介质部分(30)。接地部分(28)电耦合到底架(34)。F形天线包括第一部分(22)、第二部分(24)和第三部分(26)。F形天线的第一部分(22)沿印制电路板的电介质部分(30)伸展。F形天线的第二部分(24)电耦合到印制电路板的接地部分(28)。F形天线的第三部分(26)在印制电路板的接地部分(28)和电介质部分(30)之间伸展并且经由电抗元件(jX1，jX2)电耦合到信号处理器。

Description

用于电子设备的天线配置
技术领域
本发明一般地涉及天线配置，更具体而言，涉及尤其适合用在电子设备的前面板组件(assembly)中的天线配置。
背景技术
诸如电视机、机顶盒等之类的电子设备通常包括某种形式的天线，该天线使能来自远程信号源(例如，手持遥控设备)的信号的接收。为了以符合审美的方式提供这些设备的天线，通常希望将天线集成为该设备的前面板组件(FPA)的一部分。
鉴于空间限制，试图将天线集成为设备的FPA的一部分的传统设计经常将天线实现为包含在印制电路板上的印制迹线(trace)。利用这些设计，天线可以例如被配置为印制单极子或回路天线。但是，这些传统设计不适合于某些应用，因为印制迹线天线可能离设备底架太近。具体讲，反射表面(例如底架)离印制迹线天线很近会通过显著地缩小天线的工作范围而极大地降低天线效率。甚至印制迹线天线和底架之间距离上的小改变也会影响天线性能。
其他种类的微型低剖面天线(low profile antenna)包括L形天线和F形天线。L形天线和F形天线的示例分别如图1和2所示。如图1和2所示，L形天线和F形天线两者都包括水平部分10和一个或多个垂直部分12，垂直部分12具有表示用于信号接收的驱动点的末端14。虽然L形天线和F形天线一般都固有地具有低阻抗，但是图1和2所示的天线不一定适合用在电子设备的FPA中。例如，电子设备的FPA环境通常具有会不利地影响天线性能的信号迹线和地多边形。
因此，存在对于克服上述问题并且尤其适合用在电子设备的FPA中的电子设备的天线配置的需求。这里描述的本发明解决这些和/或其他问题。
发明内容
根据本发明的一个方面，公开了一种电子设备。根据示例性实施例，该电子设备包括底架和诸如印制电路板之类的具有接地部分和电介质部分的装置。印制电路板的接地部分电耦合到底架。该电子设备还包括诸如F形天线之类具有第一部分、第二部分和第三部分的装置。F形天线的第一部分沿印制电路板的电介质部分伸展。F形天线的第二部分电耦合到印制电路板的接地部分。F形天线的第三部分在印制电路板的接地部分和电介质部分之间伸展，并经由电抗元件电耦合到信号处理器。
根据本发明的另一方面，公开了一种用于提供电子设备的方法。根据示例性实施例，该方法包括如下步骤：提供底架；提供具有接地部分和电介质部分的印制电路板，所述接地部分电耦合到底架；以及提供具有第一部分、第二部分和第三部分的F形天线，第一部分沿印制电路板的电介质部分伸展，第二部分电耦合到印制电路板的接地部分，并且第三部分在印制电路板的接地部分和电介质部分之间伸展并且经由电抗元件电耦合到信号处理器。
附图说明
通过参考以下结合附图对本发明实施例的描述，本发明的上述和其他特征以及优点和实现它们的方式将变得更加明显并且将更容易理解本发明，其中：
图1是示出传统L形天线的图；
图2是示出传统F形天线的图；
图3是示出根据本发明的示例性实施例的电子设备的相关部分的图；
图4是示出传统的外部鞭状天线(whip antenna)的辐射图样的图；以及
图5是示出根据本发明的示例性实施例的天线配置的辐射图样的图。
这里提出的示例方式图示出本发明的优选实施例，并且这些示例方式不以任何方式被解释为对本发明的范围的限制。
具体实施方式
现在参考附图，尤其是图3，示出根据本发明的示例性实施例的电子设备100的相关部分的图被提供。具体讲，图3所示的电子设备100的部分代表可以作为电子设备100的FPA部分被包括进来的天线配置。如图3所示，电子设备100包括外壳20；具有第一部分22、第二部分24和第三部分26的F形天线；具有接地部分28和电介质部分30的印制电路板；电耦合器32；底架34；线缆耦合器36；和电抗元件jX1和jX2。
如图3所示，天线配置的各个元件被包含在电子设备100的外壳20内，并因此不能被用户容易地看见。这样，图3的天线配置可以按符合审美的方式、作为电子设备100的FPA的一部分被集成到电子设备100中。根据示例性实施例，电子设备100被实现为卫星机顶盒。但是，本领域技术人员将直觉发现，图3的天线配置也可以被用在其他类型的电子设备中。
在图3中，F形天线的第一部分22沿印制电路板的电介质部分30伸展，以使得F形天线的第一部分22与印制电路板的电介质部分30基本平行。F形天线的第一部分22与印制电路板的电介质部分30之间的物理间隔可以基于特定应用而作为设计选项来选择。
F形天线的第二部分24电耦合到印制电路板的接地部分28。这样，印制电路板的接地部分28充当F形天线的基准点。印制电路板的接地部分28还经由电耦合器32电耦合到底架34。根据示例性实施例，电耦合器32可以被实现为对底架34的接地平面具有固有电抗性的电耦合元件，例如平板和/或同轴线缆。由于印制电路板的接地部分28和底架34(其构成接地平面)之间的电连接，印制电路板的接地部分28可以实际上充当天线，并进一步提高F形天线的信号接收性能。
以如图3所示的方式，F形天线的第三部分26在印制电路板的接地部分28和电介质部分30之间伸展，并经由电抗元件jX1和jX2和线缆耦合器36电耦合到电子设备100的信号处理器。电抗元件jX1和jX2的类型和值可以基于特定应用而作为设计选项来选择。一般而言，电抗元件jX1和jX2可以被实现为电容性和/或电感性元件，并且它们的值可以取决于F形天线的固有阻抗，而F形天线的的固有阻抗取决于与特定应用相关联的多个因素。对于图3的天线配置，这些因素可以包括：F形天线与底架34的接地平面之间的邻近性；在F形天线周围的区域中，底架34的接地平面的物理配置；在F形天线周围的区域中，从印制电路板生成的电迹线的量；以及印制电路板所使用的材料。根据一个示例性实施例，电抗元件jX1被实现为具有33pF值的电容器，并且电抗元件jX2被实现为具有12pF值的电容器。根据另一示例性实施例，电抗元件jX1被实现为具有100pF值的电容器，并且电抗元件jX2被实现为具有22pF值的电容器。当然，根据设计选项，也可以使用其它类型的电抗元件和/或值。
在操作中，图3的天线配置可被用来接收无线信号(例如，红外信号、射频信号等等)，例如从用户输入元件(例如手持遥控器等等)生成的信号。图3的天线配置在这方面尤其有用，并且能够提供全向信号接收。图3的天线配置的信号接收性能可以通过图4和5来更好地理解。具体讲，图4提供了图示40，其示出传统的外部鞭状天线(即，连接到设备后部)的辐射图样，图5提供了图示50，其示出根据本发明的示例性实施例的天线配置的辐射图样。如图4和图5的比较结果所示，本发明的天线配置提供了优于传统的外部鞭状天线的全向信号接收能力。
如这里所述，本发明提供了尤其适合用在电子设备的前面板组件中的天线配置。虽然本发明已经被描述为具有优选设计，但是本发明可以在本公开的精神和范围之内作进一步修改。因此，本申请希望使用本发明的一般原理覆盖本发明的任意变化、使用或适应性改变。此外，本申请希望覆盖落在本发明所属领域中的已知或惯用实践之内、并且落入所附权利要求书的限制之内的本公开没有说明的部分。

Claims (21)

1.一种电子设备(100)，包括：
底架(34)；
具有接地部分(28)和电介质部分(30)的印制电路板，所述接地部分(28)经由电耦合器(32)电耦合到所述底架(34)，其中电耦合器(32)是对底架(34)的接地平面具有固有电抗性的电耦合元件；以及
具有第一部分(22)、第二部分(24)和第三部分(26)的F形天线，所述第一部分(22)沿所述印制电路板的所述电介质部分(30)伸展，所述第二部分(24)电耦合到所述印制电路板的所述接地部分(28)，并且所述第三部分(26)在所述印制电路板的所述接地部分(28)和所述电介质部分(30)之间伸展并且经由第一电抗元件电耦合到与信号处理器连接的线缆耦合器(36)，其中，所述线缆耦合器(36)经由第二电抗元件连接到所述接地部分(28)，所述第一电抗元件和第二电抗元件串联耦合在所述第三部分(26)和所述接地部分(28)之间。
2.如权利要求1所述的设备(100)，其中，所述F形天线是所述设备(100)的前面板组件的一部分。
3.如权利要求1所述的设备(100)，还包括外壳(20)，并且其中，所述底架(34)、所述印制电路板和所述F形天线被包含在所述外壳(20)之内。
4.如权利要求1所述的设备(100)，其中，所述F形天线的所述第一部分(22)与所述印制电路板的所述电介质部分(30)基本平行。
5.如权利要求1所述的设备(100)，其中，所述设备(100)是机顶盒。
6.如权利要求1所述的设备(100)，其中，所述F形天线接收来自用户输入元件的射频信号。
7.如权利要求1所述的设备(100)，其中，所述F形天线提供全向信号接收。
8.一种电子设备(100)，包括：
底架(34)；
具有接地部分(28)和电介质部分(30)的第一装置，所述接地部分(28)经由电耦合器(32)电耦合到所述底架(34)，其中电耦合器(32)是对底架(34)的接地平面具有固有电抗性的电耦合元件；以及
具有第一部分(22)、第二部分(24)和第三部分(26)的第二装置，所述第一部分(22)沿所述第一装置的所述电介质部分(30)伸展，所述第二部分(24)电耦合到所述第一装置的所述接地部分(28)，并且所述第三部分(26)在所述第一装置的所述接地部分(28)和所述电介质部分(30)之间伸展并且经由第一电抗元件电耦合到与信号处理装置连接的线缆耦合器(36)，其中，所述线缆耦合器(36)经由第二电抗元件连接到所述接地部分(28)，所述第一电抗元件和第二电抗元件串联耦合在所述第三部分(26)和所述接地部分(28)之间。
9.如权利要求8所述的设备(100)，其中，所述第二装置是所述设备(100)的前面板组件的一部分。
10.如权利要求8所述的设备(100)，还包括外壳(20)，并且其中，所述底架(34)、所述第一装置和所述第二装置被包含在所述外壳(20)之内。
11.如权利要求8所述的设备(100)，其中，所述第二装置的所述第一部分(22)与所述第一装置的所述电介质部分(30)基本平行。
12.如权利要求8所述的设备(100)，其中，所述设备(100)是机顶盒。
13.如权利要求8所述的设备(100)，其中，所述第二装置包括F形天线。
14.如权利要求8所述的设备(100)，其中，所述第二装置提供全向信号接收。
15.一种用于提供电子设备(100)的方法，包括：
提供底架(34)；
提供具有接地部分(28)和电介质部分(30)的印制电路板，所述接地部分(28)经由电耦合器(32)电耦合到所述底架(34)，其中电耦合器(32)是对底架(34)的接地平面具有固有电抗性的电耦合元件；以及
提供具有第一部分(22)、第二部分(24)和第三部分(26)的F形天线，所述第一部分(22)沿所述印制电路板的所述电介质部分(30)伸展，所述第二部分(24)电耦合到所述印制电路板的所述接地部分(28)，并且所述第三部分(26)在所述印制电路板的所述接地部分(28)和所述电介质部分(30)之间伸展并且经由第一电抗元件电耦合到与信号处理器连接的线缆耦合器(36)，其中，所述线缆耦合器(36)经由第二电抗元件连接到所述接地部分(28)，所述第一电抗元件和第二电抗元件串联耦合在所述第三部分(26)和所述接地部分(28)之间。
16.如权利要求15所述的方法，其中所述F形天线是所述电子设备(100)的前面板组件的一部分。
17.如权利要求15所述的方法，还包括提供外壳(20)，并且其中，所述底架(34)、所述印制电路板和所述F形天线被包含在所述外壳(20)之内。
18.如权利要求15所述的方法，其中，所述F形天线的所述第一部分(22)与所述印制电路板的所述电介质部分(30)基本平行。
19.如权利要求15所述的方法，其中，所述电子设备(100)是机顶盒。
20.如权利要求15所述的方法，还包括经由所述F形天线从用户输入元件接收无线信号。
21.如权利要求15所述的方法，还包括经由所述F形天线以全向方式接收信号。
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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100832542B1 (ko) * 2006-12-08 2008-05-27 한국전자통신연구원 ＵＰｎＰ ＱｏＳ 네트워크 시스템 및 이의 경로 및 자원예약 방법
CN101232503B (zh) * 2008-02-22 2012-05-23 中兴通讯股份有限公司 资源分配方法及资源释放方法
US20120113971A1 (en) * 2010-11-08 2012-05-10 Qualcomm Incorporated Efficient wlan discovery and association
CN104241810B (zh) * 2013-06-17 2018-09-25 深圳富泰宏精密工业有限公司 壳体，该壳体的制作方法及应用该壳体的电子装置
CN108777348B (zh) * 2018-06-26 2020-07-24 联想(北京)有限公司 一种电子设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002353716A (ja) * 2001-05-29 2002-12-06 Sony Corp 携帯無線端末
JP2003092510A (ja) * 2001-09-18 2003-03-28 Sharp Corp 板状逆ｆアンテナ及び無線通信装置
CN1408131A (zh) * 2000-03-02 2003-04-02 松下电器产业株式会社 无线信息用户电子装置

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL158378B (nl) 1950-01-12 Philips Nv Stofzuiger.
US4641146A (en) 1984-07-09 1987-02-03 General Dynamics Electronics Division Dipole array with phase and amplitude control
US4835542A (en) 1988-01-06 1989-05-30 Chu Associates, Inc. Ultra-broadband linearly polarized biconical antenna
JP3761976B2 (ja) * 1996-07-03 2006-03-29 株式会社東海理化電機製作所 インナーミラー
JP3467164B2 (ja) 1997-01-10 2003-11-17 シャープ株式会社 逆ｆアンテナ
US6195565B1 (en) * 1998-03-03 2001-02-27 Lucent Technologies Inc. Bandwidth control in a packet-based data system
US6457038B1 (en) * 1998-03-19 2002-09-24 Isochron Data Corporation Wide area network operation's center that sends and receives data from vending machines
US6607136B1 (en) 1998-09-16 2003-08-19 Beepcard Inc. Physical presence digital authentication system
US6239765B1 (en) * 1999-02-27 2001-05-29 Rangestar Wireless, Inc. Asymmetric dipole antenna assembly
US6850779B1 (en) * 1999-05-21 2005-02-01 Matsushita Electric Industrial Co., Ltd. Mobile communication antenna and mobile communication apparatus using it
JP2001077612A (ja) 1999-09-02 2001-03-23 Tdk Corp Ｒｆユニット
US6359594B1 (en) 1999-12-01 2002-03-19 Logitech Europe S.A. Loop antenna parasitics reduction technique
US6823399B2 (en) * 1999-12-06 2004-11-23 Sony Corporation Apparatus control method and transmission device
US6281857B1 (en) * 1999-12-23 2001-08-28 Zenith Electronics Corporation Dipole UHF antenna
US7006794B1 (en) 2000-07-25 2006-02-28 Endwave Corporation Wireless point to multi-point communication apparatus and method
FI20001876A (fi) * 2000-08-25 2002-02-26 Nokia Mobile Phones Ltd Parannettu menetelmä ja järjestely tiedonsiirtämiseksi pakettiradiopalvelussa
US6342860B1 (en) 2001-02-09 2002-01-29 Centurion Wireless Technologies Micro-internal antenna
US7177369B2 (en) 2001-04-27 2007-02-13 Vivato, Inc. Multipath communication methods and apparatuses
GB0117177D0 (en) 2001-07-13 2001-09-05 Hughes Philip T System and method for mass broadband communications
TWI275200B (en) 2002-05-08 2007-03-01 Sony Ericsson Mobile Comm Ab Tuneable radio antenna
US6934876B1 (en) * 2002-06-14 2005-08-23 James L. Holeman, Sr. Registration system and method in a communication network
JP2004104419A (ja) * 2002-09-09 2004-04-02 Hitachi Cable Ltd 携帯無線機用アンテナ
US7643794B2 (en) 2003-04-07 2010-01-05 Yoram Ofek Multi-sector antenna apparatus
TW583783B (en) * 2003-04-17 2004-04-11 Htc Corp Perpendicularly-oriented inverted F antenna
GB0308913D0 (en) 2003-04-17 2003-05-21 Koninkl Philips Electronics Nv Method of, and circuit for,broadening the frequency band of frequency dependentloads
TW568389U (en) * 2003-05-09 2003-12-21 Hon Hai Prec Ind Co Ltd Multi-band printed monopole antenna
KR100530667B1 (ko) * 2003-11-20 2005-11-22 주식회사 팬택 이동통신단말기용 내장 안테나
TWI229473B (en) 2004-01-30 2005-03-11 Yageo Corp Dual-band inverted-F antenna with shorted parasitic elements
KR101042745B1 (ko) * 2004-01-30 2011-06-20 삼성전자주식회사 클라이언트 단말장치와 서버 사이의 세션 재설정을 위한시스템 및 방법
US20060012482A1 (en) 2004-07-16 2006-01-19 Peter Zalud Radio frequency identification tag having an inductively coupled antenna
US7307591B2 (en) 2004-07-20 2007-12-11 Nokia Corporation Multi-band antenna
US7102577B2 (en) * 2004-09-30 2006-09-05 Motorola, Inc. Multi-antenna handheld wireless communication device
JP4843611B2 (ja) 2004-10-01 2011-12-21 デ，ロシェモント，エル．，ピエール セラミックアンテナモジュール及びその製造方法
WO2006080141A1 (ja) 2005-01-27 2006-08-03 Murata Manufacturing Co., Ltd. アンテナ及び無線通信機
US7821401B2 (en) 2005-07-28 2010-10-26 Tagsys Sas RFID tag containing two tuned circuits
US7907971B2 (en) 2005-08-22 2011-03-15 Airgain, Inc. Optimized directional antenna system
US7242364B2 (en) * 2005-09-29 2007-07-10 Nokia Corporation Dual-resonant antenna
US7876274B2 (en) * 2007-06-21 2011-01-25 Apple Inc. Wireless handheld electronic device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1408131A (zh) * 2000-03-02 2003-04-02 松下电器产业株式会社 无线信息用户电子装置
JP2002353716A (ja) * 2001-05-29 2002-12-06 Sony Corp 携帯無線端末
JP2003092510A (ja) * 2001-09-18 2003-03-28 Sharp Corp 板状逆ｆアンテナ及び無線通信装置

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