CN101813636A - LED chip panoramic scanning matching method - Google Patents
LED chip panoramic scanning matching method Download PDFInfo
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Abstract
The invention relates to an LED chip panoramic scanning matching method which comprises the following steps that: (1) detection equipment scans and detects the surface of a wafer; (2) the wafer is transferred to sorting equipment; and (3) the sorting equipment sorts an LED chip on the surface of the wafer. Step (1) comprises the following steps that: parameter setting, scanning, splicing and de-weighing, and a relation sheet 1 of the position of the LED chip and the parameter information thereof is obtained. Step (3) comprises the following steps that: (31) the sorting equipment searches the wafer, and a relation sheet 2 of the LED chip and the position thereof is obtained; (32) the parameter information of the LED chip in the relation sheet 1 is matched with the position of the LED chip in the relation sheet 2, and a relation sheet 3 of the position and parameter relationship of the chip is obtained; and (33) sorting. The LED chip panoramic scanning matching method has the advantages of accurate matching and wide scope of application.
Description
Technical field
The present invention relates to led chip sorting technology field, particularly relate to a kind of led chip panoramic scanning matching method.
Background technology
Led chip has been widely used in us and has produced and various fields in life.It is important that the performance of led chip and quality especially show, and therefore, need the led chip of crystal column surface be detected usually in the production, so that postorder will damage or led chip off quality is picked rejecting or with the conscientious quality sorting of chip.
In the actual production process,, often need detection with chip to be separated into different equipment and carry out with sorting for the detection and the efficiency of separation that improves chip.Machines at first to led chip by positioning and test.After detection was finished, position and parameter information were sent to separator in the lump.Then, wafer is transplanted on separator from machines, and separator drives vision system identification led chip again, and recognition result and the positional information of receiving are mated, and last, separator carries out sorting according to chip position and classification.
Matching process commonly used comprises coordinate coupling and index coupling.The feature chip position that coordinate coupling goes out according to visual identity such as upper right corner chip, calculates the relative position of each chip respectively, and is mated according to relative position at machines end and separator end.This method is simple, but because chip is very small, in case wafer generation microdeformation, the position of chip will change, and algorithm can't be rectified a deviation, actual employing is less.The index matching process is converted into the ranks index with relative position and handles, and can eliminate the influence of local deformation to a certain extent, and actual employing is more, in case but local deformation or deflection take place in wafer, and matching effect is still not ideal.
Detect and the handover process in, epitaxial wafer is might be cracked, local incomplete, move or deflection, these can cause that all chip position changes, and make separator end actual measurement chip position and machines provide position data not to be inconsistent, and cause sorting difficulty or mistake.And in the reality, when wafer after tested, be transplanted in the process of screening installation, wafer tends to take place the deflection of certain angle, causes chip position generation deviation, thereby causes the coupling of chip inaccurate, often causes occurring in the die grading process some deviations.Therefore, be necessary to provide a kind of method, should complete, accurately describe the distributed intelligence of led chip, eliminate the influence of technological process again as far as possible, realize accurately coupling.
Therefore, at the prior art deficiency, provide a kind of led chip panoramic scanning matching method very necessary to solve the prior art weak point.
Summary of the invention
The objective of the invention is to avoid the deficiencies in the prior art part and a kind of led chip panoramic scanning matching method is provided, this method can accurately be described the distributed intelligence of led chip, and the led chip of screening installation and checkout equipment accurately can be mated, thereby realize effective sorting.
Purpose of the present invention realizes by following technical measures:
A kind of led chip panoramic scanning matching method comprises the following steps:
(1) checkout equipment scans and detects the led chip of crystal column surface, obtains the position and the corresponding parameters information of every LEDs chip;
Specifically comprise:
(11) moving step length of the motor of default described checkout equipment is (StepX, StepY), looks the specification of piece and fixes, and the length and width of looking piece are respectively X, Y, and X=A*StepX, Y=B*StepY, wherein, A 〉=1, B 〉=1;
(12) scanning and detection, mobile motor, described checkout equipment scans the led chip of described crystal column surface, and detects the parameter information of described led chip, writes down the image of every width of cloth scanning, the parameter information motor coordinate corresponding with image of the led chip that detected;
(13) splicing is got up according to the motor coordinate of the image correspondence image mosaic with scanning;
(14) go heavily, repeating part in the above-mentioned image that is stitched together is removed, and removal repeating part corresponding parameters information, obtain the real topography of the every LEDs chip of crystal column surface, and position and its parameter information table of comparisons RelationSheet1 of the every LEDs chip of acquisition crystal column surface, RelationSheet1 is sent to screening installation with the table of comparisons;
(2) wafer is transplanted on screening installation from checkout facility;
(3) screening installation carries out sorting to the led chip of crystal column surface;
Specifically comprise:
(31) screening installation travels through the led chip of crystal column surface and searches, and obtains the every LEDs chip of crystal column surface and its position and concerns table of comparisons RelationSheet2;
(32) led chip that will show among RelationSheet1 and the table RelationSheet2 mates, with the corresponding coupling in position of the led chip among the parameter information of the led chip of table among the RelationSheet1 and the RelationSheet2, the position of the every LEDs chip of crystal column surface at acquisition screening installation place and the RelationSheet3 of parameters relationship;
(33) according to RelationSheet3 led chip is carried out sorting.
Preferably, step (14) is removed the repeating part in the above-mentioned image that is stitched together, and specifically comprises:
(141) according to the coordinate of every LEDs chip, its X coordinate is sorted, the jump by the chip coordinate figure judges whether to enter next column, determines the X index of the led chip of crystal column surface;
(142) according to the coordinate of every LEDs chip, its Y coordinate is sorted, the jump by the chip coordinate figure judges whether to enter next line, determines the Y index of the led chip of crystal column surface;
(143) judge whether the X index of any two LEDs chips, Y index be identical, if identical, then has polyisomenism, the data of a LEDs chip are wherein removed.
Preferably, above-mentioned steps (31) screening installation travels through the led chip of crystal column surface and searches, and it is searched specifically and comprises:
(311) selected led chip begins to search as starting point, and the call number of this led chip is set to (0,0);
(312) be current searching point with described led chip, seek the right part adjacent and whether have led chip,, then enter step (316), if there is no, then enter step (313) if exist with current searching point;
(313) seek the left part adjacent and whether have led chip,, then enter step (316), if there is no, then enter step (314) if exist with current searching point;
(314) seek the bottom adjacent and whether have led chip,, then enter step (316), if there is no, then enter step (315) if exist with current searching point;
(315) seek the top adjacent with current searching point and whether have led chip, if exist, then enter step (316), if there is no, then current searching point becomes end point, enters step (317);
(316) obtain the call number of the led chip of adjacent position, and with this led chip as when new current searching point, should be linked to be line formation searching path with a last current searching point by current searching point, led chip on the described searching path is put the passed sign, the led chip on next door, described searching path is put the caled sign, returns step (312) then;
(317) date back to the last current searching point of described end point from described end point, and with this point as current searching point;
(318) seek the right part adjacent and whether deposit led chip, if there is no, then enter step (319) with current searching point;
If exist, judge then whether described led chip puts passed, if, then enter step (319), if not, then enter step (3194);
(319) seek the left part adjacent and whether deposit led chip, if there is no, then enter step (3191) with current searching point;
If exist, judge then whether described led chip puts passed, if, then enter step (3191), if not, then enter step (3194);
(3191) seek the bottom adjacent and whether deposit led chip, if there is no, then enter step (3192) with current searching point;
If exist, judge then whether described led chip puts passed, if, then enter step (3192), if not, then enter step (3194);
(3192) seek the bottom adjacent and whether deposit led chip, if there is no, then enter step (3195) with current searching point;
If exist, judge then whether described led chip puts passed, if, then enter step (3192), if not, then enter step (3194);
(3194) with the starting point of described led chip as a bifurcated path, be current searching point with this starting point, return step (312);
(3195) whether the led chip of searching whole crystal column surface exists the point of having put caled but not put passed, if exist, returns step (317), if not, then enters step (3196);
(3196) finish to search.
Further, a led chip in the selected crystal column surface upper left corner of above-mentioned steps (311) begins to search as starting point.
Another is preferred, above-mentioned steps (32), specifically be the corresponding coupling in position, obtain the position of every LEDs chip of crystal column surface at screening installation place and the RelationSheet3 of parameters relationship the led chip among the X index of the led chip among the RelationSheet1 and Y index and the RelationSheet2.
A kind of led chip panoramic scanning matching method of the present invention comprises the following steps:
(1) checkout equipment scans and detects the led chip of crystal column surface, obtains the position and the corresponding parameters information of every LEDs chip; Specifically comprise: the moving step length (StepX, StepY) of the motor of (11) default described checkout equipment, to look the specification of piece and fix, the length and width of looking piece are respectively X, Y, and X=A*StepX, Y=B*StepY, wherein, A 〉=1, B 〉=1; (12) scanning and detection, mobile motor, described checkout equipment scans the led chip of described crystal column surface, and detects the parameter information of described led chip, writes down the image of every width of cloth scanning, the parameter information motor coordinate corresponding with image of the led chip that detected; (13) splicing is got up according to the motor coordinate of the image correspondence image mosaic with scanning; (14) go heavily, repeating part in the above-mentioned image that is stitched together is removed, and removal repeating part corresponding parameters information, obtain the real topography of the every LEDs chip of crystal column surface, and position and its parameter information table of comparisons RelationSheet1 of the every LEDs chip of acquisition crystal column surface, RelationSheet1 is sent to screening installation with the table of comparisons; (2) wafer is transplanted on screening installation from checkout facility; (3) screening installation carries out sorting to the led chip of crystal column surface; Specifically comprise: (31) screening installation travels through the led chip of crystal column surface and searches, and obtains the every LEDs chip of crystal column surface and its position and concerns table of comparisons RelationSheet2; (32) led chip that will show among RelationSheet1 and the table RelationSheet2 mates, with the corresponding coupling in position of the led chip among the parameter information of the led chip of table among the RelationSheet1 and the RelationSheet2, the position of the every LEDs chip of crystal column surface at acquisition screening installation place and the RelationSheet3 of parameters relationship; (33) according to RelationSheet3 led chip is carried out sorting.A kind of led chip panoramic scanning matching method of the present invention, the characteristic of utilizing the relative position between the led chip of crystal column surface can not change, the led chip information of checkout equipment led chip information and screening installation is mated, coupling accurately, can guarantee the accurate coupling of every LEDs chip, thereby guarantee that the parameter information of every LEDs chip and the positional information at screening installation place can accurately mate, guarantee the accurate letter sorting of led chip.
Description of drawings
The invention will be further described in conjunction with the accompanying drawings, but the content in the accompanying drawing does not constitute any limitation of the invention.
Fig. 1 is that step (31) screening installation of a kind of led chip panoramic scanning matching method of the present invention travels through the synoptic diagram of searching to the led chip of crystal column surface.
Embodiment
The invention will be further described with the following Examples.
A kind of led chip panoramic scanning matching method comprises the following steps:
(1) checkout equipment scans and detects the led chip of crystal column surface, obtains the position and the corresponding parameters information of every LEDs chip;
(2) wafer is transplanted on screening installation from checkout facility;
(3) screening installation carries out sorting to the led chip of crystal column surface.
Checkout equipment scans and detects the led chip of crystal column surface, obtain the position and the parameter information relation of whole crystal column surface led chip, after the scanning and detection by step (1), can tell the parameter information such as pattern, quality grade, performance parameter of the led chip of crystal column surface, for follow-up process of separation provides important information.
After the wafer process step (1), be transplanted on screening installation from checkout equipment, deflection owing to wafer generation certain angle in the handover process causes chip position generation deviation, make that the led chip coupling is inaccurate, step (3) screening installation carries out sorting to the led chip of crystal column surface, at first the led chip of crystal column surface is traveled through and search, and then carry out led chip coupling and sorting.
Because the led chip physical space skewness on chip disk surface differs between the led chip at interval, and the centre might occur lacking piece, even chip situation about damaging.In order to make scanning result can correctly, intactly reflect the actual distribution situation of led chip, need improve by planning parameters of scanning paths.
So step (1) specifically comprises:
(11) moving step length (StepX, StepY) of the motor of default described checkout equipment is looked the specification of piece and is fixed, and the length and width of looking piece are respectively X, Y, and X=A*StepX, Y=B*StepY, wherein, A 〉=1, B 〉=1.
Looking piece is the zone of visual identity.Because led chip differs at interval, looking piece can not completely comprise all led chips, that is to say that partial L ED chip might drop on the edge of looking piece, like this, the phenomenon that exists partial L ED chip can not be correctly validated, its result can cause in the identifying part led chip to lose.
In this step, the moving step length of motor is fixed, look the piece fixed size, the length and width of looking piece are respectively X, Y, and X=A*StepX, Y=B*StepY, wherein, A 〉=1, B 〉=1, like this, look the piece size and can be set to cover delegation's one row chip of step-length or multicore sheet more according to the actual scanning needs.This set, even the led chip at part edge can not be by when the effective or complete identification of forward sight piece, system has also for the second time that chance scans whole chips, thereby reduces the loss of chip.
(12) scanning and detect, mobile motor, described checkout equipment scans the led chip of described crystal column surface, and detects the parameter information of led chip, writes down the image of every width of cloth scanning, the parameter information motor coordinate corresponding with image of the led chip that detected.Motor moves to a position at every turn, and relevant detection equipment will be taken and detect, and according to the motor coordinate of every width of cloth image correspondence, captured image mosaic can be got up.
(13) splicing is got up according to the motor coordinate of the image correspondence image mosaic with scanning.
(14) go heavily, repeating part in the above-mentioned image that is stitched together is removed, and remove repeating part corresponding parameters information, and obtaining position and itself and its parameter information table of comparisons RelationSheet1 of the every LEDs chip of crystal column surface, RelationSheet1 is sent to screening installation with the table of comparisons.
Because in the scanning process, look the piece size and be set to comprise multirow, multiple row led chip, scanning process can reduce the loss of led chip, but this set also can cause same LEDs chip is carried out twice or even repeatedly scanning the detected parameters of group more than obtaining simultaneously simultaneously.Like this, behind image mosaic, just need go heavy step, the data of multiple scanning are removed.
Concrete, step (14) is removed the repeating part in the above-mentioned image that is stitched together, and specifically comprises:
(141) according to the coordinate of every LEDs chip, its X coordinate is sorted, the jump by the chip coordinate figure judges whether to enter next column, determines the X index of the led chip of crystal column surface.
(142) according to the coordinate of every LEDs chip, its Y coordinate is sorted, the jump by the chip coordinate figure judges whether to enter next line, determines the Y index of the led chip of crystal column surface.
(143) judge whether the X index of any two LEDs chips, Y index be identical, if identical, then has polyisomenism, the data of a LEDs chip are wherein removed.
As shown in Table 1, to the 20 chips coordinate datas that scanned, carry out data by ordering computation index method and go heavily.According to the coordinate of every LEDs chip, its X coordinate to be sorted, the jump by the chip coordinate figure judges whether to enter next column, determines the X index of the led chip of crystal column surface; Equally, its Y coordinate is sorted, the jump by the chip coordinate figure judges whether to enter next line, determines the Y index of the led chip of crystal column surface; Whether X index, the Y index of judging two LEDs chips again be identical, if identical, then has polyisomenism, and the data of a LEDs chip are wherein removed.Result after obtaining weighing as shown in Table 2.
Table one: do not remove heavy preceding chip data
| Chip number | Chip X coordinate | Chip Y coordinate | Chip X index | Chip Y index |
| ??1 | ??-73163.8511491387 | ??-8372.0246068896 | ?0 | ?2 |
| ??2 | ??-73152.7827819085 | ??-8935.11016905883 | ?0 | ?1 |
| Chip number | Chip X coordinate | Chip Y coordinate | Chip X index | Chip Y index |
| ??3 | ??-73137.6505221158 | ??-7777.65375905296 | ?0 | ?3 |
| ??4 | ??-73112.282470446 | ??-7193.13757733727 | ?0 | ?4 |
| ??5 | ??-72645.2919304247 | ??-9507.5751878543 | ?1 | ?0 |
| ??6 | ??-72637.418636632 | ??-9512.37603914306 | ?1 | ?0 |
| ??7 | ??-72619.2938173328 | ??-8940.06579344812 | ?1 | ?1 |
| ??8 | ??-72612.3808019169 | ??-8945.73097181379 | ?1 | ?1 |
| ??9 | ??-72601.3588662481 | ??-8354.6517190684 | ?1 | ?2 |
| ??10 | ??-72594.5132202554 | ??-8361.19612807117 | ?1 | ?2 |
| ??11 | ??-72582.186549317 | ??-7772.62787320754 | ?1 | ?3 |
| ??12 | ??-72574.8621988703 | ??-7779.95599130736 | ?1 | ?3 |
| ??13 | ??-72556.8571691621 | ??-7189.92643272013 | ?1 | ?4 |
| ??14 | ??-72549.2840782884 | ??-7198.07110063054 | ?1 | ?4 |
| ??15 | ??-72092.3700688528 | ??-9509.15911679642 | ?2 | ?0 |
| ??16 | ??-72085.7078866028 | ??-9514.56304870952 | ?2 | ?0 |
| ??17 | ??-72064.6986431714 | ??-8932.51899093807 | ?2 | ?1 |
| ??18 | ??-72059.6533418483 | ??-8938.21361737429 | ?2 | ?1 |
| ??19 | ??-72021.5648977509 | ??-7774.8225384426 | ?2 | ?3 |
| ??20 | ??-72016.3532085359 | ??-7782.02968747362 | ?2 | ?3 |
Table two: the chip data after going to weigh
| Chip number | Chip X coordinate | Chip Y coordinate | Chip X index | Chip Y index |
| ??1 | ??-73163.8511491387 | ??-8372.0246068896 | ?0 | ?2 |
| ??2 | ??-73152.7827819085 | ??-8935.11016905883 | ?0 | ?1 |
| Chip number | Chip X coordinate | Chip Y coordinate | Chip X index | Chip Y index |
| ??3 | ??-73137.6505221158 | ??-7777.65375905296 | ?0 | ?3 |
| ??4 | ??-73112.282470446 | ??-7193.13757733727 | ?0 | ?4 |
| ??5 | ??-72645.2919304247 | ??-9507.5751878543 | ?1 | ?0 |
| ??6 | ??-72619.2938173328 | ??-8940.06579344812 | ?1 | ?1 |
| ??7 | ??-72601.3588662481 | ??-8354.6517190684 | ?1 | ?2 |
| ??8 | ??-72582.186549317 | ??-7772.62787320754 | ?1 | ?3 |
| ??9 | ??-72556.8571691621 | ??-7189.92643272013 | ?1 | ?4 |
| ??10 | ??-72092.3700688528 | ??-9509.15911679642 | ?2 | ?0 |
| ??11 | ??-72064.6986431714 | ??-8932.51899093807 | ?2 | ?1 |
| ??12 | ??-72021.5648977509 | ??-7774.8225384426 | ?2 | ?3 |
Owing to adopted X, Y direction independently index determines that the actual relative position after the led chip scanning obtains correct reproduction, has truly reflected the distribution of chip at crystal column surface, and the repeating data that will cover in the scanning carried out going heavily, goes heavy processing for whole scanning important meaning to be arranged.
Through overscanning, splice and go heavy after, obtain the position of led chip of crystal column surface and the table of comparisons RelationSheet1 of its parameter information.
After checkout equipment scanning, the table of comparisons RelationSheet1 of the position of the led chip of crystal column surface and its parameter information sends to screening installation.Wafer is transplanted on screening installation then.Before sorting, screening installation need carry out go forward side by side line data coupling of searching of led chip again, and coupling requires absolutely accurate.
So step (3) specifically comprises:
Step (31) screening installation travels through the led chip of crystal column surface and searches, and it is searched specifically and comprises:
(311) selected led chip begins to search as starting point, and the call number of this led chip is set to (0,0).Usually, a led chip in the selected crystal column surface upper left corner begins to search as starting point.
(312) be current searching point with described led chip, seek the right part adjacent and whether have led chip,, then enter step (316), if there is no, then enter step (313) if exist with current searching point.
(313) seek the left part adjacent and whether have led chip,, then enter step (316), if there is no, then enter step (314) if exist with current searching point.
(314) seek the bottom adjacent and whether have led chip,, then enter step (316), if there is no, then enter step (315) if exist with current searching point.
(315) seek the top adjacent with current searching point and whether have led chip, if exist, then enter step (316), if there is no, then current searching point becomes end point, enters step (317).
(316) obtain the call number of the led chip of adjacent position, and with this led chip as when new current searching point, should be linked to be line formation searching path with a last current searching point by current searching point, led chip on the described searching path is put the passed sign, the led chip on next door, described searching path is put the caled sign, returns step (312) then.
(317) date back to the last current searching point of described end point from described end point, and with this point as current searching point.
(318) seek the right part adjacent and whether deposit led chip, if there is no, then enter step (319) with current searching point;
If exist, judge then whether described led chip puts passed, if, then enter step (319), if not, then enter step (3194);
(319) seek the left part adjacent and whether deposit led chip, if there is no, then enter step (3191) with current searching point;
If exist, judge then whether described led chip puts passed, if, then enter step (3191), if not, then enter step (3194).
(3191) seek the bottom adjacent and whether deposit led chip, if there is no, then enter step (3192) with current searching point;
If exist, judge then whether described led chip puts passed, if, then enter step (3192), if not, then enter step (3194).
(3192) seek the bottom adjacent and whether deposit led chip, if there is no, then enter step (3195) with current searching point;
If exist, judge then whether described led chip puts passed, if, then enter step (3192), if not, then enter step (3194).
(3194) with the starting point of described led chip as a bifurcated path, be current searching point with this starting point, return step (312).
(3195) whether the led chip of searching whole crystal column surface exists the point of having put caled but not put passed, if exist, returns step (317), if not, then enters step (3196).
(3196) finish to search.
(32) will show RelationSheet1 and the led chip of table among the RelationSheet2 mates, with the position of the corresponding every LEDs chip of crystal column surface that mates acquisition screening installation place in the position of the led chip among the parameter information of the led chip among the table RelationSheet1 and the RelationSheet2 and the RelationSheet3 of parameters relationship.
(33) according to RelationSheet3 led chip is carried out sorting.
A kind of led chip panoramic scanning matching method provided by the invention, by checkout equipment crystal column surface is scanned the parameter information and the position thereof that obtain led chip and concern RelationSheet1, when wafer transfer behind screening installation, screening installation travels through wafer and searches.Acquisition led chip this moment and position thereof concern RelationSheet2.Then that the location matches of the led chip among the X index of the led chip among the RelationSheet1 and Y index and the RelationSheet2 is corresponding, obtain the position of every LEDs chip and the RelationSheet3 of its parameter information relation.RelationSheet1 taken from the index of the every LEDs chip among the RelationSheet3, and RelationSheet2 is taken from the position.This matching process, the characteristic that when utilizing wafer generation angular deflection and the mutual alignment between led chip relation can not change is carried out Data Matching.Adopt this kind method, the Data Matching success ratio can guarantee the accurate location of every LEDs chip almost near 100%, guarantees that the detection Data Matching of every LEDs chip is accurate.
As shown in Figure 1, step (31) screening installation travels through the led chip of crystal column surface and searches, and it is searched specifically and comprises:
(311) led chip in the selected crystal column surface upper left corner begins to search as starting point, and the call number of this led chip is set to (0,0).
(312) be current searching point with described led chip, seek the right part adjacent and whether have led chip,, then enter step (316), if there is no, then enter step (313) if exist with current searching point.
(313) seek the left part adjacent and whether have led chip,, then enter step (316), if there is no, then enter step (314) if exist with current searching point.
(314) seek the bottom adjacent and whether have led chip,, then enter step (316), if there is no, then enter step (315) if exist with current searching point.
(315) seek the top adjacent with current searching point and whether have led chip, if exist, then enter step (316), if there is no, then current searching point becomes end point, enters step (317).
(316) obtain the call number of the led chip of adjacent position, and with this led chip as when new current searching point, should be linked to be line formation searching path with a last current searching point by current searching point, led chip on the described searching path is put the passed sign, the led chip on next door, described searching path is put the caled sign, returns step (312) then.
(317) date back to the last current searching point of described end point from described end point, and with this point as current searching point.
(318) seek the right part adjacent and whether deposit led chip, if there is no, then enter step (319) with current searching point;
If exist, judge then whether described led chip puts passed, if, then enter step (319), if not, then enter step (3194);
(319) seek the left part adjacent and whether deposit led chip, if there is no, then enter step (3191) with current searching point;
If exist, judge then whether described led chip puts passed, if, then enter step (3191), if not, then enter step (3194).
(3191) seek the bottom adjacent and whether deposit led chip, if there is no, then enter step (3192) with current searching point;
If exist, judge then whether described led chip puts passed, if, then enter step (3192), if not, then enter step (3194).
(3192) seek the bottom adjacent and whether deposit led chip, if there is no, then enter step (3195) with current searching point;
If exist, judge then whether described led chip puts passed, if, then enter step (3192), if not, then enter step (3194).
(3194) with the starting point of described led chip as a bifurcated path, be current searching point with this starting point, return step (312).
(3195) whether the led chip of searching whole crystal column surface exists the point of having put caled but not put passed, if exist, returns step (317), if not, then enters step (3196).
(3196) finish to search.
By this step (31), screening installation can all be searched the led chip of crystal column surface, makes all led chips to be searched.
By experiment the led chip of different wafers is scanned and mate, the result as shown in Table 3.Wherein, experiment 1 and experiment 2 wafers are better in test side and sorting end two ends chip registration, the wafer of experiment 3 is when the sorting end, local deformation has taken place in the wafer with respect to the test side, the wafer of experiment 4 is when the sorting end, local angular deviation has taken place in the wafer with respect to the test side, and experiment 5 and experiment 6 wafer with respect to the wafer of test side angular deviation have taken place when the sorting end.
Table three: matching result table
| The detection chip sum | The sorting chip count | The index coupling | The coordinate coupling | The position-based | |
| Experiment | |||||
| 1 | ??1961 | ??1960 | ??1768(90.22％) | ??1810(92.35％) | ??1955(99.79％) |
| |
??1960 | ??1940 | ??1793(92.45％) | ??1797(92.63％) | ??1928(99.43％) |
| |
??16987 | ??16986 | ??15227(89.65％) | ??15076(88.76％) | ??16975(99.94％) |
| |
??16709 | ??16986 | ??13813(81.32％) | ??13548(79.76％) | ??16472(96.71％) |
| |
??26820 | ??26756 | ??16470(61.56％) | ??14052(52.52％) | ??24754(92.52％) |
| Experiment 6 | ??26889 | ??26756 | ??12091(45.19％) | ??13824(49.65％) | ??24634(92.07％) |
Be the power that is matched to of every kind of method in the bracket, be i.e. search the ratio of the led chip sum that obtains on the led chip sum that the final success of screening installation is mated and the screening installation.The result shows that the matching method matches success ratio of position-based relation reaches more than 99.5%, and can eliminate the local deformation influence.
By experimental result as seen, in experiment 1 and experiment 2, when test side and sorting end two ends chip registration preferably the time, index coupling and coordinate matching method matches effect all can also be accepted, but, the matching result of the matching process of all too late position-based relation of the matching effect of index coupling and coordinate matching process.
In experiment 3 and experiment 4, in case local deformation is taken place, during angle mired deviation, index coupling and coordinate matching method matches success ratio significantly descend, and the matching result of the matching process of position-based relation is still relatively better, is respectively 99.94% and 96.71%.
In experiment 5 and experiment 6, when wafer when angular deviation has taken place with respect to the wafer of test side in the sorting end, index coupling and coordinate matching method matches success ratio are very undesirable, and the matching result of the matching process of position-based relation is still relatively better, remains on more than 92%.
As seen, the matching process of position-based relation has better adaptability.In the actual mechanical process, the choosing of recognition visible sensation sample, characteristic area, angle identification error, face local deformation etc. all can impact the chip position coupling.In the case, the matching process of position-based relation demonstrates remarkable advantages, even if because the blue film surface generation office distortion that chip depends on, but the relation of the mutual alignment between the chip can't change, in the case, effective led chip matching effect of detecting of screening installation end is ideal.
Should be noted that at last; above embodiment is only in order to illustrate technical scheme of the present invention but not limiting the scope of the invention; although the present invention has been done detailed description with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can make amendment or be equal to replacement technical scheme of the present invention, and not break away from the essence and the scope of technical solution of the present invention.
Claims (5)
1. a led chip panoramic scanning matching method is characterized in that: comprise the following steps:
(1) checkout equipment scans and detects the led chip of crystal column surface, obtains the position and the corresponding parameters information of every LEDs chip;
Specifically comprise:
(11) moving step length of the motor of default described checkout equipment is (StepX, StepY), looks the specification of piece and fixes, and the length and width of looking piece are respectively X, Y, and X=A*StepX, Y=B*StepY, wherein, A 〉=1, B 〉=1;
(12) scanning and detection, mobile motor, described checkout equipment scans the led chip of described crystal column surface, and detects the parameter information of described led chip, writes down the image of every width of cloth scanning, the parameter information motor coordinate corresponding with image of the led chip that detected;
(13) splicing is got up according to the motor coordinate of the image correspondence image mosaic with scanning;
(14) go heavily, repeating part in the above-mentioned image that is stitched together is removed, and removal repeating part corresponding parameters information, obtain the real topography of the every LEDs chip of crystal column surface, and position and its parameter information table of comparisons RelationSheet1 of the every LEDs chip of acquisition crystal column surface, RelationSheet1 is sent to screening installation with the table of comparisons;
(2) wafer is transplanted on screening installation from checkout facility;
(3) screening installation carries out sorting to the led chip of crystal column surface;
Specifically comprise:
(31) screening installation travels through the led chip of crystal column surface and searches, and obtains the every LEDs chip of crystal column surface and its position and concerns table of comparisons RelationSheet2;
(32) led chip that will show among RelationSheet1 and the table RelationSheet2 mates, with the corresponding coupling in position of the led chip among the parameter information of the led chip of table among the RelationSheet1 and the RelationSheet2, the position of the every LEDs chip of crystal column surface at acquisition screening installation place and the RelationSheet3 of parameters relationship;
(33) according to RelationSheet3 led chip is carried out sorting.
2. a kind of led chip panoramic scanning matching method according to claim 1 is characterized in that:
Step (14) is removed the repeating part in the above-mentioned image that is stitched together, and specifically comprises:
(141) according to the coordinate of every LEDs chip, its X coordinate is sorted, the jump by the chip coordinate figure judges whether to enter next column, determines the X index of the led chip of crystal column surface;
(142) according to the coordinate of every LEDs chip, its Y coordinate is sorted, the jump by the chip coordinate figure judges whether to enter next line, determines the Y index of the led chip of crystal column surface;
(143) judge whether the X index of any two LEDs chips, Y index be identical, if identical, then has polyisomenism, the data of a LEDs chip are wherein removed.
3. a kind of led chip panoramic scanning matching method according to claim 2 is characterized in that:
Described step (31) screening installation travels through the led chip of crystal column surface and searches, and it is searched specifically and comprises:
(311) selected led chip begins to search as starting point, and the call number of this led chip is set to (0,0);
(312) be current searching point with described led chip, seek the right part adjacent and whether have led chip,, then enter step (316), if there is no, then enter step (313) if exist with current searching point;
(313) seek the left part adjacent and whether have led chip,, then enter step (316), if there is no, then enter step (314) if exist with current searching point;
(314) seek the bottom adjacent and whether have led chip,, then enter step (316), if there is no, then enter step (315) if exist with current searching point;
(315) seek the top adjacent with current searching point and whether have led chip, if exist, then enter step (316), if there is no, then current searching point becomes end point, enters step (317);
(316) obtain the call number of the led chip of adjacent position, and with this led chip as when new current searching point, should be linked to be line formation searching path with a last current searching point by current searching point, led chip on the described searching path is put the passed sign, the led chip on next door, described searching path is put the caled sign, returns step (312) then;
(317) date back to the last current searching point of described end point from described end point, and with this point as current searching point;
(318) seek the right part adjacent and whether deposit led chip, if there is no, then enter step (319) with current searching point;
If exist, judge then whether described led chip puts passed, if, then enter step (319), if not, then enter step (3194);
(319) seek the left part adjacent and whether deposit led chip, if there is no, then enter step (3191) with current searching point;
If exist, judge then whether described led chip puts passed, if, then enter step (3191), if not, then enter step (3194);
(3191) seek the bottom adjacent and whether deposit led chip, if there is no, then enter step (3192) with current searching point;
If exist, judge then whether described led chip puts passed, if, then enter step (3192), if not, then enter step (3194);
(3192) seek the bottom adjacent and whether deposit led chip, if there is no, then enter step (3195) with current searching point;
If exist, judge then whether described led chip puts passed, if, then enter step (3192), if not, then enter step (3194);
(3194) with the starting point of described led chip as a bifurcated path, be current searching point with this starting point, return step (312);
(3195) whether the led chip of searching whole crystal column surface exists the point of having put caled but not put passed, if exist, returns step (317), if not, then enters step (3196);
(3196) finish to search.
4. led chip panoramic scanning matching method according to claim 3 is characterized in that: a led chip in the selected crystal column surface upper left corner of described step (311) begins to search as starting point.
5. led chip panoramic scanning matching method according to claim 3 is characterized in that:
Described step (32), specifically be the corresponding coupling in position, obtain the position of every LEDs chip of crystal column surface at screening installation place and the RelationSheet3 of parameters relationship the led chip among the X index of the led chip among the RelationSheet1 and Y index and the RelationSheet2.
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