CN101813540A - Pressure sensor capable of switching between positive pressure measurement and negative pressure measurement by program setting - Google Patents
Pressure sensor capable of switching between positive pressure measurement and negative pressure measurement by program setting Download PDFInfo
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- CN101813540A CN101813540A CN200910184657A CN200910184657A CN101813540A CN 101813540 A CN101813540 A CN 101813540A CN 200910184657 A CN200910184657 A CN 200910184657A CN 200910184657 A CN200910184657 A CN 200910184657A CN 101813540 A CN101813540 A CN 101813540A
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Abstract
The invention discloses a pressure sensor capable of switching between positive pressure measurement and negative pressure measurement by program setting, comprising a chip. The invention is characterized in that the pressure sensor also comprises a chip programming panel realizing chip programming function, the chip is provided with a programmable signal processing circuit and a pressure sensor, the input terminal of the signal processing circuit is connected with the output terminal of the pressure sensor, one end of the chip programming panel is connected with a computer by a communication interface, and the other end is connected with the signal processing circuit on the chip. In the invention, the pressure sensor and a digital signal processing circuit form an integrated structure, stability of sensor is improved, production cost is reduced, and meanwhile modularization and friendly human-machine interface are realized, thus being convenient for a user to calibrate the sensor; and the invention has the characteristics of simple structure, small volume, light weight and long service life and can be widely applied to various industrial automatic control environments.
Description
Technical field
The present invention relates to a kind of sensor, relate to malleation and negative pressure that a kind of and signal processing circuit is arranged on the setting able to programme on the same chip specifically and measure the pressure transducer of conversion.
Background technology
Sensor is a kind of pick-up unit, can experience measured information, and it can be experienced detected information, be for conversion into the information output of electric signal or other desired forms according to certain rules, to satisfy requirements such as transmission of Information, processing, storage, demonstration, record and control, it is a primary link of realizing detection automatically and automatic control.Sensing technology then is a kind of complex art of studying material, design, technology, performance and the application etc. of sensor, belongs to a marginal technology, and it relates to physics, mathematics, and chemistry, and to the research and development of the sensitive element of sensor part.In research to sensor, except will researching and developing to its chip, also tackle the packaging technology and the encapsulating structure of sensor and study, because the packaging technology of sensor and encapsulating structure cause one of key factor that sensor can not reliablely and stablely be worked often.
But after automotive electronicsization, automobile high volume applications pressure transducer, and the debugging problem of sensor also just appears suddenly out.
At first, according to the difference of measuring media, diffusion silicon pressure sensor all need be measured negative pressure in a lot of automotive applications, and traditional silicon pressure sensor can't be realized free converted measurement pressure.Therefore sensor package producer has to select the pressure transducer of two kinds of models in the former application, and this has increased the cost of debugging and encapsulation to a certain extent.
Secondly, the temperature range that the pressure transducer of automotive grade uses is from-40～125 degree, require sensor in so wide temperature range, to satisfy certain measuring accuracy, unique method is that each sensor is all done the full scale of whole temperature range ability and the temperature compensation at zero point, this desk checking method not only needs a large amount of high-quality workmans, and needs a large amount of accurate instrument and equipments.This sensor is used for this production in enormous quantities of automobile and the very abominable product of environment for use, and the signal condition of piezoelectric transducer, temperature compensation and pressure correction become the greatest problem that this product lot quantity is produced.
In addition, at present in the application of sensor, used circuit mostly is the situation that sensor and its signal processing circuit are separated, doing maximum problem like this is that volume is big, cost is high and the encapsulation difficulty, especially the automatization level of compensation method, production run of design, temperature characterisitic of signal circuit of pressure transducer that is applied in automotive grade is all very low, this has not only influenced the stability of sensor greatly, and can't realize the mass production of sensor, so pressure sensor structure and circuit design need further to improve.
Summary of the invention
At the deficiency that exists on the prior art, the object of the invention provides that a kind of volume is little, cost is low, stability is high, practical and signal processing circuit is integral structure malleation able to programme and negative pressure are measured the pressure transducer of conversion.
To achieve these goals, the present invention realizes by the following technical solutions:
A kind of malleation of setting able to programme and negative pressure are measured the pressure transducer of conversion, comprise a chip, one realizes the chip programming plate of chip programming function, on described chip, be provided with a programmable signal processing circuit and a pressure transducer, described signal processing circuit input end is connected with the pressure transducer output terminal, described chip programming plate one end is connected with computing machine by communication interface, and the other end then is connected with signal processing circuit on the chip.
As preferably, the USB communication interface that described this communication interface is a computing machine, chip programming plate one end is connected with computing machine by the USB communication interface of computing machine.
Also be integrated with single-chip microcomputer and EEPROM (Electrically Erasable Programmable Read Only Memo) (EEPRO) in the above-mentioned digital signal processing circuit, realize programmable compensated digital signal function by single-chip microcomputer and EEPROM.
Also be provided with the interface adjusted that is connected with external unit on the said chip, can adjust the pad that interface is the signal output pin, be fit to connect different equipment by adjusting interface, suitable client specifically uses.
Above-mentioned chip also is provided with the pad that pin is drawn in programming, signal, programming, signal are drawn pin and are connected single-chip microcomputer and EEPROM (Electrically Erasable Programmable Read Only Memo) (EEPRO), pad connects external unit, has made things convenient for the encapsulation of entire chip, has improved the stability of sensor.
Above-mentioned pressure transducer comprises a strain bridge, described strain bridge output terminal also be linked in sequence first amplifying circuit and second amplifying circuit.
Also be connected with copped wave detuner and gain calibration circuit between above-mentioned first amplifying circuit and second amplifying circuit, the output terminal of described first amplifying circuit connects the copped wave detuner, the output terminal of copped wave detuner connects gain calibration circuit, and the output terminal of gain calibration circuit connects second amplifying circuit.
The malleation of described setting able to programme and negative pressure are measured the pressure transducer of conversion, also comprise temperature sensor and testing circuit, and described temperature sensor is connected described signal processing circuit with testing circuit.
Principle of work of the present invention is as follows:
The present invention adopts MEMS (pressure resistance type) technology that pressure transducer and signal processing circuit are integrated on the chip, and the function of pressure transducer is to be electric signal output with the ambient pressure conversion of signals; The function of signal processing circuit is the voltage signal output that the electrical signal conversion of sensor output is become standard by programming.The major function of chip programming plate is to realize output demarcation and temperature compensation.
Beneficial effect of the present invention is: the present invention adopts MEMS (pressure resistance type) technology that pressure transducer and digital signal processing circuit are formed integral structure; thereby reduced the influence of outer bound pair sensor signal; improved stability; reduced production cost; scale and friendly man-machine interface have been realized simultaneously; make things convenient for the user that sensor is demarcated; on technology, then can guarantee large-scale production; satisfied the demand in market; will be to the automobile sensor; medical electronics plays import substitution with pressure transducer and industrial OEM with pressure transducer and forms part core devices production domesticization purpose; the present invention simultaneously also has simple in structure; volume is little; in light weight; excellent characteristics such as long service life; can be widely used in various industrial automatic control environment, relate to water conservancy and hydropower; railway traffic; intelligent building; the production automatic control; Aero-Space; military project; petrochemical industry; oil well; electric power; boats and ships; lathe; numerous industries such as pipeline.
Description of drawings
Fig. 1 is the structured flowchart of integrated pressure sensor of the present invention;
Fig. 2 is the circuit theory diagrams of integrated pressure sensor of the present invention;
Fig. 3 is the connected mode synoptic diagram of chip programming plate of the present invention;
Fig. 4 is one embodiment of the invention.
Main Reference numeral implication is among the figure:
100, chip 110, signal processing circuit 120, pressure transducer 130, pad
Embodiment
Below in conjunction with accompanying drawing, further specify concrete mode of the present invention:
Fig. 1 is the structured flowchart of integrated pressure sensor of the present invention; Fig. 2 is the circuit theory diagrams of integrated pressure sensor of the present invention; Fig. 3 is the connected mode synoptic diagram of chip programming plate of the present invention; Fig. 4 is one embodiment of the invention.
As shown in Figure 1: the present invention adopts MEMS (pressure resistance type) technology that pressure transducer and digital signal processing circuit are integrated in a programmable pressure sensor on the chip, it comprises the chip programming plate of a chip 100 and a realization chip programming function, this chip programming plate one end connects computing machine by the USB communication interface, its other end connects chip 100, realizes the programmable functions of chip 100 by the chip programming plate.Among the present invention, a programmable signal processing circuit 110 and a pressure transducer 120 are installed on the chip 100, these signal processing circuit 110 input ends connect pressure transducer 120 output terminals; Thereby signal processing circuit 110 and pressure transducer 120 are integrated on the chip, the integral structure that has constituted signal processing circuit 110 and pressure transducer 120 is the integrated pressure sensor, reduced the influence of volume He the outer bound pair sensor of sensor, improve the stability of sensor, reduced production cost.
In the present embodiment, in order to realize programmable functions, in signal processing circuit, also be integrated with single-chip microcomputer and EEPROM (Electrically Erasable Programmable Read Only Memo) (EEPROM), realize programmable compensated digital signal function, the serviceable life of having improved pressure transducer by single-chip microcomputer and EEPROM.
In the present embodiment, encapsulation for the ease of entire chip 100, improve the stability of sensor, on chip 100, also be provided with various programmings, signal and draw the pad 130 of pin, this programming, signal are drawn pin and are connected single-chip microcomputer and EEPRO, be connected with external unit such as chip programming plate by pad 130, made things convenient for the encapsulation of entire chip 100.On chip 100, also be provided with the pad that the interface adjusted that is connected with external unit is an output signal, can adjust interface and be fit to connect different equipment.In the present invention, because pressure transducer 120 and signal processing circuit 110 are encapsulated on the slight chip, and be connected with external unit by pad 130, so its demarcation and encapsulation process need instruments such as gold wire bonder, cleaning shop and realize, increase the packaging effect of chip 100, improved the stability of sensor.
As shown in Figure 2:
Pressure transducer 120 among the present invention adopts the Hui Sitong principle, resistance strain gage is bonded on the generation mechanics strain matrix closely by special bonding agent, when the stressed generation STRESS VARIATION of matrix, resistance strain gage also produces deformation together, the resistance of resistance strain gage is changed, be added in ohmically voltage and change thereby make; In the present embodiment, this foil gauge is the strain bridge 121 that resistance is formed, because the change in resistance that this foil gauge produces when stressed is less usually, voltage changes also corresponding less, so these strain bridge 121 output terminals also are connected with first amplifying circuit 122 and second amplifying circuit 125, change being converted into electric signal output after back voltage amplifies through first amplifying circuit.
Among the present invention, also be connected with copped wave detuner 123 and gain calibration circuit 124 at first amplifying circuit, 122 output terminals, after electric signal after the amplification is reconciled and is calibrated by copped wave detuner 123 and gain calibration circuit 124, be transferred to treatment circuit (normally A/D conversion and CPU) again and show or topworks that 125 outputs of second amplifying circuit are arranged again.
In the present embodiment, on chip 100, be built-in with temperature sensor 140, the induction information of temperature sensor 140 is defeated by digital processing circuit 110 input ends after by A/D converter 160, flow to first amplifying circuit 122 and second amplifying circuit 125 through D/A converter 170 then, thereby reach the purpose of temperature compensation of the present invention.In addition, on digital processing circuit 110, go back connection detection circuit 150, the effect that detects and debug.
For introducing the present invention in detail, referring to Fig. 1 to Fig. 4, detailed process is as follows:
1, sensor package process:
Because chip 100 is nude film encapsulation, so need to be earlier final products custom encapsulation (opening a mold).It is being on the pad 130 with power-with the packaging pin that it is good that gold wire bonder is drawn out to the customization in early stage just that chip 100 uses the user only to need signal output pin, power supply.
2, the sensor debugging step and the course of work:
Referring to Fig. 2 and Fig. 4, the present invention can be achieved as follows debug function: the selection and the chip of the setting of the setting of the selection of temperature compensation point, ratio output parameter, output clamp, the selection of pressure survey mode, temperature sensor are selected.
3, chip programming plate method of attachment
As shown in Figure 3, the upper computer software of computing machine links to each other with the chip programming plate by computing machine USB communication interface, and the other end of chip programming plate is connected with the signal processing circuit 110 of integrated pressure sensor then.Online normal after, the function software by computing machine can realize that output demarcates programming and temperature compensation programming to single-chip microcomputer and EEPROM in the signal processing circuit 110, be that chip realizes that programming is demarcated in output and temperature compensation is programmed from making entire chip.
2, the debugging detailed process in the present embodiment is as follows:
The first step, first temperature spot are demarcated
With transmitter is that the pressure transducer release is in the input state at zero point, click i.e. " Firsttemperature " zone the 1st button " Set Low Input " of first temperature spot, debug the flicker that the frock green light can not stop this moment, the expression system is in and reads the parameter state at zero point, parameter reads and finishes, green light stops flicker, and the 2nd button " Set High Input " becomes black by grey, and the expression system can begin to read full position parameter.
Transmitter is pressurized to full position input state, click " First temperature " zone the 2nd button " Set High Input ", debug the flicker that the frock green light can not stop this moment, the expression system is in and reads full position parameter state, parameter reads and finishes, green light stops flicker, and the 3rd button " Set Low Input " becomes black by grey, and the expression system can begin to read the zero-bit parameter.
The transmitter release is in the input state at zero point, click " First temperature " zone the 3rd button " Set Low Input ", debug the flicker that the frock green light can not stop this moment, the expression system is in and reads the parameter state at zero point, parameter reads and finishes, and green light stops flicker, and the 1st temperature spot staking-out work finished, second temperature spot i.e. " Second temperature " zone " Set Low Input " button becomes black by grey, and expression can be carried out the 2nd temperature spot compensation.
The heating transmitter is heated to the 2nd temperature spot temperature with transmitter, keeps beginning the 2nd step after 1 hour, does not allow outage in the process, does not allow connection is disconnected.
The transmitter release is in the input state at zero point, click " Second temperature " zone the 1st button " Set Low Input ", debug the flicker that the frock green light can not stop this moment, the expression system is in and reads the parameter state at zero point, parameter reads and finishes, green light stops flicker, and the 2nd button " Set High Input " becomes black by grey, and the expression system can begin to read full position parameter.
Transmitter is pressurized to full position input state, click " Second temperature " zone the 2nd button " Set High Input ", debug the flicker that the frock green light can not stop this moment, the expression system is in and reads full position parameter state, parameter reads and finishes, green light stops flicker, and the 3rd button " SetLow Input " becomes black by grey, and the expression system can begin to read the zero-bit parameter.
Second step, second temperature spot are demarcated
The transmitter release is in the input state at zero point, click " Second temperature " zone the 3rd button " Set Low Input ", debug the flicker that the frock green light can not stop this moment, the expression system is in and reads the parameter state at zero point, parameter reads and finishes, and green light stops flicker, and the 2nd temperature spot compensation work finished, " Third temperature " zone " Set Low Input " button becomes black by grey, and expression can be carried out the 3rd temperature spot compensation.
The 3rd step, the 3rd temperature spot are demarcated
The heating transmitter is heated to the 3rd temperature spot temperature with transmitter, keeps beginning the 2nd step after 1 hour, does not allow outage in the process, does not allow connection is disconnected.
As shown in the figure, the transmitter release is in the input state at zero point, click i.e. " Thirdtemperature " zone first button " Set Low Input " of the 3rd temperature spot, debug the flicker that the frock green light can not stop this moment, the expression system is in and reads the parameter state at zero point, and parameter reads and finishes, and green light stops flicker, the 2nd button " Set High Input " becomes black by grey, and the expression system can begin to read full position parameter.
Transmitter is pressurized to full position input state, click " Third temperature " zone " Set HighInput " button, debug the flicker that the frock green light can not stop this moment, the expression system is in and reads full position parameter state, parameter reads and finishes, green light stops flicker, and the 3rd button " Set Low Input " becomes black by grey, and the expression system can begin to read the zero-bit parameter.
The transmitter release is in the input state at zero point, click " Third temperature " zone the 3rd button " Set Low Input ", debug the flicker that the frock green light can not stop this moment, the expression system is in and reads the parameter state at zero point, parameter reads and finishes, green light stops flicker, and the 3rd temperature spot compensation work finished.
The 4th step, parameter are preserved
After transmitter demarcation temperature compensation is finished, can eject dialog box.
Dialog box is system's parameter value that configuration is finished through internal calculation, clicks " Change Solution ", will eject dialog box, clicks " OK " button, and parameter will be deposited in EEPROM in the sheet.
Parameter is preserved and is finished, and the work of expression transmitter calibration compensation is finished.
Points for attention are clicked " LOCK " button under the general situation, not have to click " LOCK " if the transmitter test failure of button calibration compensation again, click " LOCK " will be if the transmitter test failure of button can't be demarcated correction once more.
The 5th step, nominal data test
Parameter is preserved and is finished, and can click " Measurements " button and test.
Click " Measurements " button, eject dialog box as shown in Figure 1, choose " Continuous " option.
According to the release of pressurizeing of the test specification of pressure unit, dialog box can show the output voltage values of this moment, test output valve at zero point, intermediate point output valve, a full position output valve, record test data.
Sensor is heated, be incubated 1 hour, carry out the temperature index test, record test data.
More than show and described ultimate principle of the present invention and principal character and advantage of the present invention.The technician of the industry should understand; the present invention is not restricted to the described embodiments; that describes in the foregoing description and the instructions just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (9)
1. the malleation of a setting able to programme and negative pressure are measured the pressure transducer of conversion, comprise a chip, it is characterized in that, comprise that also one realizes the chip programming plate of chip programming function, on described chip, be provided with a programmable signal processing circuit and a pressure transducer, described signal processing circuit input end is connected with the pressure transducer output terminal, and described chip programming plate one end is connected with computing machine by communication interface, and the other end then is connected with signal processing circuit on the chip.
2. the malleation of setting able to programme according to claim 1 and negative pressure are measured the pressure transducer of conversion, it is characterized in that, also are integrated with single-chip microcomputer and EEPROM (Electrically Erasable Programmable Read Only Memo) in the described digital signal processing circuit.
3. the malleation of setting able to programme according to claim 2 and negative pressure are measured the pressure transducer of conversion, it is characterized in that, also are provided with the interface adjusted that is connected with external unit on the described chip.
4. the malleation of setting able to programme according to claim 3 and negative pressure are measured the pressure transducer of conversion, it is characterized in that, describedly adjust the pad that interface is the signal output pin.
5. the malleation of setting able to programme according to claim 1 and negative pressure are measured the pressure transducer of conversion, it is characterized in that, also be provided with programming, signal on the described chip and draw the pad of pin, programming, signal are drawn pin and are connected single-chip microcomputer and EEPROM (Electrically Erasable Programmable Read Only Memo) (EEPRO), and pad connects external unit.
6. the malleation of setting able to programme according to claim 1 and negative pressure are measured the pressure transducer of conversion, it is characterized in that, described pressure transducer comprises a strain bridge, described strain bridge output terminal also be linked in sequence first amplifying circuit and second amplifying circuit.
7. the malleation of setting able to programme according to claim 6 and negative pressure are measured the pressure transducer of conversion, it is characterized in that, also be connected with copped wave detuner and gain calibration circuit between described first amplifying circuit and second amplifying circuit, the output terminal of described first amplifying circuit connects the copped wave detuner, the output terminal of copped wave detuner connects gain calibration circuit, and the output terminal of gain calibration circuit connects second amplifying circuit.
8. the malleation of setting able to programme according to claim 1 and negative pressure are measured the pressure transducer of conversion, it is characterized in that it also comprises temperature sensor and testing circuit, and described temperature sensor is connected described signal processing circuit with testing circuit.
9. the malleation of setting able to programme according to claim 1 and negative pressure are measured the pressure transducer of conversion, it is characterized in that described communication interface is the USB communication interface.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910184657A CN101813540A (en) | 2009-08-27 | 2009-08-27 | Pressure sensor capable of switching between positive pressure measurement and negative pressure measurement by program setting |
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| Application Number | Priority Date | Filing Date | Title |
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| CN200910184657A CN101813540A (en) | 2009-08-27 | 2009-08-27 | Pressure sensor capable of switching between positive pressure measurement and negative pressure measurement by program setting |
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| CN101813540A true CN101813540A (en) | 2010-08-25 |
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| CN200910184657A Pending CN101813540A (en) | 2009-08-27 | 2009-08-27 | Pressure sensor capable of switching between positive pressure measurement and negative pressure measurement by program setting |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111649869A (en) * | 2020-06-23 | 2020-09-11 | 西安航天计量测试研究所 | Non-contact pressure measuring method and system based on strain and temperature sensors |
-
2009
- 2009-08-27 CN CN200910184657A patent/CN101813540A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111649869A (en) * | 2020-06-23 | 2020-09-11 | 西安航天计量测试研究所 | Non-contact pressure measuring method and system based on strain and temperature sensors |
| CN111649869B (en) * | 2020-06-23 | 2021-10-15 | 西安航天计量测试研究所 | Non-contact pressure measuring method and system based on strain and temperature sensors |
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Application publication date: 20100825 |