CN101813451A - Array measuring head for micro-nano geometrical quantity measurement - Google Patents
Array measuring head for micro-nano geometrical quantity measurement Download PDFInfo
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- CN101813451A CN101813451A CN 201010136213 CN201010136213A CN101813451A CN 101813451 A CN101813451 A CN 101813451A CN 201010136213 CN201010136213 CN 201010136213 CN 201010136213 A CN201010136213 A CN 201010136213A CN 101813451 A CN101813451 A CN 101813451A
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- gauge head
- measuring head
- pedestal
- array
- head assembly
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Abstract
The invention discloses an array measuring head for micro-nano geometrical quantity measurement, which consists of a grid multi-square hole base and a plurality of measuring head assemblies. The measuring head assembly comprises a measuring head, a measuring rod, a suspension structure, a sensing unit and a circuit board; the measuring head assembly is arranged on a square hole of the base in a vertical raised mode; the square holes are arranged in a grid array type; and the array measuring head is connected with a measuring head connecting structure of a three-dimensional high-precision displacement platform. According to the size of a measured workpiece, each measuring head assembly is arranged on the proper square hole selected on the grid multi-square hole base, and the each measuring head assembly can be assembled and disassembled. The measuring head of the each measuring head assembly is integrated to a uniform coordinate system through correction, one measuring head is first contacted with one end point of the measured size, then the measuring head is moved away, and another measuring head is contacted with the other end point of the measured size so as to quickly finish precise measurement of the size of the measured workpiece. Compared with the single measuring head, the array measuring head improves the work efficiency and adds the redundancy design. The array measuring head is used in the field of micro-nano geometrical quantity measurement.
Description
Technical field
The present invention relates to a kind of ultraprecise yardstick survey instrument, particularly disclose a kind of array measuring head that is used for micro-nano geometrical quantity measurement, belong to the micro-nano geometrical quantity measurement field.
Background technology
The nano measurement technology has the very status of core in the nanoscale science and technology development, because the every field of nanosecond science and technology all relates to the form of nanoscale material, and composition, the measurement and the sign of structure and physics and chemical property (function).The nano measurement technology is that the development that promotes nanosecond science and technology improves reliable guidance with application along with the development of nanosecond science and technology becomes increasingly abundant and the advanced person.
The main survey instrument of nanosecond science and technology has scanning tunnel microscope (STM), atomic force microscope (AFM), scanning electron microscope scanning probe microscopies such as (SEM) (SPM) and various optical interdferometer and spectroscopy analysis means etc.In recent years, be the calibration of the nanometer testing tool of scene of realizing or common laboratory, the metering type atomic force microscope that has been born and has had laser interferometer.For realizing large-scale nano measurement, the nano-measuring machine that has been born, and commercialization, its measurement range can reach 25mm * 25mm * 5mm, and available atomic force microscope gauge head or laser focusing type gauge head carry out micro-nano measurement to measured workpiece.
But, no matter be atomic force microscope gauge head or laser focusing type gauge head, when measuring the measured workpiece size, all will be from an end of workpiece around to the other end, Measuring Time is longer, and work efficiency is low.And, in case in the measuring process, gauge head ruptures, problem such as lose, to measure and must end, the surveying work of front all wastes.
Summary of the invention
The objective of the invention is to overcome the defective of gauge head in the prior art, a kind of gauge head that is used for micro-nano geometrical quantity measurement is provided, it is the array measuring head that constitutes by the latticed pedestal of hole in many ways and a plurality of gauge head assembly, can be used for three-dimensional high-precision displacement platform (as nano-measuring machine etc.), improve surveying work efficient, increase Redundancy Design, promote the serviceability of gauge head.
The present invention is achieved in that a kind of array measuring head that is used for micro-nano geometrical quantity measurement, constitute by the latticed pedestal of hole in many ways and a plurality of gauge head assembly, the gauge head assembly comprises gauge head, measuring staff, suspended structure, sensing unit and circuit board, and vertical protrusion of gauge head assembly is installed on the pedestal square hole.Described gauge head assembly is a plurality of gauge head assemblies more than 2 or 2, and a plurality of gauge head assemblies are installed on the pedestal, and square hole is latticed array on pedestal arranges, and array measuring head links by the gauge head syndeton of pedestal and three-dimensional high-precision displacement platform.Described gauge head assembly is to be bonded on the suspended structure after gauge head connects measuring staff, suspended structure is bonded in the central authorities of circuit board, suspended structure adopts micro fabrication, carry and convert mechanical signal the sensing unit of electric signal to (as pressure resistance type, condenser type etc.), sensing unit transfers signals to circuit board by lead, circuit board plays the signal transmitting effect, transfer signals on follow-up signal conditioning and the A/D convertor circuit plate, the gauge head assembly is installed in screw on the connection pedestal of base by the through hole on four jiaos of the circuit boards, connects pedestal array on three-dimensional high-precision Bit Shift platform and arranges.Described gauge head assembly selects suitable square hole to install and fix on the pedestal of latticed hole in many ways according to the measured workpiece size, can adjust each gauge head inter-module mutual alignment by the square hole of selecting diverse location on the pedestal, and each gauge head assembly can be adorned removable.The gauge head of described each gauge head assembly is incorporated in the unified coordinate system by calibration, to workpiece calibration the time, an end points of elder generation's gauge head contact measured workpiece, write down this end points coordinate data, this gauge head is removed, with another end points of an other gauge head contact measured workpiece, write down the coordinate data of another end points again.
The invention has the beneficial effects as follows: can finish the accurate measurement of measured workpiece size fast, compare, improve work efficiency, and increased Redundancy Design with single gauge head.
Description of drawings
Fig. 1 is a gauge head overall schematic of the present invention;
In the drawings: 1, latticed hole in many ways pedestal; 2, through hole; 3, circuit board; 4, suspended structure; 5, measuring staff; 6, gauge head; 7, screw; 8, square hole.
Fig. 2 is the latticed hole in many ways pedestal of array measuring head of the present invention;
Fig. 3 is the latticed hole in many ways pedestal of the array measuring head of miniaturization of the present invention;
Fig. 4 is the board structure of circuit figure of array measuring head of the present invention;
Fig. 5 is the gauge head assembly synoptic diagram of array measuring head of the present invention;
Fig. 6 is the work synoptic diagram that array measuring head of the present invention is used for the measuring workpieces inside dimension;
Fig. 7 is the work synoptic diagram that array measuring head of the present invention is used for the measuring workpieces external dimensions.
Embodiment
With reference to the accompanying drawings 1, a kind of array measuring head that is used for micro-nano geometrical quantity measurement of the present invention, constitute by latticed hole in many ways pedestal 1 and a plurality of gauge head assembly, the gauge head assembly comprises gauge head 6, measuring staff 5, suspended structure 4, sensing unit and circuit board 3, and vertical protrusion of gauge head assembly is installed on pedestal 1 square hole.This array measuring head links by the gauge head syndeton on latticed hole in many ways pedestal 1 and the three-dimensional high-precision displacement platform, is installed on the three-dimensional high-precision displacement platform.Four of each square hole 8 jiaos have screw 7 on the pedestal 1, are used to install the gauge head assembly.The measuring staff 5 of each gauge head 6 is bonded on the suspended structure 4, the mechanical signal of the sensing unit that suspended structure 4 carries (as pressure resistance type, condenser type etc.) during with gauge head 6 contact workpieces is converted to electric signal, signal is transferred to circuit board 3 by lead, circuit board 3 plays the signal transmitting effect, and signal is transferred on follow-up signal conditioning and the A/D convertor circuit plate again.Suspended structure 4 is bonded in the central authorities of circuit board 3, and four jiaos of circuit board 3 are provided with through hole 2, and screw 7 positions that corresponding pedestal 1 upper aperture is 8 four jiaos are installed on the latticed hole in many ways pedestal 1 by screw.According to the measured workpiece size, choose the square hole 8 of correct position on the pedestal 1 of latticed hole in many ways a plurality of gauge head assemblies are installed.Generally, 4 gauge head assemblies are installed.
The pedestal 1 of array measuring head of the present invention is designed to latticedly, and as shown in Figure 2, the line number of grid 8 and columns be all greater than 1, and can change.Each square hole 8 all is independently, and four jiaos are provided with screw 7, are used for fixing the gauge head assembly.The gauge head assembly can plug, it is comparatively convenient to mount and dismount, so that change the gauge head assembly and adjust mutual alignment between each gauge head 6, latticed hole in many ways pedestal 1 material has bigger rigidity, can bear the weight of a plurality of gauge head assemblies, be out of shape lessly, environmental baseline (as temperature and humidity) changes insensitive to external world, it is constant that each mutual position, gauge head 6 fixing backs is maintained fixed, to reduce measuring error.Simultaneously, research for convenience and use have designed base as shown in Figure 3.Because be to set up into the many gauge heads of array with 4 gauge heads 6 to carry out surveying work generally, so this base has only the identical square hole of 4 position symmetries, the position of 4 gauge heads 6 is fixed, each grid is installed 1 gauge head assembly.
Gauge head 6, measuring staff 5, suspended structure 4, sensing unit and circuit board 3 constitute a gauge head assembly, as shown in Figure 5.Gauge head 6 contacts with measured workpiece, and little power that gauge head 6 is subjected to makes probe location generation subtle change, by measuring staff 5 this variation is delivered to suspended structure 4.The sensing unit of suspended structure 4 can be pressure resistance type, condenser type, inductance type etc., thereby is electric signal with the conversion of signals of gauge head 6 perception, utilizes circuit board 3 signal is drawn and to transmit again.Utilize bonding method, suspended structure 4 is fixed on the circuit board 3.The gauge head assembly need be installed on the latticed hole in many ways pedestal 1, therefore, gets through hole 2 on four angles of circuit board 3, and is fixing with screw and latticed hole in many ways pedestal 1.On circuit board 3, choose correct position, welding row pin, available wire is transferred to signal on follow-up signal conditioning and the A/D convertor circuit plate again carries out subsequent treatment.
Measured workpiece is placed in the middle of 4 gauge heads, and surveying work mode synoptic diagram is shown in accompanying drawing 6 and accompanying drawing 7.Surveying work mainly be divided into 3 the step finish.At first, with one of them gauge head go near and contact an end points of measured size, according to the response signal of gauge head, write down this end points coordinate data; Then, this gauge head is removed, with another end points of an other gauge head contact measured size, write down another end points coordinate data again; At last, utilize measurement control software to carry out data processing, draw the measured size size according to mathematical algorithm.
When the measuring workpieces inside dimension, array measuring head is selected the square hole of close together on the pedestal for use, makes between each gauge head distance shorter, and the work synoptic diagram as shown in Figure 6; When the measuring workpieces external dimensions, array measuring head is selected on the pedestal distance square hole far away for use, makes between each gauge head distance longer, and the work synoptic diagram as shown in Figure 7.In measuring process, when certain gauge head goes wrong, make the working method of single gauge head immediately into, continue to finish measurement, and measurement result is not had a negative impact.
Good effect of the present invention is to improve surveying work efficient, increases Redundancy Design, promotes the service behaviour of gauge head.
Claims (4)
1. array measuring head that is used for micro-nano geometrical quantity measurement, constitute by the latticed pedestal of hole in many ways and a plurality of gauge head assembly, the gauge head assembly comprises gauge head, measuring staff, suspended structure, sensing unit and circuit board, the vertical protrusion of gauge head assembly is installed on the pedestal square hole, it is characterized in that: described gauge head assembly is a plurality of gauge head assemblies more than 2 or 2, a plurality of gauge head assemblies are installed on the pedestal, square hole is latticed array on pedestal arranges, and array measuring head links by the gauge head syndeton of pedestal and three-dimensional high-precision displacement platform.
2. a kind of array measuring head that is used for micro-nano geometrical quantity measurement according to claim 1, it is characterized in that: described gauge head assembly is to be bonded on the suspended structure after gauge head connects measuring staff, suspended structure is bonded in the central authorities of circuit board, suspended structure adopts micro fabrication, carry and convert mechanical signal the sensing unit of electric signal to (as pressure resistance type, condenser type etc.), sensing unit transfers signals to circuit board by lead, circuit board plays the signal transmitting effect, transfer signals on follow-up signal conditioning and the A/D convertor circuit plate, the gauge head assembly is installed in screw on the connection pedestal of base by the through hole on four jiaos of the circuit boards, connects pedestal array on the three-dimensional high-precision displacement platform and arranges.
3. a kind of array measuring head that is used for micro-nano geometrical quantity measurement according to claim 1, it is characterized in that: described gauge head assembly selects suitable square hole to install and fix on the pedestal of latticed hole in many ways according to the measured workpiece size, can adjust each gauge head inter-module mutual alignment by the square hole of selecting diverse location on the pedestal, each gauge head assembly can be adorned removable.
4. a kind of array measuring head that is used for micro-nano geometrical quantity measurement according to claim 1, it is characterized in that: the gauge head of described each gauge head assembly is incorporated in the unified coordinate system by calibration, to workpiece calibration the time, an end points of elder generation's gauge head contact measured workpiece, write down this end points coordinate data, this gauge head is removed,, write down the coordinate data of another end points again with another end points of an other gauge head contact measured workpiece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010136213 CN101813451A (en) | 2010-03-30 | 2010-03-30 | Array measuring head for micro-nano geometrical quantity measurement |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201010136213 CN101813451A (en) | 2010-03-30 | 2010-03-30 | Array measuring head for micro-nano geometrical quantity measurement |
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| CN101813451A true CN101813451A (en) | 2010-08-25 |
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| CN 201010136213 Pending CN101813451A (en) | 2010-03-30 | 2010-03-30 | Array measuring head for micro-nano geometrical quantity measurement |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103075952A (en) * | 2012-12-20 | 2013-05-01 | 上海市计量测试技术研究院 | Micro-touch measurement head for measuring micro-nano three-dimensional size |
| CN103075951A (en) * | 2012-12-20 | 2013-05-01 | 上海市计量测试技术研究院 | Three-dimensional micro touch probe based on capacitive sensor array |
| CN107966088A (en) * | 2017-11-27 | 2018-04-27 | 靖江先锋半导体科技有限公司 | A kind of gas distributor aperture inspection man dress |
| CN110095050A (en) * | 2019-04-19 | 2019-08-06 | 安徽理工大学 | A kind of triangular beam flexible constraint variation rigidity micro-nano gauge head |
Citations (3)
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| JPH03287006A (en) * | 1990-04-03 | 1991-12-17 | Mitsubishi Electric Corp | Multi-probe type surface shape and state measuring method |
| US5822877A (en) * | 1996-06-20 | 1998-10-20 | Brown & Sharpe Manufacturing Company | Multi-probe system for dimensional metrology |
| US20020148130A1 (en) * | 2001-03-02 | 2002-10-17 | Masaru Ohtsuka | Apparatus and method for measuring a shape using multiple probes |
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2010
- 2010-03-30 CN CN 201010136213 patent/CN101813451A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03287006A (en) * | 1990-04-03 | 1991-12-17 | Mitsubishi Electric Corp | Multi-probe type surface shape and state measuring method |
| US5822877A (en) * | 1996-06-20 | 1998-10-20 | Brown & Sharpe Manufacturing Company | Multi-probe system for dimensional metrology |
| US20020148130A1 (en) * | 2001-03-02 | 2002-10-17 | Masaru Ohtsuka | Apparatus and method for measuring a shape using multiple probes |
Non-Patent Citations (2)
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| 《传感器技术学报》 20061031 赵大博，栗大超，李源，傅星，胡小唐 三维微触觉MEMS传感器测试校准的方法与系统 1504-1508 第19卷, 第5期 2 * |
| 《计量学报》 20080131 李源，邵力，栗大超，胡小唐，赵大博 用于微结构几何量测量的MEMS三维微触觉传感器的性能测试 21-25 第29卷, 第1期 2 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103075952A (en) * | 2012-12-20 | 2013-05-01 | 上海市计量测试技术研究院 | Micro-touch measurement head for measuring micro-nano three-dimensional size |
| CN103075951A (en) * | 2012-12-20 | 2013-05-01 | 上海市计量测试技术研究院 | Three-dimensional micro touch probe based on capacitive sensor array |
| CN103075952B (en) * | 2012-12-20 | 2015-04-29 | 上海市计量测试技术研究院 | Micro-touch measurement head for measuring micro-nano three-dimensional size |
| CN103075951B (en) * | 2012-12-20 | 2015-04-29 | 上海市计量测试技术研究院 | Three-dimensional micro touch probe based on capacitive sensor array |
| CN107966088A (en) * | 2017-11-27 | 2018-04-27 | 靖江先锋半导体科技有限公司 | A kind of gas distributor aperture inspection man dress |
| CN110095050A (en) * | 2019-04-19 | 2019-08-06 | 安徽理工大学 | A kind of triangular beam flexible constraint variation rigidity micro-nano gauge head |
| CN110095050B (en) * | 2019-04-19 | 2021-03-26 | 安徽理工大学 | Triangular beam flexible constraint variable-rigidity micro-nano measuring head |
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| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wang Lihua Inventor after: Li Yuan Inventor after: Lei Lihua Inventor after: Wang Hong Inventor after: Liu Yi Inventor before: Wang Lihua Inventor before: Li Yuan Inventor before: Wang Hong Inventor before: Liu Yi |
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| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: WANG LIHUA LI YUAN WANG HONG LIU YI TO: WANG LIHUA LI YUAN LEI LIHUA WANG HONG LIU YI |
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Open date: 20100825 |