CN101807751B - Radio communication terminal with printing substrate - Google Patents
Radio communication terminal with printing substrate Download PDFInfo
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- CN101807751B CN101807751B CN 201010121774 CN201010121774A CN101807751B CN 101807751 B CN101807751 B CN 101807751B CN 201010121774 CN201010121774 CN 201010121774 CN 201010121774 A CN201010121774 A CN 201010121774A CN 101807751 B CN101807751 B CN 101807751B
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Abstract
A radio communication terminal with a printing substrate can stabilize a grounding level without enlarging the size of the substrate to realize a high-frequency circuit by a double layer, so as to realize low cost and miniaturization. In a double layer printing substrate with a high-frequency circuit on a first surface, a connecting part spanning the separate patterns to connect the separated grounding patterns is arranged at the position on a second surface corresponding to the high frequency circuit and at the position where the electrically-connected grounding patters are separated by the separating patterns except the grounding patterns.
Description
Technical field
The present invention relates to a kind of printed base plate, relate in particular to the wireless communication terminal with the Double-layered printing substrate that is formed with high-frequency circuit.
Background technology
In recent years, the communication equipment that carries out high-frequency wireless communication take digital cordless phones as representative is popularized.The printed base plate that disposes on these communication equipments is formed with high-frequency circuit.
On high-frequency circuit, enough grounding patterns need to be set, make earth level stable.The importance of the ground connection in the high-frequency circuit wherein, is described with reference to Fig. 7, Fig. 8.Fig. 7, Fig. 8 are that grounding pattern is more by force and the key diagram of the difference when weak in two sections the LC low pass filter of expression.
When grounding pattern was stronger, as shown in Figure 7, when high-frequency signal passed through filter, the unwanted frequency compositions such as high order harmonic component were incorporated into ground connection.And when grounding pattern is weak, the impedance that the grounding pattern that needs consideration to be surrounded by the dotted line frame in Fig. 8 has.The size of impedance depends on frequency, in high-frequency circuit, can not ignore the impact of the impedance that grounding pattern has.Its result, as shown in Figure 8, when high-frequency signal passed through filter, the unwanted frequency composition was not incorporated into ground connection and wraparound.When the unwanted frequency composition invades high-frequency circuit, becoming lead to errors the action etc. reason.The unwanted frequency composition radiates from antenna, causes other wireless devices are impacted.Therefore, make the earth level stabilisation by stronger grounding pattern, very important to the regular event of high-frequency circuit.
Following patent documentation 1 discloses the correlation technique that forms high-frequency circuit on the multilager base plate that has at least 4 layers.In patent documentation 1 disclosed technology, form the grounding pattern of bilayer at the internal layer of multilager base plate, thereby make the earth level stabilisation.
Patent documentation 1: TOHKEMY 2003-298245 communique
In order to realize cost degradation, compare the preferred printed base plate that uses bilayer with the multilager base plate more than 4 layers.And, in order to realize the miniaturization of communication equipment, require substrate size less.
But when the less Double-layered printing substrate of size forms high-frequency circuit, be difficult to fully guarantee grounding pattern, so grounding pattern dies down.The result produces the problem that receiving feature worsens, parasitic noise increases of communication equipment.
Summary of the invention
The present invention makes in view of above problem.Its purpose is to provide a kind of wireless communication terminal with printed base plate, need not to enlarge substrate size and just can make the earth level stabilisation, realizes high-frequency circuit with bilayer, thereby can realize cost degradation, miniaturization.
A kind of wireless communication terminal of the present invention has the Double-layered printing substrate that is formed with high-frequency circuit at the 1st.Above-mentioned Double-layered printing substrate has grounding pattern with the 2nd of the 1st opposition side.In the position corresponding with the part at above-mentioned the 1st above-mentioned high-frequency circuit place, this grounding pattern is separated by the separation pattern beyond this grounding pattern.In addition, above-mentioned Double-layered printing substrate has connecting portion, crosses over above-mentioned separation pattern and is electrically connected the 2nd separated above-mentioned grounding pattern.
Description of drawings
Fig. 1 is the 1st layer the synoptic diagram of the 1st embodiment of the printed base plate of expression wireless communication terminal of the present invention.
Fig. 2 is the 2nd layer the synoptic diagram of the 1st embodiment of the printed base plate of expression wireless communication terminal of the present invention.
Fig. 3 is the 1st layer the synoptic diagram of the 2nd embodiment of the printed base plate of expression wireless communication terminal of the present invention.
Fig. 4 is the 2nd layer the synoptic diagram of the 2nd embodiment of the printed base plate of expression wireless communication terminal of the present invention.
Fig. 5 is the figure of the gap length of the pattern of explanation grounding pattern beyond the being grounded position of separating.
Fig. 6 is the figure of other examples of the expression connecting portion that connects grounding pattern.
Fig. 7 is the key diagram when grounding pattern is stronger in two sections the LC low pass filter of expression.
Fig. 8 is the key diagram when grounding pattern is weak in two sections the LC low pass filter of expression.
Embodiment
Embodiments of the present invention will be described in detail with reference to the accompanying drawings.
As shown in Figure 1, be formed with high-frequency circuit on the 1st layer (the 1st face) of printed base plate 10, this high-frequency circuit comprises: the region of high frequency signals 11 in pattern (Pattern) zone of using as high-frequency signal; High frequency IC 12 as the integrated circuit of processing high-frequency signal; And as the control signal zone 13 of the area of the pattern used of control signal of control high frequency IC 12.And, the profile of 14 expression radomes.Radome 14 is installed on the 1st layer of printed base plate 10, the electromagnetic shielding high-frequency circuit.In addition, although in Fig. 1, omitted diagram, be formed with grounding pattern and other various patterns in the space of free time.
On the other hand, as shown in Figure 2, be formed with grounding pattern (oblique line), power supply pattern 15 on the 2nd layer (the 2nd face) of printed base plate 10.Wherein, the grounding pattern shown in Fig. 2 bend is electrically connected by the through hole that connects layers 1 and 2 each other.And the inboard part that is installed in the radome 14 on the 1st layer is illustrated by the broken lines.Although omitted diagram in Fig. 2, the space between grounding pattern is formed with other various patterns.
For the receiving feature of the wireless communication terminal that prevents from disposing printed base plate 10 worsens, parasitic noise increases, guarantee to be formed on the high-frequency circuit regular event on the 1st layer, preferably, by radome 14 electromagnetic shielding high-frequency circuits, and the 2nd a layer of side position corresponding with the inboard of radome 14, the 1st layer high-frequency circuit section also all is set to grounding pattern the 1st a layer of side.But in the printed base plate 10 of bilayer, because of the restriction of wiring space etc., often be difficult to fully guarantee grounding pattern.As a result, as shown in Figure 2, the situation that exists grounding pattern to be separated by power supply pattern 15.
And in printed base plate 10, in order to prevent that grounding pattern from dying down, in the position corresponding with high-frequency circuit section the inboard of radome 14 and the 1st layer the 2nd layer and the grounding pattern position of being separated by power supply pattern 15, cross over power supply pattern 15 by 0 Ω pellet resistance Ro (Ro 1, Ro 2, Ro 3) and connect grounding pattern.So, in the 1st layer of Double-layered printing substrate 10 that is formed with high-frequency circuit, can make the earth level stabilisation.Therefore, can keep well the receiving feature of wireless communication terminal, suppress parasitic noise.And, in this case, owing to need not to enlarge substrate size, therefore can realize the miniaturization of printed base plate 10.
Then, the 2nd embodiment of the present invention is described.
As shown in Figure 3, with printed base plate 10 (with reference to Fig. 1) similarly, the 1st layer (the 1st face) at printed base plate 20 is formed with the high-frequency circuit that comprises region of high frequency signals 21, high frequency IC 22, reaches control signal zone 23, radome 24 is installed on the 1st layer of printed base plate 20, the electromagnetic shielding high-frequency circuit.And separation is formed on the grounding pattern in idle space and forms signal pattern 25.
On the other hand, as shown in Figure 4, be formed with grounding pattern (oblique line), signal pattern 26, power supply pattern 27,28 at the 2nd layer (the 2nd face) of printed base plate 20.Wherein, the grounding pattern shown in Fig. 4 bend is electrically connected by the through hole that connects between the layers 1 and 2 each other.And the inboard part that is installed in the radome 24 on the 1st layer is illustrated by the broken lines.In addition, although omitted diagram in Fig. 4, the space between grounding pattern is formed with other various patterns.
Same with printed base plate 10 (with reference to Fig. 1, Fig. 2), in printed base plate 20, in order to prevent that grounding pattern from dying down, also in the position corresponding with high-frequency circuit section the inboard of radome 24 and the 1st layer the 2nd layer and grounding pattern by the position that signal pattern 26 and power supply pattern 27 separate with 28, connect grounding pattern by 0 Ω pellet resistance Ro (Ro 4～Ro 10).Especially connected the position of grounding pattern by Ro 4, Ro 5 among the 0 Ω pellet resistance Ro, Ro 6, also separated by signal pattern 25 at the 1st layer (with reference to Fig. 3) upper grounding pattern.Therefore, the 1st layer, the 2nd layer all connects grounding pattern in the separated position of grounding pattern, thereby can strengthen the position that grounding pattern all separates and dies down on two face of the printed base plate 20 of bilayer.So, in printed base plate 20, can not enlarge substrate size yet and make the earth level stabilisation, can keep well receiving feature, suppress parasitic noise.
Then, illustrate the position that the pattern of grounding pattern beyond being grounded separates gap length, with the relation that is connected of grounding pattern.In high-frequency circuit, leak in order to prevent the unwanted frequency composition, and prevent impact from the unwanted frequency composition, electromagnetic shielding is very important.In above-mentioned printed base plate 10,20, except using radome 14,24, the 2nd layer the position corresponding with radome 14,24 inboard part, the 1st layer high-frequency circuit section is set to grounding pattern as far as possible, thereby obtains the shield effectiveness of electromagnetic shielding high-frequency circuit.
Wherein, the known metallic plate that is provided with the gap (slit) of 1/2 wavelength that uses wavelength can be used as desirable slot antenna and works.Therefore, in printed base plate 10,20, during for the gap (slit) more than 1/2 wavelength of the use wavelength that has high-frequency circuit on the grounding pattern of realizing shield effectiveness, the effect of performance antenna, but do not bring into play shielding action.
Therefore, as shown in Figure 5, the gap length 1 of the position of separating according to the pattern P of grounding pattern (oblique line) beyond being grounded connects grounding pattern.In an embodiment of the present invention, in order to improve shield effectiveness, when gap length 1 when 1/8 wavelength of the use wavelength of high-frequency circuit is above, the position gap length 1 being divided into less than 1/8 wavelength of the use wavelength of high-frequency circuit connects grounding pattern.If gap length is longer, the position that then gap length 1 is divided into less than 1/8 wavelength of the use wavelength of high-frequency circuit is a plurality of positions, therefore connects grounding pattern in each position.
For example, when configuration printed base plate 10,20 wireless communication terminal used the electric wave of 2.4GHz band, its 1/8 wavelength was 15.12mm in air.On normally used FR-4 (glass epoxide) substrate, the impact of the dielectric constant that has because of substrate, its wavelength shortens, and 1/8 wavelength is approximately 8.1mm.Therefore, in the printed base plate 10,20 of present embodiment, when gap length 1 〉=8.1mm, connect grounding pattern.So, can further improve shield effectiveness.Can prevent the signals leakiness of high-frequency circuit and affect other circuit, prevent that unwanted signal from invading in the high-frequency circuit from other circuit, the action that prevents from disposing printed base plate 10,20 wireless communication terminal (for example handset of digital cordless phones) is unstable, prevents the problems such as speech quality deterioration.
Wherein, 0 Ω pellet resistance Ro is an example of connecting portion.And power supply pattern 15,27,28, signal pattern 25,26 are respectively examples of the pattern beyond the ground connection.
As mentioned above, what relate to according to the abovementioned embodiments of the present invention has printed base plate 10, a wireless communication terminal of 20, the 2nd layer the position corresponding with radome 14,24 high-frequency circuit section inboard and the 1st layer and grounding pattern by the position that power supply pattern 15,27,28 etc. separates, connect grounding pattern by 0 Ω pellet resistance Ro.Thus, by the grounding pattern that further connection is electrically connected, can not enlarge substrate size and make the earth level stabilisation.As a result, can keep well disposing the receiving feature of printed base plate 10,20 wireless communication terminal, suppress parasitic noise.Can realize high-frequency circuit at the limited Double-layered printing substrate of wiring space, realize cost degradation, miniaturization.
In addition, the invention is not restricted to above-described embodiment, in the scope that does not break away from purport of the present invention, can carry out various improvement, change.
For example, more than connected grounding pattern by 0 Ω pellet resistance Ro, but be not limited to this.Also can pass through the connections such as wire-shaped conductor, chip capacitor.
The impedance of capacitor has frequency characteristic, and for desirable capacitor, frequency is higher, electric capacity is larger, and then impedance is less.Therefore, for low frequency signal, also be the state (disconnection) that does not have electrical connection even connect with capacitor, and for high-frequency signal, be electrically connected by connecting with capacitor, help to strengthen grounding pattern, improve shield effectiveness.
And actual capacitor also has resistance components, impedance composition except capacitive component.Therefore, frequency is higher, when electric capacity is larger, and impedance may not reduce, and defines the electric capacity that impedance diminishes under specific frequency.The capacitor of the electric capacity that therefore, need to diminish under employed frequency with impedance connects.For example, for the frequency of 2.4GHz, when using common flaky pottery capacitor, be that capacitor connection about several pF～hundreds of pF gets final product with electric capacity.
In addition, as shown in Figure 6, the metal forming shape conductor M (for example Copper Foil) that also can be grounded by covering grounding pattern (oblique line) position of pattern P separation in addition crosses over pattern P and connects.
Claims (8)
1. a wireless communication terminal has the Double-layered printing substrate (20) that is formed with high-frequency circuit (21,22,23) at the 1st,
Above-mentioned Double-layered printing substrate has grounding pattern with the 2nd of the 1st opposition side, in the position corresponding with the part at above-mentioned the 1st above-mentioned high-frequency circuit place, the part of this grounding pattern is separated by the separation pattern beyond this grounding pattern (26,27,28, P)
Above-mentioned wireless communication terminal is characterised in that,
Separation pattern beyond the above-mentioned grounding pattern refers to the power supply pattern that is surrounded by above-mentioned grounding pattern or the signal pattern that is surrounded by above-mentioned grounding pattern,
Above-mentioned Double-layered printing substrate has connecting portion (Ro 4-Ro 10, M), crosses over above-mentioned separation pattern and is electrically connected the 2nd separated above-mentioned grounding pattern of a part.
2. wireless communication terminal according to claim 1 is characterized in that,
Also have radome (24), be installed on above-mentioned the 1st, the above-mentioned high-frequency circuit of electromagnetic shielding,
Above-mentioned connecting portion connects the separated above-mentioned grounding pattern of a part in the inboard of above-mentioned radome.
3. wireless communication terminal according to claim 1 is characterized in that,
Above-mentioned Double-layered printing substrate also has grounding pattern on the 1st, the 1st grounding pattern is also separated by the separation pattern (25) beyond this grounding pattern,
The 1st with the 2nd these two faces in above-mentioned grounding pattern all separated the position (26) that pattern separates by above-mentioned, above-mentioned connecting portion connects above-mentioned the 2nd grounding pattern.
4. wireless communication terminal according to claim 1 is characterized in that,
The gap length of the position that above-mentioned grounding pattern is separated by above-mentioned separation pattern is when 1/8th wavelength of the use wavelength of above-mentioned high-frequency circuit are above, in the position that above-mentioned gap length is divided into less than 1/8th wavelength of the use wavelength of above-mentioned high-frequency circuit, above-mentioned connecting portion connects above-mentioned grounding pattern.
5. wireless communication terminal according to claim 1 is characterized in that,
Above-mentioned connecting portion is made of 0 Ω resistance.
6. wireless communication terminal according to claim 1 is characterized in that,
Above-mentioned connecting portion is made of the wire-shaped conductor.
7. wireless communication terminal according to claim 1 is characterized in that,
Above-mentioned connecting portion is made of capacitor.
8. wireless communication terminal according to claim 1 is characterized in that,
Above-mentioned connecting portion is made of metal forming shape conductor.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009035548A JP4978639B2 (en) | 2009-02-18 | 2009-02-18 | Printed circuit board and wireless communication terminal |
| JP2009-035548 | 2009-02-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101807751A CN101807751A (en) | 2010-08-18 |
| CN101807751B true CN101807751B (en) | 2013-03-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010121774 Active CN101807751B (en) | 2009-02-18 | 2010-02-11 | Radio communication terminal with printing substrate |
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| JP (1) | JP4978639B2 (en) |
| CN (1) | CN101807751B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012147264A (en) * | 2011-01-12 | 2012-08-02 | Sony Corp | Remote controller |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5777277A (en) * | 1995-09-21 | 1998-07-07 | Canon Kabushiki Kaisha | Printed circuit board |
| JP2004235184A (en) * | 2003-01-28 | 2004-08-19 | Matsushita Electric Ind Co Ltd | High frequency device |
| JP5084153B2 (en) * | 2005-08-15 | 2012-11-28 | キヤノン株式会社 | Printed board |
| JP4692152B2 (en) * | 2005-08-23 | 2011-06-01 | 株式会社村田製作所 | Circuit module and manufacturing method thereof |
| US8063480B2 (en) * | 2006-02-28 | 2011-11-22 | Canon Kabushiki Kaisha | Printed board and semiconductor integrated circuit |
| KR20080005678A (en) * | 2006-07-10 | 2008-01-15 | 삼성전자주식회사 | Printed circuit board and electronic device having the same |
| JP2008028612A (en) * | 2006-07-20 | 2008-02-07 | Matsushita Electric Ind Co Ltd | Communication device, and electronic device using it |
| JP4736988B2 (en) * | 2006-07-24 | 2011-07-27 | 株式会社村田製作所 | Multilayer printed circuit board |
| JP5437558B2 (en) * | 2006-11-16 | 2014-03-12 | 三菱電機株式会社 | Electromagnetic noise countermeasure structure for printed circuit boards |
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- 2009-02-18 JP JP2009035548A patent/JP4978639B2/en active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2010192681A (en) | 2010-09-02 |
| CN101807751A (en) | 2010-08-18 |
| JP4978639B2 (en) | 2012-07-18 |
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