CN101807751A - Wireless communication terminal with printed base plate - Google Patents
Wireless communication terminal with printed base plate Download PDFInfo
- Publication number
- CN101807751A CN101807751A CN 201010121774 CN201010121774A CN101807751A CN 101807751 A CN101807751 A CN 101807751A CN 201010121774 CN201010121774 CN 201010121774 CN 201010121774 A CN201010121774 A CN 201010121774A CN 101807751 A CN101807751 A CN 101807751A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- pattern
- grounding pattern
- base plate
- wireless communication
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
A kind of wireless communication terminal with printed base plate need not to enlarge substrate size and just can make the earth level stabilisation, realizes high-frequency circuit with bilayer, thereby can realize cost degradation, miniaturization.On the 1st, be formed with in the double-deck printed base plate of high-frequency circuit, separate the position that pattern separates beyond position corresponding with high-frequency circuit portion and the grounding pattern that is electrically connected are grounded on the 2nd, have to cross over and separate the connecting portion that pattern connects separated grounding pattern.
Description
Technical field
The present invention relates to a kind of printed base plate, relate in particular to wireless communication terminal with the double-deck printed base plate that is formed with high-frequency circuit.
Background technology
In recent years, be that the communication equipment that carries out high-frequency wireless communication of representative is popularized with digital cordless phones.On the printed base plate that is disposed on these communication equipments, be formed with high-frequency circuit.
On high-frequency circuit, enough grounding patterns need be set, make earth level stable.The importance of the ground connection in the high-frequency circuit wherein, is described with reference to Fig. 7, Fig. 8.Fig. 7, Fig. 8 are the key diagrams of the difference when grounding pattern is stronger and more weak in two sections the LC low pass filter of expression.
When grounding pattern was strong, as shown in Figure 7, when high-frequency signal passed through filter, unwanted frequency compositions such as high order harmonic component were incorporated into ground connection.And when grounding pattern is more weak, the impedance that grounding pattern had that needs consideration in Fig. 8, to surround by frame of broken lines.The size of impedance depends on frequency, in high-frequency circuit, can not ignore the influence of the impedance that grounding pattern has.Its result, as shown in Figure 8, when high-frequency signal passed through filter, the unwanted frequency composition was not incorporated into ground connection and wraparound.When the unwanted frequency composition invades high-frequency circuit, becoming lead to errors the action etc. reason.The unwanted frequency composition radiates from antenna, causes other wireless devices are impacted.Therefore, make the earth level stabilisation by stronger grounding pattern, very important to the regular event of high-frequency circuit.
Following patent documentation 1 discloses the correlation technique that forms high-frequency circuit on the multilager base plate that has 4 layers at least.In patent documentation 1 disclosed technology, form the grounding pattern of bilayer at the internal layer of multilager base plate, thereby make the earth level stabilisation.
Patent documentation 1: TOHKEMY 2003-298245 communique
In order to realize cost degradation, compare the preferred printed base plate that uses bilayer with the multilager base plate more than 4 layers.And,, require substrate size less in order to realize the miniaturization of communication equipment.
But when on the less double-deck printed base plate of size, forming high-frequency circuit, be difficult to fully guarantee grounding pattern, so grounding pattern dies down.The result produces the problem that receiving feature worsens, parasitic noise increases of communication equipment.
Summary of the invention
The present invention makes in view of above problem.Its purpose is to provide a kind of wireless communication terminal with printed base plate, need not to enlarge substrate size and just can make the earth level stabilisation, realizes high-frequency circuit with bilayer, thereby can realize cost degradation, miniaturization.
A kind of wireless communication terminal of the present invention has the double-deck printed base plate that is formed with high-frequency circuit on the 1st.Above-mentioned double-deck printed base plate with the 2nd of the 1st opposition side on have grounding pattern.With the corresponding position of part at above-mentioned the 1st above-mentioned high-frequency circuit place, this grounding pattern is separated by the separation pattern beyond this grounding pattern.In addition, above-mentioned double-deck printed base plate has connecting portion, crosses over above-mentioned separation pattern and is electrically connected the 2nd separated above-mentioned grounding pattern.
Description of drawings
Fig. 1 is the 1st layer the synoptic diagram of the 1st embodiment of the printed base plate of expression wireless communication terminal of the present invention.
Fig. 2 is the 2nd layer the synoptic diagram of the 1st embodiment of the printed base plate of expression wireless communication terminal of the present invention.
Fig. 3 is the 1st layer the synoptic diagram of the 2nd embodiment of the printed base plate of expression wireless communication terminal of the present invention.
Fig. 4 is the 2nd layer the synoptic diagram of the 2nd embodiment of the printed base plate of expression wireless communication terminal of the present invention.
Fig. 5 is the figure of the gap length of the pattern of explanation grounding pattern beyond the being grounded position of separating.
Fig. 6 is the figure of other examples of the expression connecting portion that connects grounding pattern.
Fig. 7 is the key diagram when grounding pattern is strong in two sections the LC low pass filter of expression.
Fig. 8 is the key diagram when grounding pattern is more weak in two sections the LC low pass filter of expression.
Embodiment
Embodiments of the present invention will be described in detail with reference to the accompanying drawings.
As shown in Figure 1, be formed with high-frequency circuit on the 1st layer (the 1st face) of printed base plate 10, this high-frequency circuit comprises: the region of high frequency signals 11 in pattern (Pattern) zone of using as high-frequency signal; High frequency IC 12 as the integrated circuit of handling high-frequency signal; And as the control signal zone 13 of the area of the pattern used of control signal of control high frequency IC 12.And, the profile of 14 expression radomes.Radome 14 is installed on the 1st layer of printed base plate 10, the electromagnetic shielding high-frequency circuit.In addition, though in Fig. 1, omitted diagram, be formed with grounding pattern and other various patterns in the space of free time.
On the other hand, as shown in Figure 2, be formed with grounding pattern (oblique line), power supply pattern 15 on the 2nd layer (the 2nd face) of printed base plate 10.Wherein, the grounding pattern shown in Fig. 2 bend is electrically connected by the through hole that connects layers 1 and 2 each other.And the inboard part that is installed in the radome 14 on the 1st layer is illustrated by the broken lines.Though omitted diagram in Fig. 2, the space between grounding pattern is formed with other various patterns.
For the receiving feature of the wireless communication terminal that prevents to dispose printed base plate 10 worsens, parasitic noise increases, guarantee to be formed on the high-frequency circuit regular event on the 1st layer, preferably, by radome 14 electromagnetic shielding high-frequency circuits, and the position corresponding with the inboard of radome 14, the 1st layer high-frequency circuit portion also all is set to grounding pattern the 1st a layer of side the 2nd a layer of side.But in the printed base plate 10 of bilayer,, often be difficult to fully guarantee grounding pattern because of the restriction of wiring space etc.As a result, as shown in Figure 2, the situation that exists grounding pattern to be separated by power supply pattern 15.
And in printed base plate 10, in order to prevent that grounding pattern from dying down, in the position corresponding the 2nd layer and the grounding pattern position of being separated, cross over power supply pattern 15 by 0 Ω pellet resistance Ro (Ro 1, Ro 2, Ro 3) and connect grounding pattern by power supply pattern 15 with high-frequency circuit portion the inboard of radome 14 and the 1st layer.So, on the 1st layer, be formed with in the double-deck printed base plate 10 of high-frequency circuit, can make the earth level stabilisation.Therefore, can keep the receiving feature of wireless communication terminal well, suppress parasitic noise.And, in this case,, therefore can realize the miniaturization of printed base plate 10 owing to need not to enlarge substrate size.
Then, the 2nd embodiment of the present invention is described.
As shown in Figure 3, with printed base plate 10 (with reference to Fig. 1) similarly, on the 1st layer (the 1st face) of printed base plate 20, be formed with the high-frequency circuit that comprises region of high frequency signals 21, high frequency IC 22, reaches control signal zone 23, radome 24 is installed on the 1st layer of printed base plate 20, the electromagnetic shielding high-frequency circuit.And separation is formed on the grounding pattern in idle space and forms signal pattern 25.
On the other hand, as shown in Figure 4, on the 2nd layer (the 2nd face) of printed base plate 20, be formed with grounding pattern (oblique line), signal pattern 26, power supply pattern 27,28.Wherein, the grounding pattern shown in Fig. 4 bend is electrically connected by the through hole that connects between the layers 1 and 2 each other.And the inboard part that is installed in the radome 24 on the 1st layer is illustrated by the broken lines.In addition, though omitted diagram in Fig. 4, the space between grounding pattern is formed with other various patterns.
Same with printed base plate 10 (with reference to Fig. 1, Fig. 2), in printed base plate 20, in order to prevent that grounding pattern from dying down, also in the position corresponding the 2nd layer with high-frequency circuit portion the inboard of radome 24 and the 1st layer and grounding pattern by the position that signal pattern 26 and power supply pattern 27 separate with 28, connect grounding pattern by 0 Ω pellet resistance Ro (Ro 4～Ro 10).Especially connect the position of grounding pattern by Ro 4, Ro 5 among the 0 Ω pellet resistance Ro, Ro 6, go up grounding pattern at the 1st layer (with reference to Fig. 3) and also separated by signal pattern 25.Therefore, the 1st layer, the 2nd layer all connects grounding pattern in the separated position of grounding pattern, thereby can strengthen the position that grounding pattern all separates and dies down on two face of the printed base plate 20 of bilayer.So, in printed base plate 20, can not enlarge substrate size yet and make the earth level stabilisation, can keep receiving feature well, suppress parasitic noise.
Then, illustrate the position that the pattern of grounding pattern beyond being grounded separates gap length, with the relation that is connected of grounding pattern.In high-frequency circuit, leak in order to prevent the unwanted frequency composition, and prevent influence from the unwanted frequency composition, electromagnetic shielding is very important.In above-mentioned printed base plate 10,20, except using radome 14,24, the 2nd layer and inboard part radome 14,24, the 1st layer the corresponding position of high-frequency circuit portion are set to grounding pattern as far as possible, thereby obtain the shield effectiveness of electromagnetic shielding high-frequency circuit.
Wherein, the known metallic plate that is provided with the gap (slit) of 1/2 wavelength that uses wavelength can be used as desirable slot antenna and works.Therefore, in printed base plate 10,20, when being used to realize to exist on the grounding pattern of shield effectiveness the above gap (slit) of 1/2 wavelength of use wavelength of high-frequency circuit, the effect of performance antenna, but do not bring into play shielding action.
Therefore, as shown in Figure 5, the gap length 1 of the position of separating according to the pattern P of grounding pattern (oblique line) beyond being grounded connects grounding pattern.In an embodiment of the present invention, in order to improve shield effectiveness, when gap length 1 when 1/8 wavelength of the use wavelength of high-frequency circuit is above, the position gap length 1 being divided into less than 1/8 wavelength of the use wavelength of high-frequency circuit connects grounding pattern.If gap length is longer, the position that then gap length 1 is divided into less than 1/8 wavelength of the use wavelength of high-frequency circuit is a plurality of positions, therefore connects grounding pattern in each position.
For example, when the wireless communication terminal of configuration printed base plate 10,20 used the electric wave of 2.4GHz band, its 1/8 wavelength was 15.12mm in air.On normally used FR-4 (glass epoxide) substrate, the influence of the dielectric constant that has because of substrate, its wavelength shortens, and 1/8 wavelength is approximately 8.1mm.Therefore, in the printed base plate 10,20 of present embodiment, when gap length 1 〉=8.1mm, connect grounding pattern.So, can further improve shield effectiveness.Can prevent the signal leakage of high-frequency circuit and influence other circuit, prevent that unwanted signal from invading in the high-frequency circuit from other circuit, prevent to dispose the action instability of the wireless communication terminal (for example handset of digital cordless phones) of printed base plate 10,20, prevent problems such as speech quality deterioration.
Wherein, 0 Ω pellet resistance Ro is an example of connecting portion.And power supply pattern 15,27,28, signal pattern 25,26 are respectively examples of the pattern beyond the ground connection.
As mentioned above, the wireless communication terminal that relates to according to the abovementioned embodiments of the present invention with printed base plate 10,20, in the position corresponding the 2nd layer with high-frequency circuit portion the inboard of radome 14,24 and the 1st layer and grounding pattern by the position that power supply pattern 15,27,28 etc. separates, connect grounding pattern by 0 Ω pellet resistance Ro.Thus, by the grounding pattern that further connection is electrically connected, can not enlarge substrate size and make the earth level stabilisation.As a result, can keep disposing the receiving feature of the wireless communication terminal of printed base plate 10,20 well, suppress parasitic noise.Can on the limited double-deck printed base plate of wiring space, realize high-frequency circuit, realize cost degradation, miniaturization.
In addition, the invention is not restricted to the foregoing description, in the scope that does not break away from purport of the present invention, can carry out various improvement, change.
For example, more than connected grounding pattern by 0 Ω pellet resistance Ro, but be not limited thereto.Also can pass through connections such as wire-shaped conductor, chip capacitor.
The impedance of capacitor has frequency characteristic, and for desirable capacitor, frequency is high more, electric capacity is big more, and then impedance is more little.Therefore, for low frequency signal, also be the state (disconnection) that does not have electrical connection, and, be electrically connected, help to strengthen grounding pattern, improve shield effectiveness by connecting with capacitor for high-frequency signal even connect with capacitor.
And actual capacitor also has resistance components, impedance composition except capacitive component.Therefore, frequency is high more, when electric capacity is big more, and impedance may not reduce, and defines the electric capacity that impedance diminishes under specific frequency.Therefore, the capacitor of the electric capacity that need diminish under employed frequency with impedance connects.For example, for the frequency of 2.4GHz, when using common flaky pottery capacitor, be that the capacitor connection of counting about pF～hundreds of pF gets final product with electric capacity.
In addition, as shown in Figure 6, the metal forming shape conductor M (for example Copper Foil) of the position that the pattern P beyond also can being grounded by covering grounding pattern (oblique line) is separated crosses over pattern P and connects.
Claims (8)
1. a wireless communication terminal has the double-deck printed base plate (10,20) that is formed with high-frequency circuit (11,12,13,21,22,23) on the 1st,
Above-mentioned double-deck printed base plate with the 2nd of the 1st opposition side on have grounding pattern, with the corresponding position of part at above-mentioned the 1st above-mentioned high-frequency circuit place, this grounding pattern is separated by the separation pattern beyond this grounding pattern (15,26,27,28, P)
Above-mentioned wireless communication terminal is characterised in that,
Above-mentioned double-deck printed base plate has connecting portion (Ro 1-Ro 10, M), crosses over above-mentioned separation pattern and is electrically connected the 2nd separated above-mentioned grounding pattern.
2. wireless communication terminal according to claim 1 is characterized in that,
Also have radome (14,24), be installed on above-mentioned the 1st, the above-mentioned high-frequency circuit of electromagnetic shielding,
Above-mentioned connecting portion connects separated above-mentioned grounding pattern in the inboard of above-mentioned radome.
3. wireless communication terminal according to claim 1 is characterized in that,
Above-mentioned double-deck printed base plate also has grounding pattern on the 1st, the 1st grounding pattern is also separated by the separation pattern (25) beyond this grounding pattern,
The 1st with the 2nd these two faces in above-mentioned grounding pattern all separated the position (26) that pattern separates by above-mentioned, above-mentioned connecting portion connects above-mentioned the 2nd grounding pattern.
4. wireless communication terminal according to claim 1 is characterized in that,
The gap length of the position that above-mentioned grounding pattern is separated by above-mentioned separation pattern is when 1/8th wavelength of the use wavelength of above-mentioned high-frequency circuit are above, in the position that above-mentioned gap length is divided into less than 1/8th wavelength of the use wavelength of above-mentioned high-frequency circuit, above-mentioned connecting portion connects above-mentioned grounding pattern.
5. wireless communication terminal according to claim 1 is characterized in that,
Above-mentioned connecting portion is made of 0 Ω resistance.
6. wireless communication terminal according to claim 1 is characterized in that,
Above-mentioned connecting portion is made of the wire-shaped conductor.
7. wireless communication terminal according to claim 1 is characterized in that,
Above-mentioned connecting portion is made of capacitor.
8. wireless communication terminal according to claim 1 is characterized in that,
Above-mentioned connecting portion is made of metal forming shape conductor.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009035548A JP4978639B2 (en) | 2009-02-18 | 2009-02-18 | Printed circuit board and wireless communication terminal |
| JP2009-035548 | 2009-02-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101807751A true CN101807751A (en) | 2010-08-18 |
| CN101807751B CN101807751B (en) | 2013-03-27 |
Family
ID=42609418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010121774 Active CN101807751B (en) | 2009-02-18 | 2010-02-11 | Radio communication terminal with printing substrate |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4978639B2 (en) |
| CN (1) | CN101807751B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102592421A (en) * | 2011-01-12 | 2012-07-18 | 索尼公司 | Remote control device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5777277A (en) * | 1995-09-21 | 1998-07-07 | Canon Kabushiki Kaisha | Printed circuit board |
| CN1558714A (en) * | 2003-01-28 | 2004-12-29 | ���µ�����ҵ��ʽ���� | Radio frequency device |
| US20070200218A1 (en) * | 2006-02-28 | 2007-08-30 | Canon Kabushiki Kaisha | Printed board and semiconductor integrated circuit |
| CN101106863A (en) * | 2006-07-10 | 2008-01-16 | 三星电子株式会社 | Printed circuit board and electronic device having the same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5084153B2 (en) * | 2005-08-15 | 2012-11-28 | キヤノン株式会社 | Printed board |
| JP4692152B2 (en) * | 2005-08-23 | 2011-06-01 | 株式会社村田製作所 | Circuit module and manufacturing method thereof |
| JP2008028612A (en) * | 2006-07-20 | 2008-02-07 | Matsushita Electric Ind Co Ltd | Communication device, and electronic device using it |
| JP4736988B2 (en) * | 2006-07-24 | 2011-07-27 | 株式会社村田製作所 | Multilayer printed circuit board |
| JP5437558B2 (en) * | 2006-11-16 | 2014-03-12 | 三菱電機株式会社 | Electromagnetic noise countermeasure structure for printed circuit boards |
-
2009
- 2009-02-18 JP JP2009035548A patent/JP4978639B2/en active Active
-
2010
- 2010-02-11 CN CN 201010121774 patent/CN101807751B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5777277A (en) * | 1995-09-21 | 1998-07-07 | Canon Kabushiki Kaisha | Printed circuit board |
| CN1558714A (en) * | 2003-01-28 | 2004-12-29 | ���µ�����ҵ��ʽ���� | Radio frequency device |
| US20070200218A1 (en) * | 2006-02-28 | 2007-08-30 | Canon Kabushiki Kaisha | Printed board and semiconductor integrated circuit |
| CN101106863A (en) * | 2006-07-10 | 2008-01-16 | 三星电子株式会社 | Printed circuit board and electronic device having the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102592421A (en) * | 2011-01-12 | 2012-07-18 | 索尼公司 | Remote control device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010192681A (en) | 2010-09-02 |
| JP4978639B2 (en) | 2012-07-18 |
| CN101807751B (en) | 2013-03-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4868128B2 (en) | ANTENNA DEVICE AND RADIO COMMUNICATION DEVICE USING THE SAME | |
| KR101087150B1 (en) | Multiband antenna system | |
| EP1605545B1 (en) | Earphone antenna and portable radio equipment provided with earphone antenna | |
| US8237623B2 (en) | Headset antenna and connector for the same | |
| US8081048B2 (en) | Branching filter, semiconductor integrated circuit device, and communication mobile terminal | |
| EP2885839B1 (en) | Antenna apparatus and method of making same | |
| US9692099B2 (en) | Antenna-matching device, antenna device and mobile communication terminal | |
| US20040070538A1 (en) | Antenna incorporating filter | |
| US8072390B2 (en) | Antenna arrangement | |
| US9413336B2 (en) | Multiband-support radio-frequency module | |
| CN105409060A (en) | Antenna-integrated wireless module and method for manufacturing antenna-integrated wireless module | |
| US20090091507A1 (en) | Antenna device with an isolating unit | |
| US10263315B2 (en) | Directional coupler and communication module | |
| CN103635020A (en) | High-frequency circuit module | |
| CN103141031A (en) | Impedance converting circuit and communication terminal apparatus | |
| CN110635229A (en) | Antenna structure | |
| US20140045546A1 (en) | Circuit module | |
| US10707568B2 (en) | Antenna structure | |
| US20150194725A1 (en) | Internal lc antenna for wireless communication device | |
| CN102394333B (en) | Filtering directional coupler with adjustable frequency | |
| CN111509368A (en) | Antenna structure and electronic equipment | |
| US11190161B2 (en) | Filter device | |
| CN101807751B (en) | Radio communication terminal with printing substrate | |
| KR102183270B1 (en) | High frequency line integrated subboard | |
| US10008757B2 (en) | High-frequency module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |