CN101804532B - Creep-resisting soldering paste and preparation method thereof - Google Patents
Creep-resisting soldering paste and preparation method thereof Download PDFInfo
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- CN101804532B CN101804532B CN2010101496684A CN201010149668A CN101804532B CN 101804532 B CN101804532 B CN 101804532B CN 2010101496684 A CN2010101496684 A CN 2010101496684A CN 201010149668 A CN201010149668 A CN 201010149668A CN 101804532 B CN101804532 B CN 101804532B
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- 238000005476 soldering Methods 0.000 title claims abstract description 23
- 238000002360 preparation method Methods 0.000 title claims abstract description 6
- 230000004907 flux Effects 0.000 claims abstract description 23
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims abstract description 17
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000843 powder Substances 0.000 claims abstract description 14
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 claims abstract description 8
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims abstract description 8
- 235000021314 Palmitic acid Nutrition 0.000 claims abstract description 8
- 235000011037 adipic acid Nutrition 0.000 claims abstract description 8
- 239000001361 adipic acid Substances 0.000 claims abstract description 8
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052745 lead Inorganic materials 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims description 40
- 238000003756 stirring Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 9
- -1 ethylene dilaurate acid amides Chemical class 0.000 claims description 8
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 claims description 7
- 239000001856 Ethyl cellulose Substances 0.000 claims description 7
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 7
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 7
- 229920001249 ethyl cellulose Polymers 0.000 claims description 7
- 235000011187 glycerol Nutrition 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 6
- 239000006185 dispersion Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 229940023462 paste product Drugs 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 150000002943 palmitic acids Chemical class 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 6
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 abstract description 6
- 229910045601 alloy Inorganic materials 0.000 abstract description 4
- 239000000956 alloy Substances 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 3
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 abstract 1
- 239000005977 Ethylene Substances 0.000 abstract 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 abstract 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 abstract 1
- 239000004359 castor oil Substances 0.000 abstract 1
- 235000019438 castor oil Nutrition 0.000 abstract 1
- TUTWLYPCGCUWQI-UHFFFAOYSA-N decanamide Chemical compound CCCCCCCCCC(N)=O TUTWLYPCGCUWQI-UHFFFAOYSA-N 0.000 abstract 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 abstract 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 abstract 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 238000003466 welding Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 239000006210 lotion Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 229910017692 Ag3Sn Inorganic materials 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
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Abstract
The invention relates to a creep-resisting soldering paste and a preparation method thereof. The creep-resisting soldering paste consists of a soldering flux and Sn-based alloy powder, wherein the soldering flux consists of polymerized rosin, hydrogenated rosin, adipic acid, palmitic acid, hydrogenated castor oil, glycerol, dioctyl phthalate, ethylene bimonthly decanoic amide, hydroxyethyl cellulose, ethylene glycol phenyl ether and dipropylene glycol; and the Sn-based alloy powder consists of Ag, Pb and balance Sn. The creep-resisting soldering paste has the advantages of good adhesiveness, long storage period, no dazzling to eyes under high light and the like, and has unique effects on the aspects of humidification, creep resistance and the like; meanwhile, the other performance indexes of the dazzling creep-resisting soldering paste satisfy related technical requirements regulated by SJ/T11186-2009 standard issued by the industry and information department.
Description
Technical field
But the present invention relates to a kind of creep-resisting soldering paste, belong to the electronic welding material.
The invention still further relates to the preparation method of this solder(ing) paste.
Background technology
Creep is a kind of thermal excitation process, under many conditions, all can take place, and particularly under variation of ambient temperature and certain stress effect, creep takes place more easily.Electronic device is under arms the time; Because the cyclically-varying of the periodicity switching of circuit electricity and environment temperature; Can make solder joint stand the temperature cycles change procedure, cause the thermal expansion mismatch between encapsulating material, make solder joint produce stress and strain; And strain will be born by solder joint basically, causes the germinating and the expansion of crackle in the solder joint and finally causes solder joint failure.Creep causes pad to lose efficacy, and influence the welding quality of electronic device, so creep resistance is very one of important performance of scolder.Now, the solder(ing) paste creep resistance that has is also not really desirable, thereby influences the service life of electronic device.
Summary of the invention
The object of the invention provides a kind of creep-resisting soldering paste in order to improve the solder(ing) paste creep resistance just, thereby improves the service life of electronic device.
The objective of the invention is to realize through following technical proposal:
Creep-resisting soldering paste, it is made up of solder flux and Sn base alloyed powder.
Described solder flux is made up of the following weight proportion raw material:
It is made up of described Sn base alloyed powder following weight percentages:
Ag 1.5～2.5%, Pb 7～9% and Sn surplus.
Said solder flux and Sn base alloyed powder weight ratio are 11.5～12.5%: 87.5～88.5%.
The preparation method of said creep resistant soldering paste, it is undertaken by following step:
(a) ethylene glycol phenyl ether of 30.0～32.0 weight portions, the DPG butyl ether of 3.8～4.2 weight portions are added in the container, add the ethyl cellulose of 0.1～0.2 weight portion, be heated to 120 ℃ of stirrings it is dissolved fully, process solution;
(b) newtrex of 19.0～21.0 weight portions, the Foral of 31.0～33.0 weight portions are added in (a) solution, be heated to 150 ℃ and insulation, until dissolving fully;
(c) rilanit special, the ethylene dilaurate acid amides of 3.8～4.2 weight portions, the adipic acid of 1.8～2.2 weight portions, 1.8～2.2 weight portion palmitic acids with 0.7～0.9 weight portion add in (b) solution successively, stir until dissolving fully;
When treating that (d) (c) solution room temperature is cooled to 100 ℃, add the glycerine of 0.9～1.1 weight portion and the dioctyl phthalate of 2.8～3.2 weight portions, be stirred well to evenly, the solder flux that makes is cooled to room temperature, sealing is preserved;
(e) get (d) solder flux and the basic alloyed powder of Sn according to 11.5～12.5%: 87.5～88.5% part by weight mix stirring in the vacuum dispersion machine, obtain the solder(ing) paste product after stirring.
The glass putty that solder(ing) paste of the present invention is selected is made up of Sn, Ag and Pb, and the disperse of Ag3Sn particle distributes and improved the creep-resistant property of alloy in the alloy, and the relative reduction of Pb content has also reduced the crystal boundary sliding phenomenon, helps the raising of creep-resistant property.
The employed solder flux of solder(ing) paste of the present invention is made up of newtrex, Foral, adipic acid, palmitic acid, rilanit special, glycerine, dioctyl phthalate, ethylene dilaurate acid amides, ethyl cellulose, ethylene glycol phenyl ether, DPG butyl ether; Newtrex and the Foral selected are solid-state at normal temperatures; Form good, the transparent organic film of air-tightness after the soldering; Can bump be wrapped up; Have the excellent protection performance, solved activity and corrosive contradiction of scaling powder well; Rilanit special is a thixotropic agent, and main effect is to give soldering paste certain thixotropic property, makes it be convenient to the soldering paste printing at ambient temperature, keeps the intrinsic form of soldering paste after the printing again, prevents subsiding of soldering paste; Adipic acid is an activator, and it mainly acts on is the oxide of under welding condition, removing pad, welding device and solder surface, thereby improves wetability, improves welding performance; The adding of palmitic acid also has certain eliminate optical property except that the effect of playing activating agent, make solder joint under light or solar radiation, form diffusion, and is not dazzling, is convenient to visual inspection; Glycerine is a NMF, improves the maintenance time limit of soldering paste and the working life under the room temperature condition; Dioctyl phthalate is a wetting agent, and it mainly acts on is the surface tension that reduces solder flux, increases the wetability of solder flux; Ethylene dilaurate acid amides is a thickener, and it mainly acts on is to give soldering paste certain lotion form, and adjustment soldering paste viscosity satisfies instructions for use; Ethyl cellulose is tackifier, and it mainly acts on is the viscosity that increases soldering paste, is convenient to mount components and parts; Ethylene glycol phenyl ether, DPG butyl ether are solvent, and it mainly acts on is other component in the dissolving solder flux, makes solder flux become uniform lotion.
Owing to take technique scheme, make technology of the present invention have following advantage and effect:
(a) it is good to adopt the solder(ing) paste of above-mentioned prescription and prepared to have viscosity, and storage life limit for length is not dazzling under the high light, is convenient to visual inspection;
(b) this product also has its unique advantage at aspects such as wetability and creep resistances, and other performance indications of solder(ing) paste also satisfy the correlation technique requirement of stipulating in the SJ/T11186-2009 standard of the Ministry of Industry and Information Technology's promulgation.
The specific embodiment
Embodiment 1
The DPG butyl ether of getting ethylene glycol phenyl ether, the 4.2kg of 30.0kg adds in the container, adds the ethyl cellulose of 0.1kg, is heated to 120 ℃ of stirrings it is dissolved fully, processes solution; The Foral of getting newtrex, the 33.0kg of 19.0kg adds in the solution; Be heated to 150 ℃ and insulation; Until dissolving fully; Get the rilanit special of 0.7kg, the ethylene dilaurate acid amides of 4.2kg, the adipic acid of 1.8kg, the palmitic acid of 2.2kg again and add again successively in the above-mentioned solution, stir until dissolving fully; When the solution room temperature is cooled to 100 ℃; Add the glycerine of 0.9kg and the dioctyl phthalate of 3.2kg; Be stirred well to evenly; The solder flux that makes is cooled to room temperature, gets solder flux 12.5kg and in the vacuum dispersion machine, mix stirring, obtain the solder(ing) paste product after stirring with Sn base alloyed powder 87.5kg.
Embodiment 2
The DPG butyl ether of getting ethylene glycol phenyl ether, the 4.0kg of 31.0kg adds in the container, adds the ethyl cellulose of 0.15kg, is heated to 120 ℃ of stirrings it is dissolved fully, processes solution; The Foral of getting newtrex, the 32kg of 20.0kg adds in the solution; Be heated to 150 ℃ and insulation; Until dissolving fully; Get the rilanit special of 0.8kg, the ethylene dilaurate acid amides of 4.0kg, the adipic acid of 2.0kg, the palmitic acid of 2.0kg again and add again successively in the above-mentioned solution, stir until dissolving fully; When the solution room temperature is cooled to 100 ℃; Add the glycerine of 1.0kg and the dioctyl phthalate of 3.0kg; Be stirred well to evenly; The solder flux that makes is cooled to room temperature, gets solder flux 12.0kg and in the vacuum dispersion machine, mix stirring, obtain the solder(ing) paste product after stirring with Sn base alloyed powder 88.0kg.
Embodiment 3
The DPG butyl ether of getting ethylene glycol phenyl ether, the 3.8kg of 32.0kg adds in the container, adds the ethyl cellulose of 0.2kg, is heated to 120 ℃ of stirrings it is dissolved fully, processes solution; The Foral of getting newtrex, the 31.0kg of 21.0kg adds in the solution; Be heated to 150 ℃ and insulation; Until dissolving fully; Get the rilanit special of 0.9kg, the ethylene dilaurate acid amides of 3.8kg, the adipic acid of 2.2kg, the palmitic acid of 1.8kg again and add again successively in the above-mentioned solution, stir until dissolving fully; When the solution room temperature is cooled to 100 ℃; Add the glycerine of 1.1kg and the dioctyl phthalate of 2.8kg; Be stirred well to evenly; The solder flux that makes is cooled to room temperature, gets solder flux 11.5kg and in the vacuum dispersion machine, mix stirring, obtain the solder(ing) paste product after stirring with Sn base alloyed powder 88.5kg.
Claims (2)
1. creep-resisting soldering paste, it is made up of solder flux and Sn base alloyed powder, it is characterized in that:
Described solder flux is made up of the following weight proportion raw material:
It is made up of described Sn base alloyed powder following weight percentages:
Ag 1.5～2.5%, Pb 7～9% and Sn surplus.
Said solder flux and Sn base alloyed powder weight ratio are 11.5～12.5%: 87.5～88.5%.
2. the preparation method of creep resistant soldering paste according to claim 1 is characterized in that it is undertaken by following step:
(a) ethylene glycol phenyl ether of 30.0～32.0 weight portions, the DPG butyl ether of 3.8～4.2 weight portions are added in the container, add the ethyl cellulose of 0.1～0.2 weight portion, be heated to 120 ℃ of stirrings it is dissolved fully, process solution;
(b) newtrex of 19.0～21.0 weight portions, the Foral of 31.0～33.0 weight portions are added in (a) solution, be heated to 150 ℃ and insulation, until dissolving fully;
(c) rilanit special, the ethylene dilaurate acid amides of 3.8～4.2 weight portions, the adipic acid of 1.8～2.2 weight portions, 1.8～2.2 weight portion palmitic acids with 0.7～0.9 weight portion add in (b) solution successively, stir until dissolving fully;
When treating that (d) (c) solution room temperature is cooled to 100 ℃, add the glycerine of 0.9～1.1 weight portion and the dioctyl phthalate of 2.8～3.2 weight portions, be stirred well to evenly, the solder flux that makes is cooled to room temperature, sealing is preserved;
(e) get (d) solder flux and the basic alloyed powder of Sn according to 11.5～12.5%: 87.5～88.5% part by weight mix stirring in the vacuum dispersion machine, obtain the solder(ing) paste product after stirring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101496684A CN101804532B (en) | 2010-04-19 | 2010-04-19 | Creep-resisting soldering paste and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101496684A CN101804532B (en) | 2010-04-19 | 2010-04-19 | Creep-resisting soldering paste and preparation method thereof |
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| Publication Number | Publication Date |
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| CN101804532A CN101804532A (en) | 2010-08-18 |
| CN101804532B true CN101804532B (en) | 2012-01-11 |
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| CN2010101496684A Active CN101804532B (en) | 2010-04-19 | 2010-04-19 | Creep-resisting soldering paste and preparation method thereof |
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| CN111716038A (en) * | 2019-03-20 | 2020-09-29 | 天津市同鑫泰钢管制造有限公司 | Anti-cracking soldering flux for welding of long-distance transportation spiral steel pipe |
| CN110303272A (en) * | 2019-06-26 | 2019-10-08 | 浙江强力控股有限公司 | Brass base, Ni-based needle tubing halogen-free environmental solder(ing) paste and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH106074A (en) * | 1996-06-20 | 1998-01-13 | Harima Chem Inc | Solder paste composition |
| JP2004114104A (en) * | 2002-09-26 | 2004-04-15 | Omae Seiko Kk | Flux for soldering |
| CN1307024C (en) * | 2004-05-09 | 2007-03-28 | 邓和升 | High adhesion leadless soldering tin grease |
| CN100488704C (en) * | 2007-02-06 | 2009-05-20 | 北京蓝景创新科技有限公司 | Leadless alloy tin solder paste and manufacturing method thereof |
| CN101508061B (en) * | 2009-03-30 | 2012-10-03 | 汕头市骏码凯撒有限公司 | Welding flux for SnAgCu alloy solder powder and preparation method thereof |
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