CN101793913A - Processing technology of protective plate of PCB (Printed Circuit Board) testing device - Google Patents

Abstract

The invention relates to a processing technology of a protective plate of a PCB (Printed Circuit Board) testing device, which comprises the following steps of: a, arranging a blind hole with a diameter of D1 and a depth of H1 on a protective plate surface facing one side of a needle placing plate relative to the position of a testing needle, wherein D1>d1 and h1<H1<h2, d1 is the diameter of a needle sheath of the testing needle, h2 is the depth of the protective plate and h1 is the installation height of the needle sheath of the testing needle; and b, arranging a through hole in the reverse position of the protective plate with the processed blind hole, wherein the diameter of the through hole is D2, the depth of the through hole is equal to that of the blind hole, D1>D2>d2, and d2 is the maximum diameter of a needle rod of the testing needle. The invention meets different hole diameter requirements for the needle sheath and the needle rod of the testing needle for the protective plate, and enables the protective plate to effectively protect the testing needle, lead and correct the positioning of the testing needle, and effectively obstruct impurities such as tin balls, flux and the like from dropping on the needle sheath of the testing needle and the needle placing plate of the PCB testing device.

Description

PCB proving installation backplate processing technology

Technical field

The present invention relates to a kind of PCB proving installation backplate processing technology, be applicable to other proving installations such as ICT on-line testing instrument apparatus, FCT device for testing functions.

Background technology

In the PCB proving installation, as shown in Figure 1, backplate pin hole and testing needle shank gap are big at present, can not bring into play the effect of guiding, correction and protection testing needle; And foreign material such as " tin sweat(ing) ", " scaling powder " drop to the testing needle sleeve pipe easily from backplate pin hole gap and device is planted on the needle plate, cause the testing needle short circuit or follow the string, and cause the proving installation fault, shorten testing needle serviceable life.Therefore, how addressing the above problem is research object of the present invention.

Summary of the invention

The object of the present invention is to provide a kind of backplate performance " protection, guiding, correction " testing needle location that makes, improve device reliability and serviceable life, guarantee the PCB proving installation backplate processing technology of device to test bearing accuracy.

The invention is characterized in: a kind of PCB proving installation backplate processing technology, its step is as follows:

A. be D1 facing on the backplate face of planting needle plate one side and offering diameter on corresponding to the testing needle position, the degree of depth is the blind hole of H1, and D1＞d1, h1＜H1＜h2, and wherein, d1 is a testing needle needle guard diameter, and h2 is a backplate thickness, and h1 is a testing needle needle guard setting height(from bottom).

B. offering diameter on the backplate reverse side correspondence position of blind hole processing is D2, the through hole of the through blind hole of the degree of depth, and D1＞D2＞d2, and wherein, d2 is a testing needle shank maximum gauge.

Advantage of the present invention: the present invention satisfies testing needle " needle guard, shank " the aperture needs different to the backplate pin hole; make backplate can effectively protect testing needle; guiding, correction testing needle location stop that effectively foreign material such as " tin sweat(ing) ", " scaling powder " drop to the testing needle needle guard and the PCB proving installation is planted on the needle plate.

Description of drawings

Fig. 1 is present guard board structure view.

Fig. 2 is for the backplate under the processing technology of the present invention and plant structural drawing between the needle plate.

Guard board structure figure under Fig. 3 the present invention

Fig. 4 originally plants needle plate structure figure

Wherein: the 1-backplate, 2-plants needle plate, 3-testing needle needle guard, 4-testing needle shank.

Embodiment

With reference to figure 2, Fig. 3 and Fig. 4, a kind of PCB proving installation backplate processing technology, its step is as follows:

A. in the face of 1 of the backplate of planting needle plate 2 one sides and to offer diameter on corresponding to testing needle 4 positions be D1, the degree of depth is the blind hole of H1, and D1＞d1, h1＜H1＜h2, wherein, d1 is testing needle needle guard 3 diameters, and h2 is backplate 1 thickness, h1 is testing needle needle guard 3 setting height(from bottom)s, and the concrete degree of depth view apparatus of H1 needle plate " needle guard setting height(from bottom) " tolerance is selected.

B. offering diameter on the backplate 1 reverse side correspondence position of blind hole processing is D2, the through hole of the through blind hole of the degree of depth, and D1＞D2＞d2, and wherein, d2 is testing needle shank 4 maximum gauges, D2 specifically neglects greatly to install to cooperate to be needed to select.

The above only is preferred embodiment of the present invention, and all equalizations of being done according to the present patent application claim change and modify, and all should belong to covering scope of the present invention.

Claims (1)

1. PCB proving installation backplate processing technology, its step is as follows:

A. be D1 facing on the backplate face of planting needle plate one side and offering diameter on corresponding to the testing needle position, the degree of depth is the blind hole of H1, and D1＞d1, h1＜H1＜h2, and wherein, d1 is a testing needle needle guard diameter, and h2 is a backplate thickness, and h1 is a testing needle needle guard setting height(from bottom).

B. offering diameter on the backplate reverse side correspondence position of blind hole processing is D2, the through hole of the through blind hole of the degree of depth, and D1＞D2＞d2, and wherein, d2 is a testing needle shank maximum gauge.

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