CN101792647A - Aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive and preparation method thereof - Google Patents
Aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive and preparation method thereof Download PDFInfo
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- CN101792647A CN101792647A CN 201010135716 CN201010135716A CN101792647A CN 101792647 A CN101792647 A CN 101792647A CN 201010135716 CN201010135716 CN 201010135716 CN 201010135716 A CN201010135716 A CN 201010135716A CN 101792647 A CN101792647 A CN 101792647A
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Abstract
The invention discloses an aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive and a preparation method thereof, relates to a phenol formaldehyde adhesive and a preparation method thereof, and solves the problem that energy consumption in the adhesion process is high due to high curing temperature of the conventional high-temperature resistant phenol formaldehyde adhesive. The aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive is prepared from phenol, formaldehyde, zinc oxide, aluminic acid and methyl silicone resin. The preparation method comprises the following steps: adding the phenol, formaldehyde and zinc oxide into a reaction kettle, raising the temperature to 97 to 100 DEG C and maintaining the temperature for 1.8 to 2.3 hours; adding the aluminic acid and the methyl silicone resin into the reaction kettle at the temperature of between 97 and 100 DEG C and maintaining the temperature for 4 to 6 hours; distilling and dehydrating under reduced pressure; and when the temperature is between 102 and 108 DEG C, stopping dehydrating, and reducing the temperature to obtain the phenol formaldehyde adhesive. The aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive has the advantages of curing temperature of 150 DEG C, good heat resistance, and water or seawater erosion resistance, and is applied to adhering high-temperature resistant materials, friction materials, metal product parts, composite packaging materials and the like.
Description
Technical field
The present invention relates to synvaren and preparation method thereof.
Background technology
Synvaren is widely used in high-tech areas such as Aeronautics and Astronautics, weapons, automobile and electronics because of having good resistant to chemical media, ageing-resistant, water tolerance and electric insulating quality, but unmodified synvaren poor heat resistance, and its application is restricted.Improving the stable on heating method of synvaren has: one, mineral acid modification: mineral acid is phosphoric acid, molybdic acid, wolframic acid, boric acid or metatitanic acid; Two, organism modification: organism is bismaleimides or organosilicon; Can use the POSS modification in addition, above method can obtain the thermostable phenolic resin tackiness agent, its working temperature is brought up to 500 ℃～550 ℃ from unmodified 250 ℃～300 ℃, but 30 ℃～50 ℃ of the also corresponding raisings of the solidification value of these thermostable phenolic resin tackiness agent, make the solidification value of thermostable phenolic resin tackiness agent bring up to 180 ℃～200 ℃, even higher, increased the energy consumption of bonding process.
Summary of the invention
The present invention is in order to solve the solidification value height of existing thermostable phenolic resin tackiness agent, to cause the big problem of energy consumption of bonding process, and aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive and preparation method thereof are provided.
Aluminic acid of the present invention and methyl silicone resin binary modification phenol formaldehyde adhesive are made by phenol, formaldehyde, zinc oxide, aluminic acid and methyl silicon resin; Wherein phenol, mass concentration are that the mass ratio of 35%～37% formaldehyde, zinc oxide, aluminic acid and methyl silicon resin is 100:90～110:1.5～2.5:8～12:8～12.
The above-mentioned aluminic acid and the preparation method of methyl silicone resin binary modification phenol formaldehyde adhesive carry out according to the following steps: one, by phenol: mass concentration is 35%～37% formaldehyde: it is 35%～37% formaldehyde, zinc oxide, aluminic acid and methyl silicon resin that the mass ratio of zinc oxide: aluminic acid: methyl silicon resin=100:90～110:1.5～2.5:8～12:8～12 takes by weighing phenol, mass concentration; Two, be that 35%～37% formaldehyde and zinc oxide join in the reactor with phenol, the mass concentration that takes by weighing in the step 1, keep 1.8h～2.3h after being warming up to 97 ℃～100 ℃; Three, aluminic acid and the methyl silicon resin that takes by weighing in the step 1 joined in the reactor, and under 97 ℃～100 ℃ condition, keep 4h～6h; Four, be underpressure distillation dehydration under the condition of 65mmHg～73mmHg in vacuum tightness, when temperature is 102 ℃～108 ℃, stop underpressure distillation, be cooled to 30 ℃～50 ℃, obtain aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive.
Aluminic acid of the present invention and methyl silicone resin binary modification phenol formaldehyde adhesive have good toughness and resistance toheat, solidification value is 150 ℃, solidification value than existing thermostable phenolic resin tackiness agent reduces by 15%～25%, can reduce the energy consumption in the bonding process.Can sinter the mixture of aluminum oxide, pure aluminium silicate and graphite etc. under this resin hot conditions, thereby reach resistant to elevated temperatures purpose.The thermogravimetric analysis of the aluminic acid of present embodiment and methyl silicone resin binary modification phenol formaldehyde adhesive cured product shows, in the time of 500 ℃, still have 80%～83% weight reservation, cured product have 5% decomposition amount the time temperature be 515 ℃～520 ℃, temperature when having 50% decomposition amount is 700 ℃～708 ℃, and the thermolysis of cured product can continue until 800 ℃.The aluminic acid of present embodiment and methyl silicone resin binary modification phenol formaldehyde adhesive are bondingly made the steel alloy of standard test piece by the GB7124-93 standard, its shearing resistance of test and endurance quality after solidifying 30 minutes under 150 ℃ of conditions.Bond shearing resistance at normal temperatures is 20MPa～22MPa, and the shearing resistance in the time of 500 ℃ is 5MPa～5.5MPa, handles after 5 minutes under 900 ℃ of conditions, and its shearing resistance is 5MPa～5.2MPa still, has the pyritous of anti-moment ability; Bond was immersed in the tap water of room temperature after 3 months, and the shearing resistance under the normal temperature of bond is 20MPa～22MPa, and the shearing resistance under 500 ℃ is 5.0MPa～5.5MPa, and it is unaffected that bond is immersed in the tap water of room temperature after 3 months shearing resistance; Bond was immersed in the tap water of room temperature after 6 months, and the shearing resistance under the normal temperature of bond is 19.8MPa～21.5MPa, only reduces by 1.0%～2.3%; Shearing resistance under 500 ℃ is 5MPa～5.2MPa, and the shearing resistance under 500 ℃ is not affected; Bond was immersed in the artificial seawater after 1 month, shearing resistance under the normal temperature of bond is 20MPa～22MPa, shearing resistance under 500 ℃ is 5.0MPa～5.5MPa, bond was immersed in the artificial seawater after 3 months, bond normal temperature shearing resistance is 20MPa～22MPa, the normal temperature shearing resistance is not affected, and the shearing resistance of bond is that 4.7MPa～5.2MPa only reduces by 5.5% ~ 7.5% in the time of 500 ℃.Aluminic acid of the present invention and methyl silicone resin binary modification phenol formaldehyde adhesive not only have good heat-resistant, but also can tolerate water or marine denudation.Be applicable to the bonding of high temperature material, friction materials, metal products part, compound package material etc.
Embodiment
Embodiment one: the aluminic acid of present embodiment and methyl silicone resin binary modification phenol formaldehyde adhesive are made by phenol, formaldehyde, zinc oxide, aluminic acid and methyl silicon resin; Wherein phenol, mass concentration are that the mass ratio of 35%～37% formaldehyde, zinc oxide, aluminic acid and methyl silicon resin is 100:90～110:1.5～2.5:8～12:8～12.
The aluminic acid of present embodiment and methyl silicone resin binary modification phenol formaldehyde adhesive have good toughness and resistance toheat, and solidification value is 150 ℃, than the solidification value reduction by 15%～25% of existing thermostable phenolic resin tackiness agent.Can sinter the mixture of aluminum oxide, pure aluminium silicate and graphite etc. under this resin hot conditions, thereby reach resistant to elevated temperatures purpose.The thermogravimetric analysis of the aluminic acid of present embodiment and methyl silicone resin binary modification phenol formaldehyde adhesive cured product shows, in the time of 500 ℃, still have 80%～83% weight reservation, cured product have 5% decomposition amount the time temperature be 515 ℃～520 ℃, temperature when having 50% decomposition amount is 700 ℃～708 ℃, and the thermolysis of cured product can continue until 800 ℃.The aluminic acid of present embodiment and methyl silicone resin binary modification phenol formaldehyde adhesive are bondingly made the steel alloy of standard test piece by the GB7124-93 standard, its shearing resistance of test and endurance quality after solidifying 30 minutes under 150 ℃ of conditions.Bond shearing resistance at normal temperatures is 20MPa～22MPa, and the shearing resistance in the time of 500 ℃ is 5MPa～5.5MPa, handles after 5 minutes under 900 ℃ of conditions, and its shearing resistance is 5MPa～5.2MPa still, has the pyritous of anti-moment ability; Bond was immersed in the tap water of room temperature after 3 months, and the shearing resistance under the normal temperature of bond is 20MPa～22MPa, and the shearing resistance under 500 ℃ is 5.0MPa～5.5MPa, and it is unaffected that bond is immersed in the tap water of room temperature after 3 months shearing resistance; Bond was immersed in the tap water of room temperature after 6 months, and the shearing resistance under the normal temperature of bond is 19.8MPa～21.5MPa, only reduces by 1.0%～2.3%; Shearing resistance under 500 ℃ is 5MPa～5.2MPa, and the shearing resistance under 500 ℃ is not affected; Bond was immersed in the artificial seawater after 1 month, shearing resistance under the normal temperature of bond is 20MPa～22MPa, shearing resistance under 500 ℃ is 5.0MPa～5.5MPa, bond was immersed in the artificial seawater after 3 months, bond normal temperature shearing resistance is 20MPa～22MPa, the normal temperature shearing resistance is not affected, and the shearing resistance of bond is that 4.7MPa～5.2MPa only reduces by 5.5% ~ 7.5% in the time of 500 ℃.Aluminic acid of the present invention and methyl silicone resin binary modification phenol formaldehyde adhesive not only have good heat-resistant, but also can tolerate water or marine denudation.Be applicable to the bonding of high temperature material, friction materials, metal products part, compound package material etc.
Embodiment two: what present embodiment and embodiment one were different is: phenol, mass concentration are that the mass ratio of 35%～37% formaldehyde, zinc oxide, aluminic acid and methyl silicon resin is 100:92～108:1.6～2.3:8.5～11.5:8.5～11.5.Other is identical with embodiment one.
Embodiment three: what present embodiment was different with embodiment one or two is: phenol, mass concentration are that the mass ratio of 35%～37% formaldehyde, zinc oxide, aluminic acid and methyl silicon resin is 100:100:2:10:10.Other is identical with embodiment one or two.
Embodiment three: the aluminic acid of present embodiment and the preparation method of methyl silicone resin binary modification phenol formaldehyde adhesive carry out according to the following steps: one, by phenol: mass concentration is 35%～37% formaldehyde: it is 35%～37% formaldehyde, zinc oxide, aluminic acid and methyl silicon resin that the mass ratio of zinc oxide: aluminic acid: methyl silicon resin=100:90～110:1.5～2.5:8～12:8～12 takes by weighing phenol, mass concentration; Two, be that 35%～37% formaldehyde and zinc oxide join in the reactor with phenol, the mass concentration that takes by weighing in the step 1, keep 1.8h～2.3h after being warming up to 97 ℃～100 ℃; Three, aluminic acid and the methyl silicon resin that takes by weighing in the step 1 joined in the reactor, and under 97 ℃～100 ℃ condition, keep 4h～6h; Four, be underpressure distillation dehydration under the condition of 65mmHg～73mmHg in vacuum tightness, when temperature is 102 ℃～108 ℃, stop underpressure distillation, be cooled to 30 ℃～50 ℃, obtain aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive.
The aluminic acid and the methyl silicone resin binary modification phenol formaldehyde adhesive of the method preparation of present embodiment have good toughness and resistance toheat, and solidification value is 150 ℃, than the solidification value reduction by 15%～25% of existing thermostable phenolic resin tackiness agent.Can sinter the mixture of aluminum oxide, pure aluminium silicate and graphite etc. under this resin hot conditions, thereby reach resistant to elevated temperatures purpose.The thermogravimetric analysis of the aluminic acid of present embodiment and methyl silicone resin binary modification phenol formaldehyde adhesive cured product shows, in the time of 500 ℃, still have 80%～83% weight reservation, cured product have 5% decomposition amount the time temperature be 515 ℃～520 ℃, temperature when having 50% decomposition amount is 700 ℃～708 ℃, and the thermolysis of cured product can continue until 800 ℃.The aluminic acid of present embodiment and methyl silicone resin binary modification phenol formaldehyde adhesive are bondingly made the steel alloy of standard test piece by the GB7124-93 standard, its shearing resistance of test and endurance quality after solidifying 30 minutes under 150 ℃ of conditions.Bond shearing resistance at normal temperatures is 20MPa～22MPa, and the shearing resistance in the time of 500 ℃ is 5MPa～5.5MPa, handles after 5 minutes under 900 ℃ of conditions, and its shearing resistance is 5MPa～5.2MPa still, has the pyritous of anti-moment ability; Bond was immersed in the tap water of room temperature after 3 months, and the shearing resistance under the normal temperature of bond is 20MPa～22MPa, and the shearing resistance under 500 ℃ is 5.0MPa～5.5MPa, and it is unaffected that bond is immersed in the tap water of room temperature after 3 months shearing resistance; Bond was immersed in the tap water of room temperature after 6 months, and the shearing resistance under the normal temperature of bond is 19.8MPa～21.5MPa, only reduces by 1.0%～2.3%; Shearing resistance under 500 ℃ is 5MPa～5.2MPa, and the shearing resistance under 500 ℃ is not affected; Bond was immersed in the artificial seawater after 1 month, shearing resistance under the normal temperature of bond is 20MPa～22MPa, shearing resistance under 500 ℃ is 5.0MPa～5.5MPa, bond was immersed in the artificial seawater after 3 months, bond normal temperature shearing resistance is 20MPa～22MPa, the normal temperature shearing resistance is not affected, and the shearing resistance of bond is that 4.7MPa～5.2MPa only reduces by 5.5% ~ 7.5% in the time of 500 ℃.Aluminic acid of the present invention and methyl silicone resin binary modification phenol formaldehyde adhesive not only have good heat-resistant, but also can tolerate water or marine denudation.Be applicable to the bonding of high temperature material, friction materials, metal products part, compound package material etc.
Embodiment four: what present embodiment and embodiment three were different is: phenol, mass concentration are that the mass ratio of 35%～37% formaldehyde, zinc oxide, aluminic acid and methyl silicon resin is 100:92～108:1.6～2.3:8.5～11.5:8.5～11.5 in the step 1; Other step is identical with embodiment three with parameter.
Embodiment five: what present embodiment was different with embodiment three or four is: phenol, mass concentration are that the mass ratio of 35%～37% formaldehyde, zinc oxide, aluminic acid and methyl silicon resin is 100:98:2:9:11 in the step 1; Other step is identical with embodiment three or four with parameter.
Embodiment six: what present embodiment was different with one of embodiment three to five is: keep 1.9h～2.2h after being warming up to 97.5 ℃～99.5 ℃ in the step 2; Other step is identical with one of parameter and embodiment three to five.
Embodiment seven: what present embodiment was different with one of embodiment three to six is: keep 2h after being warming up to 98.5 ℃ in the step 2; Other step is identical with one of parameter and embodiment three to six.
Embodiment eight: what present embodiment was different with one of embodiment three to seven is: keep 4.2h～5.8h in the step 3 under 97.5 ℃～99.5 ℃ condition; Other step is identical with one of parameter and embodiment three to seven.
Embodiment nine: what present embodiment was different with one of embodiment three to eight is: keep 5h in the step 3 under 98.5 ℃ condition; Other step is identical with one of parameter and embodiment three to eight.
Embodiment ten: what present embodiment was different with one of embodiment three to nine is: be underpressure distillation dehydration under the condition of 66mmHg～70mmHg in vacuum tightness in the step 4, stop underpressure distillation when temperature is 103 ℃～107 ℃; Other step is identical with one of parameter and embodiment three to nine.
Embodiment 11: what present embodiment was different with one of embodiment three to ten is: be underpressure distillation dehydration under the condition of 68mmHg in vacuum tightness in the step 4, stop underpressure distillation when temperature is 105 ℃; Other step is identical with one of parameter and embodiment three to ten.
Embodiment 12: what present embodiment was different with one of embodiment three to 11 is: be cooled to 35 ℃～45 ℃ in the step 4; Other step is identical with one of parameter and embodiment three to 11.
Embodiment 13: what present embodiment was different with one of embodiment three to 12 is: be cooled to 40 ℃ in the step 4; Other step is identical with one of parameter and embodiment three to 12.
Embodiment 14: the aluminic acid of present embodiment and the preparation method of methyl silicone resin binary modification phenol formaldehyde adhesive carry out according to the following steps: one, by phenol: mass concentration is 37% formaldehyde: it is 37% formaldehyde, zinc oxide, aluminic acid and methyl silicon resin that the mass ratio of zinc oxide: aluminic acid: methyl silicon resin=100:100:2:10:10 takes by weighing phenol, mass concentration; Two, be that 37% formaldehyde and zinc oxide join in the reactor with phenol, the mass concentration that takes by weighing in the step 1, keep 2h after being warming up to 100 ℃; Two, aluminic acid and the methyl silicon resin that takes by weighing in the step 1 joined in the reactor, and under 100 ℃ condition, keep 6h; Three, be underpressure distillation dehydration under the condition of 70mmHg in vacuum tightness, when temperature is 105 ℃, stop underpressure distillation, be cooled to 50 ℃, obtain aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive.
The aluminic acid and the methyl silicone resin binary modification phenol formaldehyde adhesive of present embodiment preparation have good toughness and resistance toheat, and solidification value is 150 ℃, than the solidification value reduction by 15%～25% of existing thermostable phenolic resin tackiness agent.Can sinter the mixture of aluminum oxide, pure aluminium silicate and graphite etc. under this resin hot conditions, thereby reach resistant to elevated temperatures purpose.The thermogravimetric analysis of the aluminic acid of present embodiment and methyl silicone resin binary modification phenol formaldehyde adhesive cured product shows, in the time of 500 ℃, still have 80% weight reservation, cured product have 5% decomposition amount the time temperature be 515 ℃, temperature when having 50% decomposition amount is 700 ℃, and the thermolysis of cured product can continue until 800 ℃.The aluminic acid of present embodiment and methyl silicone resin binary modification phenol formaldehyde adhesive are bondingly made the steel alloy of standard test piece by the GB7124-93 standard, its shearing resistance of test and endurance quality after solidifying 30 minutes under 150 ℃ of conditions.The shearing resistance The performance test results of bond is as shown in table 1, if shown in the endurance quality test result table 2.
The shearing resistance The performance test results of table 1 bond
Table 2 bond endurance quality test result
As can be seen from Table 1, the aluminic acid and the shearing resistance of methyl silicone resin binary modification phenol formaldehyde adhesive under 500 ℃ of present embodiment preparation are 5.3MPa, can tolerate 900 ℃ TRANSIENT HIGH TEMPERATURE; Tap water or seawater are to the not influence of shearing resistance of aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive cured product, the aluminic acid of this explanation present embodiment and the erosion that methyl silicone resin binary modification phenol formaldehyde adhesive can tolerate water and seawater as can be seen from Table 2.
Claims (8)
1. aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive is characterized in that aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive are is that 35%～37% formaldehyde, zinc oxide, aluminic acid and methyl silicon resin are made by phenol, mass concentration; Wherein phenol, mass concentration are that the mass ratio of 35%～37% formaldehyde, zinc oxide, aluminic acid and methyl silicon resin is 100:90～110:1.5～2.5:8～12:8～12.
2. aluminic acid according to claim 1 and methyl silicone resin binary modification phenol formaldehyde adhesive is characterized in that phenol, mass concentration are that the mass ratio of 35%～37% formaldehyde, zinc oxide, aluminic acid and methyl silicon resin is 100:92～108:1.6～2.3:8.5～11.5:8.5～11.5.
3. the preparation method of aluminic acid as claimed in claim 1 and methyl silicone resin binary modification phenol formaldehyde adhesive, it is characterized in that the preparation method of aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive carries out according to the following steps: one, by phenol: mass concentration is 35%～37% formaldehyde: it is 35%～37% formaldehyde, zinc oxide, aluminic acid and methyl silicon resin that the mass ratio of zinc oxide: aluminic acid: methyl silicon resin=100:90～110:1.5～2.5:8～12:8～12 takes by weighing phenol, mass concentration; Two, be that 35%～37% formaldehyde and zinc oxide join in the reactor with phenol, the mass concentration that takes by weighing in the step 1, keep 1.8h～2.3h after being warming up to 97 ℃～100 ℃; Three, aluminic acid and the methyl silicon resin that takes by weighing in the step 1 joined in the reactor, and under 97 ℃～100 ℃ condition, keep 4h～6h; Four, be underpressure distillation dehydration under the condition of 65mmHg～73mmHg in vacuum tightness, when temperature is 102 ℃～108 ℃, stop underpressure distillation, be cooled to 30 ℃～50 ℃, obtain aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive.
4. the preparation method of aluminic acid according to claim 3 and methyl silicone resin binary modification phenol formaldehyde adhesive is characterized in that phenol in the step 1, mass concentration are that the mass ratio of 35%～37% formaldehyde, zinc oxide, aluminic acid and methyl silicon resin is 100:92～108:1.6～2.3:8.5～11.5:8.5～11.5.
5. according to the preparation method of claim 3 or 4 described aluminic acids and methyl silicone resin binary modification phenol formaldehyde adhesive, keep 1.9h～2.2h after it is characterized in that being warming up in the step 2 97.5 ℃～99.5 ℃.
6. the preparation method of aluminic acid according to claim 5 and methyl silicone resin binary modification phenol formaldehyde adhesive is characterized in that keeping 4.2h～5.8h in the step 3 under 97.5 ℃～99.5 ℃ condition.
7. according to the preparation method of claim 3,4 or 6 described aluminic acids and methyl silicone resin binary modification phenol formaldehyde adhesive, it is characterized in that in the step 4 that in vacuum tightness be underpressure distillation dehydration under the condition of 66mmHg～70mmHg, when temperature is 103 ℃～107 ℃, stop underpressure distillation.
8. the preparation method of aluminic acid according to claim 7 and methyl silicone resin binary modification phenol formaldehyde adhesive is characterized in that being cooled in the step 4 35 ℃～45 ℃.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103555238A (en) * | 2013-11-11 | 2014-02-05 | 黑龙江省科学院石油化学研究院 | Ceramic precursor modified phenolic adhesive and preparation method thereof |
| CN105801785A (en) * | 2016-05-06 | 2016-07-27 | 黑龙江省科学院石油化学研究院 | Vinyl polycarbosilane modified phenol-formaldehyde adhesive and preparation method thereof |
| CN107603539A (en) * | 2017-08-23 | 2018-01-19 | 无锡海特新材料研究院有限公司 | A kind of thermostable phenolic resin adhesive and preparation method thereof |
-
2010
- 2010-03-30 CN CN 201010135716 patent/CN101792647B/en not_active Expired - Fee Related
Non-Patent Citations (2)
| Title |
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| 《International Journal of Adhesion & Adhesives》 20050919 Jigang Wang et al The high-temperatures bonding of graphite/ceramics by organ resin matrix adhesive 532-536 1-8 , 第26期 2 * |
| 《Polymer Science U.S.S.R.》 19821231 YE. A. ZAPOROZHSKAYA ET AL EFFECT OF THE STRUCTURE OF PHENOLFORMALDEHYDE OLIGOMERS ON THEIR INTERACTION WITH ALUMINIUM gamma-OXIDE 1762-1767 1-8 第24卷, 第7期 2 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103555238A (en) * | 2013-11-11 | 2014-02-05 | 黑龙江省科学院石油化学研究院 | Ceramic precursor modified phenolic adhesive and preparation method thereof |
| CN105801785A (en) * | 2016-05-06 | 2016-07-27 | 黑龙江省科学院石油化学研究院 | Vinyl polycarbosilane modified phenol-formaldehyde adhesive and preparation method thereof |
| CN107603539A (en) * | 2017-08-23 | 2018-01-19 | 无锡海特新材料研究院有限公司 | A kind of thermostable phenolic resin adhesive and preparation method thereof |
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Application publication date: 20100804 Assignee: Haerbin Liuhuan Adhesive Co., Ltd. Assignor: Institute of Petrochemistry, HLJ Academy of Science Contract record no.: 2013230000682 Denomination of invention: Aluminic acid and methyl silicone resin binary modification phenol formaldehyde adhesive and preparation method thereof Granted publication date: 20121114 License type: Exclusive License Record date: 20130507 |
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Granted publication date: 20121114 Termination date: 20140330 |