CN101783362A - Upper cover structure, packaging structure of luminous element and packaging method for luminous element - Google Patents
Upper cover structure, packaging structure of luminous element and packaging method for luminous element Download PDFInfo
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- CN101783362A CN101783362A CN201010106616A CN201010106616A CN101783362A CN 101783362 A CN101783362 A CN 101783362A CN 201010106616 A CN201010106616 A CN 201010106616A CN 201010106616 A CN201010106616 A CN 201010106616A CN 101783362 A CN101783362 A CN 101783362A
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Abstract
The invention relates to a packaging structure of a luminous element, which comprises an element substrate, at least one luminous element and an upper cover structure. The upper cover structure comprises an upper cover substrate, a barrier dam body, frame glue and a sealing wax, wherein the barrier dam body is arranged at the periphery of the upper cover substrate and faces the element substrate; an active region is substantially surrounded by the barrier dam body; the frame glue is arranged at the periphery of the upper cover substrate and faces the element substrate; the barrier dam body is substantially surrounded by the frame glue; the upper cover substrate is jointed with the element substrate through the frame glue; the sealing wax is blocked by the barrier dam body and is substantially positioned in the active region of the upper cover substrate; and at least part of the luminous element is coated by the sealing wax.
Description
Technical field
The present invention relates to the encapsulating structure of a kind of superstructure and light-emitting component and the method for packing of light-emitting component, relate in particular to a kind of have can avoid sealing to overflow and can be used as the encapsulating structure and the method for packing thereof of the light-emitting component that stops dam body of sept.
Background technology
In recent years, electric exciting light emitting display panel, for example: organic LED display panel since have self-luminous, wide viewing angle, reaction time fast with advantage such as high-luminous-efficiency, be used in widely gradually on the various planes demonstration products.
Because the electroluminescence element that aqueous vapor and oxygen can influence electric exciting light emitting display panel is the luminous efficiency and the life-span of organic light-emitting diode element for example, therefore how to guarantee the seal of the encapsulating structure of light-emitting component, to avoid aqueous vapor and oxygen to invade light-emitting component is exerted an adverse impact, become the developmental important topic of electric exciting light emitting display panel.
Summary of the invention
One of purpose of the present invention is to provide the encapsulating structure of a kind of superstructure, a kind of light-emitting component and a kind of method for packing of light-emitting component, with the seal and the package strength of the encapsulating structure that increases light-emitting component.
A preferred embodiment of the present invention provides a kind of superstructure, is provided with the device substrate of at least one light-emitting component in order to involution one.Superstructure comprises that a loam cake substrate, stops dam body (blocking dam), a frame glue (sealant) and a sealing (encapsulation glue).Definition has an active area on the loam cake substrate, and a surrounding zone is surrounded with the source region.Stop that dam body is arranged in the surrounding zone of loam cake substrate, stop that wherein dam body has a height, and stop that dam body is surrounded with the source region substantially.Frame glue is arranged in the surrounding zone of loam cake substrate, and its center glue has a height, and the height of frame glue is greater than the height that stops dam body, and frame glue is substantially around stopping dam body.Sealing is stopped stopping of dam body and is positioned at the active area of loam cake substrate substantially.
Another preferred embodiment of the present invention provides a kind of encapsulating structure of light-emitting component, comprises an element substrate, at least one light-emitting component and a superstructure.Definition has an active area on the device substrate, and a surrounding zone is surrounded with the source region.Light-emitting component is arranged in the active area of device substrate.Superstructure comprises that a loam cake substrate, stops dam body, a frame glue and a sealing.Definition has an active area on the loam cake substrate, and a surrounding zone is surrounded with the source region, the surrounding zone of the surrounding zone counter element substrate of the wherein active area of the active area counter element substrate of loam cake substrate, and loam cake substrate.Stop that dam body is arranged in the surrounding zone of loam cake substrate and the face elements substrate, stops that wherein dam body is surrounded with the source region substantially.Frame glue is arranged in the surrounding zone of loam cake substrate and the face elements substrate, and its center glue is substantially around stopping dam body, and the loam cake substrate is engaged by frame glue with device substrate.Sealing is stopped stopping of dam body and is positioned at the active area of loam cake substrate substantially, and sealant covers is to the small part light-emitting component.
Another preferred embodiment of the present invention provides a kind of method for packing of light-emitting component, comprises the following steps.One loam cake substrate is provided, and wherein definition has an active area on the loam cake substrate, and a surrounding zone is surrounded with the source region.In the surrounding zone of loam cake substrate, form one and stop dam body, stop that wherein dam body has one first height, and stop that dam body is surrounded with the source region substantially.To stopping that dam body carries out one first hardening process and stops dam body with sclerosis, and stop that after sclerosis dam body has one second height.Form a frame glue in the surrounding zone of loam cake substrate, around stopping dam body, frame glue has one the 3rd height to its center glue substantially, and the 3rd height is greater than second height.Inject a sealing in the active area of loam cake substrate, wherein sealing is stopped stopping of dam body and is positioned at the active area of loam cake substrate substantially.One element substrate is provided, and wherein definition has an active area on the device substrate, and a surrounding zone is surrounded with the source region, and is provided with at least one light-emitting component in the active area of device substrate.The active area that makes device substrate and surrounding zone are distinguished the active area and the surrounding zone of corresponding loam cake substrate substantially, and device substrate and loam cake substrate are carried out a process for pressing, and the frame glue on the loam cake substrate is contacted with device substrate.Frame glue is carried out one second hardening process with sclerosis frame glue, the loam cake substrate is engaged by frame glue with device substrate.
The present invention utilizes stopping that dam body is limited in the sealing of light-emitting component and stop in the formed space of dam body after the sclerosis, whereby when carrying out the process for pressing of device substrate and loam cake substrate, stops that dam body can not subside because of being squeezed and makes sealing excessive.Whereby, sealing can effectively coat light-emitting component, influences emitting component and life-span to avoid aqueous vapor and oxygen.In addition, in process for pressing, stop that dam body also can bring into play the effect of sept, can make between device substrate and the loam cake substrate and keep the fixed interval (FI).
Description of drawings
Fig. 1 to Fig. 9 is the method for packing schematic diagram that shows the light-emitting component of a preferred embodiment of the present invention.
Description of reference numerals in the above-mentioned accompanying drawing is as follows:
10 loam cake substrate 10A active areas
14 frame glue, 16 cushion spaces
18 sealings, 20 device substrates
22 light-emitting component h1, first height
The h2 second height h3 the 3rd height
Embodiment
For making the general technical staff of the technical field of the invention can further understand the present invention, hereinafter the spy enumerates preferred embodiment of the present invention, and conjunction with figs., describes the effect that constitution content of the present invention and institute's desire realize in detail.
Please refer to Fig. 1 to Fig. 9.Fig. 1 to Fig. 9 is the method for packing schematic diagram that shows the light-emitting component of a preferred embodiment of the present invention, wherein for highlighting feature of the present invention, Fig. 1, Fig. 4 and Fig. 6 illustrate for the pattern of schematic appearance, and Fig. 2, Fig. 3, Fig. 5, Fig. 7 to Fig. 9 then illustrate with the pattern of generalized section.As Fig. 1 and shown in Figure 2, at first, provide a loam cake substrate 10.Loam cake substrate 10 is provided with the device substrate of at least one light-emitting component in order to involution, and wherein definition has at least one active area 10A on the loam cake substrate 10, and at least one surrounding zone 10P is surrounded with source region 10A.In the present embodiment, loam cake substrate 10 can be a transparent substrates, for example a glass substrate, a plastic substrate or other various forms of transparent substrates, but not as limit.Then, in the 10P of the surrounding zone of loam cake substrate 10, form one and stop dam body (blocking dam) 12, stop that wherein dam body 12 is surrounded with source region 10A substantially.In the present embodiment, stop that dam body 12 is preferable and have an enclosed type pattern, and stop that dam body 12 has one first height h1 that wherein the first height h1 is substantially between 6 microns to 20 microns, but not as limit.In addition, stop that dam body 12 can be a for example photoinduction material, it can utilize an irradiation technology to be hardened, or a thermoinduction material, and it can utilize a thermal process to be hardened, but or the hardened material of other type.
As shown in Figure 3, then to stopping that dam body 12 carries out one first hardening process and stops dam body 12 (shown in arrow among the figure) with sclerosis, but not as limit.As previously mentioned, if stop that dam body 12 selects the photoinduction material for use, then first hardening process can be an irradiation technology, and it utilizes the light of ultraviolet light for example or other wave-length coverage to harden to stopping dam body 12; If stop that dam body 12 selects the thermoinduction material for use, then first hardening process can be a thermal process, and it will stop that dam body 12 is heated to suitable temperature with to stopping that dam body 12 hardens.Along with the material difference that stops that dam body 12 uses, first hardening process also can be other various hardening process and does not exceed with irradiation technology or thermal process.In the present embodiment, stop that the shrinkage of the height of dam body 12 after sclerosis is about 4%, therefore the second height h2 after the sclerosis can be slightly less than the presclerotic first height h1.For example, in the present embodiment, the second height h2 is substantially between 5 microns to 20 microns, but not as limit.
As Fig. 4 and shown in Figure 5, in the 10P of the surrounding zone of loam cake substrate 10, form a frame glue (sealant) 14 subsequently, around stopping dam body 12, frame glue 14 has one the 3rd height h3 to its center glue 14 substantially, and the 3rd height h3 is greater than the second height h2 that stops after dam body 12 hardens.In the present embodiment, the 3rd height h3 of frame glue 14 is substantially between 10 microns to 25 microns, but not as limit, and frame glue 14 is preferable has an enclosed type pattern, but not as limit.In addition, stop between dam body 12 and the frame glue 14 to form a cushion space 16, to hold the sealing (figure does not show) that to overflow.
As Fig. 6 and shown in Figure 7, in the active area 10P of loam cake substrate 10, inject a sealing (encapsulation glue) 18 subsequently, to form the superstructure of present embodiment.Owing to stop that dam body 12 has the enclosed type pattern, therefore by stopping the setting of dam body 12, sealing 18 can be stopped stopping of dam body 12 and is positioned at the active area 10P of loam cake substrate 10 substantially.
As shown in Figure 8, provide an element substrate 20, wherein definition has at least one active area 20A on the device substrate 20, and at least one surrounding zone 20P is surrounded with source region 20A.Device substrate 20 comprises that in addition at least one light-emitting component 22 is arranged in the active area 20A, and other necessary element switch element (figure do not show) for example.In the present embodiment, device substrate 20 can be the device substrate of an electric exciting light emitting display panel, therefore light-emitting component 22 can comprise a plurality of electroluminescence element, for example the light-emitting component of organic light-emitting diode element, polymer LED element or other various types.
As shown in Figure 9, the active area 20A that then makes device substrate 20 and surrounding zone 20P distinguish the active area 10A and the surrounding zone 10P of corresponding loam cake substrate 10 substantially, and device substrate 20 and loam cake substrate 10 carried out a process for pressing, so that the frame glue 14 on the loam cake substrate 10 contacts with the surrounding zone 20P of device substrate 20.In process for pressing, frame glue 14 can be subjected to the extruding of device substrate 20 and make frame glue 14 closely contact with device substrate 20, and the dam body 12 that stops after the sclerosis has the effect of sept (spacer), therefore frame glue 14 is after being squeezed, frame glue 14 can have identical height substantially with stopping dam body 12, also is that the height of frame glue 14 can be reduced to the second height h2 from the 3rd height h3.In addition, in process for pressing, being positioned at the sealing 18 that stops dam body 12 formed spaces can coat light-emitting component 22 parts of device substrate 20 or coat fully, reaches the effect of isolated aqueous vapor and oxygen whereby.What deserves to be explained is, owing to stop that after sclerosis dam body 12 has enough hardness, therefore in process for pressing, stop that dam body 12 unlikely generations because being subjected to the extruding of device substrate 20 subside, and can not make that sealing 18 is excessive in a large number, can make sealing 18 effectively coat light-emitting component 22 whereby.In addition, if the injection rate of sealing 18 is because of technology variation or other factors too much the time, then being positioned at the sealing 18 that stops dam body 12 formed spaces in process for pressing perhaps has excessive on a small quantity, yet owing to stop between dam body 12 and the frame glue 14, and having formed cushion space 16 jointly between loam cake substrate 10 and the device substrate 20, therefore a small amount of excessive sealing 18 can flow in this cushion space 16.Subsequently, frame glue 14 is carried out one second hardening process with sclerosis frame glue 14 (shown in arrows among the figure), make loam cake substrate 10 and device substrate 20 whereby, with the encapsulating structure of the light-emitting component that forms present embodiment by frame glue 14 fluid-tight engagement in addition.In the present embodiment, the material of frame glue 14 can use the photoinduction adhesion material, and it can utilize an irradiation technology to be hardened and bring into play tackness, or a thermoinduction adhesion material, and it can utilize a thermal process to be hardened and bring into play tackness, but not as limit.Therefore, if frame glue 14 selects the photoinduction adhesion material for use, then second hardening process can be an irradiation technology, and it can utilize the light of ultraviolet light for example or other wave-length coverage that frame glue 14 is hardened and bring into play tackness; If frame glue 14 selects the thermoinduction adhesion material for use, then second hardening process can be a thermal process, and it can be heated to frame glue 14 suitable temperature frame glue 14 being hardened and bring into play tackness, but not as limit.
In sum, the present invention utilizes stopping that dam body is limited in the sealing of light-emitting component and stop in the formed space of dam body after the sclerosis, whereby when carrying out the process for pressing of device substrate and loam cake substrate, stop that dam body can not subside because of being squeezed and makes sealing excessive.Whereby, sealing can effectively coat light-emitting component, influences emitting component and life-span to avoid aqueous vapor and oxygen.In addition, stop that dam body also has the effect of sept in process for pressing, can make between device substrate and the loam cake substrate and keep the fixed interval (FI).
The above only is preferred embodiment of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (15)
1. the encapsulating structure of a light-emitting component comprises:
One element substrate, definition has an active area on this device substrate, and a surrounding zone is around this active area;
At least one light-emitting component is arranged in this active area of this device substrate; And
One superstructure comprises:
One loam cake substrate, definition has an active area on this loam cake substrate, and one the surrounding zone around this active area, wherein this active area of this loam cake substrate is to this active area that should device substrate, and this surrounding zone of this loam cake substrate is to this surrounding zone that should device substrate;
One stops dam body, is arranged in this surrounding zone of this loam cake substrate and in the face of this device substrate, wherein this stops that dam body is substantially around this active area;
One frame glue is arranged in this surrounding zone of this loam cake substrate and in the face of this device substrate, wherein this frame glue stops dam body around this substantially, and this loam cake substrate is engaged by this frame glue with this device substrate; And
One sealing, this sealing are subjected to this to stop stopping of dam body and are positioned at this active area of this loam cake substrate substantially, and this sealant covers is to this light-emitting component of small part.
2. the encapsulating structure of light-emitting component as claimed in claim 1, wherein this stops that dam body has an enclosed type pattern.
3. the encapsulating structure of light-emitting component as claimed in claim 1, wherein this frame glue has an enclosed type pattern.
4. the encapsulating structure of light-emitting component as claimed in claim 1, other comprises a cushion space, between this stops this loam cake substrate and this device substrate between dam body and this frame glue.
5. the encapsulating structure of light-emitting component as claimed in claim 1, wherein this stops that dam body has identical height substantially with this frame glue.
6. the encapsulating structure of light-emitting component as claimed in claim 1, wherein this height that stops dam body and this frame glue is substantially between 5 microns to 20 microns.
7. the encapsulating structure of light-emitting component as claimed in claim 1, wherein this light-emitting component comprises an electroluminescence element.
8. the method for packing of a light-emitting component comprises:
One loam cake substrate is provided, and wherein definition has an active area on this loam cake substrate, and a surrounding zone is around this active area;
Form one and stop dam body in this surrounding zone of this loam cake substrate, wherein this stops that dam body has one first height, and this stops that dam body is substantially around this active area;
This is stopped carry out one first hardening process by dam body this stops dam body to harden, and this stops that dam body has one second height after sclerosis;
Form a frame glue in this surrounding zone of this loam cake substrate, wherein this frame glue stops dam body around this substantially, and this frame glue has one the 3rd height, and the 3rd height is greater than this second height; And
Inject a sealing in this active area of this loam cake substrate, wherein this sealing is subjected to this to stop stopping of dam body and is positioned at this active area of this loam cake substrate substantially;
One element substrate is provided, and wherein definition has an active area on this device substrate, and a surrounding zone is around this active area, and is provided with at least one light-emitting component in this active area of this device substrate;
Make this active area of this device substrate and this surrounding zone substantially respectively to this active area and this surrounding zone that should the loam cake substrate, and this device substrate and this loam cake substrate carried out a process for pressing, and this frame glue on this loam cake substrate is contacted with this device substrate; And
This frame glue is carried out one second hardening process with this frame glue that hardens, this loam cake substrate is engaged by this frame glue with this device substrate.
9. the method for packing of light-emitting component as claimed in claim 8, wherein behind this process for pressing, this frame glue is subjected to the extruding of this device substrate and makes this frame glue have substantially with this to stop this second height that dam body is identical.
10. the method for packing of light-emitting component as claimed in claim 8, wherein behind this process for pressing, this stops and forms a cushion space between this loam cake substrate between dam body and this frame glue and this device substrate, this sealing of overflowing in order to this active area that holds this loam cake substrate.
11. the method for packing of light-emitting component as claimed in claim 8, wherein this first hardening process comprises an irradiation technology or a thermal process.
12. the method for packing of light-emitting component as claimed in claim 8, wherein this second hardening process comprises an irradiation technology or a thermal process.
13. the method for packing of light-emitting component as claimed in claim 8, wherein these are first highly substantially between 6 microns to 20 microns.
14. the method for packing of light-emitting component as claimed in claim 8, wherein these are second highly substantially between 5 microns to 20 microns.
15. the method for packing of light-emitting component as claimed in claim 8, wherein the 3rd highly substantially between 10 microns to 25 microns.
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| CN2010101066169A CN101783362B (en) | 2010-01-22 | 2010-01-22 | Upper cover structure, packaging structure of luminous element and packaging method for luminous element |
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| CN2010101066169A CN101783362B (en) | 2010-01-22 | 2010-01-22 | Upper cover structure, packaging structure of luminous element and packaging method for luminous element |
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| CN101783362A true CN101783362A (en) | 2010-07-21 |
| CN101783362B CN101783362B (en) | 2012-01-18 |
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