CN101777508B - System and method for picking out defective circuit small pieces - Google Patents
System and method for picking out defective circuit small pieces Download PDFInfo
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- CN101777508B CN101777508B CN 200910000169 CN200910000169A CN101777508B CN 101777508 B CN101777508 B CN 101777508B CN 200910000169 CN200910000169 CN 200910000169 CN 200910000169 A CN200910000169 A CN 200910000169A CN 101777508 B CN101777508 B CN 101777508B
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Abstract
The invention relates to a system and a method for picking out defective circuit small pieces. The system comprises an expansion ring platform and a pick-and-place device. The expansion ring platform comprises a bearing seat and a platform surface adjacent to the bearing seat, wherein the bearing seat is used for bearing picking wafers and the platform surface is used for setting a storage box. The pick-and-place device moves between the bearing seat and the platform surface in a mode of linear movement.
Description
Technical field
The present invention relates to a kind of picking out defective circuit small pieces system and method thereof, be particularly related to a kind of utilization linearity and pick up and put (Pickand Place) mechanism, in the integration platform that crystal chip bearing seat and storage bin are set, pick up picking out defective circuit small pieces system and the method thereof of the program of putting.
Background technology
In the circuit die package processing procedure, if between wafer cutting process and circuit small pieces sort program, utilize automation optical check (Automated Optical Inspection; AOI) then the defective circuits small pieces or the contaminated circuit small pieces that cause between wafer cutting and sort program of equipment inspection use the sort program pick to go out these circuit small pieces, can effectively promote the yield of encapsulation procedure.
The AOI equipment of general prior art comprises circuit small pieces verifying bench and storage bin (Bin) placement platform.Wafer is placed on the circuit small pieces verifying bench and tests, and the defective circuits small pieces of finding after check then pick up the storage bin that is put on the storage bin placement platform by oscillating arm mechanisms with the defective circuits small pieces from the circuit small pieces verifying bench.
Yet in the AOI equipment of prior art, circuit small pieces picks up sets level independently drive system of platform and each tool of storage bin placement platform, control simultaneously two cover drive systems, complicated and the situation that action postpones occurs easily in control.And, hold these two the movably larger spaces of platform needs.In addition, use oscillating arm mechanisms to carry out picking up of circuit small pieces and put, except the larger activity space of needs, speed is its another major defect slowly.Except the shortcoming of the above, the defective circuits small pieces that check out are indicated on the wafer sort figure, now still to carry out with manual type, this way not only efficient is low, and the generation that leads to errors easily.
At present conventional AOI equipment is also without the function of automatic feed/discharge, and the picking up to put and can't make sequentially marshalling of circuit small pieces of its circuit small pieces, so still belong in the use inconvenience.
Comprehensively above-mentioned, since the AOI equipment of prior art takes up space greatly, control complexity, stabilization of equipment performance low, without the automatic feed/discharge function and pick up the road small pieces that discharge can't marshalling etc. many disappearances, and still need to upgrade with manual mode the position of defective circuits small pieces on the wafer sort figure, so the correlation technique of AOI equipment still remains to do to improve further.
Summary of the invention
The purpose of this invention is to provide picking out defective circuit small pieces system and the method thereof of in the integration platform that crystal chip bearing seat and storage bin are set, picking up the program of putting.
The picking out defective circuit small pieces system of one embodiment of the invention comprises tensioner ring platform and pick and place device.Described tensioner ring platform comprises the platform surface of load bearing seat and contiguous described load bearing seat, and described load bearing seat is in order to carry the paster wafer, and described platform surface is used for arranging storage bin.Described pick and place device is mobile between described load bearing seat and described platform surface in linearly moving mode.
The method of the picking out defective circuit small pieces of another embodiment of the present invention comprises the following step: at first from the paster wafer, obtain defect inspection figure, wherein said paster wafer is placed on the load bearing seat on the tensioner ring platform, and described tensioner ring platform comprises the platform surface of contiguous described load bearing seat.Then, according to described defect inspection figure, with linearly moving pick and place device the bad circuit small pieces on the described paster wafer is sorted out the storage bin that is arranged on described platform surface.
Description of drawings
Fig. 1 shows the schematic perspective view of the picking out defective circuit small pieces system of the present invention's one specific embodiment;
Fig. 2 shows the schematic perspective view of the load bearing seat of the present invention's one specific embodiment;
Fig. 3 shows the optical sensing apparatus of the present invention's one specific embodiment and the schematic perspective view of movement and adjusting mechanism thereof;
Fig. 4 shows the pick and place device of the present invention's one specific embodiment and the schematic perspective view of movement and adjusting mechanism thereof;
Fig. 5 shows the pick and place device of the present invention's one specific embodiment and the schematic perspective view of ejector pin mechanism;
Fig. 6 shows the schematic perspective view of the feeding-discharging mechanism of the present invention's one specific embodiment;
Fig. 7 shows system's control block diagram of the present invention's one specific embodiment; And
Fig. 8 shows the moving range schematic diagram of the pick and place device of the present invention's one specific embodiment.
Embodiment
Fig. 1 shows the schematic perspective view of the picking out defective circuit small pieces system 100 of the present invention's one specific embodiment.Picking out defective circuit small pieces system 100 comprises the second linear shifter 102, be arranged on the tensioner ring platform 104 on described the second linear shifter 102, be arranged on the first linear shifter 106 of the upper area of described tensioner ring platform 104, be connected to the optical sensing apparatus 108 on described the first linear shifter 106, be connected to the pick and place device 110 on described the first linear shifter 106, ejector pin mechanism 111, feed arrangement 113, drawing mechanism 115, oscillating arm mechanisms 117 and the control device (not shown) that is used for 100 controls of picking out defective circuit small pieces system.Tensioner ring platform 104 can move at first direction by described the second linear shifter 102.Described tensioner ring platform 104 comprises for the load bearing seat 112 of carrying paster wafer 109 and the platform surface 114 of contiguous described load bearing seat 112, and described platform surface 114 is used for placing at least one storage bin 116.Owing to being adjacent to load bearing seat 112, places by storage bin 116, shortened from paster wafer 109 to storage bin the road small pieces stroke that discharges that picks up 116, therefore can improve the speed of picking out defective circuit small pieces system 1,000 discharge road small pieces, and load bearing seat 112 is moved by the second linear shifter 102 together with storage bin 116, compared with prior art, significantly the reduce injection defect circuit small pieces is sorted out the required space of system 100, and the control that the simplification system is required also improves the stability of a system.The combination of the wafer after paster wafer 109 refers to cut, the glued membrane that is used for the wafer attaching and wafer ring etc.
The first linear shifter 106 drives optical sensing apparatus 108 and pick and place device 110 and moves up in second party, and wherein said second direction can be vertical with above-mentioned first direction.In this case embodiment, the first linear shifter 106 comprises slide unit 118,120 and linear motor 122.Optical sensing apparatus 108 and pick and place device 110 are separately positioned on the slide unit 118,120, and slide unit 118,120 is driven by linear motor 122, and linear motor 122 is supported by support 124, and are positioned at the upper area of tensioner ring platform 104.
The input and output material function of the picking out defective circuit small pieces system 100 tool automations that the present invention discloses not only can promote the speed of input and output material, also can accelerate the required aligning time of paster wafer 109.Paster wafer 109 is positioned over feed arrangement 113 in stacking mode, and oscillating arm mechanisms 117 sequentially is placed on paster wafer 109 on the load bearing seat 112 of expanding on the platform 104.Check with sort out step and finish after, the paster wafer 109 that oscillating arm mechanisms 117 will be placed on the load bearing seat 112 again takes out, and is positioned over drawing mechanism 115.
Fig. 2 shows the schematic perspective view of the load bearing seat 112 of the present invention's one specific embodiment.Referring to Fig. 1 and Fig. 2, paster wafer 109 outer rims are with 126 ring sets of wafer ring, and when the paster wafer was positioned over load bearing seat 112, it seized 204 fixings of part on both sides by the arms by at least one geometrical clamp gripping member 202 and an activity.Activity is seized part 204 on both sides by the arms with lever principle, utilizes pneumatic cylinder 206 activities of moving to seize on both sides by the arms on the part 204 in order to the holding part 208 of fixing, makes its disengaging or is adjacent to wafer ring 126.Tensioner ring platform 104 can comprise angle station (not shown), and it is used for the angular error that compensation is positioned over the paster wafer of load bearing seat 112.
Fig. 3 shows the optical sensing apparatus 108 of the present invention's one specific embodiment and the schematic perspective view of mobile and adjusting mechanism thereof.Referring to Fig. 1 and Fig. 3, optical sensing apparatus 108 places linear motor 122 sides and is clamped on slide 302, slide 302 other being provided with in order to can move a little in vertical direction the micro-adjusting mechanism 304 of the slide unit 306 of described slide 302.Slide 302 is fixed in an end of L-type structure 308, and the other end of described L-type structure 308 then is fixed in the slide unit 118 that linear motor 122 drives.Can have between slide unit 118 and the L-type structure 308 that is located thereon in order to the slide 310 of finely tuning at the above-mentioned first direction combination with micro-adjusting mechanism 312, optical sensing apparatus 108 is finely tuned on first direction.Optical sensing apparatus 108 retrievals are used for blemish inspection, compensation paster wafer 109 positions and angular error and the image of counting circuit die location are provided, and it can comprise the image retrieval transducer of Charged Coupled Device type or complementary metal oxide semiconductors (CMOS) type.
Fig. 4 shows the pick and place device 110 of the present invention's one specific embodiment and the schematic perspective view of mobile and adjusting mechanism thereof.It is other that pick and place device 110 is located at linear motor 122, and be fixed on the slide unit 120 with support 402.Optical sensing apparatus 108 uses identical linear motor 122 to drive with pick and place device 110, can save usage space and improve control stability, and can set the anticollision safe distance with software control between them.
Fig. 5 shows the pick and place device 110 of the present invention's one specific embodiment and the schematic perspective view of ejector pin mechanism 111.Referring to Fig. 1 and Fig. 5, ejector pin mechanism 111 will be positioned at the circuit small pieces on the glued membrane, in the upper mode of pushing up of thimble (not shown) its part be broken away from, and be beneficial to pick and place device 110 and take out, and it is positioned at the below of load bearing seat 112.Push on the thimble (not shown) and do to comprise with stepping motor (not shown) to activate.The electromagnetically operated valve 504 that pick and place device 110 comprises suction nozzle 502 and suction nozzle 502 is moved up and down, the upper-lower position of control suction nozzle 502 positive/negative pressures and suction nozzle 502 is put action with picking up of completing circuit small pieces.Again referring to Fig. 1 because paster wafer 109 is shorter to the stroke between the storage bin 116, and operating speed faster linear motor 122 drive pick and place device 110, the picking out defective circuit small pieces system 100 that the present invention is disclosed has the advantage of high yield.
Fig. 6 shows the schematic perspective view of the feeding-discharging mechanism of the present invention's one specific embodiment.Referring to Fig. 1 and Fig. 6, feed arrangement 113 and drawing mechanism 115 can hold the stacking paster wafer 109 of multi-disc, can do so continuous inspection and check treating capacity to improve.Oscillating arm mechanisms 117 sequentially is placed on paster wafer 109 on the load bearing seat 112, and feed arrangement 113 utilizes as the elevating mechanism 602 of drawing mechanism 115 so that a plurality of suckers 604 on the oscillating arm mechanisms 117 contact each paster wafer 109 that are stacked.The tumbler 612 that oscillating arm mechanisms 117 comprises swing arm 606, is arranged on the mobile device 610 of described swing arm 606 1 ends, is arranged on the Acetabula device 608 on the described mobile device 610 and is used for rotating and being arranged on described swing arm 606 other ends.Sucker 604 is by described mobile device 610, and is mobile between feed arrangement 113 and drawing mechanism 115.
Fig. 7 shows system's control block diagram of the present invention's one specific embodiment.Comprise in addition calculation element 702 in the picking out defective circuit small pieces system 100, it is used for control the first linear shifter 704, the second linear shifter 706, optical sensing apparatus 708, pick and place device 710, ejector pin mechanism 712, feed arrangement 714, drawing mechanism 716 and oscillating arm mechanisms 718 etc., makes its coordinate operation.The above-mentioned mechanism of calculation element 702 controls or the device of being subjected to also can possess driver separately.Calculation element 702 receives the wafer sort figure that transmits from tester table, automatically wafer sort figure is combined with defect inspection figure after producing defect inspection figure.Afterwards, provide the usefulness of the wafer sort figure of renewal for the circuit small pieces classification.
Fig. 8 shows the schematic diagram of moving range 802 of the pick and place device 110 of the present invention's one specific embodiment.In this case embodiment, the first linear shifter 106 moves pick and place device 110 in linearly moving mode, can pick up rapidly discharge road small pieces.Described pick and place device 110 is in moving range 802 interior movements, described moving range 802 contains load bearing seat 112, platform surface 114 and zone between the two interior, in one embodiment, described moving range 802 can be length be 200 millimeters and wide be 150 millimeters rectangular extent.Picking out defective circuit small pieces system 100 can comprise cycle time, referring to from the defective circuits small pieces from load bearing seat that paster wafer on 112 is chosen by pick and place device 110 described cycle time takes away the beginning, after to pick and place device 110 the aforementioned disadvantages circuit small pieces being positioned over storage bin 116, move on to the time till the next defective circuits small pieces whereabouts.Among this case embodiment, pick and place device 110 described moving range 802 interior movements required cycle time less than 0.35 second.
The invention provides a kind of method of picking out defective circuit small pieces, described method at first utilizes oscillating arm mechanisms that the paster wafer is moved on to load bearing seat from feeding device.Secondly, the paster wafer is positioned and become a full member.After the paster wafer is placed load bearing seat, utilize optical sensing apparatus to measure the position of circuit small pieces and the error of angle.Angle station rotates the paster wafer to compensate described angular error, and site error then is provided in to pick up the compensation when putting.Then, scan to obtain defect inspection figure.Afterwards, calculation element calculates the position coordinates of each circuit small pieces according to defect inspection figure, drives pick and place device according to the position coordinates of each circuit small pieces, and defective circuits small pieces pick is gone out.Because the used glued membrane of wafer paster is to have elasticity, soft film, can produce distortion after repeatedly action is got on the top, therefore causes the skew of circuit small pieces position.So need between the action of top sense circuit small pieces repeatedly, carry out the revisal of circuit small pieces position.Present embodiment can be distinguished some groups with the circuit small pieces of paster wafer, each group arranges a datum mark, after finishing and sort out, each group just measures the displacement of the datum mark of next group with optical sensing apparatus, whereby the circuit small pieces position coordinates in the described group of revisal.To put be the well-known technology of those skilled in the art because circuit small pieces picks up, and its detailed step is not described further at this.Then, calculation element upgrades wafer sort figure with defect inspection figure, and calculates yield for the usefulness of circuit small pieces classification processing procedure.At last, swinging arm device will check that paster wafer later is transplanted on drawing mechanism.
The system that the present invention discloses can be applicable to any wafer manufactured goods, yet the application of light-emitting diode is preferred.The system and method that utilizes the present invention to disclose, except can be with defective circuit small pieces is rejected on the wafer, it also can pick up circuit small pieces respectively in the different storage bins set in the system of being put into according to storage bin numbering (Bin Codes) that produces after each circuit small pieces test.
Technology contents of the present invention and technical characterstic disclose as above, yet the those skilled in the art still may be based on teaching of the present invention and announcement and made all substitutions and modifications that do not break away from spirit of the present invention.Therefore, protection scope of the present invention should be not limited to the content that embodiment discloses, and should comprise the various substitutions and modifications of the present invention that do not break away from, and is contained by appended claims.
Claims (20)
1. picking out defective circuit small pieces system, it is used for the circuit small pieces on the paster wafer picked up and is put into storage bin, it is characterized in that described picking out defective circuit small pieces system comprises:
The tensioner ring platform, it comprises the platform surface of load bearing seat and contiguous described load bearing seat, and described load bearing seat is in order to carry described paster wafer, and described platform surface is used for arranging described storage bin;
The second linear shifter that is used for mobile described tensioner ring platform, wherein said load bearing seat and described storage bin are with being moved by described the second linear shifter; And
Pick and place device, it is mobile between described load bearing seat and described platform surface in linearly moving mode.
2. picking out defective circuit small pieces according to claim 1 system is characterized in that it further comprises the first linear shifter, and it is arranged on the upper area of described tensioner ring platform, is used for providing described pick and place device Linear-moving.
3. picking out defective circuit small pieces according to claim 2 system, it is characterized in that wherein said the first linear shifter comprises two slide units and a linear motor, the described slide unit of described linear electric motor moves, and described pick and place device is connected to the one in the described slide unit.
4. picking out defective circuit small pieces according to claim 3 system is characterized in that it further comprises be used to the optical sensing apparatus that defect inspection figure is provided, and it is connected in the another one in the described slide unit.
5. picking out defective circuit small pieces according to claim 4 system is characterized in that it further comprises calculation element, is used for upgrading with described defect inspection figure the wafer sort figure of described paster wafer.
6. picking out defective circuit small pieces according to claim 4 system is characterized in that wherein said optical sensing apparatus comprises the image retrieval transducer, and described image retrieval transducer is Charged Coupled Device type or complementary metal oxide semiconductors (CMOS) type.
7. picking out defective circuit small pieces according to claim 2 system is characterized in that wherein said the first linear shifter is perpendicular to one another with the moving direction of described the second linear shifter.
8. picking out defective circuit small pieces according to claim 1 system is characterized in that it further comprises the ejector pin mechanism of being located at described load bearing seat below, and it makes described circuit small pieces partly break away from the glued membrane of its adhesion.
9. picking out defective circuit small pieces according to claim 1 system is characterized in that it further comprises:
Feed arrangement is in order to hold the paster wafer that is about to check;
Drawing mechanism checks complete paster wafer in order to hold; And
Oscillating arm mechanisms, it comprises swing arm, mobile device and Acetabula device, wherein, described Acetabula device is arranged on the described mobile device, make described Acetabula device mobile between described feed arrangement and described drawing mechanism, and described swing arm make described Acetabula device mobile between load bearing seat and feed arrangement and drawing mechanism.
10. picking out defective circuit small pieces according to claim 9 system is characterized in that wherein said feed arrangement and described drawing mechanism comprise the elevating mechanism for stacking described paster wafer.
11. picking out defective circuit small pieces according to claim 1 system, it is characterized in that wherein said load bearing seat further comprises at least one geometrical clamp gripping member and a live splint gripping member, described geometrical clamp gripping member and described live splint gripping member are used for the described paster wafer of fixing.
12. picking out defective circuit small pieces according to claim 1 system, it is characterized in that it further comprises cycle time and moving range, described moving range comprises the zone between described load bearing seat, described platform surface and described load bearing seat and the described platform surface, and wherein said pick and place device moved required described cycle time less than 0.35 second in described moving range.
13. the method for a picking out defective circuit small pieces is characterized in that it comprises the following step:
Obtain defect inspection figure from the paster wafer, wherein said paster wafer is positioned over the load bearing seat on the tensioner ring platform, and described tensioner ring platform comprises the platform surface of contiguous described load bearing seat;
With linearly moving pick and place device the bad circuit small pieces on the described paster wafer is sorted out the storage bin that is arranged at described platform surface according to described defect inspection figure; And
Utilize the second linear shifter that is used for mobile described tensioner ring platform to move simultaneously described load bearing seat and described storage bin.
14. method according to claim 13 is characterized in that it further comprises the step of upgrading the wafer sort figure in the described paster wafer with described defect inspection figure.
15. method according to claim 13 is characterized in that it further comprises the following step:
Measure the angular error of described paster wafer; And
The described angular error of revisal.
16. method according to claim 13 is characterized in that the step of wherein sorting out the bad circuit small pieces on the described paster wafer further comprises the step of calculating the coordinate position of each circuit small pieces on the described paster wafer.
17. method according to claim 13 is characterized in that it further comprises the following step:
Measure the datum mark coordinate of each circuit small pieces group on the described paster wafer; And
With described datum mark coordinate, upgrade the coordinate of each circuit small pieces in each described circuit small pieces group.
18. comprising with optical sensing apparatus, method according to claim 13, the step that it is characterized in that wherein obtaining defect inspection figure scan described paster wafer.
19. method according to claim 18 is characterized in that wherein said optical sensing apparatus comprises the image retrieval transducer, described image retrieval transducer is Charged Coupled Device type or complementary metal oxide semiconductors (CMOS) type.
20. method according to claim 13 is characterized in that it further comprises the following step:
Paster wafer stacking to be tested in the feed arrangement is sequentially moved on to described load bearing seat; And
Paster wafer after the check sequentially is stacked in drawing mechanism.
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| CN 200910000169 CN101777508B (en) | 2009-01-14 | 2009-01-14 | System and method for picking out defective circuit small pieces |
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| CN 200910000169 CN101777508B (en) | 2009-01-14 | 2009-01-14 | System and method for picking out defective circuit small pieces |
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| CN101777508A CN101777508A (en) | 2010-07-14 |
| CN101777508B true CN101777508B (en) | 2013-03-13 |
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| CN109285794B (en) * | 2017-07-21 | 2020-11-20 | 上海新昇半导体科技有限公司 | Visual inspection machine and method for wafer |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101000311A (en) * | 2006-01-11 | 2007-07-18 | 索尼株式会社 | Defects detection device and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101000311A (en) * | 2006-01-11 | 2007-07-18 | 索尼株式会社 | Defects detection device and method |
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