CN101777383A - Data burning connecting device of general double-contact selenium drum chip - Google Patents
Data burning connecting device of general double-contact selenium drum chip Download PDFInfo
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- CN101777383A CN101777383A CN201010011490A CN201010011490A CN101777383A CN 101777383 A CN101777383 A CN 101777383A CN 201010011490 A CN201010011490 A CN 201010011490A CN 201010011490 A CN201010011490 A CN 201010011490A CN 101777383 A CN101777383 A CN 101777383A
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- holder
- contact
- selenium drum
- cover plate
- connecting device
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Abstract
The invention provides a data burning connecting device of a general double-contact selenium drum chip, consisting of a fixed seat and a cover plate, wherein the fixed seat is provided with a baffle, a conductor hole, a support pad, a programmer interface, springs, a clamping groove and a connecting shaft; and the cover plate is arranged above the fixed seat, is connected with the fixed seat by the connecting shaft and is provided with a fastener, a sliding groove, a sliding block, a needle-contacting base and a compressible contact needle. The two edges of the baffle are provided with fixed plates, are connected with the fixed seat by the springs and are used for fixing the selenium drum chip; and a conductor is used for electrically connecting the contact needle and the programmer interface. Compared with the traditional data burning mode, the connecting device has the advantages of fast speed and high efficiency when being used for burning the data of the chip.
Description
Technical field
The present invention relates to a kind of data burning connecting device of general double-contact selenium drum chip, be particularly useful for the data burning of six unit double-contact selenium drum chips.
Background technology
Fig. 1 is the surface structure synoptic diagram of existing double-contact selenium drum chip, also is the surface structure synoptic diagram of general double-contact selenium drum chip of the present invention.This chip (11) comprises a substrate (12), be provided with integrated circuit modules (13) in the front of substrate (12), the reverse side of substrate (12) is provided with the contact (14) that is connected with integrated circuit modules (13), contact (14) is used for contacting with contact pilotage on the laser printer, thereby makes integrated circuit modules (13) and laser printer realize being electrically connected and communicating.Be provided with a control module (15) and a memory storage (16) in the integrated circuit modules (13), this memory storage stores the data relevant with toner cartridge in (16).
When producing selenium drum chip, need be in the memory storage of integrated circuit modules with different data burnings.Traditional data burning mode be earlier by programmable device with data burning to integrated circuit modules, again module is welded on the substrate.Because programmable device once can only integrated circuit of burning, this will influence production efficiency.
Real necessity that belongs to of coupling arrangement of a kind of fast writing selenium drum chip data is provided in sum.
Summary of the invention
Fundamental purpose of the present invention provides a kind of coupling arrangement at general double-contact selenium drum chip fast writing data.
For achieving the above object, data burning connecting device of general double-contact selenium drum chip provided by the invention comprises holder and cover plate.
Holder is provided with fixed head, lead, baffle plate, wire guide, supporting pad, programmable device interface, spring, draw-in groove and coupling shaft.Baffle plate (104) is arranged on the upper surface centre position of holder (100), supporting pad (106) is arranged on the lower surface of holder (100), programmable device interface (107) is arranged on the position, rear surface of holder (100), draw-in groove (109) is arranged on the upper surface front of holder (100) along the position, spring (108) is arranged on the back of draw-in groove (109), link to each other with holder (100), coupling shaft (110) is arranged on the upper surface back edge position of holder (100), wire guide (105) is arranged on the front of coupling shaft (110), fixed head (102) is placed on the both sides of baffle plate (104), is connecting holder (100) by spring (108).Supporting pad plays support, balance and buffering effect.Spring is used for being connected with fixed head, mainly plays fixedly selenium drum chip.Baffle surface is smooth, is used to carry selenium drum chip, and cooperates spring and fixed head selenium drum chip to be carried out effectively fixing.The programmable device interface is used for this coupling arrangement and programmable device connects.
Cover plate is arranged on the top of holder, links to each other with holder by the coupling shaft on the holder.The centre position of cover plate is provided with chute, and the chute both sides are zigzag, is used to block the slide block that is arranged on chute (112) the inside, and the both sides of slide block are zigzag also, also are provided with the contact pilotage base above slide block, two compressible formula contact pilotages of each contact pilotage base carrying.Slide block can move up and down on chute, is used to adjust stylus position, so that can fully contact with the selenium drum chip contact.Below the edge of cover plate, be provided with buckle, draw-in groove is positioned at the top, edge of holder, put into selenium drum chip in coupling arrangement after, available buckle and draw-in groove firmly are buckled in whole cover plate on the holder, guarantee that the contact pilotage on the cover plate fully contacts with the selenium drum chip contact.Lead is used the compressible formula contact pilotage (115) that connects in programmable device interface (107) and the cover plate (101) by wire guide.
Description of drawings
Fig. 1 is the front appearance structural representation of general double-contact selenium drum chip chip.
Fig. 2 is the reverse side surface structure synoptic diagram of general double-contact selenium drum chip chip.
Fig. 3 is the surface structure synoptic diagram of justifying six unit general double-contact selenium drum chips.
Fig. 4 is the front appearance synoptic diagram of data burning connecting device of general double-contact selenium drum chip.
Fig. 5 is the front appearance partial enlarged drawing of data burning connecting device of general double-contact selenium drum chip.
Fig. 6 is the back appearance synoptic diagram of the coupling arrangement of general double-contact selenium drum chip data burning.
Among the figure, 11, selenium drum chip; 12, substrate; 13, integrated circuit modules; 14, contact; 15, control module; 16, memory storage; 100, holder; 101, cover plate; 102, fixed head; 103, lead; 104, baffle plate; 105, wire guide; 106, supporting pad; 107, programmable device interface; 108, spring; 109, draw-in groove (109); 110, coupling shaft; 111, buckle; 112, chute; 113, slide block; 114, contact pilotage base; 115, compressible formula contact pilotage;
Embodiment
Using coupling arrangement of the present invention, to carry out the step of data burning as follows:
Step S100 opens main frame.
Step S101 is connected the programmable device interface on the coupling arrangement with programmable device, programmable device is connected with host computer.
Step S102 is placed on justifying six unit general double-contact selenium drum chips in the coupling arrangement.Process is as follows: at first, this coupling arrangement is placed on the horizontal table top, with left hand fixed head (102) is pushed open from inside to outside, spring this moment (109) is in compressive state.Secondly, justifying six unit general double-contact selenium drum chips are lain in a horizontal plane on two groups of baffle plates (104) of holder (100) with the right hand again, make the center line of justifying chip aim at the center line of two groups of baffle plates (104) as far as possible, can guarantee that so the suffered elastic force of two groups of fixed heads (102) is even.And then unclamp left hand, allow fixed head step up the both sides of justifying six unit general double-contact selenium drum chips.Then adjust slide block (113) position again, can guarantee fully contacting of contact pilotage (115) and selenium drum chip contact behind the feasible cover plate (101) that closes.At last, the draw-in groove (109) of (100) of the buckle (111) of cover plate (101) and holder is firmly buckled extremely.At selenium drum chip contact position difference, can pass through slide block (113) and upward move at chute (112), realize contacting of contact pilotage (115) and contact.
Step S103 starts burn recording software.
Step S104 is provided with the burn recording software parameter, is written into data file, and data file is downloaded in the memory storage.
Step S105 after burning is finished, places next edition selenium drum chip.
The above only is a preferred implementation of the present invention; should be understood that; without departing from the inventive concept of the premise; can also make some distortion and improvement; such as among the present invention for easy to operate, adopting justifying six unit selenium drum chips is a burning unit, can also adopt Unit two; Unit four even multiple-unit more, these all belong to protection scope of the present invention.
Claims (4)
1. data burning connecting device of general double-contact selenium drum chip comprises holder (100) and cover plate (101), and cover plate (101) is arranged on the top of holder (100), links to each other by the coupling shaft (110) on the holder (100).
2. data burning connecting device of general double-contact selenium drum chip according to claim 1, it is characterized in that: described holder (100) comprises fixed head (102), lead (103), baffle plate (104), wire guide (105), supporting pad (106), programmable device interface (107), spring (108), draw-in groove (109) and coupling shaft (110), baffle plate (104) is arranged on the upper surface centre position of holder (100), supporting pad (106) is arranged on the lower surface of holder (100), programmable device interface (107) is arranged on the position, rear surface of holder (100), draw-in groove (109) is arranged on the upper surface front of holder (100) along the position, spring (108) is arranged on the back of draw-in groove (109), link to each other with holder (100), coupling shaft (110) is arranged on the upper surface back edge position of holder (100), wire guide (105) is arranged on the front of coupling shaft (110), fixed head (102) is placed on the both sides of baffle plate (104), is connecting holder (100) by spring (108).
3. data burning connecting device of general double-contact selenium drum chip according to claim 1, it is characterized in that: described cover plate (101) comprises the buckle (111) of the below, edge that is positioned at cover plate (101), a chute (112) that is positioned at the centre position of cover plate (101), chute (112) both sides are zigzag, block the slide block (113) that is arranged on chute (112) the inside, the both sides of slide block (113) also are zigzag, also be provided with contact pilotage base (114) in slide block (113) top, each contact pilotage base (114) carrying two compressible formula contact pilotage (115).
4. data burning connecting device of general double-contact selenium drum chip according to claim 1 is characterized in that: the lead (103) in the holder (100) is by the compressible formula contact pilotage (115) in wire guide (105) connection programmable device interface (107) and the cover plate (101).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010011490A CN101777383A (en) | 2010-01-19 | 2010-01-19 | Data burning connecting device of general double-contact selenium drum chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010011490A CN101777383A (en) | 2010-01-19 | 2010-01-19 | Data burning connecting device of general double-contact selenium drum chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101777383A true CN101777383A (en) | 2010-07-14 |
Family
ID=42513800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010011490A Pending CN101777383A (en) | 2010-01-19 | 2010-01-19 | Data burning connecting device of general double-contact selenium drum chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101777383A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105895542A (en) * | 2016-04-20 | 2016-08-24 | 上海斐讯数据通信技术有限公司 | Fixing device and fixing method for chip, PCB and electronic equipment |
| CN109147848A (en) * | 2017-06-13 | 2019-01-04 | 神讯电脑(昆山)有限公司 | Burning chip device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2524403Y (en) * | 2001-09-12 | 2002-12-04 | 顺德市顺达电脑厂有限公司 | IC chip burn-in receptacle |
| CN1874071A (en) * | 2005-05-31 | 2006-12-06 | 弗尼克斯-康泰克有限及两合公司 | Connection terminal for printed circuit boards |
| US20070183209A1 (en) * | 2000-01-06 | 2007-08-09 | Super Talent Electronics Inc. | Thin Hard Drive with 2-Piece-Casing and Ground Pin Standoff to Reduce ESD Damage to Stacked PCBA's |
-
2010
- 2010-01-19 CN CN201010011490A patent/CN101777383A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070183209A1 (en) * | 2000-01-06 | 2007-08-09 | Super Talent Electronics Inc. | Thin Hard Drive with 2-Piece-Casing and Ground Pin Standoff to Reduce ESD Damage to Stacked PCBA's |
| CN2524403Y (en) * | 2001-09-12 | 2002-12-04 | 顺德市顺达电脑厂有限公司 | IC chip burn-in receptacle |
| CN1874071A (en) * | 2005-05-31 | 2006-12-06 | 弗尼克斯-康泰克有限及两合公司 | Connection terminal for printed circuit boards |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105895542A (en) * | 2016-04-20 | 2016-08-24 | 上海斐讯数据通信技术有限公司 | Fixing device and fixing method for chip, PCB and electronic equipment |
| CN109147848A (en) * | 2017-06-13 | 2019-01-04 | 神讯电脑(昆山)有限公司 | Burning chip device |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100714 |