CN2524403Y

CN2524403Y - IC chip burn-in receptacle

Info

Publication number: CN2524403Y
Application number: CN 01255650
Authority: CN
Inventors: 邱德顺
Original assignee: Mitac Computer Shunde Ltd
Current assignee: Mitac Computer Shunde Ltd
Priority date: 2001-09-12
Filing date: 2001-09-12
Publication date: 2002-12-04
Anticipated expiration: 2011-09-12

Abstract

The utility model provides an IC chip burn-in receptacle comprising a lower base. A spring plate and an integrated chip bearing plate are arranged in the lower base, wherein the integrated chip bearing plate is provided with an elastic material part. An upper base combined with the lower base in an embedding manner is arranged on the lower base, so that when an integrated chip is assembled in the receptacle, the elastic material part is pressed to allow a user presses the upper base on the lower base when taking out of the integrated chip, help the elastic material part to recover rapidly under action of the push and generate an upward elastic force on the integrated chip. Under action of the elastic force, the integrated chip can be bounced out of the receptacle quickly, thus effectively improving burin-in efficiency of the integrated chip.

Description

Integrated chip burning socket

Technical field:

This creation is a kind of integrated chip socket, particularly a kind of integrated chip burning socket that uses on cd-rom recorder.

Background technology:

At electronic product, particularly in the computer product production process, often need be some important or information specific be burnt on some integrated chips, basic input output system (BIOS) chip etc. for example is to provide the essential information of computer normal operation.In each existing integrated chip cd-rom recorder, generally all can install several integrated chip burning sockets, during burning, a collection of integrated chip is put in the above-mentioned integrated chip burning socket, when burning is finished, the thrust that relies on the mechanical structure of integrated chip burning socket own to provide, integrated chip after the burning is hit by a bullet out from integrated chip burning socket, but because the burning integrated chip is very frequent on production line, the intrinsic elastic body of integrated chip burning socket itself can wear and tear in a short period of time, thereby cause integrated chip from integrated chip burning socket, effectively not break away from, the integrated chip burning socket that then must replacing have worn and torn this moment, and generally speaking, integrated chip burning socket price is expensive, caused the raising of production cost, if and do not change the integrated chip burning socket that has worn and torn, then the operator must pluck out integrated chip to come with finger from integrated chip burning socket, not only influence production efficiency, and cause the operator to overwork, even the generation of hand phenomenon appears galling.

Summary of the invention:

The purpose of this creation provides a kind of integrated chip burning socket that integrated chip is applied ejection power from elastic body and elasticity material two aspects.

For achieving the above object, this is created integrated burning chip socket and is made up of following structure: a lower bottom base, and this lower bottom base is provided with the sheet of upspringing, and this sheet of upspringing is provided with an integrated chip loading plate, and this integrated chip loading plate is provided with an elastic material part; And this lower bottom base be provided with collude the embedding mode with it in conjunction with on base, when making integrated chip be installed in this socket, elastic material part can be stressed, and make the user when taking out integrated chip, only need upper bed-plate is pressed to lower bottom base, elastic material part is recovered rapidly under the effect of this thrust, integrated chip is produced an elastic force that makes progress, integrated chip is ejected from socket under the effect of this elastic force quickly and effectively, and then improved integrated chip burning efficient effectively.

From the above, this creation integrated chip burning socket utilizes the mechanical structure of former socket, set up elastomeric layer, realized the sustainable utilization of integrated chip burning socket, prolong the useful life of integrated chip burning socket greatly, reduced production cost, and picked and placeed integrated chip easily, fast, make production process light, reduced operator's labour intensity.

Description of drawings:

Below in conjunction with most preferred embodiment and accompanying drawing this creation integrated chip burning socket is described in further detail:

Fig. 1 is the exploded view of this creation integrated chip burning socket;

Fig. 2 is that this creation integrated chip burning socket is equipped with the integrated chip elastomeric layer and is subjected to the integrated chip stereogram in when extrusion;

Fig. 3 is that this creation integrated chip burning socket elastomeric layer is subjected to the integrated chip profile in when extrusion;

Fig. 4 is the stereogram of this creation integrated chip burning socket when integrated chip is upspring;

Fig. 5 is the profile of this creation integrated chip burning socket when integrated chip is upspring.

Embodiment:

Please refer to illustrated in figures 1 and 2ly, this creation integrated chip burning socket comprises a upper bed-plate 20, and one colludes the lower bottom base 10 that is embedded under the upper bed-plate 20.The bottom of this lower bottom base 10 is provided with a pedestal 100 (as shown in Figure 3), and the middle part of this pedestal 100 is provided with an inverted "L" shaped groove 1001 (please refer to Fig. 3).Hold the projection 1000 that is respectively equipped with on the angle to upper process for four of this pedestal 100 again, this projection 1000 is provided with the groove 102 to inner opening, and the lower bottom part of these grooves 102 is lower slightly than pedestal 100.And these both sides, projection 1000 outside are respectively equipped with groove 106.The periphery of this pedestal 100 is respectively equipped with the four array of pins shell fragments 101 that run through pedestal 100 top and the bottom, by these structures, forms an accommodation space 30 at the middle part of lower bottom base 10.

These pedestal 100 middle parts are equiped with the relative sheet 103 of upspringing, and these sheet 103 1 ends of upspringing are provided with a joint end 1031, and the other end then is provided with to accommodation space 30 extensions and becomes forked shell fragment 1032.This joint end 1031 is embedded in respectively in end angle, wherein two diagonal angles groove 102 of lower bottom base 10.

Pressed the integrated chip loading plate 104 that is placed in the accommodation space 30 on this sheet 103 of upspringing, this integrated chip loading plate is respectively equipped with the joint end 1042 that stretches out on 104 liang of diagonal angles, and lower end, two diagonal angles is respectively equipped with " L " shape trip 1041 in addition.These joint ends 1042 embed lower bottom base 10 respectively and do not set in addition end angle, two diagonal angles groove 102 of joint end 1031 of the sheet 103 of upspringing, this L " shape trip 1041 embeds respectively in the inverted "L" shaped groove 1001 at pedestal 100 middle parts.This loading plate 104 and lower bottom base 10 are fastened togather by above-mentioned syndeton.

Moreover, be pasted with an elastic material part 105 on this integrated chip loading plate 104, this elastic material part 105 comprises following three-decker: a substrate layer 1051, the lower surface of this substrate layer 1051 has the characteristic of Pasting, makes the upper surface of elastic material part 105 Pastings at integrated chip loading plate 104; One elastomeric layer 1052, this elastomeric layer 1052 place above-mentioned substrate layer 1051 upper surfaces, and this creation mainly is the ability that well is stressed and the restorability that utilizes this elastomeric layer 1052, for burning/recording chip 1 provides At time of eject required elastic force; One screen layer 1053, this screen layer 1053 places on the above-mentioned elastomeric layer 1052, be used to adsorb foreign material, with fricative metal fillings between the pin shell fragment 101 that prevents integrated chip 1 and integrated chip burning socket, or the extraneous metal fillings that falls into enters the circuit board below the integrated chip burning socket, causes circuit board to open circuit and the generation of cd-rom recorder fault.

This upper bed-plate 20 is interconnected by four blocks of side plates 203 and forms, thereby forms an accommodation space 40 at the middle part of upper bed-plate 20, and this accommodation space 40 connects with the accommodation space 30 of lower bottom base 10, joins together, in order to installing integrated chip 1; The inboard of these side plates 203 is respectively equipped with plurality of grooves 2031, in order to the pin shell fragment 101 of installing lower bottom base 10.The bottom, end angle, two diagonal angles of this upper bed-plate 20 is respectively equipped with bar shaped depression bar 201, and this depression bar 201 is corresponding with two diagonal grooves 102 that are equiped with the sheet 103 of upspringing of lower bottom base 10, and this depression bar 201 can insert and detach in the groove 102 of lower bottom base 10; Every block of side plate 203 both sides of this upper bed-plate 20 are respectively equipped with " L " shape trip 202 that bends inwards again, and this trip 202 can embed in the groove 106 on lower bottom base 10 peripheral surface approach end limits, and can slide up and down in groove 106.By above-mentioned syndeton, upper bed-plate 20 and lower bottom base 10 both can tighten mutually, can move up and down mutually again, inserted and detach groove 102 thereby drive depression bar 202.

Please refer to Fig. 2 and shown in Figure 3, when integrated chip 1 is put into this integrated chip burning socket, integrated chip loading plate 104 can press the forked shell fragment 1032 of the sheet 103 of upspringing, upper bed-plate 20 can upwards detach, and keep certain distance with lower bottom base 10, this moment, trip 202 can tighten the upper limb of groove 106 simultaneously, and depression bar 201 also not have the upspring joint end 1031 of sheet 103 of conflict; When making integrated chip 1 down push the elastic material part 105 of integrated chip burning socket, the elastomeric layer 1052 of this elastic material part 105 is subjected to force compresses.

When integrated chip 1 burning finishes, need be when integrated chip burning socket takes off, the operator can be pressed to lower bottom base 10 to upper bed-plate 20, make the depression bar 201 of this upper bed-plate 20 down push the joint end 1031 of the sheet 103 of upspringing, the joint end 1031 of this sheet 103 of upspringing pressurized toward the tenesmus in, forked up perk of shell fragment 1032, hold up integrated chip loading plate 104 thereupon, in the integrated chip loading plate 104 quilt processes that hold up, 104 pairs of elastic material parts 105 of this integrated chip loading plate have applied a thrust that makes progress, under the effect of this thrust, elasticity material layer 1052 reverts to original state from compressive state rapidly, and, integrated chip 1 is ejected (please refer to Fig. 4 and shown in Figure 5) from socket 2 to integrated chip 1 generation one elastic force that makes progress.

In sum, this creation integrated chip burning socket can fast and effeciently eject integrated chip 1 from integrated chip burning socket, alleviated operator's labour intensity, has improved production efficiency, and prolonged the useful life of integrated chip burning socket, reduced production cost.

Claims

1, a kind of integrated chip burning socket, it comprises a upper bed-plate, it is characterized in that it also comprises: a lower bottom base, this lower bottom base collude and are embedded under the above-mentioned upper bed-plate; And the bottom of this lower bottom base is provided with a pedestal, and the periphery of this pedestal is respectively equipped with the pin shell fragment, by said structure, forms an accommodation space at the middle part of lower bottom base; This pedestal is provided with at least one sheet of upspringing again, and this sheet of upspringing is provided with an integrated chip loading plate that is placed in the accommodation space, is pasted with an elastic material part on this integrated chip loading plate.

2, integrated chip burning socket as claimed in claim 1 is characterized in that, described elastic material part comprises following three layers:

One substrate layer, it is in order on the integrated chip loading plate that elastic material part is fixed on lower bottom base;

One elasticity material layer, this elasticity material layer are extruded in the process of recovering the back integrated chip are produced elastic force upwards;

One screen layer, it is in order to the absorption foreign material, the metal fillings that the fricative metal fillings or the external world fall between the pin shell fragment of prevention integrated chip and integrated chip burning socket enters the circuit board below the integrated chip burning socket, causes the short circuit of circuit board or burns barrier.