CN101770960B - Perfusion device of protection glue - Google Patents
Perfusion device of protection glue Download PDFInfo
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- CN101770960B CN101770960B CN200910247044A CN200910247044A CN101770960B CN 101770960 B CN101770960 B CN 101770960B CN 200910247044 A CN200910247044 A CN 200910247044A CN 200910247044 A CN200910247044 A CN 200910247044A CN 101770960 B CN101770960 B CN 101770960B
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- protection glue
- closed container
- negative pressure
- glue
- protection
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Abstract
The invention discloses a perfusion device of protection glue, which comprises a perfusion die and a cylindrical container with one end thereof to be opened. The cylindrical container comprises a protection glue injection inlet, a negative pressure means for generating negative pressure within the cylindrical container, a pressurization means for applying pressure on the protection glue so as to output the protection glue, and an output pipeline for outputting the protection glue to the perfusion die. As the cylindrical closed container is adopted to vacuumize the protection glue, air bubbles in the protection glue are extruded by the protection glue to be discharged due to negative pressure, the cured protection glue forms a compact structure, a protection glue layer has good insulation effect, and therefore the surface breakdown voltage of the chip is enhanced. The invention discloses a device adopting the method to pour the protection glue at the same time.
Description
Technical field
The relevant a kind of chip insulation resist technology of the present invention particularly relates to a kind of protection glue device for casting that is used for chip insulation.
Background technology
Along with the power device improvement of Manufacturing Technology, electric power thyristor and rectifying tube develop towards the high-tension direction of big electric current.In order to improve the operating voltage of device, just must improve the interior puncture voltage of body and the surface breakdown voltage of chip simultaneously.Surface breakdown voltage for chip; In the technical field of present stage; International, the domestic method that generally adopts is that the one or more angles of mill are carried out insulation protection in the zone of being ground then on chip silicon edge table top; With the electric field strength at reduction chip silicon edge, thus the surface breakdown voltage of raising chip.
As shown in Figure 1; Traditional insulation protection mode adopts machine or portable mold on chip 3 edge table tops, to irritate layer of protecting glue 4 and accomplishes; But this glue-pouring method reckons without colloid itself in process of production or be exposed to and cause in the air that colloid is inner to form residual bubble; After the colloid solidifying and setting, form loose and porous structure, thereby therefore the problem of the long-time stability of influence protection glue is necessary this is further studied.
Summary of the invention
In view of this, the purpose of this invention is to provide a kind of device that pours into protection glue, adopt the insulating cement compact structure of this device perfusion, insulation effect is better.
For this reason, the technical scheme of the present invention's employing is:
A kind of device that pours into protection glue; Comprise the encapsulating mould; It also comprises the tubular closed container that an end is uncovered, this tubular closed container comprises protection glue inlet, make this tubular closed container produce negative pressure negative pressure device, be used for exerting pressure with the pressue device of output protection glue and being used for output pipe to said encapsulating mould output protection glue to protection glue.
Preferably, said pressue device is a pneumatic shuttle, is used for feeding pressed gas to said tubular closed container, and said output pipe one end is positioned at the bottom of said tubular closed container.
Preferably, said negative pressure device is a vacuum pump, and this vacuum pump is connected in said tubular closed container through negative pressure line.
Further, said tubular closed container is equipped with end cap at its opening end, and said negative pressure line, pressue device and output pipe all are arranged on this end cap, and said output pipe extends to the bottom of tubular closed container.
Compared with prior art; Protection glue device for casting of the present invention is owing to adopt the tubular closed container that protection glue is vacuumized; Because of suction function, the protected glue extruding of the bubble of protection in the glue and discharging can make the protection glue after the curing form fine and close structure; Make the protection glue-line have better insulation effect, thereby improve the surface breakdown voltage of chip.Preferable through experiment showed, the suction function time in a large number at exhaust effect more than six hours, and with good especially more than eight hours.And the encapsulating mould is preheated, can make the sulfuration typing rapidly of protection glue perfusion back surface, the convenient taking-up and get into next flow process, and the encapsulating mould also can carry out next duty cycle, thus improve production and processing efficient greatly.Adopt the mode of gas pressurized can make the structure of device for casting more simple, then can avoid protecting the glue top layer to dissolve in oxygen-containing gas and influence insulation effect with nitrogen pressure.
Description of drawings
Fig. 1 encapsulating chip structure sketch map.
Fig. 2 is the schematic flow sheet that the present invention protects the glue method for filling.
Fig. 3 is the structural representation that the present invention pours into the protection adhesive dispenser.
Among the figure
1, closed container 2, encapsulating mould
3, chip 4, protection glue
11, glue inlet 12, output pipe
13, air inlet pipe 14, negative pressure line
15, end cap
21, metal die 22, mould of plastics
22a, patrix 22b, counterdie
23, die cavity 24, gum-injecting port
25, gum outlet
Embodiment
Describe the present invention below in conjunction with accompanying drawing and specific embodiment.
Fig. 2 is a schematic flow sheet of protecting the glue method for filling of the present invention.Fig. 3 is the structural representation that the present invention pours into the protection adhesive dispenser.
As shown in Figure 2, the present invention is used for the protection glue method for filling of chip insulation, and it comprises: deaeration step 100, place chip step 200, encapsulating step 300, curing schedule 400.
In deaeration step 100, will protect glue to pour closed container shown in Figure 21 into earlier after, closed container vacuumizes and keeps vacuum a period of time, so that the bubble of protection in the glue is owing to the negative pressure of closed container is discharged.
The preferred silicon rubber of protection glue that adds is like dimethyl silicone rubber, methyl vinyl silicone rubber, methyl phenyl silicone rubber, fluorosioloxane rubber, nitrile silicone rubber, ethyl silicon rubber ethyl phenylene silicone rubber etc.Silicon rubber have excellent electric insulating can, have good thermal stability, weatherability, ozone resistance, gas permeability, very high transparency, tearing strength, good thermal diffusivity and excellent cementability, flowability and release property.In the serviceability temperature scope, silicon rubber can not only keep certain flexibility, resilience and case hardness, and mechanical performance does not have significant change yet, and can resist long heat ageing, is a kind of stable electrical insulating material.
The negative pressure of closed container 1 can realize through negative pressure device is set on closed container, as can on closed container 1, connecting vacuum pump, in closed container 1, produces vacuum through discharging the air in the closed container; Also can adopt the mechanical type method for extracting vacuum, as connecting piston apparatus or the like.In this step, vacuumize and keep time of vacuum to be preferably more than six hours and (contain given figure), be preferably more than eight hours.
In encapsulating step 300, the protection glue in the closed container 1 is passed through enhancing perfusion in said encapsulating mould 2.The preferred mode of gas pressurized that adopts will protect glue to be poured into said encapsulating mould, and the gas-pressurized of selecting for use is preferably nitrogen.Its operating procedure is the negative pressure device of closing closed container 1 earlier; Injection pressure nitrogen in closed container 1 then; To protect glue to be injected into encapsulating mould 2 through nitrogen gas pressure from output pipe 12; Protection glue is filled in the chip table surrounding space, and in encapsulating mould 2, solidifies, and also can after protection glue primary solidification, take out.
In curing schedule 400, after the adhesive curing to be protected, take out chip.Also can when protection glue primary solidification, behind the taking-up chip, then chip be put into baking box protection glue is further solidified.For silicon rubber, it is 150 °～250 ° that baking box can be set curing temperature, and cure time is 7～9 hours.
The device that is the present invention to chip perfusion protection glue shown in Figure 3; It comprises encapsulating mould 2 and closed container 1, this closed container 1 comprises protection glue inlet, make this closed container 1 produce negative pressure negative pressure device, be used for exerting pressure with the pressue device of output protection glue and being used for output pipe 12 to said encapsulating mould output protection glue to protection glue.
Said encapsulating mould 2 comprises metal die 21 and mould of plastics 22 2 parts.Metal die 21 is provided with caulking groove, is used for the said mould of plastics 22 of setting-in; Said mould of plastics 22 has involutory patrix 22a and counterdie 22b; This patrix 22a has the die cavity 23 consistent with said chip outline shape with counterdie 22b periphery; Can after the chip of packing into is involutory, can form and hold the space of protecting glue, gum-injecting port 24 and gum outlet 25 are set in the position of above-mentioned metal die 21 corresponding said die cavitys 23 at the chip periphery.
Said pressue device is a pneumatic shuttle, and it feeds pressed gas such as nitrogen through air inlet pipe 13 to said closed container 1, and said output pipe 12 1 ends are positioned at the bottom of said closed container 1.After closed container 1 fed pressed gas, protection glue injected the gum-injecting port 24 of encapsulating mould 2 from this output pipe 12.
Said negative pressure device can be vacuum pump (figure slightly), and this vacuum pump is connected in said closed container 1 through negative pressure line 14.Negative pressure device also can be other mechanical type negative pressure device, like piston-cylinder apparatus, through moving to a direction, because of suction produces negative pressure, or moves the generation malleation to another direction, and same device both can be used for exhaust, can be used for the injecting glue that pressurizes again.
Said closed container 1 is the uncovered cylindrical container of an end; At its opening end end cap 15 is housed; Said negative pressure line 14, pressue device (like pneumatic shuttle air inlet pipe 13) and output pipe 12 all are arranged on this end cap 15; And said output pipe 12 extends to the bottom of closed container 1, so that when pressurization, protection glue can be exported from output pipe.
It may occur to persons skilled in the art that, on above-mentioned negative pressure line 14, air inlet pipe 13 and the output pipe 12 corresponding valve all should be set, so that switch, accomplish corresponding operating, it belongs to this area routine techniques, and this paper repeats no more.
The above only is a preferred implementation of the present invention; Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; Can also make some improvement and retouching; Also can above-mentioned technology contents be combined to form other technical scheme, these improvement and retouching, and the other technologies scheme that forms also should be regarded as protection scope of the present invention.
Claims (2)
1. one kind is poured into the device of protecting glue; Comprise the encapsulating mould; It is characterized in that: also comprise the tubular closed container that an end is uncovered; This tubular closed container comprises protection glue inlet, make this tubular closed container produce negative pressure negative pressure device, be used for exerting pressure with the pressue device of output protection glue and being used for output pipe to said encapsulating mould output protection glue to protection glue; Said negative pressure device is a vacuum pump, and this vacuum pump is connected in said tubular closed container through negative pressure line, and said tubular closed container is equipped with end cap at its opening end; Said negative pressure line, pressue device and output pipe all are arranged on this end cap, and said output pipe extends to the bottom of tubular closed container.
2. the device of perfusion protection glue according to claim 1, it is characterized in that: said pressue device is a pneumatic shuttle, is used for feeding pressed gas to said tubular closed container, said output pipe one end is positioned at the bottom of said tubular closed container.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910247044A CN101770960B (en) | 2009-12-25 | 2009-12-25 | Perfusion device of protection glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910247044A CN101770960B (en) | 2009-12-25 | 2009-12-25 | Perfusion device of protection glue |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101770960A CN101770960A (en) | 2010-07-07 |
| CN101770960B true CN101770960B (en) | 2012-09-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910247044A Active CN101770960B (en) | 2009-12-25 | 2009-12-25 | Perfusion device of protection glue |
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| CN (1) | CN101770960B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102306989A (en) * | 2011-09-08 | 2012-01-04 | 中国航空工业第六一八研究所 | Bonding and potting method for aerial integrated motor |
| CN104157582B (en) * | 2014-07-18 | 2017-02-15 | 宁波芯科电力半导体有限公司 | Mold and method for preparing insulating protective layer for table surface of thyristor chip with mold |
| CN104907224B (en) * | 2015-06-03 | 2017-04-12 | 宜昌劲森光电科技股份有限公司 | Glue pouring method for quantum dot colloid |
| CN105126393B (en) * | 2015-08-18 | 2017-07-14 | 安徽日正新源电气技术有限公司 | Vacuum defoaming device |
| CN106409695B (en) * | 2016-09-30 | 2018-12-11 | 西安微电子技术研究所 | A kind of non-hermetically sealed encapsulating method of complex three-dimensional construction package |
| CN108962833A (en) * | 2017-05-25 | 2018-12-07 | 株洲中车时代电气股份有限公司 | Power module insulating glue-pouring method, power module and application by this method production |
| CN109633315B (en) * | 2018-12-18 | 2020-11-17 | 米艾西(福建)测控技术有限公司 | Insulation glue filling method for realizing no air bubble |
| CN110211804A (en) * | 2019-05-14 | 2019-09-06 | 安徽博微智能电气有限公司 | Coil glue-pouring device and method |
| CN112712952B (en) * | 2020-12-18 | 2022-07-08 | 厦门赛尔特电子有限公司 | Packaging and forming method of piezoresistor |
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| US6656773B2 (en) * | 2001-06-15 | 2003-12-02 | International Business Machines Corporation | Transfer molding of integrated circuit packages |
| CN1928534A (en) * | 2006-09-29 | 2007-03-14 | 西安交通大学 | Method for preparing micro-flowing injection type chemical luminous chip |
| CN101060733A (en) * | 2007-04-30 | 2007-10-24 | 林万炯 | Flexible bar type waterproof LED lamp forming process |
| CN101364478A (en) * | 2008-06-16 | 2009-02-11 | 易军 | Manufacturing method for combined high-speed electro-magnet iron core |
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2009
- 2009-12-25 CN CN200910247044A patent/CN101770960B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6656773B2 (en) * | 2001-06-15 | 2003-12-02 | International Business Machines Corporation | Transfer molding of integrated circuit packages |
| CN1928534A (en) * | 2006-09-29 | 2007-03-14 | 西安交通大学 | Method for preparing micro-flowing injection type chemical luminous chip |
| CN101060733A (en) * | 2007-04-30 | 2007-10-24 | 林万炯 | Flexible bar type waterproof LED lamp forming process |
| CN101364478A (en) * | 2008-06-16 | 2009-02-11 | 易军 | Manufacturing method for combined high-speed electro-magnet iron core |
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| CN101770960A (en) | 2010-07-07 |
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Address after: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee after: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road Patentee before: ZHUZHOU CSR TIMES ELECTRIC Co.,Ltd. |
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Effective date of registration: 20200924 Address after: 412001 Room 309, floor 3, semiconductor third line office building, Tianxin hi tech park, Shifeng District, Zhuzhou City, Hunan Province Patentee after: Zhuzhou CRRC times Semiconductor Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee before: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. |
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