CN101770872B - Process for packaging dye-sensitized solar cell - Google Patents
Process for packaging dye-sensitized solar cell Download PDFInfo
- Publication number
- CN101770872B CN101770872B CN2010101219836A CN201010121983A CN101770872B CN 101770872 B CN101770872 B CN 101770872B CN 2010101219836 A CN2010101219836 A CN 2010101219836A CN 201010121983 A CN201010121983 A CN 201010121983A CN 101770872 B CN101770872 B CN 101770872B
- Authority
- CN
- China
- Prior art keywords
- room temperature
- pouring
- titanium deoxid
- deoxid film
- screen printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/20—Light-sensitive devices
- H01G9/2068—Panels or arrays of photoelectrochemical cells, e.g. photovoltaic modules based on photoelectrochemical cells
- H01G9/2077—Sealing arrangements, e.g. to prevent the leakage of the electrolyte
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/20—Light-sensitive devices
- H01G9/2027—Light-sensitive devices comprising an oxide semiconductor electrode
- H01G9/2031—Light-sensitive devices comprising an oxide semiconductor electrode comprising titanium oxide, e.g. TiO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/20—Light-sensitive devices
- H01G9/2059—Light-sensitive devices comprising an organic dye as the active light absorbing material, e.g. adsorbed on an electrode or dissolved in solution
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/542—Dye sensitized solar cells
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Hybrid Cells (AREA)
Abstract
The invention discloses a process for packaging a dye-sensitized solar cell. The process comprises the steps of: making pouring holes at positions where light anode film blocks are printed on a platinum electrode substrate; printing a silver grating on a fluorine-doped SnO2 conducting glass substrate by screen printing, manufacturing titanium dioxide film layers by the screen printing and allowing the titanium dioxide film layers to cool naturally and gradually to the room temperature to obtain a light anode; printing low glass-powder slurries in the middle of intervals between the titanium dioxide film blocks and on the outer edges first, then covering the platinum electrode substrate to perform heat treatment and sintering, then pouring dyes into the product from the pouring holes and, after the pouring is finished, finally keeping the obtained product at room temperature for 16 and 24 hours so that the dyes are completely absorbed on the titanium dioxide film blocks; pouring electrolyte into the obtained product from the pouring holes after the dyes are absorbed completely; and filling the holes with filling materials and finally packaging the holes which are filled with the filling materials by ultraviolet curing adhesives. By using the process, the service life of the cell can be prolonged efficiently.
Description
Technical field
The invention belongs to area of solar cell, relate to a kind of packaging technology of DSSC or rather.
Background technology
At present, energy shortage in the world, solar cell receives much attention as a kind of never exhausted energy, the development of As market, the application of solar cell constantly develops.Along with the development of solar cell, to the also further raising of requirement of encapsulation technology.The encapsulation technology of DSSC mainly contains ultra-violet curing glue and hot melt adhesive film now.Because ultra-violet curing glue and hot melt adhesive film itself all are chemical materials, therefore certain defective is all arranged at chemical resistance and natural aging aspect of performance, influence the useful life of solar cell.
Summary of the invention
The purpose of this invention is to provide a kind of DSSC packaging technology, adopt this packaging technology can make the significant prolongation in useful life of solar cell.
For reaching above purpose, the present invention takes following technical scheme to be achieved:
A kind of packaging technology that is used for DSSC comprises the steps:
(1) fill orifice is offered in the position of on the platinum electrode substrate, printing the photo-anode film piece;
(2) at the SnO of doped with fluorine
2Print silver-colored grid through silk screen printing on the conducting glass substrate, heat-treat then, be raised to 450 ℃～550 ℃ through 2h～3h time, and keep temperature 20min～40min, slowly reduce to room temperature naturally from room temperature;
(3) carry out the titanium deoxid film layer and make, be made into the shape identical to the titanium deoxid film layer, heat-treat then with silver-colored grid through silk screen printing; Be raised to 450 ℃～550 ℃ from room temperature through 1.5h～2.5h; And keep temperature 25min～40min, and slowly reduce to room temperature naturally, obtain the light anode;
(4) be printed in low glass powder slurry in the middle of the spacing of each titanium deoxid film piece through silk screen printing again; And outside; Cover above-mentioned platinum electrode substrate then and heat-treat, heat treatment is in sintering furnace, to be heated to 450 degrees centigrade to carry out sintering, takes out after sintering finishes;
(5) carry out dye perfusion through fill orifice then, perfusion is at room temperature placed after finishing dyestuff fully is adsorbed on the titanium deoxid film piece;
(6) carry out electrolytical perfusion through fill orifice again after dyestuff absorption finishes;
(7) the packing material filling aperture that uses Mould Machining to go out
(8) use vapour deposition layer of silicon dioxide material
(9) encapsulate depositing the silicon dioxide aperture through ultraviolet glue more at last, method is carried out photocuring then for a little ultra-violet curing glue on the point around aperture under uviol lamp.
Said titanium deoxid film piece is a rectangular block, and its mutual spacing is identical.
Said fill orifice is positioned at the diagonal angle up and down or the diagonal positions of rectangle titanium deoxid film piece.
Described low glass powder slurry mixes for ethyl cellulose or terpinol and low glass powder, and the thermal softening point temperature of low glass powder wherein is 400～500 ℃, and the thermal coefficient of expansion of thermal coefficient of expansion and transparent conducting glass plate is complementary.
Described packing material has characteristics such as very strong antiacid burn into alkali resistant burn into is anti-aging.
Described packing material is the chloro polyvinyl chloride.
Deposition process is a physical vapour deposition (PVD)
The present invention has following beneficial effect:
1, DSSC encapsulation technology of the present invention is because what use is low glass powder, so can not receive the influencing oxidation of factor such as electrolyte and shorten useful life of solar module easily as potting resin is such.
2, DSSC encapsulation technology of the present invention is owing to having used packing material filling aperture and then having encapsulated with ultra-violet curing glue; Therefore the ultra-violet curing glue around the aperture can not receive the corrosion of electrolyte, thereby has improved the life-span of battery.
3, DSSC encapsulation technology of the present invention is owing to used packing material to fill aperture and then deposition layer of silicon dioxide; Encapsulate with ultra-violet curing glue at last; Therefore the ultra-violet curing glue around the aperture can not receive the corrosion of electrolyte, thereby has improved the life-span of battery.
4, DSSC encapsulation technology of the present invention is to use the silk screen printing low glass powder, has improved the precision of DSSC encapsulation, simplifies manufacture craft.
Embodiment
A kind of method for packing that is used for dye-sensitized solar battery assembly comprises the steps:
(1) on the platinum electrode substrate, design the position that is printed with the photo-anode film piece and bore two fill orifices, two fill orifices diagonal position settings up and down are so that DSSC carries out electrolytical perfusion after encapsulation;
(2) at the FTO (SnO of doped with fluorine
2Electro-conductive glass) print silver-colored grid through silk screen printing on the conducting glass substrate, silver-colored grid are shaped as rectangle or circular shape, heat-treat then, are raised to 450 ℃ from room temperature through the 3h time, and keep temperature 40min, slowly reduce to room temperature naturally;
(3) carry out the titanium deoxid film layer and make, be made into the shape identical to the titanium deoxid film layer, heat-treat then, be raised to 550 ℃ through 2.5h, and keep temperature 25min, slowly reduce to room temperature naturally, obtain the light anode from room temperature with silver-colored grid through silk screen printing;
(4) be printed in low glass powder slurry in the middle of the spacing of each titanium deoxid film piece through silk screen printing again; And outside; Cover above-mentioned platinum electrode substrate then and heat-treat, heat treatment is in sintering furnace, to be heated to 450 degrees centigrade to carry out sintering, takes out after sintering finishes; The low glass powder slurry can adopt ethyl cellulose or terpinol and low glass powder to mix, and the thermal softening point temperature of low glass powder wherein is 400～500 ℃, and the thermal coefficient of expansion of thermal coefficient of expansion and transparent conducting glass plate is complementary;
(5) carry out dye perfusion through fill orifice then, perfusion is at room temperature placed after finishing dyestuff fully is adsorbed on the titanium deoxid film piece;
(6) carry out electrolytical perfusion through fill orifice again after dyestuff absorption finishes;
(7) the packing material filling aperture that uses Mould Machining to go out, packing material are chloro polyvinyl chloride (have very strong corrosion resistance, electrolyte and ultra-violet curing glue are isolated);
(8) use physical vapor on aperture, to deposit layer of silicon dioxide material (have good water proofing property and put gas permeability);
(9) encapsulate the aperture of filling with packing material through ultraviolet glue more at last, method is around aperture, to put a little ultra-violet curing glue, then at 100W/cm
2The uviol lamp condition under shine 1min, obtain packaged DSSC.
Claims (4)
1. the packaging technology of DSSC is characterized in that, comprises the steps:
(1), the platinum electrode substrate offers fill orifice on printing the position of titanium deoxid film piece of light anode;
(2) at the SnO of doped with fluorine
2Print silver-colored grid through silk screen printing on the conducting glass substrate, heat-treat then, be raised to 450 ℃～550 ℃ through 2h～3h time, and keep temperature 20min～40min, slowly reduce to room temperature naturally from room temperature;
(3) carry out the titanium deoxid film layer and make, be made into the shape identical to the titanium deoxid film layer, heat-treat then with silver-colored grid through silk screen printing; Be raised to 450 ℃～550 ℃ from room temperature through 1.5h～2.5h; And keep temperature 25min～40min, and slowly reduce to room temperature naturally, obtain the light anode;
(4) be printed in low glass powder slurry in the middle of the spacing of titanium deoxid film piece of each light anode through silk screen printing again; And outside; Cover above-mentioned platinum electrode substrate then and heat-treat, heat treatment is in sintering furnace, to be heated to 400-550 degree centigrade to carry out sintering, takes out after sintering finishes;
(5) pour into N3 or N719 dyestuff through fill orifice then, perfusion is at room temperature placed after finishing dyestuff fully is adsorbed on the titanium deoxid film piece;
(6) carry out electrolytical perfusion through fill orifice again after dyestuff absorption finishes;
(7) the packing material filling aperture that uses Mould Machining to go out;
(8) deposition layer of silicon dioxide on the filling aperture;
(9) encapsulate the aperture that deposits silicon dioxide through ultra-violet curing glue more at last, method is carried out photocuring then for a little ultra-violet curing glue on the point around aperture under uviol lamp.
2. the packaging technology of DSSC according to claim 1 is characterized in that, said titanium deoxid film piece is a rectangular block, and its mutual spacing is identical.
3. the packaging technology of DSSC according to claim 1; It is characterized in that; Described low glass powder slurry mixes for ethyl cellulose or terpinol and low glass powder, and the thermal softening point temperature of low glass powder wherein is 400～500 ℃, the SnO of thermal coefficient of expansion and doped with fluorine
2The thermal coefficient of expansion of conductive glass plate is complementary.
4. the packaging technology of DSSC according to claim 1 is characterized in that, described packing material is the chloro polyvinyl chloride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101219836A CN101770872B (en) | 2010-03-11 | 2010-03-11 | Process for packaging dye-sensitized solar cell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101219836A CN101770872B (en) | 2010-03-11 | 2010-03-11 | Process for packaging dye-sensitized solar cell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101770872A CN101770872A (en) | 2010-07-07 |
| CN101770872B true CN101770872B (en) | 2012-05-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101219836A Expired - Fee Related CN101770872B (en) | 2010-03-11 | 2010-03-11 | Process for packaging dye-sensitized solar cell |
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| CN (1) | CN101770872B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102568866A (en) * | 2011-12-23 | 2012-07-11 | 彩虹集团公司 | Method for packaging dye sensitized solar cell by low glass powder |
| CN111273497A (en) * | 2020-02-13 | 2020-06-12 | 电子科技大学 | Packaging method of electro-deposition electrochromic device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101515509B (en) * | 2009-03-25 | 2010-12-08 | 彩虹集团公司 | Packaging method for dye-sensitized solar battery assembly |
| CN101582335B (en) * | 2009-05-27 | 2011-01-05 | 彩虹集团公司 | Method for packaging dye-sensitized solar battery |
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2010
- 2010-03-11 CN CN2010101219836A patent/CN101770872B/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN101770872A (en) | 2010-07-07 |
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