CN101430972B - Method for dye sensitization solar battery packaging - Google Patents
Method for dye sensitization solar battery packaging Download PDFInfo
- Publication number
- CN101430972B CN101430972B CN2008102327737A CN200810232773A CN101430972B CN 101430972 B CN101430972 B CN 101430972B CN 2008102327737 A CN2008102327737 A CN 2008102327737A CN 200810232773 A CN200810232773 A CN 200810232773A CN 101430972 B CN101430972 B CN 101430972B
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- glass substrate
- lower glass
- dye
- printed
- conduction lower
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/542—Dye sensitized solar cells
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- Photovoltaic Devices (AREA)
Abstract
The invention relates to a method used for encapsulating a dye sensitized solar cell, belonging to the preparation field of solar cell. The encapsulating method comprises the steps as follows: two dye pouring holes are punched on a lower glass substrate; TiO2 slurry is printed on the lower glass substrate; meanwhile, the circumference of an optical anode film block is printed by a layer of TiO2 film partition; the optical anode film covers the two dye pouring holes; the printed TiO2 glass substrate is sintered; subsequently, dye sensitization disposal is carried out; then, the glass substrate is arranged in the dye under room temperature; a layer of ultraviolet curing adhesive is coated on the lower glass substrate outside the partition and an upper glass substrate covers on the lower glass substrate; the glass substrates are irradiated under an ultraviolet lamp, thus completing the bonding of the solar cell; liquid electrolyte is poured in the hole on the lower glass substrate; little curing glue is dropped on the small hole and photo-cured under the irradiation of the ultraviolet lamp so as to encapsulate the small hole. The encapsulation technology improves the encapsulation precision, simplifies the preparation process, and prolongs the service life of the solar battery component.
Description
Technical field
The invention belongs to solar cell and make the field, relate to a kind of method of encapsulation of DSSC.
Background technology
At present, energy shortage in the world, solar cell receives much attention as a kind of never exhausted energy, and along with the development of the market demand, the application of solar cell constantly develops.Along with the development of solar cell, to the also further raising of requirement of encapsulation technology.The employed encapsulating material of hot melt adhesive film method for packing of present stage is subjected to the influence of factors such as sunlight, electrolyte easily and wears out, and causes solar module to shorten useful life thereby make inside battery not make electrolyte take place to leak with extraneous well the isolation for a long time.
Summary of the invention:
Aging easily at solar cell package material in the prior art, inside battery is isolated from the outside bad, and electrolyte leaks easily, and the problem that causes solar battery life to shorten proposes following technical scheme:
A kind of method for packing that is used for DSSC, it comprises the steps:
1) getting through the hole on the FTO conduction lower glass substrate: on FTO conduction lower glass substrate, make a call to two fill orifices earlier before making battery component, after component package, carry out electrolytical perfusion, do not hole on the upper glass plates;
2) making of titanium deoxid film light anode and partition: according to the figure that designs, titania slurry is printed on the FTO conduction lower glass substrate, the titanium dioxide photo anode film covers two dye perfusion holes, the figure that prints be square or and rectangle, cut off at the square of printing or with ring-type titanium deoxid film that the place of the peripheral 2mm of rectangular titanium deoxid film profile prints out the wide 3mm of one deck simultaneously;
3) sintering: the FTO conduction lower glass substrate that prints titanium deoxid film light anode is put into baking oven carry out sintering, at 450 ℃ of sintering temperature 40min;
4) dye sensitization is handled: the intact back of sintering is taken out FTO and is led down FTO that electric glass substrate is printed with the titanium dioxide photo anode film after sintering and conduct electricity lower glass substrate and at room temperature be positioned in the dyestuff 24 hours, and dyestuff fully is adsorbed on the titanium dioxide photo anode film;
5) solar cell is bonding: by screen printing technique an amount of ultra-violet curing glue is printed in titanium deoxid film and cuts off on the outer ring-type FTO conduction lower glass substrate, cover upper glass plates then and carry out the uviol lamp processing again, under the uviol lamp condition of 100W/cm2, shine 1min;
6) perfusion electrolyte: behind the ultra violet lamp, carry out the perfusion of electrolyte I-/I-3 by fill orifice from the another side of FTO conduction lower glass substrate;
7) sealing of hole: putting a little ultra-violet curing glue on the fill orifice, shine 1min then under the uviol lamp of 100W/cm2, fill orifice is sealed, solar cell package finishes.
When encapsulation technology of the present invention encapsulates, ultra-violet curing glue is applied on the partition around the ring-type around the titanium deoxid film, carry out reprocessing at last and encapsulate two glass substrates are compound then, improved encapsulation precision, simplify and made technology.
Encapsulation technology of the present invention since usefulness be ultra-violet curing glue, so can not be subjected to the influencing oxidation of factor such as sunlight, electrolyte and shorten useful life of solar module as potting resin is like that easy.
Description of drawings
Fig. 1 solar cell encapsulation method schematic diagram of the present invention
Embodiment:
The present invention is described in further detail below in conjunction with drawings and Examples.
As shown in Figure 1, a kind of method for packing that is used for dye-sensitized solar battery assembly comprises the steps:
1) getting through the hole on the FTO conduction lower glass substrate 2: on FTO conduction lower glass substrate 2, make a call to two fill orifices 5 earlier before making battery component, be used for carrying out electrolytical perfusion, do not hole on the upper glass plates in component package.
2) titanium deoxid film light anode 1 and the making that cuts off 3: according to the figure that designs, titania slurry is printed on the one side of FTO conduction lower glass substrate 2, titanium dioxide photo anode 1 film covers two dye perfusion holes 5, the figure that prints be square or and rectangle, cut off 3 at the square of printing or with ring-type titanium deoxid film that the place of the peripheral 2mm of rectangular titanium deoxid film light anode 1 profile prints out the wide 3mm of one deck simultaneously;
3) sintering: the FTO conduction lower glass substrate 2 that prints titanium deoxid film light anode 1 is put into baking oven carry out sintering, at 450 ℃ of sintering temperature 40min;
4) dye sensitization is handled: the FTO conduction lower glass substrate 2 that is printed with titanium deoxid film light anode 1 behind the sintering at room temperature was positioned in the dyestuff 24 hours, dyestuff fully is adsorbed on titanium dioxide photo anode 1 film.
5) solar cell is bonding: by screen printing technique an amount of ultra-violet curing glue is printed on the titanium deoxid film partition 3 ring-type FTO conduction lower glass substrate 4 outward, covers upper glass plates then and carry out the uviol lamp processing again, at 100W/cm
2The uviol lamp condition under shine 1min.
6) perfusion electrolyte: behind the ultra violet lamp, carry out electrolyte I by fill orifice 5 from the another side of FTO conduction lower glass substrate 2
-/ I
- 3Perfusion.
7) sealing of hole: putting a little ultra-violet curing glue on the fill orifice 5, then at 100W/cm
2The following irradiation 1min of uviol lamp, fill orifice 5 is sealed, solar cell package finishes.
Claims (1)
1. method for packing that is used for DSSC, its step is:
1) getting through the hole on the FTO conduction lower glass substrate: on FTO conduction lower glass substrate, make a call to two fill orifices (5) earlier before making battery component, be used for carrying out electrolytical perfusion, do not hole on the upper glass plates in the component package process;
2) making of titanium deoxid film light anode and partition: according to the figure that designs, titania slurry is printed on the FTO conduction lower glass substrate, the titanium dioxide photo anode film covers two dye perfusion holes (5), the figure that prints be square or and rectangle, cut off at the square of printing or with ring-type titanium deoxid film that the place of the peripheral 2mm of rectangular titanium dioxide photo anode film profile prints out the wide 3mm of one deck simultaneously;
3) sintering: the FTO conduction lower glass substrate that prints titanium deoxid film light anode is put into baking oven carry out sintering, at 450 ℃ of sintering temperature 40min;
4) dye sensitization is handled: the intact back of sintering is taken out FTO conduction lower glass substrate that FTO conduction lower glass substrate is printed with titanium deoxid film light anode after sintering and at room temperature was positioned in the dyestuff 24 hours, and dyestuff fully is adsorbed on the titanium dioxide photo anode film;
5) solar cell is bonding: by screen printing technique an amount of ultra-violet curing glue is printed in titanium deoxid film and cuts off on the outer ring-type FTO conduction lower glass substrate, cover upper glass plates then and carry out the uviol lamp processing again, at 100W/cm
2The uviol lamp condition under shine 1min;
6) perfusion electrolyte: behind the ultra violet lamp, carry out electrolyte I by fill orifice (5) from the another side of FTO conduction lower glass substrate
-/ I
- 3Perfusion;
7) sealing of hole: putting a little ultra-violet curing glue on the fill orifice, then at 100W/cm
2The following irradiation 1min of uviol lamp, fill orifice (5) is sealed, solar cell package finishes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008102327737A CN101430972B (en) | 2008-12-11 | 2008-12-11 | Method for dye sensitization solar battery packaging |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008102327737A CN101430972B (en) | 2008-12-11 | 2008-12-11 | Method for dye sensitization solar battery packaging |
Publications (2)
Publication Number | Publication Date |
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CN101430972A CN101430972A (en) | 2009-05-13 |
CN101430972B true CN101430972B (en) | 2011-06-01 |
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CN2008102327737A Expired - Fee Related CN101430972B (en) | 2008-12-11 | 2008-12-11 | Method for dye sensitization solar battery packaging |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101582335B (en) * | 2009-05-27 | 2011-01-05 | 彩虹集团公司 | Method for packaging dye-sensitized solar battery |
CN101567268B (en) * | 2009-06-01 | 2011-06-01 | 彩虹集团公司 | Method for preparing ternary two-layer titanium dioxide film |
CN101950690A (en) * | 2010-09-27 | 2011-01-19 | 彩虹集团公司 | Dye sensitized solar cell and sealing method thereof |
CN102903535A (en) * | 2012-09-28 | 2013-01-30 | 彩虹集团公司 | Method for prolonging service life of large-size dye-sensitized solar cell assembly |
CN103256556B (en) * | 2013-05-16 | 2014-12-10 | 邯郸市盛德技术玻璃有限公司 | Sunlight and manual light combined utilization type photosynthetic light turning glass plane light source |
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2008
- 2008-12-11 CN CN2008102327737A patent/CN101430972B/en not_active Expired - Fee Related
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