CN101762860A - 光学装置 - Google Patents
光学装置 Download PDFInfo
- Publication number
- CN101762860A CN101762860A CN200910259498A CN200910259498A CN101762860A CN 101762860 A CN101762860 A CN 101762860A CN 200910259498 A CN200910259498 A CN 200910259498A CN 200910259498 A CN200910259498 A CN 200910259498A CN 101762860 A CN101762860 A CN 101762860A
- Authority
- CN
- China
- Prior art keywords
- lens element
- optical devices
- lens
- substrate
- mentioned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 84
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 238000003384 imaging method Methods 0.000 claims abstract description 17
- 239000011521 glass Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000007767 bonding agent Substances 0.000 claims description 5
- 230000010354 integration Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 230000003667 anti-reflective effect Effects 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 claims 1
- 238000002955 isolation Methods 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
- G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
- G02B13/003—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having two lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
- G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
- G02B13/0035—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having three lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0055—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element
- G02B13/006—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element at least one element being a compound optical element, e.g. cemented elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Lenses (AREA)
- Lens Barrels (AREA)
Abstract
Description
Claims (31)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1036360 | 2008-12-23 | ||
NL1036360A NL1036360C2 (nl) | 2008-12-23 | 2008-12-23 | Optische eenheid. |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101762860A true CN101762860A (zh) | 2010-06-30 |
CN101762860B CN101762860B (zh) | 2017-03-01 |
Family
ID=40823268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910259498.2A Active CN101762860B (zh) | 2008-12-23 | 2009-12-23 | 光学装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8077404B2 (zh) |
EP (1) | EP2202796B1 (zh) |
JP (1) | JP5707636B2 (zh) |
KR (1) | KR101694537B1 (zh) |
CN (1) | CN101762860B (zh) |
NL (1) | NL1036360C2 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102955217A (zh) * | 2011-08-24 | 2013-03-06 | 奇景光电股份有限公司 | 光学镜片模组 |
CN103210333A (zh) * | 2010-07-28 | 2013-07-17 | 安特尔耀恩国际有限公司 | 光学单元 |
CN109152518A (zh) * | 2016-05-24 | 2019-01-04 | 奥林巴斯株式会社 | 内窥镜用摄像单元和内窥镜 |
CN110596868A (zh) * | 2018-05-25 | 2019-12-20 | 安特尔耀恩国际有限公司 | 光学单元和层叠体 |
CN114041078A (zh) * | 2019-03-28 | 2022-02-11 | 华为技术有限公司 | 光学透镜系统和包括所述光学透镜系统的电子设备 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL2006373C2 (nl) * | 2011-03-11 | 2012-09-17 | Anteryon Internat B V | Optische eenheid. |
NL2011843C2 (en) | 2013-11-26 | 2015-05-27 | Anteryon Wafer Optics B V | A method for manufacturing an optical assembly. |
US10217789B2 (en) * | 2016-04-06 | 2019-02-26 | Omnivision Technologies, Inc. | Interposer and chip-scale packaging for wafer-level camera |
KR102546556B1 (ko) * | 2018-05-28 | 2023-06-22 | 엘지이노텍 주식회사 | 반도체 소자 패키지 및 이를 포함하는 광조사장치 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2155388A (en) | 1984-03-09 | 1985-09-25 | Philips Electronic Associated | Moulding an accurately centred lens surface |
CN100440544C (zh) | 2002-09-17 | 2008-12-03 | 安特约恩股份有限公司 | 照相装置、制造照相装置的方法以及晶片尺度的封装 |
JP2004344230A (ja) * | 2003-05-20 | 2004-12-09 | Olympus Corp | 内視鏡撮像装置 |
JP3521332B1 (ja) | 2003-08-06 | 2004-04-19 | マイルストーン株式会社 | 撮像レンズ |
JP2005072364A (ja) * | 2003-08-26 | 2005-03-17 | Fuji Film Microdevices Co Ltd | 固体撮像素子及びその製造方法 |
KR100665176B1 (ko) * | 2005-05-18 | 2007-01-09 | 삼성전기주식회사 | 웨이퍼 스케일 렌즈 및 이를 구비하는 광학계 |
GB0613146D0 (en) | 2006-06-30 | 2006-08-09 | Microgen Energy Ltd | A stirling engine assembly |
JP5292291B2 (ja) * | 2006-07-17 | 2013-09-18 | デジタルオプティクス・コーポレイション・イースト | カメラシステムの作製方法 |
US8000038B2 (en) * | 2007-02-19 | 2011-08-16 | Konica Minolta Opto, Inc. | Image pickup lens, image pickup apparatus and mobile terminal |
JP3946245B1 (ja) * | 2007-03-08 | 2007-07-18 | マイルストーン株式会社 | 撮像レンズ |
US7692256B2 (en) | 2007-03-23 | 2010-04-06 | Heptagon Oy | Method of producing a wafer scale package |
US7710667B2 (en) * | 2008-06-25 | 2010-05-04 | Aptina Imaging Corp. | Imaging module with symmetrical lens system and method of manufacture |
US7773317B2 (en) * | 2008-07-01 | 2010-08-10 | Aptina Imaging Corp. | Lens system with symmetrical optics |
JP5321954B2 (ja) * | 2008-08-28 | 2013-10-23 | コニカミノルタ株式会社 | 撮像レンズ、撮像装置及び携帯端末 |
-
2008
- 2008-12-23 NL NL1036360A patent/NL1036360C2/nl not_active IP Right Cessation
-
2009
- 2009-12-22 JP JP2009290027A patent/JP5707636B2/ja active Active
- 2009-12-23 KR KR1020090130148A patent/KR101694537B1/ko active IP Right Grant
- 2009-12-23 CN CN200910259498.2A patent/CN101762860B/zh active Active
- 2009-12-23 EP EP09015925.2A patent/EP2202796B1/en active Active
- 2009-12-23 US US12/646,175 patent/US8077404B2/en active Active
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103210333A (zh) * | 2010-07-28 | 2013-07-17 | 安特尔耀恩国际有限公司 | 光学单元 |
CN102955217A (zh) * | 2011-08-24 | 2013-03-06 | 奇景光电股份有限公司 | 光学镜片模组 |
CN102955217B (zh) * | 2011-08-24 | 2016-01-20 | 奇景光电股份有限公司 | 光学镜片模组 |
CN109152518A (zh) * | 2016-05-24 | 2019-01-04 | 奥林巴斯株式会社 | 内窥镜用摄像单元和内窥镜 |
CN110596868A (zh) * | 2018-05-25 | 2019-12-20 | 安特尔耀恩国际有限公司 | 光学单元和层叠体 |
CN110596868B (zh) * | 2018-05-25 | 2023-12-22 | 安特尔耀恩国际有限公司 | 光学单元和层叠体 |
CN114041078A (zh) * | 2019-03-28 | 2022-02-11 | 华为技术有限公司 | 光学透镜系统和包括所述光学透镜系统的电子设备 |
CN114041078B (zh) * | 2019-03-28 | 2023-09-22 | 华为技术有限公司 | 光学透镜系统和包括所述光学透镜系统的电子设备 |
Also Published As
Publication number | Publication date |
---|---|
JP2010152358A (ja) | 2010-07-08 |
US8077404B2 (en) | 2011-12-13 |
KR20100074078A (ko) | 2010-07-01 |
EP2202796B1 (en) | 2016-04-13 |
CN101762860B (zh) | 2017-03-01 |
NL1036360C2 (nl) | 2010-06-24 |
EP2202796A1 (en) | 2010-06-30 |
KR101694537B1 (ko) | 2017-01-09 |
JP5707636B2 (ja) | 2015-04-30 |
US20100157446A1 (en) | 2010-06-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200225 Address after: Room 118, building B, 133 Changyang street, Suzhou Industrial Park, Jiangsu Province Patentee after: Suzhou Jingfang Photoelectric Technology Co., Ltd Address before: Eindhoven Patentee before: Anteryon International B.V. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20200708 Address after: Eindhoven, the Netherlands Patentee after: ANTERYON INTERNATIONAL B.V. Address before: Room 118, building B, 133 Changyang street, Suzhou Industrial Park, Jiangsu Province Patentee before: Suzhou Jingfang Photoelectric Technology Co.,Ltd. |
|
TR01 | Transfer of patent right |