CN101752658A - 天线组件、制作该天线组件的方法及集成有该天线组件的壳体 - Google Patents

天线组件、制作该天线组件的方法及集成有该天线组件的壳体 Download PDF

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CN101752658A
CN101752658A CN200810306002A CN200810306002A CN101752658A CN 101752658 A CN101752658 A CN 101752658A CN 200810306002 A CN200810306002 A CN 200810306002A CN 200810306002 A CN200810306002 A CN 200810306002A CN 101752658 A CN101752658 A CN 101752658A
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antenna
antenna module
dielectric layer
stack
stacks
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CN101752658B (zh
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李展
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Nantong UP Machinery Engineering Co., Ltd.
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Shenzhen Futaihong Precision Industry Co Ltd
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Priority to US12/556,236 priority patent/US20100141550A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0006—Particular feeding systems
    • H01Q21/0025—Modular arrays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • B29C45/14811—Multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3456—Antennas, e.g. radomes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Details Of Aerials (AREA)
  • Support Of Aerials (AREA)

Abstract

一种天线组件，具有多层结构，该天线组件包括：一承载层、至少一介电层及至少两天线层，该介电层及所述天线层交互层叠于所述承载层上，该承载层为一树脂薄膜。本发明还提供了一种制作该天线组件的方法及集成有该天线组件的壳体。

Description

天线组件、制作该天线组件的方法及集成有该天线组件的壳体
技术领域
本发明涉及一种天线组件。
背景技术
无线通信终端的天线主要有内置天线及外置天线两种。相较于外置天线，内置天线能够有效地减小无线通信终端的尺寸，因而，目前无线通信终端通常采用内置天线的设计。请参照图1，现有的采用内置天线设计的无线通信终端包括一外壳层91，一天线层92，一内壳层93、一导电端子94、电路板(图未示)及由连接于所述电路板的一弹性导柱95。外壳层91通常为一装饰性塑料薄膜，用于承载天线层92。天线层92成型于或贴附于外壳层91上，且夹设于外壳层91与内壳层93之间。导电端子94一端与天线层92导电接触，其另一端穿过内壳层93后与弹性导柱95导电接触，如此，实现天线层92与所述电路板的电路结构的无线电信号交流。但是，天线的设计越来越需要考虑天线多功能的实现，而现有的天线组件一般为单天线层，因此就需要设计多个天线元件以实现多功能，如此，会使得天线组件占用无线通信终端的更多的空间，不利于无线通信终端小型化的设计。
发明内容
鉴于以上内容，有必要提供一种可实现多功能且节省空间的天线组件。
另，有必要提供一种制作所述天线组件的方法。
另，有必要提供一种集成有所述天线组件的壳体。
一种天线组件，该天线组件包括：一承载层、至少一介电层及至少两天线层，该至少一介电层及该至少两天线层交互层叠于该承载层上，该承载层为一树脂薄膜。
一种制作具有多层结构的天线组件的方法，其包括以下步骤：
提供一树脂薄膜；
在该树脂薄膜上交互地层叠至少两天线层和至少一介电层，该至少两天线层是使用导电油墨印刷而成。
一种壳体，其包括一注塑层及一天线组件，该天线组件包括：一承载层、至少一介电层及至少两天线层，该至少一介电层及该至少两天线层交互层叠于所述承载层上，该承载层为一树脂薄膜，该注塑层注塑结合于该天线组件上。
相较现有技术，本发明所述天线组件具有多层天线，可实现天线的多功能，节省了天线设计的空间。
附图说明
图1是现有的无线通信终端的剖面示意图。
图2是本发明较佳实施方式所述的天线组件的剖面示意图。
图3是本发明较佳实施方式所述的壳体的剖面示意图。
具体实施方式
请参阅图2，本发明较佳实施方式的天线组件20包括一承载层21、若干天线层22及若干介电层23。
承载层21可以是模内装饰工艺中的模内装饰膜，其为聚碳酸酯树脂薄膜、丙烯腈丁二烯苯乙烯共聚物树脂薄膜及聚对苯二甲酸乙二醇酯树脂薄膜中的一种。
每一天线层22为通过印刷的方式形成的导电油墨层，其具有天线的辐射图案。该等天线层22可以分别是天线组件中的主天线辐射体及辅天线辐射体。
每一介电层23为不导电的油墨层，其通过印刷的方式形成于该等天线层22之间。天线层22与介电层23交互层叠，天线层22即以介电层23相间隔。各天线层22之间可形成有一电导通部24。电导通部24可以由导电油墨形成，电连接相邻的两天线层22。
制作时，将导电油墨以一天线辐射图案印刷于承载层21上，从而形成一天线层22。
将不导电的油墨印刷在天线层22上而形成一介电层23；其中，印刷不导电的油墨形成介电层23时，可设计介电层23的印刷图案以使在介电层23形成后天线层22需要导电接触的部位暴露。
在介电层23上印刷导电油墨以形成另一天线层22，且所述导电油墨同时亦形成于先前的天线层22需要导电接触的部位上，此时，形成于所述导电接触的部位的导电油墨即为电导通部24，通过电导通部24即可实现相邻天线层22间的电导通。
如此，反复交互层叠地形成天线层22及介电层23，即可以获得天线组件20的多层天线结构。各天线层22可分别用于实现不同的功能，节省了天线设计的空间。
可以理解地，介电层23也可以是由喷涂工艺形成的不导电的树脂漆层。
可以理解地，该等天线层22也可以省略电导通部24，各天线层22之间可以不直接电导通，每一天线层22可以分别通过电缆(如铜丝)与一电路板连接，从而实现无线电信号的传导。
本发明较佳实施方式的天线组件20可直接集成于无线通讯装置的壳体上。
请参阅图3，本发明较佳实施方式的无线通讯装置的壳体100包括一注塑层30及所述的天线组件20。注塑层30可以是一树脂层，如硅胶树脂或热塑性树脂，其通过注塑成型的方式与天线组件20结合。
在通过注塑成型的方式制作壳体100时，天线组件20置于一注塑成型模具(图未示)中，其具有承载层21的一面与注塑成型模具相贴附。注塑成型时，所述注塑层30则成型于天线组件20上相对于承载层21的一面。
当天线组件20中与承载层21相对的一面的最外层为天线层22时，注塑层30与天线层22结合。
当所述天线组件20包括至少两介电层23时，天线组件20中与承载层21相对的一面的最外层可为介电层23，所述注塑层30也可以注塑结合于介电层23上。此时，注塑层30在注塑成型中不会对天线层22直接冲击，因此不易破坏天线层22的图案，同时，可防止天线层22在注塑成型中被氧化。
本发明较佳实施方式的壳体100集成了多层结构的天线组件20，有利于降低无线电装置的尺寸。

Claims (14)

1.一种天线组件，其特征在于，该天线组件包括：一承载层、至少一介电层及至少两天线层，该至少一介电层及该至少两天线层交互层叠在该承载层上，该承载层为一树脂薄膜。
2.如权利要求1所述的天线组件，其特征在于：该至少两天线层为使用导电油墨印刷而成。
3.如权利要求2所述的天线组件，其特征在于：相邻两天线层之间形成有一电导通部，该电导通部由导电油墨形成并电连接相邻的两天线层。
4.如权利要求2所述的天线组件，其特征在于：该至少两天线层分别通过电缆与一电路板连接。
5.如权利要求1所述的天线组件，其特征在于：该至少一介电层为不导电的油墨层。
6.如权利要求1所述的天线组件，其特征在于：该至少一介电层为不导电的树脂漆层。
7.如权利要求1所述的天线组件，其特征在于：该承载层为聚碳酸酯树脂薄膜、丙烯腈丁二烯苯乙烯共聚物树脂薄膜及聚对苯二甲酸乙二醇酯树脂薄膜中的一种。
8.一种制作天线组件的方法，包括以下步骤：
提供一树脂薄膜；
在该树脂薄膜上交互地层叠至少两天线层和至少一介电层，所述至少两天线层是使用导电油墨印刷而成。
9.如权利要求8所述的制作天线组件的方法，其特征在于：该至少一介电层为不导电的油墨层，其通过印刷的方式形成。
10.如权利要求8所述的制作天线组件的方法，其特征在于：该至少一介电层为不导电的树脂漆层。
11.如权利要求8所述的制作天线组件的方法，其特征在于：在前一天线层上形成介电层后，该前一天线层的需与后一天线层导电接触的部位暴露；形成后一天线层时，形成该后一天线层的导电油墨同时印刷于该前一天线层的需与后一天线层导电接触的部位。
12.一种壳体，包括一注塑层和一天线组件，其特征在于：该天线组件为权利要求1-7中任一项所述的天线组件，该注塑层注塑结合于该天线组件上。
13.如权利要求12所述的壳体，其特征在于：该天线组件中与该承载层相对的一面的最外层为介电层，该注塑层注塑结合于该介电层上。
14.如权利要求12所述的壳体，其特征在于：该天线组件中与该承载层相对的一面的最外层为天线层，该注塑层注塑结合于该天线层上。
CN200810306002.8A 2008-12-05 2008-12-05 天线组件、制作该天线组件的方法及集成有该天线组件的壳体 Expired - Fee Related CN101752658B (zh)

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US12/556,236 US20100141550A1 (en) 2008-12-05 2009-09-09 Antenna module, method for making the antenna module, and housing incorporating the antenna module

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CN103208677A (zh) * 2013-03-30 2013-07-17 东莞劲胜精密组件股份有限公司 一种印刷天线
CN104674423A (zh) * 2013-11-27 2015-06-03 深圳光启创新技术有限公司 混纺纤维布、高频天线基板及其制作方法
CN106413254A (zh) * 2015-08-03 2017-02-15 广东格林精密部件股份有限公司 一种模内转印多层电路胶片及其制作方法

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US20040145858A1 (en) * 2002-11-19 2004-07-29 Kazuaki Sakurada Multilayer circuit board, manufacturing method therefor, electronic device, and electronic apparatus
US20060160432A1 (en) * 2004-12-16 2006-07-20 Rebecca Silveston-Keith Multiple digital printing techniques for fabricating printed circuits
WO2007094494A1 (ja) * 2006-02-19 2007-08-23 Nissha Printing Co., Ltd. アンテナ付き筺体の給電構造

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103208677A (zh) * 2013-03-30 2013-07-17 东莞劲胜精密组件股份有限公司 一种印刷天线
CN104674423A (zh) * 2013-11-27 2015-06-03 深圳光启创新技术有限公司 混纺纤维布、高频天线基板及其制作方法
CN104674423B (zh) * 2013-11-27 2017-02-01 深圳光启创新技术有限公司 混纺纤维布、高频天线基板及其制作方法
CN106413254A (zh) * 2015-08-03 2017-02-15 广东格林精密部件股份有限公司 一种模内转印多层电路胶片及其制作方法

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