CN101740540A - Interconnecting structure of lead frame and interconnecting method thereof - Google Patents
Interconnecting structure of lead frame and interconnecting method thereof Download PDFInfo
- Publication number
- CN101740540A CN101740540A CN 200810178445 CN200810178445A CN101740540A CN 101740540 A CN101740540 A CN 101740540A CN 200810178445 CN200810178445 CN 200810178445 CN 200810178445 A CN200810178445 A CN 200810178445A CN 101740540 A CN101740540 A CN 101740540A
- Authority
- CN
- China
- Prior art keywords
- lead
- lead frame
- insulation film
- foots
- openings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses an interconnecting structure of a lead frame, comprising a plurality of leading pins, an insulating thin film, a plurality of openings and at least one electric connecting structure, wherein the insulating thin film is arranged on first surfaces of partial leading pins; the plurality of openings are arranged on the insulating thin films so as to expose the first surface of the partial leading pins; and the at least one electric connecting structure is selectively and electrically connected with the leading pins with the exposed insulating thin film. In addition, the invention also provides an interconnecting method of the lead frame. The electric connecting structure is isolated from the lead frame by using the insulated thin film so as to bring convenience to the connection of the leading pins of the lead frame or the connection of overlines.
Description
Technical field
The present invention relates to a kind of lead frame interconnect structure and inner connection method thereof.
Background technology
Along with the high development of semiconductor industry, electronic product in the design of IC assembly towards the development of demand of multiway number and multifunction, and at assembly in appearance also towards light, thin, short, little trend development.Therefore, also face many challenges on packaging technology, problem such as the selecting for use of, encapsulating material increasingly sophisticated such as the design of lead frame, slim warpage of packaging assembly distortion, thermal diffusivity and structural strength all is the problem that encapsulates industry at present and met with.
In addition, if lead frame design have cross in during lead foot, need very big space that interior lead foot is extended to the routing place, sometimes because the interference of lead foot and can't extending in other, and cause difficulty in the design.
Summary of the invention
For addressing the above problem, one of the object of the invention utilizes insulation film that electric connection structure and lead frame are isolated for a kind of lead frame interconnect structure and inner connection method thereof are provided, and connects or the connection of cross-line to make things convenient for the lead frame pin to do.
In order to achieve the above object, a kind of lead frame interconnect structure of the embodiment of the invention comprises: a plurality of lead foots; Insulation film, it is arranged on the first surface of part lead foot; A plurality of openings, it is arranged on the insulation film to expose the first surface of part lead foot; And at least one electric connection structure, it optionally electrically connects the lead foot that exposes insulation film.
A kind of lead frame inner connection method of further embodiment of this invention comprises: a kind of lead frame is provided, and this lead frame contains a plurality of lead foots; On the first surface of part lead foot, insulation film is set, wherein has a plurality of openings on this insulation film to expose the part first surface of part lead foot; And form at least one electric connection structure, be used for optionally electrically connecting the lead foot that exposes insulation film.
Below by specific embodiment explanation in detail in conjunction with the accompanying drawings, the effect that can more easily understand purpose of the present invention, technology contents, characteristics and be reached.
Description of drawings
Figure 1A is the structural representation of the interior pin part of lead frame of the embodiment of the invention.
Figure 1B is the local enlarged diagram of Figure 1A.
Fig. 2 is the structure cross-sectional schematic between AA ' the face line of Figure 1B.
The primary clustering symbol description
| ??10，10’ | Lead foot |
| ??20 | Insulation film |
| ??22 | Opening |
| ??10，10’ | Lead foot |
| ??30 | Electric connection structure |
| ??40 | Chip |
Embodiment
Be described in detail as follows, described preferred embodiment only is used for doing explanation, and is not to be used for limiting the present invention.
Please refer to Figure 1A and Figure 1B, Figure 1A is the structural representation of the interior pin part of lead frame of the embodiment of the invention; Figure 1B is the local enlarged diagram of Figure 1A.The lead frame interconnect structure of the embodiment of the invention comprises: a plurality of lead foots 10,10 ', and as shown in the figure, this lead foot 10,10 ' length can be inequality; Insulation film 20, it is arranged on part lead foot 10,10 ' the first surface, and lead foot 10,10 ' is fixed on the insulation film 20; A plurality of openings 22, it is arranged on the insulation film 20, is used for exposing lead foot that part need electrically connect 10,10 ' first surface; And at least one electric connection structure 30, it optionally electrically connects the lead foot 10,10 ' of the opening 22 that exposes insulation film 20.
From the above, in the present embodiment, insulation film 20 comprises insulating tape, is used for preventing lead foot 10 or 10 ' and electric connection structure 30 short circuits.Moreover, the protection of insulation film 20 has been arranged, the lead foot design of lead frame can more be simplified.In addition, insulation film 20 also can be roughly fixed thereon to make things convenient for the electric connection of back with lead foot 10,10 '.In the present embodiment, can be metal lead wire electrically connect lead foot 10 and lead foot 10 ' in the mode of routing to electric connection structure 30; In another embodiment, electric connection structure 30 also can be a conducting resinl, and is formed in a suitable manner on the insulation film 20 to electrically connect the lead foot of desiring conducting.In addition, in the present embodiment, the first surface in the accompanying drawing is lead foot 10,10 ' lower surface, but is understandable that this structure also can be formed on the upper surface of lead frame, that is to say, first surface also can be lead foot 10,10 ' upper surface.In addition, in another embodiment, as shown in Figure 2, also comprise the chip 40 that is arranged on the lead frame, and this chip 40 electrically connects with lead foot.
From the above, the lead frame inner connection method of the embodiment of the invention comprises: at first, provide a kind of lead frame, this lead frame contains a plurality of lead foots; Then, on the first surface of part lead foot, insulation film is set, wherein has a plurality of openings on this insulation film, be used for exposing the part first surface of part lead foot; Form at least one electric connection structure, be used for optionally electrically connecting the lead foot that exposes insulation film.Wherein first surface can be the upper surface or the lower surface of lead foot.
From the above, in one embodiment, the opening on the insulation film can form when making insulation film together; Also be to be after the insulation film step is set, utilize opening step to form.In addition, in another embodiment, the method that forms at least one electric connection structure comprises routing method and coating method.That is to say, can utilize the routing mode will come the conducting lead foot as the electric connection structure of metal lead wire; Also can be to utilize coating method that for example electric connection structure of conducting resinl is formed on the insulation film, and electrically connect the lead foot that needs conducting by the opening on the insulation film.By the use of insulation film, can prevent in the past issuable short circuit in the routing process.In addition, the inside Connection Step that in the past needs complicated routing has also been simplified in the use of insulation film, and moreover, the technology of simplification can be avoided makeing mistakes and make efficient to improve.
Comprehensively above-mentioned, the invention provides a kind of lead frame interconnect structure and inner connection method thereof, it utilizes insulation film that electric connection structure and lead frame are isolated, and can make things convenient for the lead frame pin to do and connect or the connection of cross-line.
Above-described embodiment only is explanation technological thought of the present invention and characteristics, its purpose is to make those skilled in the art can understand content of the present invention and implements according to this, and can not limit the present invention with this, promptly, the equivalence that every foundation spirit disclosed in this invention is done changes or modifies, and must be encompassed in the scope of the present invention.
Claims (10)
1. lead frame interconnect structure comprises:
A plurality of lead foots;
One insulation film, it is arranged on the first surface of described these lead foots of part;
A plurality of openings, it is arranged on the described insulation film, to expose the described first surface of described these lead foots of part; And
At least one electric connection structure, it optionally electrically connects described these lead foots that expose described insulation film.
2. lead frame interconnect structure as claimed in claim 1 is characterized in that described insulation film comprises insulating tape.
3. lead frame interconnect structure as claimed in claim 1 is characterized in that described electric connection structure comprises metal lead wire and conducting resinl.
4. lead frame interconnect structure as claimed in claim 1 is characterized in that the length of described these lead foots can be inequality.
5. lead frame interconnect structure as claimed in claim 1 is characterized in that described first surface is the upper surface or the lower surface of described these lead foots.
6. lead frame inner connection method comprises:
One lead frame is provided, and this lead frame comprises a plurality of lead foots;
One insulation film is set on the first surface of described these lead foots of part, wherein has a plurality of openings on this insulation film, with the described first surface of the part that exposes described these lead foots of part; And
Form at least one electric connection structure, be used for optionally electrically connecting described these lead foots that expose described insulation film.
7. lead frame inner connection method as claimed in claim 6 is characterized in that described these openings form together when making described insulation film.
8. lead frame inner connection method as claimed in claim 6 is characterized in that also comprising opening step after the step of described insulation film is set, and is used for forming on described insulation film described these openings.
9. lead frame inner connection method as claimed in claim 6 is characterized in that described first surface is the upper surface or the lower surface of described these lead foots.
10. lead frame inner connection method as claimed in claim 6 is characterized in that the method that forms described electric connection structure comprises routing method and coating process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810178445 CN101740540A (en) | 2008-11-26 | 2008-11-26 | Interconnecting structure of lead frame and interconnecting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810178445 CN101740540A (en) | 2008-11-26 | 2008-11-26 | Interconnecting structure of lead frame and interconnecting method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101740540A true CN101740540A (en) | 2010-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810178445 Pending CN101740540A (en) | 2008-11-26 | 2008-11-26 | Interconnecting structure of lead frame and interconnecting method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101740540A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023272450A1 (en) * | 2021-06-28 | 2023-01-05 | 欧菲光集团股份有限公司 | Chip packaging structure, camera module, and electronic device |
-
2008
- 2008-11-26 CN CN 200810178445 patent/CN101740540A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023272450A1 (en) * | 2021-06-28 | 2023-01-05 | 欧菲光集团股份有限公司 | Chip packaging structure, camera module, and electronic device |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100616 |