CN101733892A - Production technique of organic-inorganic compound disassembly-free thermal-insulation form board - Google Patents
Production technique of organic-inorganic compound disassembly-free thermal-insulation form board Download PDFInfo
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- CN101733892A CN101733892A CN200910220440A CN200910220440A CN101733892A CN 101733892 A CN101733892 A CN 101733892A CN 200910220440 A CN200910220440 A CN 200910220440A CN 200910220440 A CN200910220440 A CN 200910220440A CN 101733892 A CN101733892 A CN 101733892A
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- expandable polystyrene
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- disassembly
- polystyrene particle
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Abstract
The invention provides a production technique of an organic-inorganic compound disassembly-free thermal-insulation form board, which comprises the following steps: foaming expandable polystyrene into grains, aging, storing, and uniformly mixing with carbon black or graphite, so that the carbon black or graphite uniformly wraps the expandable polystyrene grains; sending the mixture into a forming machine, cooling, and drying to obtain the finished organic-inorganic compound disassembly-free thermal-insulation form board. The organic-inorganic compound disassembly-free thermal-insulation form board has the advantages of favorable thermal-insulating property, favorable aging resistance and favorable fire resistance, and can multiply the service life.
Description
One, technical field: the present invention relates to building heat preservation materials for wall production method, specifically refer to a kind of production technology of disassembly-free thermal-insulation form board.
Two, background technology: existing organic type insulation material is because its high insulating effect, price is low and use in a large number at home, but because the organic material loss of properties on aging, the life-span is short, and fire protecting performance is poor, is a big technical barrier of organic insulation material always.
Three, summary of the invention:
1, goal of the invention: the invention provides a kind ofly, purpose is to provide a kind of good heat insulating, ageing-resistant performance is good, fire protecting performance is good, can significantly improve the production technique of organic-inorganic compound disassembly-free thermal-insulation form board in service life.
2, technical scheme: technical scheme of the present invention is implemented in the following manner:
A kind of production technique of organic-inorganic compound disassembly-free thermal-insulation form board is characterized in that: this production technology may further comprise the steps:
(1) expandable polystyrene being added in the prefoaming machine, by Steam Heating, is graininess with the expandable polystyrene foaming;
(2) expandable polystyrene particle after will foaming carries out slaking and stores, and is standby;
(3) expandable polystyrene particle standby in the step (2) is added in the stirred vessel, add carbon black or graphite again, the two is evenly stirred into compound, carbon black or graphite are evenly wrapped up expandable polystyrene particle;
Wherein the ratio of carbon black is 0.1%～0.5% of the expandable polystyrene particle weight after foaming; The ratio of graphite is 1%～5% of the expandable polystyrene particle weight after foaming;
(4) expandable polystyrene particle that stirs and the compound of carbon black or graphite are transported in the make-up machine, fixed-type by actual required size;
(5) compound after the moulding is cooled off naturally, drying, obtain the finished product of organic-inorganic compound disassembly-free thermal-insulation form board.
3, advantage and effect: beneficial effect of the present invention is:
(1) high insulating effect: owing to added inorganic atrament, make its function with heat absorption and heat release, heat insulation effect also improves thereupon;
(2) improve insulation material service life: because inorganic fireproof material is wrapped up organic insulation material, making it ageing resistace and significantly improve, is exactly significantly improving of service life therefore;
(3) fire protecting performance improves: inorganic material belongs to A level fire-retardant type fire proofing material, therefore can allow the performance of insulation material significantly improve thereupon.
Four, the specific embodiment: technical scheme of the present invention is further specified below by specific embodiment:
Embodiment 1,
A kind of production technique of organic-inorganic compound disassembly-free thermal-insulation form board is characterized in that: this production technology may further comprise the steps:
(1) expandable polystyrene being added in the prefoaming machine, by Steam Heating, is graininess with the expandable polystyrene foaming;
(2) expandable polystyrene particle after will foaming carries out slaking and stores, and is standby;
(3) expandable polystyrene particle standby in the step (2) is added in the stirred vessel, add carbon black again, the two is evenly stirred into compound, carbon black is evenly wrapped up expandable polystyrene particle;
Wherein the ratio of carbon black is 0.1 of the expandable polystyrene particle weight after foaming;
(4) expandable polystyrene particle that stirs and the compound of carbon black are transported in the make-up machine, fixed-type by actual required size;
(5), obtain the finished product of organic-inorganic compound disassembly-free thermal-insulation form board with the cooling of the compound after the moulding, drying.
Embodiment 2,
A kind of production technique of organic-inorganic compound disassembly-free thermal-insulation form board is characterized in that: this production technology may further comprise the steps:
(1) expandable polystyrene being added in the prefoaming machine, by Steam Heating, is graininess with the expandable polystyrene foaming;
(2) expandable polystyrene particle after will foaming carries out slaking and stores, and is standby;
(3) expandable polystyrene particle standby in the step (2) is added in the stirred vessel, add carbon black again, the two is evenly stirred into compound, carbon black is evenly wrapped up expandable polystyrene particle;
Wherein the ratio of carbon black is 0.5% of the expandable polystyrene particle weight after foaming;
(4) expandable polystyrene particle that stirs and the compound of carbon black are transported in the make-up machine, fixed-type by actual required size;
(5), obtain the finished product of organic-inorganic compound disassembly-free thermal-insulation form board with the cooling of the compound after the moulding, drying.
Embodiment 3,
A kind of production technique of organic-inorganic compound disassembly-free thermal-insulation form board is characterized in that: this production technology may further comprise the steps:
(1) expandable polystyrene is added in the prefoaming machine, pass through Steam Heating
, be graininess with the expandable polystyrene foaming;
(2) expandable polystyrene particle after will foaming carries out slaking and stores, and is standby;
(3) expandable polystyrene particle standby in the step (2) is added in the stirred vessel, add carbon black again, the two is evenly stirred into compound, carbon black is evenly wrapped up expandable polystyrene particle;
Wherein the ratio of carbon black is 0.3% of the expandable polystyrene particle weight after foaming;
(4) expandable polystyrene particle that stirs and the compound of carbon black are transported in the make-up machine, fixed-type by actual required size;
(5), obtain the finished product of organic-inorganic compound disassembly-free thermal-insulation form board with the cooling of the compound after the moulding, drying.
Embodiment 4,
A kind of production technique of organic-inorganic compound disassembly-free thermal-insulation form board is characterized in that: this production technology may further comprise the steps:
(1) expandable polystyrene being added in the prefoaming machine, by Steam Heating, is graininess with the expandable polystyrene foaming;
(2) expandable polystyrene particle after will foaming carries out slaking and stores, and is standby;
(3) expandable polystyrene particle standby in the step (2) is added in the stirred vessel, add graphite again, the two is evenly stirred into compound, graphite is evenly wrapped up expandable polystyrene particle;
Wherein the ratio of graphite is 1% of the expandable polystyrene particle weight after foaming;
(4) expandable polystyrene particle that stirs and the compound of graphite are transported in the make-up machine, fixed-type by actual required size;
(5), obtain the finished product of organic-inorganic compound disassembly-free thermal-insulation form board with the cooling of the compound after the moulding, drying.
Embodiment 5,
A kind of production technique of organic-inorganic compound disassembly-free thermal-insulation form board is characterized in that: this production technology may further comprise the steps:
(1) expandable polystyrene being added in the prefoaming machine, by Steam Heating, is graininess with the expandable polystyrene foaming;
(2) expandable polystyrene particle after will foaming carries out slaking and stores, and is standby;
(3) expandable polystyrene particle standby in the step (2) is added in the stirred vessel, add graphite again, the two is evenly stirred into compound, graphite is evenly wrapped up expandable polystyrene particle;
Wherein the ratio of graphite is 5% of the expandable polystyrene particle weight after foaming;
(4) expandable polystyrene particle that stirs and the compound of carbon black or graphite are transported in the make-up machine, fixed-type by actual required size;
(5), obtain the finished product of organic-inorganic compound disassembly-free thermal-insulation form board with the cooling of the compound after the moulding, drying.
Embodiment 6,
A kind of production technique of organic-inorganic compound disassembly-free thermal-insulation form board is characterized in that: this production technology may further comprise the steps:
(1) expandable polystyrene being added in the prefoaming machine, by Steam Heating, is graininess with the expandable polystyrene foaming;
(2) expandable polystyrene particle after will foaming carries out slaking and stores, and is standby;
(3) expandable polystyrene particle standby in the step (2) is added in the stirred vessel, add graphite again, the two is evenly stirred into compound, graphite is evenly wrapped up expandable polystyrene particle;
Wherein the ratio of graphite is 4% of the expandable polystyrene particle weight after foaming;
(4) expandable polystyrene particle that stirs and the compound of graphite are transported in the make-up machine, fixed-type by actual required size;
(5), obtain the finished product of organic-inorganic compound disassembly-free thermal-insulation form board with the cooling of the compound after the moulding, drying.
Claims (1)
1. production technique of organic-inorganic compound disassembly-free thermal-insulation form board, it is characterized in that: this production technology may further comprise the steps:
(1) expandable polystyrene being added in the prefoaming machine, by Steam Heating, is graininess with the expandable polystyrene foaming;
(2) expandable polystyrene particle after will foaming carries out slaking and stores, and is standby;
(3) expandable polystyrene particle standby in the step (2) is added in the stirred vessel, add carbon black or graphite again, the two is evenly stirred into compound, carbon black or graphite are evenly wrapped up expandable polystyrene particle;
Wherein the ratio of carbon black is 0.1%～0.5% of the expandable polystyrene particle weight after foaming; The ratio of graphite is 1%～5% of the expandable polystyrene particle weight after foaming;
(4) expandable polystyrene particle that stirs and the compound of carbon black or graphite are transported in the make-up machine, fixed-type by actual required size;
(5) compound after the moulding is cooled off naturally, drying, obtain the finished product of organic-inorganic compound disassembly-free thermal-insulation form board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910220440A CN101733892A (en) | 2009-12-04 | 2009-12-04 | Production technique of organic-inorganic compound disassembly-free thermal-insulation form board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910220440A CN101733892A (en) | 2009-12-04 | 2009-12-04 | Production technique of organic-inorganic compound disassembly-free thermal-insulation form board |
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| CN101733892A true CN101733892A (en) | 2010-06-16 |
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| CN200910220440A Pending CN101733892A (en) | 2009-12-04 | 2009-12-04 | Production technique of organic-inorganic compound disassembly-free thermal-insulation form board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102276203A (en) * | 2011-06-07 | 2011-12-14 | 王建国 | Antiflaming graphite polystyrene insulation board and preparation method thereof |
| CN102558598A (en) * | 2011-12-14 | 2012-07-11 | 曾首元 | Preparation method of black gray expandable polystyrene |
| CN103057027A (en) * | 2012-12-31 | 2013-04-24 | 天津市奥新海塑料制品有限公司 | Production method of expandable polystyrene disappear template material |
-
2009
- 2009-12-04 CN CN200910220440A patent/CN101733892A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102276203A (en) * | 2011-06-07 | 2011-12-14 | 王建国 | Antiflaming graphite polystyrene insulation board and preparation method thereof |
| CN102558598A (en) * | 2011-12-14 | 2012-07-11 | 曾首元 | Preparation method of black gray expandable polystyrene |
| CN103057027A (en) * | 2012-12-31 | 2013-04-24 | 天津市奥新海塑料制品有限公司 | Production method of expandable polystyrene disappear template material |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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Open date: 20100616 |