CN101733708B - Method for processing pore wall of SMT laser template - Google Patents
Method for processing pore wall of SMT laser template Download PDFInfo
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- CN101733708B CN101733708B CN2009101098519A CN200910109851A CN101733708B CN 101733708 B CN101733708 B CN 101733708B CN 2009101098519 A CN2009101098519 A CN 2009101098519A CN 200910109851 A CN200910109851 A CN 200910109851A CN 101733708 B CN101733708 B CN 101733708B
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Abstract
The invention provides a method for processing the pore wall of an SMT laser template. The method comprises the following steps that a nozzle arranged obliquely opposite to the pore wall of the SMT laser template sprays a liquid flow mixed with ground granules on the surface of the processed pore wall; and the nozzle moves at a certain speed to ensure that the liquid flow can be sprayed on the surface of the to-be-processed pore wall. Compared with the prior art, the method has the advantages that the method is more environment-friendly and processing efficiency is higher; and in the method, the pore wall of the SMT laser template is deburred and polished so as to facilitate subsequent processing such as solder paste printing and the like.
Description
Technical field
The present invention relates to a kind of method that the hole wall of SMT laser template is handled.
Background technology
Surface mounting technology (SMT) is the mainstream technology that present electronic product is made.Before electronic component mounts flow process, all need use printing stencil, the preparation method of printing stencil has method for chemially etching and laser cutting method.The template of cut is commonly called the SMT laser template, and it has characteristics such as positional precision height.But the hole wall after the cutting exists certain burr and roughness can influence the effect of print solder paste.Because the SMT laser template is generally thinner, and its hole is also less, and the area of hole wall is also less, and the method for removal burr commonly used and polishing is like mechanical grinding etc., all inapplicable.
Now common removal hole wall burr and the method for polishing generally adopt: through chemical immersion, electrochemistry or hyperacoustic mode.But chemistry or the not environmental protection of electrochemical mode, ultrasonic wave mode efficient is not high, and this has all seriously restricted the popularization of SMT laser template.
Summary of the invention
In view of this, technical problem to be solved by this invention provides a kind of relatively environmental protection, and the method with higher treatment effeciency is arranged, and the hole wall of SMT laser template is removed burr and polishing, so that carry out subsequent processes such as print solder paste.
The objective of the invention is to realize through following technical scheme:
A kind of method that the hole wall of SMT laser template is handled comprises the steps:
The nozzle that tiltedly hole wall of this SMT laser template is provided with is ejected into the wall of its handled hole wall with the flow of liquid that is mixed with abrasive grains,
And said nozzle moves by certain speed, so that the wall of the pending hole wall of the flow of liquid directive of its injection.
Wherein, abrasive grains is meant, the fine particle shape material of hard; Liquid can select to adopt water.
In general, the SMT laser template selects to adopt the metal or alloy material to process, especially stainless steel material.Adopt technique scheme, by nozzle institute atomizing of liquids stream will be preferably to the joint-cutting place of the hole wall of the SMT laser template after the cut carrying out deburring and polishing.
Preferably, said abrasive grains is selected to adopt: size is 100 to 800 purpose silica sands, garnet, and diamond dust.
Contrast is found through test of many times, if abrasive grains, then causes the whole deformation of the SMT laser template that is processed easily less than 100 orders; And if abrasive grains is greater than 800 orders, then polishing efficiency is low excessively.
Further, the thickness of said SMT laser template is 0.03 to 1 millimeter; Said abrasive grains is selected to adopt by 1: 2: 1 weight mixing match: size is that 300 purpose silica sands, size are that 400 purpose garnets and size are 600 purpose diamond dust.
Abovementioned technology is the embodiment that a kind of process test of many times contrasts resulting optimum, and three kinds of different polishing particles mix according to the above ratio, can reach the effect that has complementary functions.Find with analyzing to contrast through overtesting: large diameter burr has good effect to a 300 purpose silica sands on the hole wall for removing; Two part of 400 purpose garnet has the best effect of improving for the stainless steel wall roughness; A 600 purpose diamond dust can guarantee that stainless steel wall light is clean.
Preferably, to press be 100 to 300Mpa to the liquid of said nozzle ejection flow of liquid.
Find that through the overtesting contrast if liquid forces down in 100Mpa, then the ability of deburring is not enough, and treatment effeciency decline, do not reach the production demand; Be higher than 300Mpa if liquid is pressed, can make that then the SMT laser template causes tangible flexural deformation.
Further, the liquid of said nozzle ejection flow of liquid is pressed and is 200Mpa.
Preferably, the diameter of said nozzle is 0.3 millimeter to 2 millimeters.
Find through the overtesting contrast, if the diameter of nozzle less than 0.3mm, can be easy to cause spray nozzle clogging; And if its diameter causes the skewness of the abrasive grains in the fluid jet that is sprayed easily greater than 2mm, make the quality of handling descend.
Further, the diameter of said nozzle is 1.3 millimeters.
Preferably, the angle between said nozzle and the said SMT laser template is 15 to 75 degree.
Find that through overtesting contrast when if the angle between said nozzle and the said SMT laser template is spent less than 15, the flow of liquid that nozzle sprayed is too small to stainless active force, deburring efficient is too low, has a large amount of injection streams not do work; And if this angle is when spending greater than 75, the smear metal power of the flow of liquid that nozzle sprayed is excessive, will make the SMT laser template seem coarse rough.
Further, the angle between said nozzle and the said SMT laser template is 45 degree.
Preferably, along the axial direction of said nozzle ejection, the distance of said nozzle and said SMT laser template is 2 to 7 millimeters.
Find through the overtesting contrast; If axial direction along said nozzle ejection; The distance of said nozzle and said SMT laser template is less than 2 millimeters the time, and the flow of liquid that nozzle sprayed is handled in the initial segment of its jet, though can remove burr fast; But will cause darker vestige to the SMT laser template, not reach polishing action; If this distance is greater than 7 millimeters the time, the flow of liquid that nozzle sprayed is handled in the dissipation section of its jet, be difficult to remove burr, so polishing effect is also bad.
Further, along the axial direction of said nozzle ejection, the distance of said nozzle and said SMT laser template is 5 millimeters.
Preferably, the translational speed of said nozzle is 3 to 10 mm/min.
Find through overtesting contrast, if the translational speed of said nozzle less than 3 mm/min, then the flow of liquid of said nozzle ejection is to the wall action overlong time of its processing, polishing effect is relatively poor; And if the translational speed of said nozzle is then unclean to the removal of wall burr greater than 10 mm/min, polishing effect is not good yet.
Further, the translational speed of said nozzle is 7 mm/min.
Compared with prior art the invention has the advantages that, a kind of relatively environmental protection is provided, the method with higher treatment effeciency is arranged, the hole wall of SMT laser template is removed burr and polishing, so that it carries out subsequent processes such as print solder paste.
Description of drawings
Fig. 1 is the work sketch map of an embodiment of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing and preferred embodiment the present invention is described further.
Be distributed with the formed hole 2 of cut on the SMT laser template 1 of employing stainless steel.Nozzle 4 will eject the current that are mixed with abrasive grains 3, with SMT laser template 1 hole wall in the direction directive hole 2 of a in angle of 45 degrees.Said nozzle 4 also moves with the speed of 7 mm/min along direction V simultaneously, to let all hole wall surfaces of the current sweep hole 2 that is mixed with abrasive grains 3.Along the axial direction of said nozzle ejection, the distance of said nozzle and said SMT laser template is also referred to as range L, and the value of this range L is 5 millimeters.
Wherein, the diameter of nozzle 4 is 1.3 millimeters, and the liquid of nozzle 4 atomizing of liquids stream is pressed and is 200Mpa.Said abrasive grains is selected to adopt by 1: 2: 1 weight mixing match: size is that 300 purpose silica sands, size are that 400 purpose garnets and size are 600 purpose diamond dust.
Above content is to combine concrete preferred implementation to the further explain that the present invention did, and can not assert that practical implementation of the present invention is confined to these explanations.For the those of ordinary skill of technical field under the present invention, under the prerequisite that does not break away from the present invention's design, can also make some simple deduction or replace, all should be regarded as belonging to protection scope of the present invention.
Claims (11)
1. the method that the hole wall of SMT laser template is handled comprises the steps:
The nozzle that tiltedly hole wall of this SMT laser template is provided with is ejected into the wall of its handled hole wall with the flow of liquid that is mixed with abrasive grains,
And said nozzle moves by certain speed, so that the wall of the pending hole wall of the flow of liquid directive of its injection is characterized in that:
The thickness of said SMT laser template is 0.03 to 1 millimeter; Said abrasive grains is selected to adopt by 1: 2: 1 weight mixing match: size is that 300 purpose silica sands, size are that 400 purpose garnets and size are 600 purpose diamond dust.
2. the method for claim 1 is characterized in that, it is 100 to 300Mpa that the liquid of said nozzle ejection flow of liquid is pressed.
3. method as claimed in claim 2, the liquid of said nozzle ejection flow of liquid are pressed and are 200Mpa.
4. like claim 1,2 or 3 described methods, it is characterized in that the diameter of said nozzle is 0.3 millimeter to 2 millimeters.
5. method as claimed in claim 4, the diameter of said nozzle are 1.3 millimeters.
6. like claim 1,2 or 3 described methods, it is characterized in that the angle between said nozzle and the said SMT laser template is 15 to 75 degree.
7. method as claimed in claim 6, the angle between said nozzle and the said SMT laser template are 45 degree.
8. method as claimed in claim 6, along the axial direction of said nozzle ejection, the distance of said nozzle and said SMT laser template is 2 to 7 millimeters.
9. method as claimed in claim 8, along the axial direction of said nozzle ejection, the distance of said nozzle and said SMT laser template is 5 millimeters.
10. like claim 1,2 or 3 described methods, it is characterized in that the translational speed of said nozzle is 3 to 10 mm/min.
11. method as claimed in claim 10 is characterized in that, the translational speed of said nozzle is 7 mm/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101098519A CN101733708B (en) | 2009-11-26 | 2009-11-26 | Method for processing pore wall of SMT laser template |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101098519A CN101733708B (en) | 2009-11-26 | 2009-11-26 | Method for processing pore wall of SMT laser template |
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| Publication Number | Publication Date |
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| CN101733708A CN101733708A (en) | 2010-06-16 |
| CN101733708B true CN101733708B (en) | 2012-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009101098519A Active CN101733708B (en) | 2009-11-26 | 2009-11-26 | Method for processing pore wall of SMT laser template |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102240935A (en) * | 2011-05-13 | 2011-11-16 | 南京三乐电子信息产业集团有限公司 | Method for deburring cold cathode in traveling-wave tube |
| CN105563292B (en) * | 2015-12-17 | 2017-09-08 | 东莞市秦智工业设计有限公司 | A kind of polissoir of SMT laser templates |
| CN105586592B (en) * | 2015-12-17 | 2018-05-04 | 国科产业科技服务（深圳）有限公司 | A kind of burnishing device of SMT laser templates |
| CN105538120B (en) * | 2016-03-03 | 2017-12-19 | 惠州市美特伦科技有限公司 | A kind of device for being polished to SMT laser templates |
| CN106965435B (en) * | 2017-03-28 | 2019-01-22 | 四川长虹智能制造技术有限公司 | A kind of 3D printing part post-processing approach |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1053030A (en) * | 1990-01-04 | 1991-07-17 | 周一届 | Polisher with jetted abrasive oil |
| CN1880018A (en) * | 2005-09-26 | 2006-12-20 | 福群电子(深圳)有限公司 | Method and device for removing burr and oil stain of metal piece, plastic product using jet fluid |
| CN101011814A (en) * | 2007-01-19 | 2007-08-08 | 电子科技大学 | Method and apparatus for processing transparent conductive glass surface by dry ice particle spraying technique |
| WO2009064254A1 (en) * | 2007-11-13 | 2009-05-22 | Khoon Leong Chong | High pressure liquid abrasive de-burring system and process for same |
| CN101456164A (en) * | 2007-12-14 | 2009-06-17 | 深圳市裕鼎精密工业科技股份有限公司 | Fluid jet polishing device |
-
2009
- 2009-11-26 CN CN2009101098519A patent/CN101733708B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1053030A (en) * | 1990-01-04 | 1991-07-17 | 周一届 | Polisher with jetted abrasive oil |
| CN1880018A (en) * | 2005-09-26 | 2006-12-20 | 福群电子(深圳)有限公司 | Method and device for removing burr and oil stain of metal piece, plastic product using jet fluid |
| CN101011814A (en) * | 2007-01-19 | 2007-08-08 | 电子科技大学 | Method and apparatus for processing transparent conductive glass surface by dry ice particle spraying technique |
| WO2009064254A1 (en) * | 2007-11-13 | 2009-05-22 | Khoon Leong Chong | High pressure liquid abrasive de-burring system and process for same |
| CN101456164A (en) * | 2007-12-14 | 2009-06-17 | 深圳市裕鼎精密工业科技股份有限公司 | Fluid jet polishing device |
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| CN101733708A (en) | 2010-06-16 |
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