CN101727127B - Electronic device - Google Patents
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- CN101727127B CN101727127B CN2008101674966A CN200810167496A CN101727127B CN 101727127 B CN101727127 B CN 101727127B CN 2008101674966 A CN2008101674966 A CN 2008101674966A CN 200810167496 A CN200810167496 A CN 200810167496A CN 101727127 B CN101727127 B CN 101727127B
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- housing
- shape memory
- memory alloy
- movable part
- electronic installation
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Abstract
The invention discloses an electronic device comprising a shell, a moving piece and a shape memory alloy element, wherein the shell is provided with at least one opening, the moving piece is positioned among the openings, pivoted on the shell and can be in pivoted rotation relative to the shell; the shape memory alloy element is respectively connected to the shell and the moving piece; the shape memory alloy element is deformed when receiving heat energy generated by an electronic element of the electronic device to link the moving piece for pivoted rotation, and the moving piece supports against a plane so as to enable the shell to be obliquely arranged on the plane; in addition, an air flow space for assisting in heat radiation is formed between the shell and the plane. The electronic device is free from being additionally provided with a height-adjusting mechanism, thereby greatly simplifying the steps for adjusting the height and simultaneously reducing the manufacturing cost.
Description
Technical field
The present invention is about a kind of electronic installation, particularly puts electronic device construction on the plane about a kind of tiltable one angle.
Background technology
Fast development along with present electronics technology, and the consumer becomes to paying attention to for the frivolous portable benefit of consumption electronic products, brought up electronic product now, as notebook computer, flat computer, super pocket computer (ultra mobile personal computer, portable electronic devices such as UMPC) is all gradually towards the microminiaturization development, for frequent outside the user of needs, it is more portable that portable electronic product becomes, and significantly promotes the convenience on using.
In order to satisfy the requirement of consumer for data processing speed, the arithmetic speed of computer installation internal electronic element must be fast, the volume of adding electronic component is small, cause heat generation density also to increase thereupon, if the untimely discharge of heat, too high temperature will have a strong impact on stability and the efficient on the computer operating, also cause the lost of life of electronic component.
With portable electronic devices of small such as present flat computer or super pocket computers is example, choose the necessary frivolous and portable demand of this class small-size computer device in order to meet the consumer, in the limited portable computer device of free space, to additionally install radiator fan certain difficulty is arranged, thereby cause not having the inner forced convertion that lacks air of portable computer device that fan designs, single natural convection and thermal radiation that only relies between heating radiator (heat sink) and the air dispels the heat, its radiating efficiency is unsatisfactory, can't satisfy the radiating requirements of the portable electronic equipment of present high arithmetic speed.
In order to solve the heat dissipation problem of portable computer device inside, the practice commonly used is to offer a plurality of louvres in the portable computer device bottom surface, and the surface of shell that increases computer installation is long-pending, making heat energy that electronic component produced, and get rid of from computer installation is inner by large-area heat-delivery surface.Therefore, must a plurality of foots pad be set in the notebook computer bottom, computer installation propped up a height and to be constituted the heat radiation gap, but the operational effectiveness of mobile computer is quite quick at present, the heat energy that it produced also increases many relatively, dispel the heat in the gap of only being dependent on foot pad and being constituted, be not enough to flow in the computer installation bottom cycle for radiating airflow, cause the heat energy of device inside can't loss in the short time, and can't satisfy the radiating requirements of the notebook computer of present high arithmetic speed.
Optimal radiating mode is that portable computer device is propped up certain height, is beneficial to the flow perturbation of portable computer device bottom.The bed hedgehopping mechanism of general portable computer device commonly used, be on portable computer device, to add one group of height control mechanism, common mechanism design is on the back of the body cover plate of portable computer device a protuberance to be set, make protuberance rotate to the bottom of portable computer device by opening back of the body cover plate, and be resisted against desktop, portable computer device is propped up a height; Or installing one support member and one group of adjusting gear in portable computer device by the engagement of support member and adjusting gear, and can and be propped up certain altitude with the past top rake of portable computer device; Install a foot rest respectively at the portable computer device dual side-edge, when the engaging support mechanism of living foot rest when hook was released, foot rest can pivot with respect to portable computer device, and is resisted against desktop and props up portable computer device with an end.
Though above-mentioned common technology can play the portable computer device pad one height, is beneficial to the heat radiation of device and controlling of user.Yet height control mechanism and portable computer device are two members independently, there is no direct continuous action relation.When the user desires the bed hedgehopping portable computer device, must adjust height control mechanism separately, can be with the portable computer device bed hedgehopping to the height and position that the user was accustomed to, on reality is used and inconvenient.
In sum, manufacturer must additionally add height control mechanism on portable computer device, and the composition member complexity of height control mechanism, must assemble the overspending time in the assembly process, so all will cause the increase of manufacturing cost, and not meet manufacturing industry and stress the requirement that reduces cost at present.
Summary of the invention
In view of above problem, the invention provides a kind of electronic installation, there is no direct continuous action relation so as to improveing height control mechanism commonly used and portable computer, the user must adjust height control mechanism separately, operation steps is complicated, and necessary extra the manufacturing and assembly height control mechanism of manufacturer, cause problems such as manufacturing cost increase.
Electronic installation of the present invention is put on a plane, and by circuit board with a plurality of electronic components to carry out preset function, electronic installation comprises a housing, at least one movable part, and at least one shape memory alloy component.Housing has at least one opening towards a side on plane, and movable part is hubbed at housing and can pivoting with respect to housing, and movable part has a link and a support end, and this movable part is between this opening.Shape memory alloy component is connected to the link of housing and movable part, shape memory alloy component is accepted the heat energy that electronic component produces and is shunk deformation, shape memory alloy component interlock movable part pivots, be resisted against on the plane with the support end that makes movable part, make the housing angle that tilts be arranged on the plane, and form the airflow space of auxiliary heat dissipation between housing and the plane.
Beneficial effect of the present invention is, when shape memory alloy component receives heat energy and during drawdown deformation, the corresponding pivot of the movable part that is connected with shape memory alloy component, and be resisted against the plane with support end, so that housing is obliquely installed on the plane, produce a distance between housing and the plane, to form the airflow space of auxiliary heat dissipation.Electronic installation of the present invention is the mounting height adjusting mechanism separately, significantly to simplify the height control step, reduces manufacturing cost simultaneously.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the decomposing schematic representation of first embodiment of the invention;
Fig. 2 is that the electronic installation of first embodiment of the invention lies against the schematic perspective view on the plane;
Fig. 3 is the side view of Fig. 2;
The schematic perspective view of Fig. 4 for having a distance between the electronic installation of first embodiment of the invention and the plane;
Fig. 5 is the side view of Fig. 4;
Fig. 6 is the schematic perspective view of second embodiment of the invention;
Fig. 7 is that the electronic installation of second embodiment of the invention lies against the side view on the plane;
The side view of Fig. 8 for having a distance between the electronic installation of second embodiment of the invention and the plane;
Fig. 9 is the schematic perspective view of third embodiment of the invention.
Wherein, Reference numeral
100 electronic installations
110 housings
111 openings
112 fixed legs
113 pivot holes
120 movable parts
121 links
122 support ends
123 pivots
130 shape memory alloy components
131 line bodies
200 circuit boards
210 electronic components
300 planes
400 airflow spaces
Embodiment
The disclosed electronic installation according to the present invention, including, but not limited to notebook computer, flat computer, super pocket computer (ultra mobile personal computer, UMPC), personal digital assistant (PersonalDigital Assistant, PDA) equal can produce under the operating state portable computer device of heat energy, but not as limit.In following detailed description of the present invention, will be with super pocket computer as most preferred embodiment of the present invention.Yet appended accompanying drawing only provides reference and explanation usefulness, is not in order to restriction the present invention.
See also Fig. 1 to Fig. 3, the electronic installation 100 of first embodiment of the invention has a circuit board 200 and reaches a plurality of electronic components 210 that electrically are arranged on the circuit board 200, to carry out default function, but electronic installation 100 is carried out preset function by circuit board 200 and electronic component 210 thereof, be not the technology emphasis of this case, so the inventor does not give unnecessary details at this.
Please continue to consult Fig. 1 to Fig. 3, shape memory alloy component 130 is marmem (ShapeMemory Alloy, SMA) made, for example be Ni-Ti (Ti-Ni) marmem, copper-zinc-aluminium (Cu-Zn-Al) marmem or copper-nickel-aluminium (Cu-Ni-Al) marmem, it can produce the deformation effect according to temperature variation.Under the normal temperature state, shape memory alloy component 130 has an extensional deformation state; Under heating status, shape memory alloy component 130 has one and shrinks reset condition.
Shape memory alloy component 130 is arranged between housing 110 and the circuit board 200, shape memory alloy component 130 is a cuboid structure, and its two opposite end has a line body 131 respectively, in order to the fixed leg 112 that connects housing 110 respectively link 121 with movable part 120, make an end of shape memory alloy component 130 be fixed on the fixed leg 112, the other end of shape memory alloy component 130 can drive movable part 120 and produce interlock.Wherein, the material of the disclosed line body 131 of first embodiment of the invention can be metal material or marmem, the effect of line body 131 is to connect shape memory alloy component 130, housing 110, and movable part 120, the selecting for use not as limit of its material.
As shown in Figures 2 and 3, when electronic installation 100 does not operate or has just come into operation, the temperature no show inversion temperature still of shape memory alloy component 130 (transition temperature), therefore present extended configuration, and shape memory alloy component 130 interlock movable parts 120 produce the opening 111 that pivots and be covered in housing 110, make electronic installation 100 horizontal pendulums be put on the plane 300.And movable part 120 can cover opening 111 fully, enters housing 110 inside via opening 111 to avoid dirty dust.
As Fig. 4 and shown in Figure 5, after electronic installation 100 operated a period of times, the electronic component 210 of circuit board 200 produced quite high heat energy, makes that the shape memory alloy component 130 between housing 110 and circuit board 200 is in heating status.After the heating temperature of shape memory alloy component 130 arrives inversion temperature, with the nickel-titanium shape memory alloy is example, its inversion temperature is 40 degree (40 ℃) Celsius, shape memory alloy component 130 begins to produce deformation and is contracted to the contraction reset condition, shape memory alloy component 130 by line body 131 with interlock movable part 120, the support end 122 of movable part 120 pivots toward the clockwise direction and is resisted against on the plane 300, to make housing 110 upwards lift certain height, housing 110 is put on plane 300 with an angle of inclination, and constitute an airflow space 400 between housing 110 and the plane 300, remove the heat energy of electronic installation 100 inside to loose fast.
It should be noted that, the support end 122 of movable part 120 is a globoidal structure, and parameters such as the size of shape memory alloy component 130, putting position, line body 131 length all are that the corresponding relation of the heat energy that produced of angle of inclination and electronic component 210 at housing 110 designs.When shape memory alloy component 130 is being carried out preset function (for example for carrying out the document work of treatment according to electronic installation 100, or carry out that 3D draws and functions such as image processing) watt level that produced and correspondingly produce deformation, change pivoting angle with interlock movable part 120, and cooperate support end 122 to be resisted against plane 300 with the outer rim of diverse location, adjust the angle that is obliquely installed of housing 110 with correspondence, make and reach best heat dissipation by the airflow space 400 that forms differing heights between housing 110 and the plane 300.
See also the second embodiment synoptic diagram of Fig. 6 to Fig. 8, in this embodiment, its structure and aforementioned first embodiment are roughly the same, below only the different place of two embodiment are illustrated.The shape memory alloy component 130 of second embodiment of the invention is the spring coil kenel, its two end is connected to the fixed leg 112 of housing 110 and the link 121 of movable part 120, after the heating temperature of shape memory alloy component 130 arrives inversion temperature, shape memory alloy component 130 begins to produce deformation and shrinks also interlock movable part 120 pivots, be resisted against plane 300 with the support end 122 that makes movable part 120, make housing 110 tilt to put on plane 300 and constitute the airflow space 400 of auxiliary heat dissipation.
As shown in Figure 9, the structure of third embodiment of the invention and aforementioned first embodiment are roughly the same, for electronic installation 100 can firmly be put in the plane, then install movable part 120 and shape memory alloy component 130 respectively in housing 110 dual side-edge positions when tilting an angle.When shape memory alloy component 130 is subjected to thermal shrinkage, the support end 122 that is positioned at housing 110 dual side-edges can on average be propped up housing 110 height, and the unlikely housing 110 that makes is toppled over towards any side, and the electronic installation 100 that makes things convenient for the user that inclination is put on the plane is controlled.
Electronic installation of the present invention is heated by shape memory alloy component and produces the contraction deformation effect, be resisted against the plane with corresponding pivot of interlock movable part, making housing be propped up one highly and with an angle of inclination is arranged on the plane, form the airflow space of auxiliary heat dissipation between housing and the plane, with the long-pending heat of effective runaway electron device inside.Electronic installation of the present invention is the mounting height adjusting mechanism separately, significantly to simplify time and the step of adjusting height, reduces manufacturing cost simultaneously.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (8)
1. an electronic installation is put on a plane, and by a circuit board with a plurality of electronic components carrying out a preset function, and these electronic components produce a heat energy, it is characterized in that this electronic installation comprises having:
One housing, this housing has at least one opening towards a side on this plane;
At least one movable part is hubbed at this housing and also can pivots with respect to this housing, and this movable part has a link and a support end, and this movable part is between this opening; And
At least one shape memory alloy component, be connected to this link of this housing and this movable part, this shape memory alloy component is accepted this heat energy and is produced contraction deformation, pivot with this movable part of interlock, and make this support end be resisted against this plane, make between this housing and this plane to have an airflow space.
2. electronic installation according to claim 1 is characterized in that this housing has more at least one fixed leg, and two opposite ends of this shape memory alloy component are connected to this fixed leg and this link.
3. electronic installation according to claim 2 is characterized in that, this shape memory alloy component is the spring coil shape, and two opposite ends of this shape memory alloy component are connected to this fixed leg and this link.
4. electronic installation according to claim 2 is characterized in that, two opposite ends of this shape memory alloy component have a line body respectively, is connected to this fixed leg and this link.
5. electronic installation according to claim 4 is characterized in that, the material of this line body is metal material or marmem.
6. electronic installation according to claim 1, it is characterized in that this housing has two relative pivot holes, has two pivots between this link of this movable part and this support end, this two pivot is inserted in this two pivots hole respectively, so that this movable part pivots with respect to this housing.
7. electronic installation according to claim 1 is characterized in that, this shape memory alloy component is arranged between this housing and this circuit board.
8. electronic installation according to claim 1 is characterized in that, this support end of this movable part is a globoidal structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101674966A CN101727127B (en) | 2008-10-10 | 2008-10-10 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101674966A CN101727127B (en) | 2008-10-10 | 2008-10-10 | Electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101727127A CN101727127A (en) | 2010-06-09 |
| CN101727127B true CN101727127B (en) | 2011-10-12 |
Family
ID=42448120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101674966A Expired - Fee Related CN101727127B (en) | 2008-10-10 | 2008-10-10 | Electronic device |
Country Status (1)
| Country | Link |
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| CN (1) | CN101727127B (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102635768A (en) * | 2011-05-16 | 2012-08-15 | 刘钦 | Portable electronic equipment bracket and method capable of being opened by controlling shape memory alloy |
| CN103037666B (en) * | 2011-09-28 | 2015-05-20 | 鸿富锦精密工业（深圳）有限公司 | Heat dissipation structure and electronic device |
| CN103576810B (en) * | 2012-08-09 | 2017-06-06 | 宏碁股份有限公司 | Electronic installation |
| CN104159434A (en) * | 2013-05-15 | 2014-11-19 | 宏碁股份有限公司 | Heat dissipation structure, and electronic apparatus applying the heat dissipation structure |
| TW201446120A (en) * | 2013-05-30 | 2014-12-01 | Wistron Corp | Heat-dissipation mechanism for an electronic device |
| TWI553258B (en) * | 2013-07-15 | 2016-10-11 | 緯創資通股份有限公司 | Foot cushion mechanism with lifting function and electronic device therewith |
| CN104853562B (en) * | 2014-02-19 | 2018-04-27 | 联想(北京)有限公司 | A kind of electronic equipment and flow accelerator |
| US9740245B2 (en) * | 2015-10-05 | 2017-08-22 | Microsoft Technology Licensing, Llc | Locking mechanism |
| CN105959609B (en) * | 2016-05-20 | 2018-12-18 | 广州市艾乐特电子科技有限公司 | A kind of automatic cooling hard disk video recorder shell |
| US10794093B2 (en) * | 2017-05-19 | 2020-10-06 | Microsoft Technology Licensing, Llc | Method of optimizing memory wire actuator energy output |
| TWI653526B (en) * | 2017-12-26 | 2019-03-11 | 宏碁股份有限公司 | Electronic device |
| TWM614137U (en) | 2021-04-09 | 2021-07-01 | 華碩電腦股份有限公司 | Electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1162110A (en) * | 1995-04-19 | 1997-10-15 | 大宇电子株式会社 | Device for opening-closing radiating component using marmen |
| CN1936770A (en) * | 2005-09-22 | 2007-03-28 | 鸿富锦精密工业（深圳）有限公司 | Note-book computer |
| CN101131597A (en) * | 2006-08-25 | 2008-02-27 | 佛山市顺德区顺达电脑厂有限公司 | Notebook- computer system and its extended base |
| CN101130398A (en) * | 2006-08-25 | 2008-02-27 | 佛山市顺德区顺达电脑厂有限公司 | Device for automatically opening and closing dust-proof cover |
-
2008
- 2008-10-10 CN CN2008101674966A patent/CN101727127B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1162110A (en) * | 1995-04-19 | 1997-10-15 | 大宇电子株式会社 | Device for opening-closing radiating component using marmen |
| CN1936770A (en) * | 2005-09-22 | 2007-03-28 | 鸿富锦精密工业（深圳）有限公司 | Note-book computer |
| CN101131597A (en) * | 2006-08-25 | 2008-02-27 | 佛山市顺德区顺达电脑厂有限公司 | Notebook- computer system and its extended base |
| CN101130398A (en) * | 2006-08-25 | 2008-02-27 | 佛山市顺德区顺达电脑厂有限公司 | Device for automatically opening and closing dust-proof cover |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2008-177232A 2008.07.31 |
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| Publication number | Publication date |
|---|---|
| CN101727127A (en) | 2010-06-09 |
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Effective date of registration: 20170816 Address after: Room 8, building 805, sunshine times, Fenghuang Road, Fenghuang County, Shangrao, Jiangxi, Shangrao Co-patentee after: Zhang Kaijun Patentee after: Jiangxi union Speed Technology Co.,Ltd. Address before: Qingnian Road Taiwan Wanhua District of Taipei city China No. 184 3 2 floor Patentee before: Fucheng International Machinery Co.,Ltd. Effective date of registration: 20170816 Address after: Qingnian Road Taiwan Wanhua District of Taipei city China No. 184 3 2 floor Patentee after: Fucheng International Machinery Co.,Ltd. Address before: Taipei City, Taiwan, China Patentee before: Yingda Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111012 Termination date: 20171010 |
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| CF01 | Termination of patent right due to non-payment of annual fee |